CN109161858B - 一种掺氮的铝钪合金靶材及其制造方法 - Google Patents
一种掺氮的铝钪合金靶材及其制造方法 Download PDFInfo
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- CN109161858B CN109161858B CN201811048555.8A CN201811048555A CN109161858B CN 109161858 B CN109161858 B CN 109161858B CN 201811048555 A CN201811048555 A CN 201811048555A CN 109161858 B CN109161858 B CN 109161858B
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- nitrogen
- powder
- target
- alloy
- scandium alloy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811048555.8A CN109161858B (zh) | 2018-09-10 | 2018-09-10 | 一种掺氮的铝钪合金靶材及其制造方法 |
Applications Claiming Priority (1)
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CN201811048555.8A CN109161858B (zh) | 2018-09-10 | 2018-09-10 | 一种掺氮的铝钪合金靶材及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN109161858A CN109161858A (zh) | 2019-01-08 |
CN109161858B true CN109161858B (zh) | 2020-08-07 |
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CN201811048555.8A Active CN109161858B (zh) | 2018-09-10 | 2018-09-10 | 一种掺氮的铝钪合金靶材及其制造方法 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020184319A1 (ja) * | 2019-03-12 | 2020-09-17 | 三井金属鉱業株式会社 | スパッタリングターゲット材及びその製造方法 |
EP4006198A4 (en) * | 2019-07-31 | 2023-10-18 | Furuya Metal Co., Ltd. | SPRAY TARGET |
CN110643937A (zh) * | 2019-10-22 | 2020-01-03 | 上海大学 | 掺铝AlN-CdZnTe复合结构组件及其制备方法 |
CN111206216B (zh) * | 2020-02-27 | 2022-01-25 | 电子科技大学 | 可控制薄膜成分的镶嵌靶材实验设计方法 |
EP4162088A1 (en) * | 2020-06-05 | 2023-04-12 | Materion Corporation | Aluminum-scandium composite, aluminum-scandium composite sputtering target and methods of making |
CN112723893B (zh) * | 2021-02-02 | 2022-11-25 | 邱从章 | 一种氮化铝钪靶材及其制备方法 |
CN115537746B (zh) * | 2022-10-25 | 2024-04-19 | 洛阳丰联科绑定技术有限公司 | 一种铝钪合金靶材及其制备方法和应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140174908A1 (en) * | 2011-03-29 | 2014-06-26 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Scandium-aluminum alloy sputtering targets |
CN104883149B (zh) * | 2014-02-28 | 2020-06-05 | 安华高科技股份有限公司 | 钪铝合金溅镀目标 |
CN105483615B (zh) * | 2014-09-18 | 2018-10-16 | 清华大学 | 具有闪锌矿结构的磁性氮化铝薄膜材料及其制备方法与应用 |
CN106086567B (zh) * | 2016-08-16 | 2018-05-01 | 北京有色金属与稀土应用研究所 | 一种高钪含量铝钪合金及其制备方法 |
CN107841643A (zh) * | 2017-12-11 | 2018-03-27 | 基迈克材料科技(苏州)有限公司 | 铝钪合金靶坯及其制备方法及应用 |
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2018
- 2018-09-10 CN CN201811048555.8A patent/CN109161858B/zh active Active
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Inventor after: Ding Zhaochong Inventor after: Wang Xingquan Inventor after: Zhang Xiaona Inventor after: He Jinjiang Inventor after: Li Yongjun Inventor after: Lei Jifeng Inventor after: Pang Xin Inventor after: He Xin Inventor before: Ding Zhaochong Inventor before: Wang Xingquan Inventor before: Zhang Xiaona Inventor before: He Jinjiang Inventor before: Li Yongjun Inventor before: Lei Jifeng Inventor before: Pang Xin Inventor before: He Xin |
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