CN109031745B - Display module to be cut and manufacturing method thereof - Google Patents

Display module to be cut and manufacturing method thereof Download PDF

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Publication number
CN109031745B
CN109031745B CN201811007273.3A CN201811007273A CN109031745B CN 109031745 B CN109031745 B CN 109031745B CN 201811007273 A CN201811007273 A CN 201811007273A CN 109031745 B CN109031745 B CN 109031745B
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back plate
layer
display panel
display module
cut
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CN109031745A (en
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宋月龙
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The invention provides a display module to be cut and a manufacturing method thereof, wherein the display module to be cut comprises a supporting layer, a display panel positioned on the supporting layer and a backboard layer positioned between the supporting layer and the display panel; and the shape of the back plate layer in the orthographic projection of the display panel is the same as that of the target display module. According to the invention, the back plate layer is set to be in the same shape as the target display module, so that the cutting machine processes the display module to be cut by taking the outer ring of the back plate layer as the cutting channel, thereby eliminating the dust accumulation of the back plate layer and reducing the processing time.

Description

Display module to be cut and manufacturing method thereof
Technical Field
The invention relates to the field of panel manufacturing, in particular to a display module to be cut and a manufacturing method thereof.
Background
In recent years, display technology has been rapidly developed, and flat panel displays have been increasingly developed into people's daily lives instead of bulky CRT (Cathode Ray Tube) displays. Currently, commonly used flat panel displays include LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) displays.
At present, a display screen of common equipment, such as a mobile phone, a tablet computer or a notebook computer, is small, and the cost of a display panel photomask process is high; therefore, the display screen of the electronic device commonly seen in the prior art is usually cut from a larger display panel.
In the prior art, the display module to be cut comprises a supporting structure, a back plate and a display panel which are stacked in sequence, and the display module to be cut is required to be assembled after being cut to form a finished product because the shape of the display module to be cut is different from that of a target product.
In the cutting process, the cutting of the back plate layer can cause the deposition of dust on the material, which adheres to the display panel, and affects the display effect and the service life of the display panel.
Therefore, a display panel is needed to solve the above problems.
Disclosure of Invention
The invention provides a display module to be cut and a manufacturing method thereof, which aim to solve the technical problem of poor display effect of the conventional display panel.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the invention provides a display module to be cut, which comprises:
a support layer;
a display panel on the support layer; and
a back plate layer located between the support layer and the display panel, the back plate layer being located within the display panel in an orthographic projection of the display panel;
and the shape of the back plate layer in the orthographic projection of the display panel is the same as that of the target display module.
In the display module to be cut, the display module to be cut further comprises a first alignment mark, and the supporting layer, the back plate layer and the display panel are aligned according to the first alignment mark.
In the display module to be cut, the support layer comprises at least two first alignment marks, the back plate layer comprises at least two first alignment marks, and the display panel comprises at least two first alignment marks;
wherein the first alignment mark on the support layer is aligned with the first alignment mark on the back plate layer and the first alignment mark on the display panel to define the positions of the support layer, the back plate layer and the display panel.
In the display module to be cut, the backboard layer comprises a first backboard and a second backboard, the first backboard is provided with the first alignment mark, and the second backboard is provided with the second alignment mark;
the second alignment mark is aligned with the first alignment mark to define the positions of the first back plate and the second back plate.
In the display module to be cut, the orthographic projection of the back plate layer on the supporting layer is positioned in the supporting layer.
In the display module to be cut, the display module to be cut further comprises optical cement;
the optical cement is formed between the support layer and the back plate layer, and between the display panel and the back plate layer.
The invention also provides a manufacturing method of the display module to be cut, which comprises the following steps:
providing a supporting layer, a back plate layer and a display panel;
arranging at least two first alignment marks on the supporting layer, the back plate layer and the display panel, and acquiring an outer ring track of the back plate layer according to a scanning device;
aligning and attaching the supporting layer, the back plate layer and the display panel according to the supporting layer, the back plate layer and the first alignment marks on the display panel, wherein the shape of the orthographic projection of the back plate layer on the display panel is the same as that of a target display module;
and cutting the display module to be cut according to the outer ring track of the backboard layer to obtain a target display module.
In the manufacturing method of the display module to be cut, the backboard layer comprises a first backboard and a second backboard, the first alignment mark is formed on the first backboard, and the second alignment mark is formed on the second backboard;
the second alignment mark is aligned with the first alignment mark to define the positions of the first back plate and the second back plate.
In the manufacturing method of the display module to be cut, the orthographic projection of the back plate layer on the supporting layer is positioned in the supporting layer.
In the manufacturing method of the display module to be cut, the display module to be cut also comprises optical cement;
the optical cement is formed between the support layer and the back plate layer, and between the display panel and the back plate layer.
Has the advantages that: according to the invention, the back plate layer is set to be in the same shape as the target display module, so that the cutting machine processes the display module to be cut by taking the outer ring of the back plate layer as the cutting channel, thereby eliminating the dust accumulation of the back plate layer and reducing the processing time.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a diagram of a structure of a display module to be cut according to the present invention;
FIG. 2 is a projection view of a back plate layer on a display panel in the display module to be cut according to the present invention;
FIG. 3 is a top view of the structures of the display module to be cut according to the present invention;
FIG. 4 is a diagram of another layer structure of the display module to be cut according to the present invention;
FIG. 5 is a structural diagram of a back plate layer of the display module to be cut according to the present invention;
FIG. 6 is a diagram illustrating a method for manufacturing a display module to be cut according to the present invention.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], are only referring to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
Fig. 1 shows a film structure diagram of a display module to be cut, where the display module to be cut includes a support layer 10, a display panel 20, and a back plate layer 30.
The support layer 10 is located on the base of the display module to be cut, and is mainly used for supporting a structure located on the support layer 10.
The display panel 20 is located on the support layer 10, and preferably, the display panel 20 may be an LCD display screen, an OLED display screen, or another type of display screen, which is not limited in particular.
The back plate layer 30 is located between the support layer 10 and the display panel 20, as shown in fig. 2, the front projection of the back plate layer 30 on the display panel 20 is located in the display panel 20, that is, the area of the display panel 20 is larger than that of the back plate layer 30; the shape of the back plate layer 30 projected on the display panel 20 is the same as the shape of the target display module.
It can be understood that the cutting machine can process the display module to be cut by taking the curve L in the figure as a cutting track.
In the display module to be cut of the present invention, the display module to be cut includes a first alignment mark, that is, the support layer 10, the back plate layer 30 and the display panel 20 are aligned according to the first alignment mark.
In the present embodiment, the support layer 10 includes at least two first alignment marks, the back plate layer 30 includes at least two first alignment marks, and the display panel 20 includes at least two first alignment marks; wherein the first alignment mark on the support layer 10 is aligned with the first alignment mark on the back plate layer 30 and the first alignment mark on the display panel 20 to define the positions of the support layer 10, the back plate layer 30 and the display panel 20.
As shown in fig. 3, the supporting layer 10 includes four first alignment marks a1、B1、C1、D1The back plate layer 30 includes four first alignment marks A2、B2、C2、D2The display panel 20 comprises four first alignment marks A3、B3、C3、D3；
It can be understood that when the support layer 10, the back plate layer 30 and the display panel 20 are aligned and attached, first, the marks a in each layer structure are aligned; and so on, followed by the alignment of the marker B, C, D.
And finally, finishing the display module to be cut by taking the outer ring of the backboard layer 30 as a cutting track.
In this embodiment, the front projection of the back plate layer 30 on the support layer 10 is located in the support layer 10, that is, the area of the support layer 10 is larger than the area of the back plate layer 30.
As shown in fig. 1, in the display module to be cut of the present invention, the display module to be cut further includes an optical adhesive 40, where the optical adhesive 40 is formed between the supporting layer 10 and the back plate layer 30, and between the display panel 20 and the back plate layer 30; the support layer 10, the back plate layer 30 and the display panel 20 are bonded together by an optical adhesive 40; it is understood that the structure of the present invention may be, but is not limited to, one of the optical glues 40.
For the existing flexible display panel 20, because a part of the panel connected with the flexible circuit board needs to be bent to the inner side of the panel, the lower frame of the electronic device is reduced, and the screen occupation ratio is increased; in order to ensure the bending performance of the flexible panel, the back plate corresponding to the bending area needs to be removed;
as shown in fig. 4, in the display module to be cut of the present invention, the back plate layer 30 includes a first back plate 301 and a second back plate 302, and a certain distance exists between the first back plate 301 and the second back plate 302, where the distance corresponds to a bending area of the flexible panel; it will be appreciated that the backing layer 30 is present in the bend region of the existing flexible panel.
As shown in fig. 5, the first alignment mark is formed on the first backplane 301, and at least two second alignment marks are formed on the second backplane 302; in this embodiment, two second alignment marks E are formed on the second backplane 3022、F2By mixing E2And C2Is aligned, F2And D2Aligning to define the positions of the first back plate 301 and the second back plate 302; in this embodiment, the shapes of the first alignment mark and the second alignment mark may be, but are not limited to, a square, and may also be a rectangle, a triangle, or other rulesThe shape of (2).
It can be understood that, since the first alignment mark and the second alignment mark are on the same layer, the positional relationship between the second backplane 302 and the first backplane 301 can only be defined by the horizontal or vertical spacing between the first alignment mark and the second alignment mark;
in other words, in the embodiment, the first backplane 301 and the second backplane 302 are used as the cutting tracks of the display module to be cut, and the display module to be cut is directly processed, so that the dust accumulation of the backplane layer 30 is eliminated, and the processing time is reduced;
it can be understood that, since there is a certain distance between the first back plate 301 and the second back plate 302, the compensation device is required to compensate the distance between the first back plate 301 and the second back plate 302, so that the cutting device cuts along the curve L in fig. 2.
The invention also provides a manufacturing method of the display module to be cut, and as shown in fig. 6, the manufacturing method of the display module to be cut comprises the following steps:
s10, providing a supporting layer, a back plate layer and a display panel.
S20, arranging at least two first alignment marks on the supporting layer, the back plate layer and the display panel, and acquiring an outer ring track of the back plate layer according to a scanning device;
in this step, the supporting layer 10 is located on the base of the display module to be cut, and is mainly used for supporting the structure located on the supporting layer 10; the display panel 20 is located on the supporting layer 10, and preferably, the display panel 20 may be an LCD display screen, an OLED display screen, or another type of display screen, which is not limited in particular;
in the present embodiment, the back plate layer 30 is located between the support layer 10 and the display panel 20, as shown in fig. 2, the front projection of the back plate layer 30 on the display panel 20 is located in the display panel 20, that is, the area of the display panel 20 is larger than the area of the back plate layer 30; the shape of the back plate layer 30 projected on the display panel 20 is the same as the shape of the target display module; it can be understood that the outer ring track L of the backboard layer is obtained according to the scanning device, that is, the cutting machine can process the display module to be cut by taking the curve L in fig. 2 as a cutting track.
S30, aligning and attaching the support layer, the back plate layer 30 and the display panel according to the first alignment marks on the support layer, the back plate layer 30 and the display panel;
in this step, as shown in fig. 3, four first alignment marks a are disposed on the support layer 101、B1、C1、D1Four first alignment marks A are arranged on the back plate layer 302、B2、C2、D2Four first alignment marks A are arranged on the display panel 203、B3、C3、D3；
It can be understood that when the support layer 10, the back plate layer 30 and the display panel 20 are aligned and attached, first, the marks a in each layer structure are aligned; and so on, then the alignment of the mark B, C, D is performed to define the positions of the support layer 10, the back sheet layer 30 and the display panel 20;
as shown in fig. 1, in this step, the display module to be cut further includes an optical adhesive 40, where the optical adhesive 40 is formed between the support layer 10 and the back plate layer 30, and between the display panel 20 and the back plate layer 30; the support layer 10, the back plate layer 30 and the display panel 20 are bonded together by an optical adhesive 40; it is understood that the structure of the present invention may be, but is not limited to, one of the optical glues 40.
S40, cutting the display module to be cut according to the outer ring track of the backboard layer to obtain a target display module;
since the outer track of the back plate layer 30 is the same as that of the target display module, the outer track of the back plate layer 30 is used as a cutting track of a cutting machine to obtain the target display module.
In the manufacturing method of the display module to be cut, for the flexible display panel 20, as part of the panel connected with the flexible circuit board needs to be bent to the inner side of the panel, the lower frame of the electronic equipment is reduced, and the screen occupation ratio is increased; in order to ensure the bending performance of the flexible panel, the back plate corresponding to the bending area needs to be removed;
as shown in fig. 4, in the display module to be cut of the present invention, the back plate layer 30 includes a first back plate 301 and a second back plate 302, and a certain distance exists between the first back plate 301 and the second back plate 302, where the distance corresponds to a bending area of the flexible panel; it will be appreciated that in the bending region of the existing flexible panel there is a backing layer 30;
in this embodiment, two second alignment marks E are disposed on the second backplane 3022、F2By mixing E2And C on the first back plate 3012Is aligned, F2And D2Aligning to define the positions of the first back plate 301 and the second back plate 302;
as can be understood, since the first alignment mark and the second alignment mark are on the same layer, the position relationship between the second backplane 302 and the first backplane 301 is defined by the horizontal or vertical spacing between the first alignment mark and the second alignment mark; the back sheet layer 30 is then bonded to the support layer 10 and the display panel 20.
It can be understood that, since there is a gap between the first back plate 301 and the second back plate 302, the compensation device is required to compensate the gap between the first back plate 301 and the second back plate 302, so that the cutting device cuts along the curve L in fig. 2.
The invention provides a display module to be cut and a manufacturing method thereof, wherein the display module to be cut comprises a supporting layer, a display panel positioned on the supporting layer and a backboard layer positioned between the supporting layer and the display panel; and the shape of the back plate layer in the orthographic projection of the display panel is the same as that of the target display module. According to the invention, the back plate layer is set to be in the same shape as the target display module, so that the cutting machine processes the display module to be cut by taking the outer ring of the back plate layer as the cutting channel, thereby eliminating the dust accumulation of the back plate layer and reducing the processing time.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (9)

1. The utility model provides a treat cutting display module assembly which characterized in that includes:
a support layer;
a display panel on the support layer; and
the back plate layer is positioned between the supporting layer and the display panel, the orthographic projection of the back plate layer on the display panel is positioned in the display panel, and the shape of the orthographic projection of the back plate layer on the display panel is the same as that of the target display module;
the display module to be cut further comprises a first alignment mark, and the supporting layer, the back plate layer and the display panel are aligned according to the first alignment mark.
2. A display module as claimed in claim 1, wherein the support layer comprises at least two first alignment marks, the back plate layer comprises at least two first alignment marks, and the display panel comprises at least two first alignment marks;
wherein the first alignment mark on the support layer is aligned with the first alignment mark on the back plate layer and the first alignment mark on the display panel to define the positions of the support layer, the back plate layer and the display panel.
3. The display module to be cut according to claim 2, wherein the back plate layer comprises a first back plate and a second back plate which are arranged oppositely, and the distance between the first back plate and the second back plate corresponds to the bending area of the display panel;
at least two first alignment marks are formed on the first backboard, at least two second alignment marks are formed on the second backboard, and one second alignment mark is aligned with one first alignment mark to limit the positions of the first backboard and the second backboard.
4. A display module as set forth in claim 1, characterized in that the orthographic projection of the backboard layer on the support layer is located within the support layer.
5. The display module to be cut as claimed in claim 1, wherein the display module to be cut further comprises an optical adhesive formed between the support layer and the back plate layer and between the display panel and the back plate layer.
6. A manufacturing method of a display module to be cut is characterized by comprising the following steps:
providing a supporting layer, a back plate layer and a display panel;
arranging at least two first alignment marks on the supporting layer, the back plate layer and the display panel, and acquiring an outer ring track of the back plate layer according to a scanning device;
aligning and attaching the supporting layer, the back plate layer and the display panel according to the supporting layer, the back plate layer and the first alignment marks on the display panel, wherein the shape of the orthographic projection of the back plate layer on the display panel is the same as that of a target display module;
and cutting the display module to be cut according to the outer ring track of the backboard layer to obtain a target display module.
7. The manufacturing method of the display module to be cut according to claim 6, wherein the back plate layer comprises a first back plate and a second back plate, and the distance between the first back plate and the second back plate corresponds to the bending area of the display panel;
at least two first alignment marks are formed on the first backboard, at least two second alignment marks are formed on the second backboard, and one second alignment mark is aligned with one first alignment mark to limit the positions of the first backboard and the second backboard.
8. The method for manufacturing a display module to be cut according to claim 6, wherein the orthographic projection of the back plate layer on the support layer is located in the support layer.
9. The method for manufacturing a display module to be cut according to claim 6, wherein the display module to be cut further comprises an optical adhesive, and the optical adhesive is formed between the support layer and the back plate layer and between the display panel and the back plate layer.
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CN111525016A (en) * 2020-04-20 2020-08-11 深圳市华星光电半导体显示技术有限公司 Display panel and manufacturing method thereof
CN113947994B (en) * 2020-07-15 2023-01-10 京东方科技集团股份有限公司 Display panel and display device
CN113707029A (en) * 2021-09-08 2021-11-26 业成科技（成都）有限公司 Flexible display module and manufacturing method thereof
CN114627762B (en) * 2022-03-09 2024-04-09 武汉华星光电半导体显示技术有限公司 Display module, attaching method thereof and mobile terminal

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