CN109203266B - Rapid orientation method for silicon carbide crystals - Google Patents
Rapid orientation method for silicon carbide crystals Download PDFInfo
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- CN109203266B CN109203266B CN201811282639.8A CN201811282639A CN109203266B CN 109203266 B CN109203266 B CN 109203266B CN 201811282639 A CN201811282639 A CN 201811282639A CN 109203266 B CN109203266 B CN 109203266B
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- 239000013078 crystal Substances 0.000 title claims abstract description 137
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 133
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 60
- 238000005520 cutting process Methods 0.000 claims abstract description 124
- 239000003292 glue Substances 0.000 claims abstract description 10
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 abstract description 10
- 238000005259 measurement Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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Abstract
The invention discloses a quick orientation method of a silicon carbide crystal, which utilizes a pre-cutting orientation jig to directly fix a silicon carbide crystal stick stuck with a glass stick on a platform of the pre-cutting jig through glue, and then realizes that the platform on the pre-cutting jig can move in the horizontal and vertical directions through mutual combination of a screw, a worm wheel and a worm on the pre-cutting jig, thereby realizing measurement and orientation of angles of the silicon carbide crystal stick in the horizontal and vertical directions.
Description
Technical Field
The invention relates to the technical field of crystal processing, in particular to a method for quickly orienting a silicon carbide crystal.
Background
Silicon carbide, as a third-generation semiconductor material, has rapidly penetrated into various corners in the fields of lighting, power devices, microwave radio frequency, and the like in recent years. The energy-saving LED light source has wide application markets in the fields of liquid crystal display backlight sources, automobile lamps, decorative lamps, general illumination, electric vehicles, 5G application and the like, and becomes one of the directions of new energy development in the future.
However, silicon carbide material is used as an epitaxial substrate, and the surface of the substrate needs to have high requirements, and during the process of epitaxial growth, the defect density and quality of the thin film growth of the epitaxial high-temperature crystal growth are affected by the offset of the substrate wafer angle. The angle anomaly results in time-consuming parameter adjustments at the epitaxy to achieve good quality. Thus, orienting the silicon carbide crystal prior to cutting is an essential factor in obtaining a good silicon carbide epitaxial substrate.
The traditional silicon carbide crystal bar is mainly oriented by the following two methods before cutting: the first method is used for the orientation of the silicon carbide short crystal bar, has great difficulty in the operation of personnel and can influence the precision of the silicon carbide orientation angle; the second method is that the end face of the crystal is adopted for orientation, the silicon carbide crystal bar bonded with the glass bar is fixed on a jig capable of adjusting the angle in the vertical direction, then the jig fixed with the crystal bar is locked on one side of the X-Ray orientation instrument capable of measuring the angle in the vertical direction, then the screw on the jig is adjusted to find the maximum wave crest displayed on the X-Ray orientation instrument, the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction, then the jig with the adjusted angle of the silicon carbide crystal bar is taken on a grinding machine platform to grind the glass bar by taking the bottom edge of the jig as the reference, then the other side of the X-Ray orientation instrument is taken to adjust the angle in the horizontal direction by a manual method to find the maximum wave crest displayed on the X-Ray orientation instrument, the angle at the moment is the angle of the silicon carbide crystal bar in the horizontal direction, and then the glass rod is stuck on a carrying platform of the line cutting machine, and the method has the disadvantages of complicated operation, long time consumption and low efficiency.
Chinese patent CN102615721B discloses a directional material platform of processing of crystal skew angle, including base, adjusting plate, vertical rotation target, horizontal rotation target, fixed carousel screw, chassis upper portion installing support, stopping board install the adjusting plate on the stopping board, be equipped with the revolving stage on the riser in the middle of the adjusting plate, the link is connected to the revolving stage, the link is relative with the clamping piece that is located to keep away from support one end setting. The invention aims to better, faster and more directly find the crystal orientation required by people and control the precision of the crystal orientation to the minimum extent, thereby avoiding repeated material waste processing due to low precision, greatly reducing the cost and improving the utilization rate of crystals. However, in this invention, the crystal orientation time is long and the epitaxial quality of the wafer cut from the crystal is affected.
Chinese patent CN106553276B discloses an orientation fixture for processing silicon carbide crystal at an off-angle, which belongs to the field of crystal processing devices. The orientation jig includes: the rotary sliding table is fixedly connected to the cutting workbench and is provided with a rotation angle adjusting knob; the horizontal angle adjuster is arranged on the upper surface of the rotary sliding table and is provided with a horizontal angle adjusting knob; the support frame is provided with a support frame base, the support frame base is fixedly connected to the upper surface of the horizontal angle regulator, and a linear slide rail is fixedly connected to the upper surface of the support frame base; and the pressing block is fixedly connected to the upper surface of the sliding block of the linear sliding rail and can slide along with the sliding block. According to the invention, a 2-4-degree off-angle substrate can be obliquely cut by adjusting the angle of a horizontal angle adjuster on the basis of a 0-degree off-angle cylindrical crystal bar; the substrate with the deflection angle of 4-8 degrees can be obliquely cut by adjusting the angle of the rotating sliding table relative to the vertical plane; and the precision can reach +/-1. However, in the invention, a plurality of supporting devices are needed in the crystal orientation process, the crystal orientation time is longer, and the orientation cost investment is increased.
Therefore, it is necessary to provide a method for rapidly orienting silicon carbide crystals, which comprises the steps of directly fixing a silicon carbide crystal rod adhered with a glass rod on a platform of a pre-cutting jig by using the pre-cutting jig through glue, and then realizing that the platform on the pre-cutting jig can move in the horizontal and vertical directions by mutually combining a screw, a worm wheel and a worm on the pre-cutting jig, so as to realize measurement and orientation of angles of the silicon carbide crystal rod in the horizontal and vertical directions.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a quick orientation method of a silicon carbide crystal, which utilizes a pre-cutting orientation jig to directly fix a silicon carbide crystal stick stuck with a glass stick on a platform of the pre-cutting jig through glue, and then realizes that the platform on the pre-cutting jig can move in the horizontal and vertical directions through the mutual combination of a screw, a worm wheel and a worm on the pre-cutting jig, thereby realizing the measurement and orientation of the angle of the silicon carbide crystal stick in the horizontal and vertical directions, and solving the problems of complicated operability, low precision, long time consumption and the like existing in the prior orientation of the silicon carbide crystal stick before cutting.
In order to solve the technical problems, the invention adopts the following technical scheme:
a quick orientation method of a silicon carbide crystal comprises the steps that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the horizontal and vertical angles of the silicon carbide crystal bar are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on the upper platform of the pre-cutting orientation fixture, standing for 5-8 min, and after the glue is solidified, fastening the bonded pre-cutting orientation fixture of the SiC crystal bar on an X-Ray orientation instrument;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
s30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
and S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
Further, in S10, the pre-cutting orientation jig of the bonded silicon carbide crystal bar is fastened to the X-Ray orienter through the screw and the threaded hole of the pre-cutting orientation jig.
Further, in S20, the upper platform uses a bearing in the middle of the platform as a rolling support during the rotation of the adjusting screw in the vertical direction.
Further, in S40, the worm wheel, the worm, and the hand wheel are used to control the lower platform to rotate in the horizontal direction during the orientation process in the horizontal direction.
Further, in S40, the specific operation of orienting the silicon carbide crystal bar in the horizontal direction includes:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
b, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
Furthermore, in the step A, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.001 mm-0.1 mm.
Furthermore, in C, the deflection angle required before the cutting of the silicon carbide crystal bar is 0.2-10 degrees.
Furthermore, the orientation jig before cutting can also be used for orienting the sapphire and the monocrystalline silicon.
The invention has the advantages that:
1. according to the quick orientation method of the silicon carbide crystal, a pre-cutting orientation jig is adopted in the orientation process, a glass rod fixed on the crystal rod is not required to be taken onto a grinding machine for grinding, and the silicon carbide can be simply oriented in the horizontal and vertical directions through a screw, a worm wheel and a worm on the pre-cutting jig, so that the quick orientation method has the characteristics of simplicity in operation, short time consumption, high efficiency, low requirement on operator operation, high precision, no need of taking the glass rod onto the grinding machine for grinding and low cost;
2. according to the quick orientation method of the silicon carbide crystal, disclosed by the invention, the silicon carbide crystal bar can be adhered to the platform of the orientation jig before cutting by using glue, and the orientation jig before cutting enables the platform on the jig before cutting to move in the horizontal and vertical directions by adjusting the screw, the worm wheel and the worm on the jig before cutting, so that the measurement of the angle of the silicon carbide crystal bar in the horizontal and vertical directions is realized, and compared with the traditional orientation method, the quick orientation method is low in cost and low in requirement on the operation of a human operator;
3. the quick orientation method for the silicon carbide crystal disclosed by the invention has the advantages that the orientation time of the silicon carbide crystal is shorter, the orientation efficiency is high, and the cutting quality of the silicon carbide crystal can be improved.
In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts. In the drawings:
FIG. 1 shows a pre-cutting orientation fixture according to the present invention.
Fig. 2 is a front view of the orientation fixture before cutting of the present invention.
Fig. 3 is a side view of the pre-cutting orientation fixture of the present invention.
Labeled as: 1-a silicon carbide crystal bar; 2-a middle bearing; 3-screws; 4-upper platform; 5-a lower platform; 6-screw; 7-a hand wheel; 8-a jig threaded hole; 9-carrying platform of line cutting machine.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A quick orientation method of a silicon carbide crystal comprises the steps that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the horizontal and vertical angles of the silicon carbide crystal bar are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on the upper platform of the pre-cutting orientation jig, placing for 5min, and after the glue is cured, fastening the bonded pre-cutting orientation jig of the SiC crystal bar on an X-Ray orientation instrument through a screw and a threaded hole of the pre-cutting orientation jig;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
in the operation, the upper platform adopts the bearing in the middle of the platform as rolling support in the process of rotating in the vertical direction by utilizing the adjusting screw.
S30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
in the operation, the worm wheel, the worm and the hand wheel are used for controlling the lower platform to rotate in the horizontal direction orientation process; the specific operation steps of the orientation of the silicon carbide crystal bar in the horizontal direction are as follows:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
in the operation, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.001 mm.
B, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
In the above operation, the angle to be deflected before the silicon carbide ingot is cut is 0.2 °.
And S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
In the above operation, the pre-cutting orientation jig can also be used to orient sapphire and single crystal silicon.
Example 2
A quick orientation method of a silicon carbide crystal comprises the steps that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the horizontal and vertical angles of the silicon carbide crystal bar are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on the upper platform of the pre-cutting orientation jig, placing for 8min, and after the glue is cured, fastening the bonded pre-cutting orientation jig of the SiC crystal bar on an X-Ray orientation instrument through a screw and a threaded hole of the pre-cutting orientation jig;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
in the operation, the upper platform adopts the bearing in the middle of the platform as rolling support in the process of rotating in the vertical direction by utilizing the adjusting screw.
S30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
in the operation, the worm wheel, the worm and the hand wheel are used for controlling the lower platform to rotate in the horizontal direction orientation process; the specific operation steps of the orientation of the silicon carbide crystal bar in the horizontal direction are as follows:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
in the operation, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.1 mm.
B, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
In the above operation, the angle to be deflected before the silicon carbide ingot is cut is 10 °.
And S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
In the above operation, the pre-cutting orientation jig can also be used to orient sapphire and single crystal silicon.
Example 3
A quick orientation method of a silicon carbide crystal comprises the steps that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the horizontal and vertical angles of the silicon carbide crystal bar are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on the upper platform of the pre-cutting orientation jig, placing for 6min, and after the glue is cured, fastening the bonded pre-cutting orientation jig of the SiC crystal bar on an X-Ray orientation instrument through a screw and a threaded hole of the pre-cutting orientation jig;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
in the operation, the upper platform adopts the bearing in the middle of the platform as rolling support in the process of rotating in the vertical direction by utilizing the adjusting screw.
S30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
in the operation, the worm wheel, the worm and the hand wheel are used for controlling the lower platform to rotate in the horizontal direction orientation process; the specific operation steps of the orientation of the silicon carbide crystal bar in the horizontal direction are as follows:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
in the operation, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.005 mm.
B, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
In the above operation, the angle to be deflected before the silicon carbide ingot is cut is 0.5 °.
And S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
In the above operation, the pre-cutting orientation jig can also be used to orient sapphire and single crystal silicon.
Example 4
A quick orientation method of a silicon carbide crystal comprises the steps that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the horizontal and vertical angles of the silicon carbide crystal bar are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on an upper platform of a pre-cutting orientation jig, placing for 7min, and after the glue is cured, fastening the bonded pre-cutting orientation jig of the SiC crystal bar on an X-Ray orientation instrument through a screw and a threaded hole of the pre-cutting orientation jig;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
in the operation, the upper platform adopts the bearing in the middle of the platform as rolling support in the process of rotating in the vertical direction by utilizing the adjusting screw.
S30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
in the operation, the worm wheel, the worm and the hand wheel are used for controlling the lower platform to rotate in the horizontal direction orientation process; the specific operation steps of the orientation of the silicon carbide crystal bar in the horizontal direction are as follows:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
in the operation, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.01 mm.
B, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
In the above operation, the angle to be deflected before the silicon carbide ingot is cut is 1.0 °.
And S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
In the above operation, the pre-cutting orientation jig can also be used to orient sapphire and single crystal silicon.
Examples of the experiments
From the actual production, the pre-cutting orientation jig related in the silicon carbide crystal rapid orientation method brings huge product benefits in the actual production. Table 1 below presents a comparison of the pre-cut orientation fixture involved in the method of rapidly orienting silicon carbide crystals of the present invention with the pre-cut orientation data of conventional silicon carbide crystal rods.
TABLE 1 Pre-cutting orientation tool involved in the method for rapidly orienting silicon carbide crystals of the present invention and conventional pre-cutting orientation data statistics for silicon carbide
From the above table, the pre-cutting orientation jig related to the rapid orientation method for the silicon carbide crystal solves the problems of complicated orientation operation, long operation time, low efficiency, cost waste and the like caused by the need of purchasing a flat grinder for grinding the glass rod before cutting the silicon carbide crystal rod.
In addition, compared with the traditional orientation method, the orientation jig method related in the rapid orientation method of the silicon carbide crystal improves the efficiency by 3-4 times; the angle of the C to A direction of the wafer cut by the orientation fixture method related in the quick orientation method of the silicon carbide crystal can be converged to +/-0.1 degrees, and the angle of the C to M direction can be converged to +/-0.05 degrees; the angle of the wafer C to A direction can only be converged to +/-0.2 degrees after the wafer is directionally cut by adopting the traditional orientation method, and the angle of the wafer C to M direction can be converged to +/-0.2 degrees, so that the epitaxial quality of the silicon carbide is influenced; the orientation fixture involved in the rapid orientation method of the silicon carbide crystal is adopted to orient the silicon carbide crystal bar before cutting, any auxiliary equipment is not needed, and compared with the traditional orientation method, a plane grinder is needed to grind the glass bar, so that the cost of a grinding wheel and a machine table is saved.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A quick orientation method of a silicon carbide crystal is characterized in that a pre-cutting orientation jig is used for respectively controlling the vertical and horizontal movements of an upper platform and a lower platform to vertically and horizontally fix a silicon carbide crystal bar, so that the angles of the silicon carbide crystal bar in the horizontal and vertical directions are measured; the method for rapidly orienting the silicon carbide crystals comprises the following steps:
s10, adhering the SiC crystal bar on the upper platform of the pre-cutting orientation fixture, standing for 5-8 min, and after the glue is solidified, fastening the bonded pre-cutting orientation fixture of the SiC crystal bar on an X-Ray orientation instrument;
s20, adjusting an adjusting screw on the upper platform to enable the upper platform to move in the vertical direction, and searching the highest peak of the pointer on an instrument of the X-Ray orientation instrument, wherein the angle at the moment is the angle of the silicon carbide crystal bar in the vertical direction;
s30, after determining the angle of the SiC crystal bar in the vertical direction, detaching the pre-cutting orientation fixture from the X-Ray orientation instrument, and fixing the pre-cutting orientation fixture on a carrying table of the line cutting machine through screws;
s40, moving the carrier of the fixed line cutting machine and the pre-cutting orientation jig into a clamping groove of an X-Ray orientation instrument to orient the silicon carbide crystal bar in the horizontal direction, and adjusting the angle displayed on a display of the X-Ray orientation instrument to the angle of the silicon carbide crystal bar;
and S50, taking down the oriented pre-cutting orientation jig and the carrying platform of the line cutting machine from the clamping groove on the X-Ray orientation instrument, and placing the line cutting machine on the line cutting machine for cutting.
2. The method for rapidly orienting silicon carbide crystals according to claim 1, wherein the pre-cut orientation jig of the bonded silicon carbide crystal rods is fastened to the X-Ray orienter through screws and threaded holes of the pre-cut orientation jig in S10.
3. The method for rapidly orienting silicon carbide crystals according to claim 1, wherein in step S20, the upper platform is supported by a bearing in the middle of the platform for rolling movement in the vertical direction by the adjusting screws.
4. The method for rapidly orienting silicon carbide crystals according to claim 1, wherein in step S40, the lower platform is controlled by a worm wheel, a worm and a hand wheel to rotate in the horizontal direction during the orientation in the horizontal direction.
5. The method for rapidly orienting silicon carbide crystals according to claim 1 wherein in S40 the specific operation of orienting the silicon carbide crystal rods in the horizontal direction is:
a, a worm wheel and a worm are driven by a hand wheel to drive a lower platform to rotate in the horizontal direction;
b, when the lower platform rotates in the horizontal direction, observing a pointer on an instrument of the X-Ray direction finder, and recording the position pointed by the pointer when the pointer points at a wave crest;
and C, adding the angle to be deflected to the angle displayed by the conventional X-Ray direction finder according to the angle to be deflected before the silicon carbide crystal bar is cut, then driving the worm wheel and the worm by using the hand wheel again, driving the lower platform to rotate in the horizontal direction, finding the position pointed by the pointer in the B on the meter of the X-Ray direction finder at the moment, and finishing the direction in the horizontal direction.
6. The method for rapidly orienting silicon carbide crystals according to claim 5, wherein in A, the periphery of the hand wheel is provided with a circle of scale marks with the precision of 0.001-0.1 mm.
7. The method for rapidly orienting a silicon carbide crystal according to claim 5, wherein the angle of deflection required before the silicon carbide crystal ingot is cut in C is 0.2 ° to 10 °.
8. The method for rapidly orienting silicon carbide crystals according to claim 1, wherein the pre-cut orientation fixture is further used to orient sapphire and single crystal silicon.
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| CN113427650B (en) * | 2021-06-17 | 2023-03-14 | 西北工业大学 | Method for measuring orientation of directionally solidified alloy single crystal and cutting seed crystal |
| CN113787636B (en) * | 2021-07-09 | 2022-05-27 | 麦斯克电子材料股份有限公司 | Manual bar adhering method for 12-inch semiconductor wafer |
| CN115478325B (en) * | 2022-08-15 | 2024-01-26 | 江西兆驰半导体有限公司 | Stick sticking orientation instrument, oriented stick sticking device and oriented stick sticking method |
| CN117415966A (en) * | 2023-11-16 | 2024-01-19 | 深圳平湖实验室 | Orientation jig, orientation method and cutting method of silicon carbide crystal |
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| JP3919756B2 (en) * | 2004-02-27 | 2007-05-30 | 株式会社リガク | X-ray crystal orientation measuring device, crystal sample holding device using the same, and crystal orientation cutting method used therefor |
| CN103434036A (en) * | 2013-08-12 | 2013-12-11 | 元鸿（山东）光电材料有限公司 | Crystal rod orientation device |
| CN203636629U (en) * | 2014-01-14 | 2014-06-11 | 山东天岳先进材料科技有限公司 | Universal device for directional machining of crystals |
| CN204214796U (en) * | 2014-11-28 | 2015-03-18 | 温岭市朗杰机械设备有限公司 | The control circuit of the directed sizing machine of the automatic X-ray of a kind of crystal |
| CN104985709B (en) * | 2015-06-16 | 2017-01-11 | 浙江海纳半导体有限公司 | Method for adjusting crystal orientation of single-crystal rod and measuring method |
| CN106553276B (en) * | 2016-10-21 | 2018-08-10 | 珠海鼎泰芯源晶体有限公司 | A kind of orientation fixture of carborundum crystals inclination angle processing |
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