CN109108578A - The processing method of core part on semiconductor packaging device - Google Patents
The processing method of core part on semiconductor packaging device Download PDFInfo
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- CN109108578A CN109108578A CN201810986146.6A CN201810986146A CN109108578A CN 109108578 A CN109108578 A CN 109108578A CN 201810986146 A CN201810986146 A CN 201810986146A CN 109108578 A CN109108578 A CN 109108578A
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- stainless steel
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- milling cutter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
Abstract
The present invention relates to the processing method of core part on semiconductor packaging device, a rectangle Peek plate clamps, roughing lower surface, upper surface, side in positioning on vertical knee-type milling machine bench vice；Roughing lower surface and upper surface on grinding machine；Four blade milling cutter of stainless steel processes upper surface, the bottom outlet of fluted drill auger shell pit on an upper；The bottom outlet of four sword wolfram steel milling cutter roughing bolts hole and stainless steel location hole；Fluted drill bores the bottom outlet of black photosensitive origin on an upper, and drill bit processes the pilot hole of black photosensitive origin；Four blade milling cutter of stainless steel finishes lower surface；Stainless steel bushing is installed on stainless steel location hole bottom outlet, black PEEK cylinder material is installed on the bottom outlet of black photosensitive origin；The stainless steel bushing of four blade milling cutter roughing stainless steel location hole of wolfram steel finishes stainless steel location hole with four blade milling cutter of wolfram steel, forms stainless steel location hole；Wolfram steel grinding wheel finishes lower surface and upper surface；Four sword wolfram steel milling cutter roughing package position slots.
Description
Technical field
The present invention relates to a kind of processing methods of core part on semiconductor packaging device.
Background technique
It currently, universal processing method, should prevent from collapsing in PEEK material processing scarce, guarantee surface smoothness again
With the position degree of slot size, it is difficult to ensure that processing quality and processing efficiency in single-piece work, existing processing technology is small lot
Processing.
Summary of the invention
The purpose of the present invention is overcoming the shortcomings of the prior art, core part on a kind of semiconductor packaging device is provided
Processing method.
The purpose of the present invention is achieved through the following technical solutions:
The processing method of core part, feature are on semiconductor packaging device: comprising the steps of:
1) prepare a rectangular Peek plate, positioned, clamped with side and upper surface asperities on vertical knee-type milling machine bench vice,
With sword diameter Φ 20mm wolfram steel finger cutter roughing lower surface, guarantee surface roughness 3.2um；Part is overturn, with side under
Asperities positioning in surface clamps, roughing upper surface, guarantees surface roughness 3.2um；Positioned with upper and lower surfaces asperities,
It clamps, roughing side, guarantees surface roughness 3.2um；
2) it is positioned on grinding machine with side and upper surface asperities, is clamped with block, with wolfram steel grinding wheel roughing lower surface, protected
Demonstrate,prove roughness 1.6um；Part is overturn, is positioned, is clamped with block, roughing upper surface, thickness is stayed with side and lower surface asperities
0.1mm surplus；
3) it is positioned on lathe with accurate bench vice with pressing from both sides position one side and both ends of the surface, is clamped with pressing from both sides the another side of position, first use sword
Four blade milling cutter of diameter Φ 10mm stainless steel processes upper surface, then is revived formula fluted drill auger shell pit on an upper with diameter of phi 3.2mm
Bottom outlet complete the processing of threaded hole and with M4 screw tap tapping；Then with outside the four blade milling cutter milling of sword diameter Φ 10mm stainless steel
Shape, with tetra- sword wolfram steel milling cutter roughing bolt hole of sword diameter Φ 4mmSTK andAnd the bottom outlet of stainless steel location holeAgain with the new knife finishing of sword diameter Φ 4mmWithSmart hole；With diameter of phi 2.2mm Soviet Union formula
Fluted drill bores the bottom outlet of black photosensitive origin, the dress of the drill bit processing Φ 3mm black photosensitive origin of diameter of phi 3mm on an upper
Distribution；
4) it is positioned, is clamped with pressing from both sides the another side of position, with sword diameter with pressing from both sides position one side and both ends of the surface with accurate bench vice on lathe
Four blade milling cutter of Φ 10mm stainless steel finishes lower surface, guarantees 7.55 ± 0.05mm of size；
5) stainless steel bushing is installed on stainless steel location hole bottom outlet, black is installed on the bottom outlet of black photosensitive origin
PEEK cylinder material completes the processing to black photosensitive origin；
6) it is positioned on lathe with accurate bench vice with pressing from both sides position one side and both ends of the surface, is clamped with pressing from both sides the another side of position, first use sword
The stainless steel bushing of four blade milling cutter roughing stainless steel location hole of diameter Φ 3mm wolfram steel, then with new four sword of sword diameter Φ 3.0mm wolfram steel
Milling cutter finishes stainless steel location hole, completes the processing to stainless steel location hole；With tetra- sword wolfram steel milling cutter of sword diameter Φ 1.5mmSTK
Roughing package position slot, then the clear angle of package position slot is processed with the drill bit of sword diameter Φ 1mm；
7) it is positioned on grinding machine with side and upper surface, is clamped with block, finished lower surface with wolfram steel grinding wheel, guarantee table
Surface roughness 1.6um and flatness 0.02；It is positioned with side and lower surface, is clamped with block, finish upper surface, guarantee surface
Roughness 1.6um and flatness 0.02；
8) it is compressed on lathe with side one side positioning and briquetting, on the basis of stainless steel location hole, with new sword diameter Φ
Tetra- sword wolfram steel milling cutter roughing package position slot of 1.5mmSTK, tetra- sword wolfram steel milling cutter semifinishing package position of sword diameter Φ 1mmSTK
Slot side and bottom surface guarantee slot with new tetra- sword wolfram steel milling cutter of sword diameter Φ 1mmSTK finishing package position slot side and bottom surface
Dimensional tolerance.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 1), prepare one
Rectangle 150mm × 160mm × 7.75mm Peek plate.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 1), vertical milling
Bed is 16SS vertical knee-type milling machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 2), grinding machine are
BSTM618 grinding machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 2) and step
7), wolfram steel grinding wheel is 2000# wolfram steel grinding wheel.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 3), lathe are
YCM76 CNC machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 4), lathe are
YCM76 CNC machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 6), lathe are
YCM76 CNC machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 7), grinding machine are
BSTM618 grinding machine.
Further, on above-mentioned semiconductor packaging device core part processing method, wherein step 8), lathe are
YCM76 CNC machine.
The present invention has significant advantages and beneficial effects compared with prior art, embodies in the following areas:
Present invention process finishes release internal stress using CNC twice, then cooperates grinding machine, has both guaranteed that integral planar degree is parallel
Degree requires, and the size in aperture, surface smoothness guarantees the position degree in aperture again, and effective reduce answers in peek material processing
Power influence, meet client to series parts to quality and hand over the phase the needs of, the debugging cycle that goes wrong early period is short, stable；
Accomplish the stress that is released effectively of process in machining process arrangement, maximizes and reduce and avoid finishing passes
The easily-deformable problem of middle peek material guarantees the consistency of processing, simplifies production process, reduces occupied area, reduces and adds
Work cost improves the flexibility and adaptability of product, is suitble to the production of multi items similar material part small batch.
Other features and advantages of the present invention will be illustrated in subsequent specification, also, partly be become from specification
It is clear that by implementing specific embodiment of the invention understanding.The objectives and other advantages of the invention can be by institute
Specifically noted structure is achieved and obtained in specification, claims and the attached drawing write.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1: the structural schematic diagram of core part on semiconductor packaging device；
Fig. 2 a: the positioning of step 1) clamps schematic front view；
Fig. 2 b: the positioning of step 1) clamps schematic side view；
Fig. 3 a: the positioning of step 2) clamps schematic front view；
Fig. 3 b: the positioning of step 2) clamps schematic side view；
Fig. 4 a: the positioning of step 3) clamps schematic front view；
Fig. 4 b: the positioning of step 3) clamps schematic side view；
Fig. 5: the process schematic representation of step 6)；
Fig. 6 a: the positioning of step 7) clamps schematic front view；
Fig. 6 b: the positioning of step 7) clamps schematic side view；
Fig. 7: the process schematic representation of step 8)；
The meaning of appended drawing reference in figure:
Wherein: 101-package position slots, 102-upper surfaces, 103-black photosensitive origins, 104-stainless steel location holes,
105-sides, 106-lower surfaces, 107-threaded holes.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile of the invention
In description, directional terminology and ordinal term etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
As shown in Figure 1, core part on semiconductor packaging device, is in plank frame, it include upper surface 102, lower surface 106
And side 105, upper surface 102 are equipped with package position slot 101, black photosensitive origin 103,104 and of stainless steel location hole
Bolt hole 107.
The specific processing technology step of core part on semiconductor packaging device are as follows:
1) as shown in Fig. 2 a, Fig. 2 b, prepare a rectangle 150mm × 160mm × 7.75mm Peek plate, it is vertical in 16SS
With side 105 and the positioning of 102 asperities of upper surface, clamping on formula milling machine bench vice, with sword diameter Φ 20mm wolfram steel finger cutter roughing
Lower surface 106 guarantees surface roughness 3.2um；Part is overturn, with side 105 and the positioning of 106 asperities of lower surface, is clamped, it is thick to add
Work upper surface 102 guarantees surface roughness 3.2um；With upper surface 102 and the positioning of 106 asperities of lower surface, clamp, roughing side
Face 105 guarantees surface roughness 3.2um；
2) it as shown in Figure 3a, 3b, is positioned on BSTM618 grinding machine with side 105 and 102 asperities of upper surface, is pressed from both sides with block
Tightly, with 2000# wolfram steel grinding wheel roughing lower surface 106, guarantee roughness 1.6um；Part is overturn, with side 105 and lower surface
The positioning of 106 asperities, is clamped, roughing upper surface 105, thickness stays 0.1mm surplus with block；
3) it as shown in Fig. 4 a, Fig. 4 b, is positioned in YCM76 CNC machine with accurate bench vice with pressing from both sides position one side and both ends of the surface, with
The another side for pressing from both sides position clamps, and first processes upper surface 102 with four blade milling cutter of sword diameter Φ 10mm stainless steel, then revived with diameter of phi 3.2mm
The bottom outlet of formula fluted drill auger shell pit 107 on upper surface 102, and with M4 screw tap tapping, complete the processing of threaded hole 107；So
Use four blade milling cutter milling shape of sword diameter Φ 10mm stainless steel afterwards, with tetra- sword wolfram steel milling cutter roughing bolt hole of sword diameter Φ 4mmSTK andAnd the bottom outlet of stainless steel location holeAgain with the new knife finishing of sword diameter Φ 4mmWithSmart hole；The bottom of black photosensitive origin 103 is bored on upper surface 102 with diameter of phi 2.2mm Soviet Union formula fluted drill
Hole, the pilot hole of the drill bit processing Φ 3mm black photosensitive origin 103 of diameter of phi 3mm；
4) it is positioned in YCM76 CNC machine with accurate bench vice with pressing from both sides position one side and both ends of the surface, is clamped with pressing from both sides the another side of position,
Lower surface 106 is finished with four blade milling cutter of sword diameter Φ 10mm stainless steel, guarantees 7.55 ± 0.05mm of size；
5) stainless steel bushing is installed on 104 bottom outlet of stainless steel location hole, is installed on the bottom outlet of black photosensitive origin 103
Black PEEK cylinder material completes the processing to black photosensitive origin 103；
6) as shown in figure 5, being positioned in YCM76 CNC machine with accurate bench vice with pressing from both sides position one side and both ends of the surface, to press from both sides position
Another side clamps, and first uses the stainless steel bushing of four blade milling cutter roughing stainless steel location hole 104 of sword diameter Φ 3mm wolfram steel, then with newly
Four blade milling cutter of sword diameter Φ 3.0mm wolfram steel finish stainless steel location hole 104, complete processing to stainless steel location hole 104；With
Tetra- sword wolfram steel milling cutter roughing package position slot 101 of sword diameter Φ 1.5mmSTK, then package position is processed with the drill bit of sword diameter Φ 1mm
The clear angle of slot；
7) it as shown in Fig. 6 a, Fig. 6 b, is positioned on BSTM618 grinding machine with side 105 and upper surface 102, is clamped with block,
Lower surface is finished with 2000# wolfram steel grinding wheel, guarantees surface roughness 1.6um and flatness 0.02；With side 105 and lower surface
106 positioning, are clamped with block, finish upper surface 102, guarantee surface roughness 1.6um and flatness 0.02；
8) as shown in fig. 7, being compressed in YCM76 CNC machine with side one side positioning and briquetting, with stainless steel location hole 104
On the basis of, with new tetra- sword wolfram steel milling cutter roughing package position slot 101 of sword diameter Φ 1.5mmSTK, tetra- sword of sword diameter Φ 1mm STK
Wolfram steel milling cutter semifinishing package position slot side and bottom surface finish envelope with new tetra- sword wolfram steel milling cutter of sword diameter Φ 1mm STK
Holding position slot side and bottom surface guarantee slot dimensional tolerance.
Since semiconductor packaging device core part is also easy to produce surface scratching, off-dimension, slot in process
Interior knife mark is thick, easily-deformable, and peek material easily collapses the problems such as scarce.Present invention process finishes release internal stress using CNC twice, then
Cooperate grinding machine, not only guaranteed the size, surface smoothness and position degree of package position slot, but meet simultaneously integral planar degree with it is parallel
Degree requires, and meets the needs of client is to series parts quality and friendship phase, reduces production cost, go wrong early period debugging cycle
It is short, it is stable, production efficiency is improved, ensure that being normally carried out for production.
The present invention accomplishes the stress that is released effectively of process in machining process arrangement, maximizes and reduces and avoid finishing
The easily-deformable problem of peek material during work guarantees the consistency of processing, simplifies production process, reduces occupied area, drop
Low processing cost, improves the flexibility and adaptability of product, is suitble to the production of multi items similar material part small batch.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
The above is only a specific embodiment of the present invention, but scope of protection of the present invention is not limited thereto, any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to protection scope described in claim.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
Claims (10)
1. the processing method of core part on semiconductor packaging device, it is characterised in that: comprise the steps of:
1) prepare a rectangular Peek plate, with side and the positioning of upper surface asperities, clamping on vertical knee-type milling machine bench vice, use sword
Diameter Φ 20mm wolfram steel finger cutter roughing lower surface guarantees surface roughness 3.2um；Part is overturn, with side and lower surface
Asperities positioning clamps, roughing upper surface, guarantees surface roughness 3.2um；With the positioning of upper and lower surfaces asperities, clamp,
Roughing side guarantees surface roughness 3.2um；
2) it is positioned on grinding machine with side and upper surface asperities, is clamped with block, with wolfram steel grinding wheel roughing lower surface, guaranteed thick
Rugosity 1.6um；Part is overturn, is positioned, is clamped with block, roughing upper surface, thickness stays 0.1mm with side and lower surface asperities
Surplus；
3) it is positioned on lathe with accurate bench vice with pressing from both sides position one side and both ends of the surface, is clamped with pressing from both sides the another side of position, first use sword diameter Φ
Four blade milling cutter of 10mm stainless steel processes upper surface, then is revived the bottom of formula fluted drill auger shell pit on an upper with diameter of phi 3.2mm
Hole, and with M4 screw tap tapping, complete the processing of threaded hole；Then four blade milling cutter milling shape of sword diameter Φ 10mm stainless steel is used, is used
Tetra- sword wolfram steel milling cutter roughing bolt hole of sword diameter Φ 4mmSTK andAnd the bottom outlet of stainless steel location holeAgain with the new knife finishing of sword diameter Φ 4mmWithSmart hole；With diameter of phi 2.2mm Soviet Union formula
Fluted drill bores the bottom outlet of black photosensitive origin, the dress of the drill bit processing Φ 3mm black photosensitive origin of diameter of phi 3mm on an upper
Distribution；
4) it is positioned, is clamped with pressing from both sides the another side of position, with sword diameter Φ with pressing from both sides position one side and both ends of the surface with accurate bench vice on lathe
Four blade milling cutter of 10mm stainless steel finishes lower surface, guarantees 7.55 ± 0.05mm of size；
5) stainless steel bushing is installed on stainless steel location hole bottom outlet, black PEEK circle is installed on the bottom outlet of black photosensitive origin
Column material completes the processing to black photosensitive origin；
6) it is positioned on lathe with accurate bench vice with pressing from both sides position one side and both ends of the surface, is clamped with pressing from both sides the another side of position, first use sword diameter Φ
The stainless steel bushing of four blade milling cutter roughing stainless steel location hole of 3mm wolfram steel, then with new four blade milling cutter of sword diameter Φ 3.0mm wolfram steel
Stainless steel location hole is finished, the processing to stainless steel location hole is completed；Slightly added with tetra- sword wolfram steel milling cutter of sword diameter Φ 1.5mmSTK
Work package position slot, then the clear angle of package position slot is processed with the drill bit of sword diameter Φ 1mm；
7) it is positioned on grinding machine with side and upper surface, is clamped with block, finish lower surface with wolfram steel grinding wheel, guarantee that surface is thick
Rugosity 1.6um and flatness 0.02；It is positioned with side and lower surface, is clamped with block, finish upper surface, guarantee rough surface
Spend 1.6um and flatness 0.02；
8) it is compressed on lathe with side one side positioning and briquetting, on the basis of stainless steel location hole, with new sword diameter Φ
Tetra- sword wolfram steel milling cutter roughing package position slot of 1.5mmSTK, tetra- sword wolfram steel milling cutter semifinishing package position of sword diameter Φ 1mmSTK
Slot side and bottom surface guarantee slot with new tetra- sword wolfram steel milling cutter of sword diameter Φ 1mmSTK finishing package position slot side and bottom surface
Dimensional tolerance.
2. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
1), prepare a rectangle 150mm × 160mm × 7.75mm Peek plate.
3. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
1), vertical knee-type milling machine is 16SS vertical knee-type milling machine.
4. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
2), grinding machine is BSTM618 grinding machine.
5. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step 2)
With step 7), wolfram steel grinding wheel is 2000# wolfram steel grinding wheel.
6. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
3), lathe is YCM76CNC lathe.
7. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
4), lathe is YCM76CNC lathe.
8. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
6), lathe is YCM76CNC lathe.
9. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
7), grinding machine is BSTM618 grinding machine.
10. the processing method of core part on semiconductor packaging device according to claim 1, it is characterised in that: step
8), lathe is YCM76CNC lathe.
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| CN111730297A (en) * | 2020-07-08 | 2020-10-02 | 科瑞自动化技术（苏州）有限公司 | Manufacturing method of core part of flying probe detection equipment |
| CN111730296A (en) * | 2020-07-07 | 2020-10-02 | 科瑞自动化技术（苏州）有限公司 | Processing method of hard disk test equipment core parts |
| CN111941009A (en) * | 2020-08-18 | 2020-11-17 | 江苏兴达智能制造有限公司 | Machining method of robot moving and traveling mechanism |
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| CN111730296B (en) * | 2020-07-07 | 2022-01-28 | 科瑞自动化技术（苏州）有限公司 | Processing method of hard disk test equipment core parts |
| CN111730297A (en) * | 2020-07-08 | 2020-10-02 | 科瑞自动化技术（苏州）有限公司 | Manufacturing method of core part of flying probe detection equipment |
| CN111730297B (en) * | 2020-07-08 | 2022-01-28 | 科瑞自动化技术（苏州）有限公司 | Manufacturing method of core part of flying probe detection equipment |
| CN111730298A (en) * | 2020-07-10 | 2020-10-02 | 科瑞自动化技术（苏州）有限公司 | Processing method of core parts of capsule machine equipment of medical equipment |
| CN111730298B (en) * | 2020-07-10 | 2022-01-28 | 科瑞自动化技术（苏州）有限公司 | Processing method of core parts of capsule machine equipment of medical equipment |
| CN111941009A (en) * | 2020-08-18 | 2020-11-17 | 江苏兴达智能制造有限公司 | Machining method of robot moving and traveling mechanism |
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| CN109108578B (en) | 2020-05-19 |
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