CN109176724A - A kind of processing mold and processing method of flexible circuit board - Google Patents
A kind of processing mold and processing method of flexible circuit board Download PDFInfo
- Publication number
- CN109176724A CN109176724A CN201811034334.5A CN201811034334A CN109176724A CN 109176724 A CN109176724 A CN 109176724A CN 201811034334 A CN201811034334 A CN 201811034334A CN 109176724 A CN109176724 A CN 109176724A
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- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- lower die
- positioning pin
- processing mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012545 processing Methods 0.000 title claims abstract description 33
- 238000003672 processing method Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 description 19
- 238000005520 cutting process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
本发明属于PCB加工领域，公开了一种柔性电路板的加工模具，包括上模和与上模配合的下模，所述的下模上设有定位销，所述的定位销以可从下模表面伸出或缩回的方式布置，同时本发明还公开了基于上述加工模具的柔性电路板的加工方法，本发明的优势在于：利于吸盘的吸取和移送冲切后的柔性电路板，利于吸盘的布置，不需要克服定位销的阻力，扩大了自动化加工的适用范围，进一步解决了传统手工操作的不便的问题。
The invention belongs to the field of PCB processing, and discloses a processing die for a flexible circuit board, comprising an upper die and a lower die matched with the upper die. The mold surface is arranged in a way of extending or retracting, and the present invention also discloses a processing method of the flexible circuit board based on the above-mentioned processing mold. The arrangement of the suction cups does not need to overcome the resistance of the positioning pins, which expands the scope of application of automatic processing and further solves the inconvenient problem of traditional manual operations.
Description
Technical field
The present invention relates to the field PCB, the processing mold and processing method of especially a kind of flexible circuit board.
Background technique
With the high speed development of smart phone in recent years, flexible circuit board (abbreviation FPC) development is swift and violent, and annual value of production expands year by year
Greatly, it has also become electronics industry pillar industry.
FPC is flexible material, and the molding mode in volume production generallys use mold punching mode, and product covers the fixation in mold
On positioning pin, molding punching；Manually operated punching process needs a large amount of manpowers, and labor intensity is high, and industrial injury is dangerous high；For punching
We have developed a plurality of automation equipments to cutting process, but can the product that the scope of application of equipment has been limited to after punching
The ratio grabbed using suction nozzle.
During automation mode Punching Technology, carrying product is using sucker mode.It is placed in the outside of positioning pin straight
The sucker of diameter 4mm or more, it is ensured that the resistance that can overcome lower die positioning pin grabs the product being punched from lower die positioning pin
Out,；
But producer is to improve the utilization rate of material, after portioned product punching, without position appropriate put 4mm with
Upper suction nozzle, this kind of product can not adopt be punched in an automated fashion at present, can only maintain existing manual punching state；This kind of production
30% or so is accounted about before items, further up with product density, the ratio regular meeting of this part is higher and higher.
Product orientation pin on mold is generally pylindrical or conical, and general for automatic punching uses circular cone
Shape；When punching, the part on cylindrical surface is accurately positioned product.In order to guarantee positioning accuracy, positioning pin and product
The gap of location hole is all as small as possible.So product is tight compared with the cylindrical surface portion combination of positioning pin after the completion of punching.This
When, if grabbing product using sucker mode,；It ideally needs in the two sides of the almost symmetry of each positioning pin, respectively
There is the suction nozzle of a diameter 4mm or more.Again the case where backward, need to have sufficient amount of diameter on the outside of general location pin
The suction nozzle of 4mm or more, it is ensured that product is entirely sucked up, smooth disengaging positioning pin in this way can also be with stable operation.Such as
Some positioning pin of fruit is that inside has suction nozzle, then when mentioning, the product of alignment pin position be not it is smooth, positioning pin is to production
The resistance of product will increase, cause product cannot smooth disengaging positioning pin, be thus unable to automatic punching.
Summary of the invention
The object of the present invention is to provide a kind of processing mold of flexible circuit board and processing method, which is conducive to
The absorption of sucker and the flexible circuit board after transfer punching do not need the resistance for overcoming positioning pin conducive to the arrangement of sucker, expand
The scope of application of automation processing further solves the inconvenient problem of traditional-handwork operation.
Technical solution provided by the invention are as follows: a kind of processing mold of flexible circuit board, including upper mold and with upper mold cooperate
Lower die, the lower die be equipped with positioning pin, the positioning pin by can from lower mould surface stretch out or retract in a manner of arrange.
In the processing mold of above-mentioned flexible circuit board, lifter plate is equipped in the lower die, the positioning pin is solid
It is scheduled on lifter plate, position corresponding with positioning pin is equipped with the dowel hole that diameter is greater than positioning pin outer diameter in the lower die.
In the processing mold of above-mentioned flexible circuit board, the lifter plate is driven by cylinder.
In the processing mold of above-mentioned flexible circuit board, the lower die is equipped with first row slug hole；The liter
It drops plate and is equipped with second row slug hole corresponding with first row slug hole.
In the processing mold of above-mentioned flexible circuit board, the diameter of the dowel hole is greater than the outer diameter of positioning pin.
In the processing mold of above-mentioned flexible circuit board, when positioning pin is stretched out from lower die, the positioning surface of positioning pin
Higher than lower die upper surface.
In the processing mold of above-mentioned flexible circuit board, when positioning pin is retracted from lower die, the positioning surface of positioning pin
Lower than lower die upper surface.
Meanwhile the invention also discloses a kind of processing mold processing flexibility circuits using flexible circuit board as described above
The method of plate, includes the following steps:
Step 1: positioning pin being stretched out from lower die, dowel hole on the plate on flexible circuit board and lower die are cooperated；
Step 2: being acted by upper mold, flexible circuit board is punched out；
Step 3: after step 2, positioning pin being retracted into lower die；
Step 4: the flexible circuit board in lower die is transferred by the automation equipment with sucker；The flexible circuit board
It is fixed by sucker suction.
In the method for above-mentioned processing flexibility circuit board, the sucker diameter can be less than 4mm,
The present invention is after adopting the above technical scheme, it has the beneficial effect that
Using positioning pin movable up and down, positioning pin guarantees die cutting accuracy upper when punching；It is fixed after the completion of punching
Position pin falls on bottom automatically, is detached from product.In this way, not needing the resistance for overcoming positioning pin when sucker grabs product in lower die
Power also can more optionally put 4mm or the sucker less than 4mm diameter, in this manner it is possible to expand automatic punching mode
The scope of application improve benefit to save manpower.
Detailed description of the invention
Fig. 1 is a kind of working state figure of the processing mold of the embodiment of the present invention 1；
Fig. 2 is another working state figure of the processing mold of the embodiment of the present invention 1；
Fig. 3 is the positioning pin and lower die cooperation schematic diagram of the embodiment of the present invention 1；
Fig. 4 is the enlarged drawing of the local B of the embodiment of the present invention 1；
Fig. 5 is the enlarged drawing of the Local C of the embodiment of the present invention 1；
Fig. 6 is the enlarged drawing of the local D of the embodiment of the present invention 1.
Specific embodiment
With reference to embodiment, technical solution of the present invention is described in further detail, but do not constituted pair
Any restrictions of the invention.
Embodiment 1:
With reference to Fig. 1, a kind of processing mold of flexible circuit board is described including upper mold 1 and the lower die 2 cooperated with upper mold 1
Lower die 2 is equipped with positioning pin 3, and the positioning pin 3 is arranged in a manner of it can stretch out or retract from 2 surface of lower die.
The present embodiment uses positioning pin 3 movable up and down, and positioning pin 3 is guaranteeing die cutting accuracy upper when punching；Punching
After the completion of cutting, positioning pin 3 falls on bottom automatically, is detached from product.In this way, when sucker grabs product in lower die 2, do not need gram
The resistance of positioning pin 3 is taken, 4mm also can be more optionally put or is less than 4mm diameter sucker, in this manner it is possible to expand certainly
The scope of application of dynamicization punching mode is improved benefit to save manpower.
Specific in the present embodiment, lifter plate 4 is equipped in the lower die 2, the positioning pin 3 is fixed on lifter plate 4
On, position corresponding with positioning pin 3 is equipped with the dowel hole 5 that diameter is greater than 3 outer diameter of positioning pin in the lower die 2.Positioning pin
The diameter in hole 5 is slightly larger than positioning pin 3, and guarantee is smooth to combine positioning accuracy.The gap used in example is 0.02mm.It has
The driving method of body are as follows: the lifter plate 4 is driven by cylinder 8.
As advanced optimizing for the present embodiment, the lower die 2 is equipped with first row slug hole 6；The lifter plate 4
It is equipped with second row slug hole 7 corresponding with first row slug hole 6,.The outside dimension C2 of second row slug hole 7 should be slightly larger than most
The outside dimension C1 of the first row slug hole 6 in outside avoids waste material from being stuck between 2 bottom surface of lifter plate 4 and lower die, in the present embodiment
In, C2-C1=2mm.
In practical applications, when positioning pin 3 is stretched out from lower die 2, the positioning surface F of positioning pin 3 is higher than 2 upper surface of lower die
2mm (mark of b in such as figure), when positioning pin 3 is retracted from lower die 2, the positioning surface F of positioning pin 3 is lower than 2 upper surface of lower die
3mm (mark of a in such as figure).The top of positioning pin 3 is bullet, and positioning surface is located at the lowest part of bullet.
It as height relationships described above, can be adjusted flexibly in practical applications, excessive limitation is had no to this, it is above-mentioned
Distance is used only as describing the specific course of work.
Meanwhile the present embodiment also discloses a kind of processing mold processing flexibility electricity using flexible circuit board as described above
The method of road plate, includes the following steps:
Step 1: positioning pin 3 being stretched out from lower die 2, dowel hole on the plate on flexible circuit board A and lower die 2 are matched
It closes；As shown in Figure 2 and Figure 5；
Step 2: being acted by upper mold 1, flexible circuit board A is punched out；
Step 3: after step 2, positioning pin 3 being retracted into lower die 2；As shown in Figure 1 and Figure 4.
Step 4: the flexible circuit board A in lower die 2 is transferred by the automation equipment with sucker；The flexible circuit
Plate A is fixed by sucker suction.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (8)
1. a kind of processing mold of flexible circuit board, including upper mold are equipped with fixed with lower die, the lower die is matched with the upper die
Position pin, it is characterised in that: the positioning pin is arranged in a manner of it can stretch out or retract from lower mould surface.
2. the processing mold of flexible circuit board according to claim 1, it is characterised in that: be equipped with lifting in the lower die
Plate, the positioning pin are fixed on lifter plate, and position corresponding with positioning pin is equipped with diameter greater than positioning in the lower die
Sell the dowel hole of outer diameter.
3. the processing mold of flexible circuit board according to claim 2, it is characterised in that: the lifter plate passes through cylinder
Driving.
4. the processing mold of flexible circuit board according to claim 1, it is characterised in that: the lower die is equipped with first
Arrange slug hole；The lifter plate is equipped with second row slug hole corresponding with first row slug hole.
5. the processing mold of flexible circuit board according to claim 2, it is characterised in that: the diameter of the dowel hole
Greater than the outer diameter of positioning pin.
6. the processing mold of -5 meanings flexible circuit board according to claim 1, it is characterised in that: when positioning pin is from lower die
When stretching, the positioning surface of positioning pin is higher than lower die upper surface.
7. the processing mold of -6 flexible circuit boards according to claim 1, it is characterised in that: when positioning pin is from lower die
When middle retraction, the positioning surface of positioning pin is lower than lower die upper surface.
8. a kind of method of the processing mold processing flexibility circuit board using the flexible circuit board as described in claim 1-6 meaning,
It is characterized by comprising the following steps:
Step 1: positioning pin being stretched out from lower die, dowel hole on the plate on flexible circuit board and lower die are cooperated；
Step 2: being acted by upper mold, flexible circuit board is punched out；
Step 3: after step 2, positioning pin being retracted into lower die；
Step 4: the flexible circuit board in lower die is transferred by the automation equipment with sucker；The flexible circuit board passes through
Sucker suction is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811034334.5A CN109176724A (en) | 2018-09-06 | 2018-09-06 | A kind of processing mold and processing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811034334.5A CN109176724A (en) | 2018-09-06 | 2018-09-06 | A kind of processing mold and processing method of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109176724A true CN109176724A (en) | 2019-01-11 |
Family
ID=64914831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811034334.5A Pending CN109176724A (en) | 2018-09-06 | 2018-09-06 | A kind of processing mold and processing method of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109176724A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370301A (en) * | 2021-08-12 | 2021-09-10 | 常州市昌隆电机股份有限公司 | Machining jig for motor controller board |
| CN113370110A (en) * | 2021-08-12 | 2021-09-10 | 常州市昌隆电机股份有限公司 | Jig for motor controller board and positioning method thereof |
| CN115648329A (en) * | 2022-10-08 | 2023-01-31 | 厦门弘信电子科技集团股份有限公司 | Feeding and discharging device for punching FPC (flexible printed circuit) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001007130A (en) * | 1999-06-21 | 2001-01-12 | Mitsubishi Electric Corp | Apparatus and method for manufacturing semiconductor device |
| CN103056237A (en) * | 2011-10-21 | 2013-04-24 | 北汽福田汽车股份有限公司 | Workpiece positioning mechanism and stamping mold |
| CN103480715A (en) * | 2013-09-06 | 2014-01-01 | 珠海元盛电子科技股份有限公司 | Pre-pressed pipe position forming die |
| CN106553239A (en) * | 2017-02-04 | 2017-04-05 | 深圳市麦肯机电有限公司 | Positioning punching die |
| CN207509373U (en) * | 2017-03-29 | 2018-06-19 | 深圳市麦肯机电有限公司 | Positioning punching die |
| CN208880911U (en) * | 2018-09-06 | 2019-05-21 | 深圳市麦肯机电有限公司 | A processing mold for flexible circuit board |
-
2018
- 2018-09-06 CN CN201811034334.5A patent/CN109176724A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001007130A (en) * | 1999-06-21 | 2001-01-12 | Mitsubishi Electric Corp | Apparatus and method for manufacturing semiconductor device |
| CN103056237A (en) * | 2011-10-21 | 2013-04-24 | 北汽福田汽车股份有限公司 | Workpiece positioning mechanism and stamping mold |
| CN103480715A (en) * | 2013-09-06 | 2014-01-01 | 珠海元盛电子科技股份有限公司 | Pre-pressed pipe position forming die |
| CN106553239A (en) * | 2017-02-04 | 2017-04-05 | 深圳市麦肯机电有限公司 | Positioning punching die |
| CN207509373U (en) * | 2017-03-29 | 2018-06-19 | 深圳市麦肯机电有限公司 | Positioning punching die |
| CN208880911U (en) * | 2018-09-06 | 2019-05-21 | 深圳市麦肯机电有限公司 | A processing mold for flexible circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370301A (en) * | 2021-08-12 | 2021-09-10 | 常州市昌隆电机股份有限公司 | Machining jig for motor controller board |
| CN113370110A (en) * | 2021-08-12 | 2021-09-10 | 常州市昌隆电机股份有限公司 | Jig for motor controller board and positioning method thereof |
| CN115648329A (en) * | 2022-10-08 | 2023-01-31 | 厦门弘信电子科技集团股份有限公司 | Feeding and discharging device for punching FPC (flexible printed circuit) |
| CN115648329B (en) * | 2022-10-08 | 2026-02-17 | 厦门弘信电子科技集团股份有限公司 | Feeding and discharging device for punching FPC flexible circuit board |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190111 |