CN109004373A - A kind of high integration active integrated antenna module for the 5th third-generation mobile communication - Google Patents
A kind of high integration active integrated antenna module for the 5th third-generation mobile communication Download PDFInfo
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- CN109004373A CN109004373A CN201810824016.2A CN201810824016A CN109004373A CN 109004373 A CN109004373 A CN 109004373A CN 201810824016 A CN201810824016 A CN 201810824016A CN 109004373 A CN109004373 A CN 109004373A
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- 238000010295 mobile communication Methods 0.000 title claims abstract description 21
- 230000010354 integration Effects 0.000 title claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 34
- 238000001465 metallisation Methods 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 25
- 230000003071 parasitic effect Effects 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000003321 amplification Effects 0.000 claims description 4
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 4
- 230000000630 rising effect Effects 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000003786 synthesis reaction Methods 0.000 abstract description 2
- 238000003491 array Methods 0.000 abstract 1
- 238000012913 prioritisation Methods 0.000 description 5
- 238000001228 spectrum Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 238000013439 planning Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 230000004927 fusion Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
- H01Q19/104—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces using a substantially flat reflector for deflecting the radiated beam, e.g. periscopic antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
- H04B7/0413—MIMO systems
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Waveguide Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The present invention relates to wireless communication technology fields, more particularly to a kind of high integration active integrated antenna module for the 5th third-generation mobile communication, including 2 × 2 miniature antenna arrays, antennal interface, reference clock interface, power interface, serial interface, i/q signal interface, radio frequency front-end unit, transceiver unit, MCU unit, amplifier unit and Power Management Unit etc..Invention is directed to 3.3GHz~3.5GHz frequency range of 5G Mid Frequency, proposes a kind of novel antenna structure, designs a kind of circular polarisation miniature antenna by the methods of corner cut metal patch and metal-loaded patch, size is simple and compact；Antenna and circuit system integrated design can be freely composed extensive mimo antenna array according to different antenna topologies, realize antenna Multibeam synthesis.
Description
Technical field
The present invention relates to wireless communication technology fields more particularly to a kind of high integration for the 5th third-generation mobile communication to have
Resource integrated Anneta module.
Background technique
The mobile data flow continuing detonation that faces the future increases, and needs to develop future new era mobile communication-the
Five generations (5G) mobile communication, as the wireless communication intelligent network towards human information social demand after the year two thousand twenty.5G network
Not only there is higher rate, bigger bandwidth, larger capacity and support super large data traffic, but also to realize the more technologies of multi-service
Fusion meets the development need of the various businesses of the following super large data and high speed connection.
The promotion of 5th third generation mobile communication network professional ability needs the new network architecture and Radio Transmission Technology, realizes more
The high availability of frequency spectrum and transmission rate.Wireless data service is increased in a manner of index, and user pursues higher and higher data
Experience, thus it is higher and higher to the capacity requirement of network.In numerous methods for promoting network capacity, spectrum efficiency is promoted very
Key, and in numerous technologies for promoting spectrum efficiency, extensive MIMO technology is crucial.Extensive MIMO array is (usually several
Ten arrive several hundred antennas) development, will be expected to realize that spectrum efficiency and power efficiency promote a magnitude again on the basis of 4G, be
Important one of the research direction of 5G key technology at present.
Shuo Zi Bo Bouquet forms technology and starts to obtain on 3G/4G mobile communication intelligent antenna, active integrated antenna at present
Using.It is based on extensive mimo system and aerial array in the 5th third-generation mobile communication, uses digital beam forming technology can be with
It realizes antenna beam figuration, substantially inhibits interference and noise, reduce transmission power.
In November, 2017, the Ministry of Industry and Information Technology issued frequency of the 5G system in 3000-5000MHz frequency range (Mid Frequency)
Rate using planning planning, specify 3300~3400MHz (use), 3400~3600MHz and 4800 the principle upper limit the room in~
Working frequency range of the 5000MHz frequency range as 5G system.It can reduce greatly by using high integration active integrated antenna module
The complexity of scale mimo system aerial array reduces 5G network construction cost.
Summary of the invention
The present invention provides a kind of high integration active integrated antenna modules for the 5th third-generation mobile communication, meet 5G
The requirement of the extensive mimo antenna array of system, can reduce 5G communication system construction cost.
In order to achieve the object of the present invention, used technical solution is: a kind of height collection for the 5th third-generation mobile communication
Emit link and MCU unit at degree active integrated antenna module, including miniature antenna array, multipath reception link, multichannel,
One end of multipath reception link connects miniature antenna array, and the other end of multipath reception link connects MCU unit, multichannel transmitting
One end of link connects MCU unit, and the other end that multichannel emits link connects miniature antenna array, the receives link packet
Dielectric filter, the first RF switch, the first low-noise amplifier, the first SAW filter, receiver and the first operation is included to put
Big device, miniature antenna array received to signal are filtered by dielectric filter, the switching of the first RF switch, the signal received
Amplify into the first low-noise amplifier, receiver mixing demodulation, the I/Q demodulated are entered after the first SAW filter
Signal exports through the first operational amplifier and gives MCU unit；Emitting link includes second operational amplifier, transmitter, rising tone table
Filter, radio frequency amplifier, the second RF switch and exquisite filter, the i/q signal of MCU unit output are put by the second operation
Enter transmitter after big device, rising tone table filter filtering is output to after transmitter is modulated, then passes through radio frequency amplifier
Amplification, the switching of the second RF switch, signal enter miniature antenna array after exquisite filter filtering.
As prioritization scheme of the invention, miniature antenna includes metallic reflection plate, medium substrate, the rectangular corner cut spoke of metal
Penetrate patch, rectangular metal radiation patch, the first metallization VIA, the first rosette, band flange fixed connection device, the second gold medal
The lower layer of medium substrate, the rectangular corner cut radiation patch of metal and gold is arranged in categoryization via hole and short circuit metallic column, metallic reflection plate
Belong to rectangle radiation patch to be attached on medium substrate, the first metallization VIA and the second metallization VIA are provided with medium base
On plate, the lower surface of medium substrate is arranged in the first rosette, and band flange fixed connection device passes through the first metallization VIA coupling
It closes to being fed on the first rosette, the flange with flange fixed connection device is fixed in metallic reflection plate, short circuit metallic
Column passes through the second metallization VIA, and the lower end of short circuit metallic column is fixed in metallic reflection plate.
As prioritization scheme of the invention, miniature antenna further includes parasitic metal piece, and parasitic metal piece is arranged in medium
The upper layer of substrate.
As prioritization scheme of the invention, miniature antenna further includes the second rosette, and the setting of the second rosette exists
The upper surface of medium substrate, the probe with flange fixed connection device passes through the first rosette and the first metallization VIA is connected to
On second rosette.
As prioritization scheme of the invention, miniature antenna further includes third rosette and the 4th rosette, third
The upper surface of medium substrate is arranged in rosette, and the lower surface of medium substrate, short circuit metallic column is arranged in the 4th rosette
It is connected on third rosette across the 4th rosette and the second metallization VIA.
As prioritization scheme of the invention, rectangular metal radiation patch is four, the distribution of rectangular metal radiation patch
Around the rectangular corner cut radiation patch of metal.
The present invention has the effect of positive: 1) inventive antenna array element design uses corner cut metal patch and couple feed side
Formula works in 3.3GHz-3.6GHz range, meets 5G Mid Frequency 3.3GHz~3.4GHz, 3.4GHz~3.6GHz band requirement；
2) present invention believes machine core piece and small size radio-frequency devices of good performance using the multichannel transmitting-receiving of high integration,
PCB realizes circuit system excellent radio-frequency performance and width phase one using structure, isometric microstrip line and the design of metallic shield storehouse is claimed
Cause property；
3) inventive antenna and circuit structure integrated design, pass through the methods of corner cut metal patch and metal-loaded patch
A kind of circular polarisation miniature antenna is designed, size is simple and compact, and easy to process, consistency is good；
4) inventive antenna and circuit system integrated design can be freely composed greatly according to different antenna topologies
Scale mimo antenna array realizes antenna Multibeam synthesis.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is whole functional block diagram of the invention；
Fig. 2 is the structure chart of miniature antenna.
Wherein: 1, metallic reflection plate, 2, medium substrate, 3, the rectangular corner cut radiation patch of metal, 4, rectangular metal radiation
Patch, the 6, first rosette, 7, band flange fixed connection device, the 9, second metallization VIA and short circuit metallic column, 10, parasitic gold
Belong to piece, the 11, second rosette, 12, third rosette, the 13, the 4th rosette.
Specific embodiment
As shown in Figs. 1-2, the invention discloses a kind of high integration for the 5th third-generation mobile communication resource integrated day
Wire module, including miniature antenna array, multipath reception link, multichannel transmitting link and MCU unit, the one of multipath reception link
End connection miniature antenna array, the other end of multipath reception link connect MCU unit, and multichannel emits one end connection of link
MCU unit, the other end that multichannel emits link connect miniature antenna array, and receives link includes dielectric filter, first penetrates
Frequency switch, the first low-noise amplifier, the first SAW filter, receiver and the first operational amplifier, miniature antenna array
It receives signal to filter by dielectric filter, the first RF switch switching, the signal received enters the first low noise amplification
Device amplification enters receiver mixing demodulation after the first SAW filter, and the i/q signal demodulated is through the first operation amplifier
Device, which exports, gives MCU unit；Transmitting link include second operational amplifier, transmitter, the second SAW filter, radio frequency amplifier,
Second RF switch and exquisite filter, the i/q signal of MCU unit output enter transmitter after second operational amplifier,
It is output to rising tone table filter filtering after transmitter is modulated, is then amplified by radio frequency amplifier, the second RF switch
Switching, signal enter miniature antenna array after exquisite filter filtering.
Wherein, the miniature antenna array that miniature antenna array is 2 × 2, transmitting link are four tunnels, receives link four
Road, four tunnels emit link and four tunnel receives link amplitude-phase consistencies are good, have high-gain, low noise and wide dynamic characteristic, should
High integration active integrated antenna module for the 5th third-generation mobile communication further includes antennal interface, reference clock interface, electricity
Source interface, serial interface, i/q signal interface and Power Management Unit etc.；Dielectric filter, the first RF switch, the first low noise
Acoustic amplifier, the first SAW filter, the second SAW filter, radio frequency amplifier, the second RF switch and exquisite filter group
At radio frequency front-end unit, antennal interface connects miniature antenna and radio frequency front-end unit；Receiver And Transmitter composition transmitting-receiving letter
Machine unit, transceiver unit use the multichannel receiving-transmitting chain chip of high integration, are also integrated with phase-locked loop circuit；Reference clock
Interface connects transceiver unit, provides external reference clock signal for transceiver unit；Power interface provides power supply；Serial ports
Interface connects MCU unit, and computer passes through this interface control program burning and setting, debugging etc.；First operational amplifier and
Two operational amplifiers form amplifier unit, and amplifier unit uses the high performance operational amplifier of wideband low noise, will be conditioned
I/q signal is output to I/Q interface；Power Management Unit includes switching power source chip and LDO chip, realizes that modular power source power supply is wanted
It asks.The circuit PCB fabric swatch of high integration active integrated antenna module for the 5th third-generation mobile communication using symmetrical structure and
Isometric microstrip line realizes that each receiving-transmitting chain has good Phase amplitude-matched by the isolation of shielding storehouse between each link RF circuit
Property.Exquisite filter can better filtering clutter compared to common filter.
As shown in Fig. 2, miniature antenna include metallic reflection plate 1, medium substrate 2, the rectangular corner cut radiation patch 3 of metal,
Rectangular metal radiation patch 4, the first metallization VIA, the first rosette 6, band flange fixed connection device 7, second metallize
The lower layer of medium substrate 2, the rectangular corner cut radiation patch 3 of metal and gold is arranged in via hole and short circuit metallic column 9, metallic reflection plate 1
Belong to rectangle radiation patch 4 to be attached on medium substrate 2, the first metallization VIA and the second metallization VIA are provided with medium
On substrate 2, the lower surface of medium substrate 2 is arranged in the first rosette 6, and band flange fixed connection device 7 passes through the first metallization
Via hole, which is coupled on the first rosette 6, to be fed, and the flange with flange fixed connection device 7 is fixed in metallic reflection plate 1,
Short circuit metallic column 9 passes through the second metallization VIA, and the lower end of short circuit metallic column 9 is fixed in metallic reflection plate 1.Miniature antenna
It is fed by the way of coupling, realizes the good impedance operator of antenna, improve the standing-wave ratio of antenna, increase the work of antenna
Make bandwidth.Wherein, 2 × 2 miniature antenna array uses the circular polarized antenna group battle array of corner cut radiation patch, between 0.5 λ≤array element
Away from≤0.7 λ；It can also be using the antenna array of other forms similar in characteristic dimension.
Miniature antenna further includes parasitic metal piece 10, and the upper layer of medium substrate 2 is arranged in parasitic metal piece 10.
Miniature antenna further includes the second rosette 11, and the upper surface of medium substrate 2 is arranged in the second rosette 11,
Probe with flange fixed connection device 7 passes through the first rosette 6 and the first metallization VIA is connected to the second rosette 11
On.
Miniature antenna further includes third rosette 12 and the 4th rosette 13, and the setting of third rosette 12 is being situated between
The lower surface of medium substrate 2 is arranged in the upper surface of matter substrate 2, the 4th rosette 13, and short circuit metallic column 9 passes through the 4th metal
Disk 13 and the second metallization VIA are connected on third rosette 12.
Rectangular metal radiation patch 4 is four, and rectangular metal radiation patch 4 is distributed in the rectangular corner cut radiation patch of metal
Around piece 3.
The height of miniature antenna is 18.5mm, is air dielectric between metallic reflection plate 1 and medium substrate 2, and metal is anti-
Penetrating distance of the plate 1 apart from medium substrate 2 is 8mm, and metallic reflection plate 1 is supported on the lower section of medium substrate 2 by plastic support post.
The circuit part of high integration active integrated antenna module for the 5th third-generation mobile communication is mounted on 1 back side of metallic reflection plate
Wire chamber in.It is air dielectric between parasitic metal piece 10 and medium substrate 2.Wherein, parasitic metal piece 10 is apart from medium base
The distance of plate 2 is 6mm.Parasitic metal piece 10 is supported on the top of medium substrate 2 by plastic support post.Rectangular metal radiation
Patch 4 is distributed in around the rectangular corner cut radiation patch 3 of metal, altogether there are four, increase the standing wave bandwidth and axis ratio of antenna
Bandwidth.The upper surface of medium substrate 2 is arranged in second rosette 11, and the probe with flange fixed connection device 7 passes through the first gold medal
Belong to disk 6 and the first metallization VIA is connected on the second rosette 11.Band flange fixed connection device 7 passes through the first metallization
Via hole, which is coupled on the first rosette 6, to be fed, the mode of this couple feed can broaden antenna impedance bandwidth and
Circular polarisation bandwidth improves axis ratio.Third rosette 12 and the 4th rosette 13 are separately positioned on the upper surface of medium substrate 2
And lower surface, short circuit metallic column 9 passes through the 4th rosette 13 and the second metallization VIA is connected on third rosette 12,
The size for reducing antenna has broadened the bandwidth of antenna.
The many high integration active integrated antenna modules for the 5th third-generation mobile communication can combine in any permutation,
The extensive mimo antenna array of M × N (M, N are 2 multiple) for forming different topology structure, to realize different digital waves
Beam is formed.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in guarantor of the invention
Within the scope of shield.
Claims (6)
1. a kind of high integration active integrated antenna module for the 5th third-generation mobile communication, it is characterised in that: including small-sized
Change aerial array, multipath reception link, multichannel transmitting link and MCU unit, one end connection miniaturization day of multipath reception link
Linear array, the other end of multipath reception link connect MCU unit, and one end that multichannel emits link connects MCU unit, multichannel transmitting
The other end of link connects miniature antenna array, and the receives link includes dielectric filter, the first RF switch, first
Low-noise amplifier, the first SAW filter, receiver and the first operational amplifier, miniature antenna array received are logical to signal
Dielectric filter filtering is crossed, the switching of the first RF switch, the signal received enters the amplification of the first low-noise amplifier, by the
Enter receiver mixing demodulation after one SAW filter, the i/q signal demodulated exports mono- to MCU through the first operational amplifier
Member；Transmitting link include second operational amplifier, transmitter, the second SAW filter, radio frequency amplifier, the second RF switch and
The i/q signal of exquisite filter, the output of MCU unit enters transmitter after second operational amplifier, modulates by transmitter
After be output to rising tone table filter filtering, then pass through radio frequency amplifier amplify, the second RF switch switching, signal by essence
Enter miniature antenna array after causing filter filtering.
2. a kind of high integration active integrated antenna module for the 5th third-generation mobile communication according to claim 1,
It is characterized by: the miniature antenna includes metallic reflection plate (1), medium substrate (2), the rectangular corner cut radiation patch of metal
(3), rectangular metal radiation patch (4), the first metallization VIA, the first rosette (6), band flange fixed connection device (7),
The lower layer in medium substrate (2) is arranged in second metallization VIA and short circuit metallic column (9), metallic reflection plate (1), and metal is rectangular to be cut
Angle radiation patch (3) and rectangular metal radiation patch (4) are attached on medium substrate (2), the first metallization VIA and second
Metallization VIA is provided on medium substrate (2), and the first rosette (6) setting is in the lower surface of medium substrate (2), band method
Blue fixed connection device (7) is coupled on the first rosette (6) by the first metallization VIA to be fed, and band flange is fixed to be connected
The flange for connecing device (7) is fixed on metallic reflection plate (1), and short circuit metallic column (9) passes through the second metallization VIA, short circuit metallic column
(9) lower end is fixed on metallic reflection plate (1).
3. a kind of high integration active integrated antenna module for the 5th third-generation mobile communication according to claim 2,
It is characterized by: the miniature antenna further includes parasitic metal piece (10), parasitic metal piece (10) is arranged in medium substrate
(2) upper layer.
4. a kind of high integration active integrated antenna module for the 5th third-generation mobile communication according to claim 3,
It is characterized by: the miniature antenna further includes the second rosette (11), the second rosette (11) is arranged in medium
The upper surface of substrate (2), the probe with flange fixed connection device (7) pass through the first rosette (6) and the first metallization VIA
It is connected on the second rosette (11).
5. a kind of high integration active integrated antenna module for the 5th third-generation mobile communication according to claim 4,
It is characterized by: the miniature antenna further includes third rosette (12) and the 4th rosette (13), third metal
In the upper surface of medium substrate (2), the 4th rosette (13) is arranged in the lower surface of medium substrate (2) for disk (12) setting,
Short circuit metallic column (9) passes through the 4th rosette (13) and the second metallization VIA is connected on third rosette (12).
6. a kind of high integration active integrated antenna mould for the 5th third-generation mobile communication stated according to the office claim 2-5
Block, it is characterised in that: the rectangular metal radiation patch (4) is four, and rectangular metal radiation patch (4) is distributed in gold
Belong to around rectangular corner cut radiation patch (3).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810824016.2A CN109004373A (en) | 2018-07-25 | 2018-07-25 | A kind of high integration active integrated antenna module for the 5th third-generation mobile communication |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810824016.2A CN109004373A (en) | 2018-07-25 | 2018-07-25 | A kind of high integration active integrated antenna module for the 5th third-generation mobile communication |
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| CN109004373A true CN109004373A (en) | 2018-12-14 |
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| WO2020133514A1 (en) * | 2018-12-29 | 2020-07-02 | 华为技术有限公司 | Multi-band radio frequency front-end device, multi-band receiver, and multi-band transmitter |
| CN112054312A (en) * | 2019-06-06 | 2020-12-08 | 北京小米移动软件有限公司 | Antenna structure and electronic device |
| CN113451762A (en) * | 2020-03-27 | 2021-09-28 | 南宁富桂精密工业有限公司 | Antenna system and electronic device thereof |
| US11664591B2 (en) | 2019-06-06 | 2023-05-30 | Beijing Xiaomi Mobile Software Co., Ltd. | Antenna structure, electronic device and arraying method for antenna structure |
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| WO2020133514A1 (en) * | 2018-12-29 | 2020-07-02 | 华为技术有限公司 | Multi-band radio frequency front-end device, multi-band receiver, and multi-band transmitter |
| US11683054B2 (en) | 2018-12-29 | 2023-06-20 | Huawei Technologies Co., Ltd. | Multi-band radio frequency front-end device, multi-band receiver, and multi-band transmitter |
| CN112054312A (en) * | 2019-06-06 | 2020-12-08 | 北京小米移动软件有限公司 | Antenna structure and electronic device |
| EP3748769A1 (en) * | 2019-06-06 | 2020-12-09 | Beijing Xiaomi Mobile Software Co., Ltd. | Antenna structure and electronic device |
| KR20200140998A (en) * | 2019-06-06 | 2020-12-17 | 베이징 시아오미 모바일 소프트웨어 컴퍼니 리미티드 | Antenna structure and electronic devices |
| US11165152B2 (en) | 2019-06-06 | 2021-11-02 | Beijing Xiaomi Mobile Software Co., Ltd. | Antenna and electronic device |
| KR102326870B1 (en) * | 2019-06-06 | 2021-11-17 | 베이징 시아오미 모바일 소프트웨어 컴퍼니 리미티드 | Antenna structures and electronic devices |
| US11664591B2 (en) | 2019-06-06 | 2023-05-30 | Beijing Xiaomi Mobile Software Co., Ltd. | Antenna structure, electronic device and arraying method for antenna structure |
| CN113451762A (en) * | 2020-03-27 | 2021-09-28 | 南宁富桂精密工业有限公司 | Antenna system and electronic device thereof |
| CN113451762B (en) * | 2020-03-27 | 2022-09-27 | 南宁富联富桂精密工业有限公司 | Antenna system and electronic device thereof |
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