CN109068484A - A kind of sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test - Google Patents
A kind of sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test Download PDFInfo
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- CN109068484A CN109068484A CN201811249565.8A CN201811249565A CN109068484A CN 109068484 A CN109068484 A CN 109068484A CN 201811249565 A CN201811249565 A CN 201811249565A CN 109068484 A CN109068484 A CN 109068484A
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- circuit board
- hole
- flexible circuit
- mems sensor
- component side
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Abstract
The invention discloses a kind of sensor arrays of complicated interface pressure fluctuations beneath turbulent boundary lay test, are related to turbulence driver the field of test technology, comprising: the MEMS sensor of predetermined quantity bottom entering tone, flexible circuit board, steel disc；Flexible circuit board includes component side and welding surface, is routed in component side and the welding surface, arranges component in component side；Each MEMS sensor is welded on the component side of flexible circuit board according to the predetermined position of circuit design, and the first sound hole corresponding with the bottom tone-entering hole of MEMS sensor is provided on flexible circuit board；Steel disc is fixed on the welding surface of flexible circuit board, and the second sound hole corresponding with the bottom tone-entering hole of MEMS sensor is provided on steel disc.Surfacing model interface is realized by itself, is conducive to control errors.
Description
Technical field
The present invention relates to turbulence driver the field of test technology, especially a kind of complicated interface pressure fluctuations beneath turbulent boundary lay is surveyed
The sensor array of examination.
Background technique
Pressure fluctuations beneath turbulent boundary lay is a kind of arbitrary excitation power source of EDS maps, needs to be retouched using statistical method
It states.The F-K spectra of turbulence pulsation pressure quantitatively describes the time and space usage feature of fluctuation pressure and structural interaction.
Once the power that turbulence pulsation pressure is defeated by structure determines, considers further that the coupling of structure Yu interior outer fluid, that is, can determine knot
The vibration and sound radiation of structure.Underwater sailing body surface three dimension flow regime and its flowing excitation load, especially attached body and upper layer
It builds in close relations with the sharp load of the stream of hull binding site and the sharp hydrodynamic noise of underwater sailing body stream.It is both sail body hydrodynamic(al)
The advanced problems of mechanics study, and be the key technology for having to solve.
For the hydrodynamic noise of accurate forecast and control underwater sailing body, the attached body of sail body and superstructure are needed to be grasped
There are the wave number of lack of balance pressure fluctuations beneath turbulent boundary lay when potential barrier barometric gradient-frequency spectral properties for equal curved surfaces.It is external
When being mainly based upon planar rigidity interface turbulence pulsation pressure to the quantitative description of pressure fluctuations beneath turbulent boundary lay arbitrary excitation power
Sky measurement provides its flow direction and lateral correlation, space-time transformation is recycled to provide its wave number-frequency spectrum.Such method mainly solves
Certainly areal model and structure line style Curvature varying not large-sized model exciting force problem, body attached for sail body, superstructure and hull
For the biggish model of the models Curvature varying such as binding site, the pressure fluctuations beneath turbulent boundary lay frequency that is obtained using flat plate model
Rate-wave-number spectrum may bring large error.The country is more when plate or small curvature model hydrodynamic load are studied in experimental analysis
The survey of pressure fluctuations beneath turbulent boundary lay F-K spectra is carried out using scatterplot sensor or hardboard sensor array in the lab
Examination, the array can carry out arbitrary surface turbulent boundary surging pressure test.
The especially prominent body in underwater sailing body surface, attached body and superstructure and hull binding site line style are complicated, have certain
The curvature of space, need to guarantee test sensor array fit in body surface completely, do not influence surface linear.Existing hardboard test
Array only can be suitably used for plane or deep camber similar to the test of areal model, the spacing of sensor cause greatly spatial resolution compared with
It is low, seriously affect the forecast precision that underwater sailing body stream swashs hydrodynamic noise.Furthermore hot-wire array uses top into sonic transducer,
Array surface is flushed using the plastic plate contour with circuit components, it is desirable that machining accuracy is high but there are still more seams on surface
Gap.
Summary of the invention
The present invention regarding to the issue above and technical need, proposes a kind of complicated interface pressure fluctuations beneath turbulent boundary lay test
Sensor array.
Technical scheme is as follows:
A kind of sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test, the sensor array includes: pre-
The MEMS sensor of fixed number amount bottom entering tone, flexible circuit board, steel disc；
The flexible circuit board includes component side and welding surface, is routed in the component side and the welding surface, described
Component side arranges component；
Each MEMS sensor is welded on the component side of the flexible circuit board according to the predetermined position of circuit design,
The first sound hole corresponding with the bottom tone-entering hole of the MEMS sensor is provided on the flexible circuit board；
The steel disc is fixed on the welding surface of the flexible circuit board, is provided on the steel disc and the MEMS sensor
Corresponding second sound hole of bottom tone-entering hole.
Its further technical solution are as follows: the MEMS sensor is paster type encapsulation, the bottom of the MEMS sensor
Tone-entering hole is affixed on the component side of the flexible circuit board.
Its further technical solution are as follows: first sound hole is greater than the bottom tone-entering hole, second sound hole
More than or equal to first sound hole.
Its further technical solution are as follows: the MEMS sensor is connected with signal and draws connector, and the signal extraction connects
Head is used for connection signal Acquisition Instrument；
The signal of each MEMS sensor draws connector centralized arrangement in the presumptive area of the component side.
Its further technical solution are as follows: bolt hole is provided on the flexible circuit board, the bolt hole is arranged in institute
The position other than the presumptive area of connector is drawn in the predetermined position and the signal of stating MEMS sensor；
On the component side, the periphery of the bolt hole is provided with reinforcement protrusion；
The bolt hole corresponding position is provided with bolt hole chamfering, the size of the bolt hole chamfering on the steel disc
It is matched with flat head screw, the gap position between the flat head screw and the bolt hole chamfering is smoothed out using pointing.
Its further technical solution are as follows: the component side of the flexible circuit board is buried in the preset of tested complicated interface
In groove；
In the model accurately slotted, the tested complicated interface refers to model shell, offers spiral shell on the model shell
Keyhole, Signal connector through-hole and element recess；
In the model non-precisely slotted, the model further includes the mould with the point position surface line style of the model
Type substrate, the tested complicated interface refer to the dummy substrate, and bolt hole, Signal connector through-hole are offered on the dummy substrate
And element recess；
It is corresponding that the Signal connector through-hole and the signal draw the presumptive area of connector, the element recess with it is described
The predetermined position of MEMS sensor is corresponding.
The method have the benefit that:
By selecting the MEMS sensor of bottom entering tone, it is attached to the component side of flexible circuit board, by bottom entering tone
The steel disc that the whole plate of MEMS sensor, flexible circuit board and another side arrangement is reinforced realizes surfacing model interface, favorably
In control errors, measuring accuracy and reliability are improved by optimizing space layout, is easily installed disassembly, can be repeated several times makes
With.
Detailed description of the invention
Fig. 1 is the sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test provided by one embodiment of the present invention
Schematic diagram.
Fig. 2 is the schematic diagram of the flexible circuit board component side of sensor array provided by one embodiment of the present invention.
Fig. 3 is the schematic diagram in the steel disc face of sensor array provided by one embodiment of the present invention.
Fig. 4 is the sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test provided by one embodiment of the present invention
Scheme of installation.
Fig. 5 is the schematic diagram of dummy substrate provided by one embodiment of the present invention.
Specific embodiment
The following further describes the specific embodiments of the present invention with reference to the drawings.
Fig. 1 is the sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test provided by one embodiment of the present invention
Schematic diagram, as shown in Figure 1, the sensor array includes: the MEMS sensor 1 of predetermined quantity bottom entering tone, flexible circuit board
(English: Flexible Printed Circuit, referred to as: FPC) 2, steel disc 3.
Flexible circuit board 2 includes component side and welding surface, is routed in component side and welding surface, arranges first device in component side
Part.Component side is used for mounting related components, and welding surface is the back side of component side.
Each MEMS sensor 1 is welded on the component side of flexible circuit board 2, flexible electrical according to the predetermined position of circuit design
First sound hole 21 corresponding with the bottom tone-entering hole 11 of MEMS sensor 1 is provided on road plate 2.
Optionally, MEMS sensor 1 is paster type encapsulation, and the bottom tone-entering hole 11 of MEMS sensor 1 is affixed on flexible circuit
On the component side of plate 2.
Flexible circuit board 2 has preferable pliability, can be born millions of times with free bend, winding, folding
Dynamic bending is without losing.
Due to MEMS sensor 1 be paster type encapsulation, the welding surface and element of MEMS sensor 1 in the same face, and
MEMS sensor 1 is bottom entering tone, therefore the tone-entering hole of MEMS sensor 1 is attached on the component side of flexible circuit board 2.
In practical applications, the component on flexible circuit board 2 is all made of paster type encapsulation under normal circumstances.
In practical applications, peripheral cell needed for also will be installed circuit on flexible circuit board 2, flexible circuit board 2 can be pre-
Circuit design first is carried out according to circuit diagram, component encapsulation, installation requirements etc., controls the spacing of each MEMS sensor 1, is collected
Middle all components of arrangement.The fabric swatch of flexible circuit board 2 designs, and component size, the first sound hole, bolt hole etc. are in flexible electrical
It reserves and embodies on road plate 2, whole plate reinforcement is carried out during printed circuit board and component side layout is reinforced, and complete bolt hole, the
The punching of one sound hole, in the welding process, whole process are machine positioning weldings, and MEMS sensor 1 and peripheral circuit will side by side
It is affixed on flexible circuit board 2.
For the type selecting of MEMS sensor 1, need to be surveyed according to complicated interface pressure fluctuations beneath turbulent boundary lay wave number-frequency spectrum
Try index request, in type selecting, need to meet entering tone bore dia is small, size sensor is small, bandwidth range is big, frequency response fluctuate it is small,
The good requirements of type selecting of frequency spectrum-phase equalization.Illustratively, entering tone bore dia is less than 0.4mm, and sensor is wide to be less than 4mm, bandwidth
10Hz~10kHz, frequency response fluctuation are less than ± 1dB to range again, and frequency spectrum consistency is less than ± 0.5dB, and phase equalization is less than ± 2 °.
Steel disc 3 is fixed on the welding surface of flexible circuit board 2, and the bottom tone-entering hole with MEMS sensor 1 is provided on steel disc 3
11 corresponding second sound holes 31.
Steel disc 3 is that whole plate corresponding with flexible circuit board 2 reinforces steel disc, and steel disc 3 is fixed on the welding of flexible circuit board 2
Face, had not only had adjusted the flexibility of flexible circuit board 2, but also improved the intensity of flexible circuit board 2, so that the weldering of flexible circuit board 2
Junction (back side) finishing, ensure that sensor array fits in body surface completely, does not need additional measures and carries out surfacing,
It ensure that surface line style.The one side of sensor array, as the new interface of testee, is guaranteed by smooth reinforcement steel disc
The fairing at interface is smooth.
Optionally, steel disc 3 can select 304 stainless steels.
Optionally, the first sound hole 21 is greater than bottom tone-entering hole 11, and the second sound hole 31 is greater than or equal to the first sound hole
21.It ensure that and the bottom tone-entering hole 11 of MEMS sensor 1 is not blocked.
MEMS sensor 1 is connected with signal and draws connector, and signal draws connector and is used for connection signal Acquisition Instrument.
The signal of sensor array in the embodiment of the present invention needs to be introduced into analysis in signal sampler and handles, therefore passes
The signal of sensor needs to draw.
In conjunction with reference Fig. 2, the signal of each MEMS sensor 1 draws connector centralized arrangement in the presumptive area 22 of component side
It is interior.
Optionally, in conjunction with reference Fig. 2, bolt hole is provided on flexible circuit board 2, bolt hole is arranged in MEMS sensor 1
Predetermined position and signal draw connector presumptive area 22 other than position, bolt hole is through-hole.
On the component side of flexible circuit board 2, the periphery of bolt hole is provided with reinforcement protrusion 23.
As shown in figure 3, bolt hole corresponding position is provided with bolt hole chamfering 32 on steel disc 3, bolt hole chamfering 32
Size is matched with flat head screw, and the gap position between flat head screw and bolt hole chamfering 32 is smoothed out using pointing.
The front of steel disc 3 is arranged with the sound hole linear array distribution 33 of the second sound hole 31, two neighboring second sound hole 31
Compartment is away from 34.
Bolt hole chamfering 32 is set on steel disc 3, and when being to guarantee installation, flat head screw is flushed with steel disc 3, to protect
Card testee surface flushes.
Sensor array is fixed by flat head screw and bolt hole cooperation, so that sensor array convenient disassembly,
It may be reused.
The component side of flexible circuit board 2 is buried in the preset-groove of tested complicated interface.
In the model accurately slotted, tested complicated interface refers to model shell, and bolt hole, signal are offered on model shell
Tab through-hole and element recess.
Optionally, the model accurately slotted can be certain thickness wooden model.
For the model accurately slotted, the sensor array in the embodiment of the present invention is directly installed on model shell.
In the model non-precisely slotted, as shown in figure 4, model further includes the point position surface line style with model
Dummy substrate 4, tested complicated interface refer to dummy substrate 4, and in conjunction with reference Fig. 5, bolt hole 41, signal are offered on dummy substrate 4
Tab through-hole 42 and element recess 43.
Optionally, the model non-precisely slotted can not accurately slot, such as GRP mold, for the mould non-precisely slotted
Type can carry out modularization substrate design, and according to sensor array size and tested model point position, processing has tested model
Point position surface line style simultaneously has certain thickness dummy substrate 4, and 4 surface of dummy substrate opens up element recess, spiral shell according to this
Bolt reinforces position groove, bolt hole, Signal connector through-hole, and optionally, dummy substrate 4 can be metal substrate.
Signal connector through-hole 42 is corresponding with the signal extraction presumptive area 22 of connector, element recess 43 and MEMS sensor 1
Predetermined position it is corresponding.
For the model non-precisely slotted, as shown in figure 4, sensor array, dummy substrate 4 in the embodiment of the present invention with
Model shell 5 is fixed together.
Optionally, the embodiment of the present invention also provides a kind of design installation procedure of sensor array:
The first step, Component selection.According to the basic Type Selection Principle of microphone elements and the packing forms of bottom entering tone, selection
A silicon micro-microphone.Illustratively, selected model SPU1410LR5H-QB, 1kHz sensitivity is -38dBV/pa,
In 10Hz~10kHz bandwidth range, deviation is less than ± 1dB, and component size is long generous 3.76mm*3.00mm*1.10mm, acoustic aperture
Diameter is 0.25mm.
Second step, circuit design.According to circuit diagram and size requirement, PCB design is carried out.Between sensor unit
Spacing determines that the analysis upper limit of array wave-number domain, the quantity of sensor determine the resolution ratio of wave-number domain.Illustratively, control sensing
Device unit (i.e. MEMS sensor 1) spacing is 1.2mm, then acoustic aperture spacing is 4.2mm；Sensor unit quantity is 17, then acoustic aperture
Overall length be 71.2mm, reasonable Arrangement signal draw connector and installation bolt hole position, diameter 4mm, PCB length and width be 100mm*
50mm。
Third step, FPC and reinforcement.Sensor array uses flexible circuit board 2, and another side is added using the whole plate of 0.2mm thickness
Strong steel disc 3, opens the second sound hole of diameter 0.3mm in the sensor acoustic aperture corresponding position of steel disc 3.The component side part FR-4
Strengthening stud hole, and reinforce 3 corresponding position of steel disc in whole plate and open up bolt hole chamfering.
4th step, array installation.It is distributed according to array sizes and element, opens element recess, bolt in tested model surface
Reinforce position groove and Signal connector through-hole, fixed hot-wire array, bolt and array seam and array are installed with flat head screw
Guarantee surfacing with model surface joint filler.
Above-described is only preferred embodiments of the invention, and present invention is not limited to the above embodiments.It is appreciated that this
The other improvements and change that field technical staff directly exports or associates without departing from the spirit and concept in the present invention
Change, is considered as being included within protection scope of the present invention.
Claims (6)
1. a kind of sensor array of complicated interface pressure fluctuations beneath turbulent boundary lay test, which is characterized in that the sensor array
Column include: the MEMS sensor of predetermined quantity bottom entering tone, flexible circuit board, steel disc；
The flexible circuit board includes component side and welding surface, is routed in the component side and the welding surface, in the element
Component is arranged in face；
Each MEMS sensor is welded on the component side of the flexible circuit board according to the predetermined position of circuit design, described
The first sound hole corresponding with the bottom tone-entering hole of the MEMS sensor is provided on flexible circuit board；
The steel disc is fixed on the welding surface of the flexible circuit board, and the bottom with the MEMS sensor is provided on the steel disc
Corresponding second sound hole of portion's tone-entering hole.
2. sensor array according to claim 1, which is characterized in that the MEMS sensor is paster type encapsulation, institute
The bottom tone-entering hole for stating MEMS sensor is affixed on the component side of the flexible circuit board.
3. sensor array according to claim 1, which is characterized in that first sound hole is greater than the bottom entering tone
Hole, second sound hole are greater than or equal to first sound hole.
4. sensor array according to claim 1, which is characterized in that the MEMS sensor is connected with signal extraction and connects
Head, the signal draw connector and are used for connection signal Acquisition Instrument；
The signal of each MEMS sensor draws connector centralized arrangement in the presumptive area of the component side.
5. sensor array according to claim 4, which is characterized in that it is provided with bolt hole on the flexible circuit board,
The position other than the predetermined position of the MEMS sensor and the presumptive area of signal extraction connector is arranged in the bolt hole
It sets；
On the component side, the periphery of the bolt hole is provided with reinforcement protrusion；
It is provided with bolt hole chamfering on the steel disc with the bolt hole corresponding position, the size of the bolt hole chamfering and flat
Head screw matching, the gap position between the flat head screw and the bolt hole chamfering are smoothed out using pointing.
6. sensor array according to claim 5, which is characterized in that the component side of the flexible circuit board be buried in
In the preset-groove of tested complicated interface；
In the model accurately slotted, the tested complicated interface refers to model shell, offered on the model shell bolt hole,
Signal connector through-hole and element recess；
In the model non-precisely slotted, the model further includes the model lining of the point position surface line style with the model
Bottom, the tested complicated interface refer to the dummy substrate, and bolt hole, Signal connector through-hole and member are offered on the dummy substrate
Part groove；
The Signal connector through-hole is corresponding with the signal extraction presumptive area of connector, and the element recess and the MEMS are passed
The predetermined position of sensor is corresponding.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114166416A (en) * | 2021-12-08 | 2022-03-11 | 中国船舶科学研究中心 | Correction method for turbulent pulsating pressure |
| CN115575081A (en) * | 2022-12-09 | 2023-01-06 | 中国空气动力研究与发展中心低速空气动力研究所 | Two-dimensional lattice design method and device for wind tunnel pulsating pressure measurement |
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