CN109190298A - Hole processing method, device, system and storage medium based on assembled architecture - Google Patents

Hole processing method, device, system and storage medium based on assembled architecture Download PDF

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Publication number
CN109190298A
CN109190298A CN201811158524.8A CN201811158524A CN109190298A CN 109190298 A CN109190298 A CN 109190298A CN 201811158524 A CN201811158524 A CN 201811158524A CN 109190298 A CN109190298 A CN 109190298A
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China
Prior art keywords
component
hole
datum
information
obtains
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CN201811158524.8A
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CN109190298B (en
Inventor
刘现
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China Mingsheng Drawin Technology Investment Co Ltd
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China Mingsheng Drawin Technology Investment Co Ltd
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Priority to CN201811158524.8A priority Critical patent/CN109190298B/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/10Geometric CAD
    • G06F30/13Architectural design, e.g. computer-aided architectural design [CAAD] related to design of buildings, bridges, landscapes, production plants or roads
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation

Abstract

The invention discloses a kind of hole processing method, device, system and computer readable storage medium based on assembled architecture, this method comprises: carrying out Boolean calculation to first component and second component, hole location information corresponding with first component and second component is obtained;The component that first component is vertically arranged;Component information according to first component obtains horizontal datum corresponding with hole;Component information and horizontal datum according to second component obtain each depth datum line corresponding with hole, and each depth datum line is vertical with horizontal datum;Corresponding hole face is generated according to horizontal datum and each depth datum line;Thickness direction by hole face along first component extends preset length, obtains hole.Hole can be handled automatically by the method in the application, not only increase hole treatment effeciency, so that the hole arrived is more accurate, be conducive to accurate control and calculating to building cost.

Description

Hole processing method, device, system and storage medium based on assembled architecture
Technical field
The present embodiments relate to assembled architecture technical fields, more particularly to a kind of hole based on assembled architecture Processing method, device, system and storage medium.
Background technique
In assembled architecture, whether the boolean of door and window or wall or beam all has hole, pre-buried to need hole, and Hole is also required to do filling processing, thus hole whether exact relationship to building cost size.In the prior art, usually logical After crossing the position that Boolean calculation has determined hole, manually corresponding component is measured, and is manually determined according to measurement result The hole information of hole out causes the accuracy of hole to reduce, and working efficiency is low, is unfavorable for realizing to the accurate of building cost Control and calculating.
In consideration of it, how to provide a kind of hole processing method based on assembled architecture of solution above-mentioned technical problem, dress It sets, system and computer readable storage medium become the current problem to be solved of those skilled in the art.
Summary of the invention
The purpose of the embodiment of the present invention is that provide a kind of hole processing method based on assembled architecture, device, system and Storage medium improves hole treatment effeciency in use, and the hole made is more accurate, is conducive to building The accurate control and calculating of cost.
In order to solve the above technical problems, the embodiment of the invention provides a kind of hole processing side based on assembled architecture Method, comprising:
Boolean calculation is carried out to first component and second component, is obtained corresponding with the first component and the second component Hole location information;The component that the first component is vertically arranged;
Component information according to the first component obtains horizontal datum corresponding with hole;
Each depth corresponding with described hole is obtained according to the component information of the second component and the horizontal datum Reference line is spent, each depth datum line is vertical with the horizontal datum;
Corresponding hole face is generated according to the horizontal datum and each depth datum line;
Thickness direction by described hole face along the first component extends preset length, obtains described hole.
Optionally, the component information according to the first component obtains the process of horizontal datum corresponding with hole Are as follows:
Component information according to the first component obtains the first facade projection of the first component;
The smallest first line segment of length in the first line segment of each item in first facade projection in the horizontal direction is obtained, And using the smallest first line segment of the length as the horizontal datum.
Optionally, described to be obtained and described hole pair according to the component information of the second component and the horizontal datum The process for each depth datum line answered are as follows:
Component information according to the second component obtains the second facade projection of the second component;
Obtain each second line segment vertical with the horizontal datum in second facade projection;
Filter out each second line segment of the length less than the first preset value from each second line segment, and by each length Degree is less than the second line segment of the first preset value as each depth datum line.
Optionally, the preset length is equal to the thickness of the first component.
Optionally, extend preset length in the thickness direction by described hole face along the first component, obtain institute After stating hole, further includes:
Boolean calculation is carried out to the first component, the second component and described hole, is obtained corresponding with described hole Hole information.
Optionally, further includes:
According to the component information of the first component, the component information of the second component and described hole is determined and institute State the corresponding cast-in-place part of hole information.
The embodiment of the present invention provides a kind of hole processing unit based on assembled architecture accordingly, comprising:
Computing module obtains and the first component and institute for carrying out Boolean calculation to first component and second component State the corresponding hole location information of second component;The component that the first component is vertically arranged;
First processing module, for obtaining horizontal reference corresponding with hole according to the component information of the first component Line;
Second processing module, for according to the second component component information and the horizontal datum obtain with it is described The corresponding each depth datum line of hole, each depth datum line are vertical with the horizontal datum;
Generation module, for generating corresponding hole face according to the horizontal datum and each depth datum line;
Extension of module extends preset length for the thickness direction by described hole face along the first component, obtains institute State hole.
Optionally, the first processing module includes:
First processing units, for obtaining the first facade of the first component according to the component information of the first component Projection;
First acquisition unit is long in the first line segment of each item in first facade projection in the horizontal direction for obtaining The smallest first line segment is spent, and using the smallest first line segment of the length as the horizontal datum.
The hole processing system based on assembled architecture that the embodiment of the invention also provides a kind of, comprising:
Memory, for storing computer program;
Processor realizes the hole processing as described above based on assembled architecture when for executing the computer program The step of method.
The embodiment of the invention also provides a kind of computer readable storage medium, deposited on the computer readable storage medium Computer program is contained, the computer program realizes the hole as described above based on assembled architecture when being executed by processor The step of processing method.
The embodiment of the invention provides a kind of hole processing method, device, system and computer based on assembled architecture Readable storage medium storing program for executing obtains and first component and second this method comprises: carrying out Boolean calculation to first component and second component The corresponding hole location information of component;The component that first component is vertically arranged;According to first component component information obtain with The corresponding horizontal datum of hole;Component information and horizontal datum according to second component obtain each depth corresponding with hole Reference line is spent, each depth datum line is vertical with horizontal datum;Phase is generated according to horizontal datum and each depth datum line The hole face answered;Thickness direction by hole face along first component extends preset length, obtains hole.
As it can be seen that the application can determine that hole location is believed according to the Boolean calculation result of first component and second component Breath, and horizontal datum related with hole and depth can also be determined according to the component information of first component and second component Reference line is spent, corresponding hole face is further generated according to the horizontal datum and depth datum line, then to hole face the The thickness direction of one component, which extends preset length, can be obtained corresponding hole.It being capable of automatic device to hole by the method in the application Hole is handled, and hole treatment effeciency is not only increased, so that the hole arrived is more accurate, is conducive to building cost It is accurate control and calculating.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings Obtain other attached drawings.
Fig. 1 is a kind of flow diagram of the hole processing method based on assembled architecture provided in an embodiment of the present invention;
Fig. 2 is a kind of structural schematic diagram of the hole processing unit based on assembled architecture provided in an embodiment of the present invention;
Fig. 3 is a kind of structural schematic diagram of the hole processing system based on assembled architecture provided in an embodiment of the present invention.
Specific embodiment
The embodiment of the invention provides a kind of, and hole processing method, device, system and storage based on assembled architecture are situated between Matter improves hole treatment effeciency in use, and the hole made is more accurate, is conducive to building cost Accurate control and calculating.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 is please referred to, Fig. 1 is a kind of stream of the hole processing method based on assembled architecture provided in an embodiment of the present invention Journey schematic diagram.This method, comprising:
S110: Boolean calculation is carried out to first component and second component, is obtained corresponding with first component and second component Hole location information;The component that first component is vertically arranged;
It should be noted that can establish before carrying out Boolean calculation to first component and second component including door and window The initial model of information includes the relevant information of first component and second component in the initial model, wherein door and window information can be with Including lines frame or three-dimensional figure, the approximate region of door and window may be used to determine, and the first component in the present embodiment and second Component can be wall and beam, or column and beam, wherein first component is vertically arranged (namely being vertically arranged on ground), Then second component is set in first component by corresponding hole, for example, beam by the hole crossbearer that is set on wall in wall On.Certainly, the first component in the application and second component may be other kinds of component, with specific reference to be actually needed into Row determines.
S120: the component information according to first component obtains horizontal datum corresponding with hole;
Specifically, due to the component that first component is vertically arranged, and usually hole is set in first component, so this Application can obtain the horizontal datum of hole by the component information of first component, can determine and portal according to horizontal datum The bore in hole width in the horizontal direction.
Specifically, the application can obtain the first facade projection of first component according to the component information of first component;It obtains The smallest first line segment of length in the first line segment of each item in the first facade projection in the horizontal direction is taken, and length is the smallest First line segment is as horizontal datum.
Wherein, the first facade projection is the facade projection for examining first component, and the first facade projection has in the horizontal direction A plurality of first line segment obtains the smallest first line segment of length as horizontal datum, so as to determine hole bore in water Square upward most short width.
S130: component information and horizontal datum according to second component obtain each depth datum corresponding with hole Line, each depth datum line are vertical with horizontal datum;
It should be noted that after determining the horizontal datum of hole, it can be further according to the component of second component Information and the horizontal datum determine each depth datum line of hole.
Specifically, the application can obtain the second facade projection of second component according to the component information of second component;It obtains Take each second line segment vertical with horizontal datum in the second facade projection;Length is filtered out from each second line segment to be less than Each second line segment of first preset value, and the second line segment using each length less than the first preset value is as each depth datum Line.
It should be noted that the first preset value in the present embodiment is, for example, 10cm, specific value can be according to reality It is set, the application is without limitation.
S140: hole corresponding with hole face is generated according to horizontal datum and each depth datum line;
Hole face is constituted with horizontal datum specifically, the endpoint of each depth datum line is connected, and after being extended, To obtain the shape of hole.
S150: the thickness direction by hole face along first component extends preset length, obtains hole.
It is understood that since hole is set in first component, and hole should be through first component Thickness direction, so the thickness direction after obtaining hole face by the hole face along first component carries out extension preset length, just It can obtain three-dimensional hole.Wherein, which can be equal to the thickness of first component, might be less that the first component Thickness, specific value can be determined according to the actual situation, and the application does not do particular determination.
Further, extend preset length in the thickness direction by hole face along first component, after obtaining hole, also wrap It includes:
Boolean calculation is carried out to first component, second component and hole, obtains hole information corresponding with hole.
Specifically, after obtaining corresponding hole boolean's fortune can also be carried out to first component, second component and hole It calculates, is further cost to provide accurate hole technological parameter for follow-up work to obtain the hole information of the hole Control and calculate accurate foundation be provided.
Further, this method further include:
Component information, the component information of second component and hole information according to first component are determined corresponding with hole Cast-in-place part.
It should be noted that in practical applications two by hole intersect component, it is also necessary to hole is poured, To ensure the secure bond between component, therefore, after determining hole information, the component information of acceptable foundation first component, The component information and hole information of second component determine cast-in-place part corresponding with hole, further provide for subsequent work Accurate foundation.
As it can be seen that the application can determine that hole location is believed according to the Boolean calculation result of first component and second component Breath, and horizontal datum related with hole and depth can also be determined according to the component information of first component and second component Reference line is spent, corresponding hole face is further generated according to the horizontal datum and depth datum line, then to hole face the The thickness direction of one component, which extends preset length, can be obtained corresponding hole.It being capable of automatic device to hole by the method in the application Hole is handled, and hole treatment effeciency is not only increased, so that the hole arrived is more accurate, is conducive to building cost It is accurate control and calculating.
On the basis of the above embodiments, the embodiment of the present invention provides a kind of hole based on assembled architecture accordingly Processing unit, specifically referring to figure 2..The device includes:
Computing module 21 obtains and first component and second for carrying out Boolean calculation to first component and second component The corresponding hole location information of component;The component that first component is vertically arranged;
First processing module 22 obtains horizontal datum corresponding with hole for the component information according to first component;
Second processing module 23, component information and horizontal datum for foundation second component obtain corresponding with hole Each depth datum line, each depth datum line are vertical with horizontal datum;
Generation module 24, for generating corresponding hole face according to horizontal datum and each depth datum line;
Extension of module 25 extends preset length for the thickness direction by hole face along first component, obtains hole.
Further, first processing module 22 includes:
First processing units obtain the first facade projection of first component for the component information according to first component;
First acquisition unit, for obtaining in the first line segment of each item in the first facade projection in the horizontal direction length most The first small line segment, and using the smallest first line segment of length as horizontal datum.
On the basis of the above embodiments, the hole processing based on assembled architecture that the embodiment of the invention also provides a kind of System, specifically referring to figure 3..The system includes:
Memory 31, for storing computer program;
Processor 32 is realized when for executing computer program such as the above-mentioned hole processing method based on assembled architecture Step.
For example, processor 32 carries out Boolean calculation for realizing to first component and second component, obtain and first component Hole location information corresponding with second component;The component that first component is vertically arranged;Component information according to first component Obtain horizontal datum;Component information and horizontal datum according to second component obtain each depth datum line;According to horizontal Reference line and each depth datum line generate corresponding hole face;Hole face is extended into default length along the thickness direction of first component Degree, obtains hole.
On the basis of the above embodiments, the embodiment of the invention also provides a kind of computer readable storage mediums, calculate It is stored with computer program on machine readable storage medium storing program for executing, is realized when computer program is executed by processor and is based on assembled as above-mentioned The step of hole processing method of building.
The computer readable storage medium may include: USB flash disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (RandomAccess Memory, RAM), magnetic or disk etc. is various to deposit Store up the medium of program code.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part It is bright.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged Except there is also other identical elements in the process, method, article or apparatus that includes the element.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (10)

1. a kind of hole processing method based on assembled architecture characterized by comprising
Boolean calculation is carried out to first component and second component, obtains hole corresponding with the first component and the second component Hole location information;The component that the first component is vertically arranged;
Component information according to the first component obtains horizontal datum corresponding with hole;
Each depth base corresponding with described hole is obtained according to the component information of the second component and the horizontal datum Directrix, each depth datum line are vertical with the horizontal datum;
Corresponding hole face is generated according to the horizontal datum and each depth datum line;
Thickness direction by described hole face along the first component extends preset length, obtains described hole.
2. the hole processing method according to claim 1 based on assembled architecture, which is characterized in that described in the foundation The component information of first component obtains the process of horizontal datum corresponding with hole are as follows:
Component information according to the first component obtains the first facade projection of the first component;
The smallest first line segment of length in the first line segment of each item in first facade projection in the horizontal direction is obtained, and will The smallest first line segment of length is as the horizontal datum.
3. the hole processing method according to claim 2 based on assembled architecture, which is characterized in that described in the foundation The component information of second component and the horizontal datum obtain the process of each depth datum line corresponding with described hole are as follows:
Component information according to the second component obtains the second facade projection of the second component;
Obtain each second line segment vertical with the horizontal datum in second facade projection;
Each second line segment of the length less than the first preset value is filtered out from each second line segment, and each length is small In the first preset value second line segment as each depth datum line.
4. the hole processing method according to claim 1 based on assembled architecture, which is characterized in that the preset length Equal to the thickness of the first component.
5. the hole processing method according to any one of claims 1-4 based on assembled architecture, which is characterized in that The thickness direction by described hole face along the first component extends preset length, after obtaining described hole, further includes:
Boolean calculation is carried out to the first component, the second component and described hole, obtains hole corresponding with described hole Hole information.
6. the hole processing method according to claim 5 based on assembled architecture, which is characterized in that further include:
It is determined and the hole according to the component information of the first component, the component information of the second component and described hole The corresponding cast-in-place part of hole information.
7. a kind of hole processing unit based on assembled architecture characterized by comprising
Computing module obtains and the first component and described for carrying out Boolean calculation to first component and second component The corresponding hole location information of two components;The component that the first component is vertically arranged;
First processing module, for obtaining horizontal datum corresponding with hole according to the component information of the first component;
Second processing module, for according to the second component component information and the horizontal datum obtains and described hole Corresponding each depth datum line, each depth datum line are vertical with the horizontal datum;
Generation module, for generating corresponding hole face according to the horizontal datum and each depth datum line;
Extension of module extends preset length for the thickness direction by described hole face along the first component, obtains the hole Hole.
8. the hole processing unit according to claim 7 based on assembled architecture, which is characterized in that first processing Module includes:
First processing units, the first facade for obtaining the first component according to the component information of the first component are thrown Shadow;
First acquisition unit, for obtaining in the first line segment of each item in first facade projection in the horizontal direction length most The first small line segment, and using the smallest first line segment of the length as the horizontal datum.
9. a kind of hole processing system based on assembled architecture characterized by comprising
Memory, for storing computer program;
Processor is realized when for executing the computer program and is built as described in claim 1 to 6 any one based on assembled The step of hole processing method built.
10. a kind of computer readable storage medium, which is characterized in that be stored with computer on the computer readable storage medium Program is realized when the computer program is executed by processor and is based on assembled architecture as described in claim 1 to 6 any one Hole processing method the step of.
CN201811158524.8A 2018-09-30 2018-09-30 Hole processing method, device and system based on assembly type building and storage medium Active CN109190298B (en)

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Application Number Priority Date Filing Date Title
CN201811158524.8A CN109190298B (en) 2018-09-30 2018-09-30 Hole processing method, device and system based on assembly type building and storage medium

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CN109190298B CN109190298B (en) 2022-11-15

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008242609A (en) * 2007-03-26 2008-10-09 Fujitsu Ltd Three-dimensional design support method, three-dimensional design support apparatus and computer program
CN203782874U (en) * 2014-03-05 2014-08-20 广东合力建造科技有限公司 Support assembly for light steel residence
CN104340813A (en) * 2014-10-30 2015-02-11 中国建筑股份有限公司 Construction method of elevator mounting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008242609A (en) * 2007-03-26 2008-10-09 Fujitsu Ltd Three-dimensional design support method, three-dimensional design support apparatus and computer program
CN203782874U (en) * 2014-03-05 2014-08-20 广东合力建造科技有限公司 Support assembly for light steel residence
CN104340813A (en) * 2014-10-30 2015-02-11 中国建筑股份有限公司 Construction method of elevator mounting

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