CN108939834A - Radio-frequency signal generator clean dry air is blown off - Google Patents

Abstract

Embodiments of the present disclosure generally relate to radio frequency generator protection, including a radio frequency generator protection assembly, a method for controlling an environment around a radio frequency generator, and a semiconductor device having a radio frequency generator. In one embodiment, the radio frequency generator protection assembly includes a controller configured to assess the local ambient environment of the radio frequency generator and a clean dry air dryer coupled to and controlled by the controller Condition the local surroundings of the RF generator by providing clean, dry air.

Description

RF generator clean dry air blow out

technical field

The present disclosure relates to clean dry air blowing. More specifically, the present disclosure relates to clean dry air blowout for radio frequency generators.

Background technique

Plasma processing systems have been widely used in the manufacture and processing of semiconductors, integrated circuits, displays, and other electronic devices for performing, for example, etching processes and film-forming processes on substrates by using plasma, such as chemical vapor deposition processes . In some plasma processing systems, a radio frequency (RF) generator used to supply high frequency power may involve generating an RF electric field between electrodes in the plasma processing chamber.

RF generators typically include an RF output for providing a high frequency power output when the RF generator is operating. Such RF generators are precision devices and are generally limited by certain operating specifications to function properly and safely. During operation of the RF generator, forced cooling is often required to remove the heat generated by the RF generator. However, environmental or operational hazards around the RF generator that may suddenly change when the RF generator is unable to detect them, or when the RF generator is completely unable to defend itself against these hazards even if it knows about them, can still damage the RF generator. .

RF generators need better and reliable protection, and so do plasma processing systems with RF generators.

Contents of the invention

One embodiment of the present disclosure relates to an RF generator protection assembly, the RF generator protection assembly includes a controller and a clean dry air (CDA) dryer, the controller is configured to assess the local ambient environment of the RF generator, the CDA dryer Coupled to and controlled by the controller to provide a CDA to adjust the local ambient of the RF generator.

In another embodiment, a method for controlling an environment around an RF generator is provided. The method includes sensing, by a sensor, a local surrounding of the RF generator, receiving, by a controller, a signal of the local surrounding from the sensor, and providing a CDA to adjust the local surrounding of the RF generator based on the received signal.

In another embodiment, a semiconductor device having an RF generator is provided. The semiconductor device includes an RF generator having a local ambient controller and a CDA drier coupled to the local ambient controller and configured to provide a CDA to adjust the local ambient temperature of the RF generator in the semiconductor device. surroundings.

Implementations may include one or more of the following features.

The RF generator protection assembly further includes a sensor coupled to the controller and configured to sense the local ambient environment and transmit an environmental signal to the controller. The environmental signal transmitted to the controller includes temperature related parameters, humidity related parameters, or both. The parameters are compared with predetermined values stored in the controller according to a heuristic algorithm in order to control the CDA dryer. Heuristics include reliable and efficient tests. The predetermined values stored in the controller include lower and upper limits operable for parameters of the RF generator. The CDA dryer is controlled by a controller by activating or deactivating the CDA dryer based on parameters. The CDA dryer includes a CDA source configured to supply CDA and a valve connected to the CDA source and configured to direct CDA from the CDA source. Dry air from the CDA source is directed to the RF generator's air intake. The local ambient of the RF generator is adjusted by activating the valve of the CDA dryer.

The method for controlling the surroundings of the RF generator further includes turning off the RF generator based on the received signal. The signal of the local ambient environment includes temperature related parameters, humidity related parameters, or both. Providing the CDA to adjust the local surroundings based on the received signal includes comparing the received signal with a predetermined value by the controller according to a heuristic algorithm, and supplying the CDA to the RF generator according to the comparison result. Providing CDA to adjust the local ambient based on the received signal includes activating or deactivating a CDA dryer connected to a CDA source. Providing CDA to condition the local ambient based on the received signal includes supplying CDA from a CDA source and directing the supplied CDA to an air inlet of the RF generator. Directing the supplied CDA to the inlet of the RF generator is done by adjusting the valve.

For semiconductor devices with RF generators, the CDA dryer includes a valve coupled to a CDA source external to the semiconductor device. The local ambient controller is configured to terminate operation of the semiconductor device based on the local ambient of the RF generator.

Additional features and advantages will be set forth in the following detailed description, and in part will become apparent to those skilled in the art from this description, or by practice of what is described herein, including the following detailed description, claims and drawings. It is recognized by the above-mentioned embodiment.

It is to be understood that both the foregoing summary and the following detailed description are exemplary only, and are intended to provide an overview or framework for understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more implementations, and together with the description serve to explain the principles and operations of the various implementations.

Description of drawings

FIG. 1 is a semiconductor device with an RF generator, such as a plasma processing system;

Figure 2 is a clean dry air (CDA) purge apparatus including a CDA source and a valve connected to the CDA source;

Figure 3 is a method of controlling the surrounding environment of a radio frequency generator.

To facilitate understanding, identical reference numerals have been used wherever possible to designate identical components that are common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated into other embodiments without further recitation.

Detailed ways

Reference will now be made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings.

Unless otherwise defined, all terms used in the specification and claims generally have their ordinary meanings in the art, in the context of this disclosure, and in the specific context where each term is used. Certain terms used to describe the present disclosure are discussed below or elsewhere in this specification to provide additional guidance to the practitioner regarding the description of the present disclosure. As used herein, the singular forms "a", "an" and "the" include plural forms unless the context clearly dictates otherwise. Thus, for example, reference to a vent includes embodiments having two or more such vents unless the context clearly dictates otherwise. Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. Thus, appearances of the words "in one embodiment" or "in an embodiment" in various places throughout this specification are not all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more implementations. It should be understood that the accompanying drawings are not drawn to scale; rather, these drawings are for illustration.

A "local ambient" as disclosed herein may include one or more metrics used to determine environmental conditions surrounding the RF generator. By way of example and not limitation, environmental conditions may include temperature values near the RF generator, humidity values near the RF generator, etc., or combinations thereof.

The local surrounding environment of the RF generator may change due to various reasons, such as a sudden rise in temperature in the environment or a water leak from another facility during operation of the RF generator. Additionally, the RF generator may fail to notice and/or defend itself against these changes in the local surrounding environment. Thus, environmental changes may cause or even accelerate damage to the RF generator 102 . The inventors have recognized this situation and provide a protection system for an RF generator with CDA blowdown and a method of evaluating and adjusting an RF generator using the protection system.

Turning now to FIG. 1, a semiconductor device 100, such as a plasma processing system, having an RF generator 102 is provided. The RF generator 102 can supply high-frequency power to the semiconductor device 100 by, for example, outputting electric power of about 30 kW at a frequency in a region of about 12.88 MHz to 14.24 MHz. The semiconductor device 100 can apply this high frequency power in its semiconductor process. In an embodiment, the semiconductor device 100 may include some means for protecting the RF generator 102 to ensure its benign operation.

According to an embodiment of the present disclosure, the RF generator 102 may be equipped with a forced cooling mechanism, such as a water cooling device or a forced air cooling device. In a water-cooled arrangement, the RF generator 102 may use a cooling water arrangement having a water inlet and a water outlet to allow cooling water to flow into the RF generator 102 at the water inlet and flow out at the water outlet. In a forced air cooling device, the RF generator 102 may use fans respectively disposed at the air inlet and the air outlet of the RF generator 102 to provide air movement. The air is sucked into the RF generator housing through the fan at the air inlet, and flows through the heat generating module, taking up heat. The air is then exhausted from the RF generator 102 by a fan at the outlet.

In an embodiment, the semiconductor device 100 may include a control device 104 configured to assess the local surroundings of the RF generator 102 and a clean dry air (CDA) purge device 106 controlled by the control device 104. Control to provide CDA to adjust the local ambient of the RF generator 102 . For example, control device 104 may notice an environmental change related to the local ambient environment and determine whether to allow CDA purge 106 to use CDA to adjust the local ambient environment of RF generator 102 against the environmental change. The AC power required by the control device 104 and the CDA purge device 106 can be supplied from the semiconductor device 100 . The control device 104 can be implemented with digital electronic circuitry or with computer software, firmware, or hardware, or a combination thereof. The control device 104 may include one or more computer program products embodied in a computer-readable medium having computer-readable program code thereon. Any combination of computer readable media could also be used. The control device 104 may use electrical signals and algorithms to implement its receptive, comparative and deterministic functions. The control device 104 may include or work together with other electronic devices (including another control device) to accomplish more complicated and complex control tasks. By way of example and not limitation, control device 104 may include an electronic control unit, a computing controller, a microcontroller, a programmable logic controller, or the like.

In another embodiment, the semiconductor device 100 may include a sensing device 108 coupled to the control device 104 and configured to sense the local surrounding environment of the RF generator 102 and transmit an environmental signal to the control device 104 . For example, sensing device 108 may sense a temperature or humidity value in an environment surrounding RF generator 102 and send an electronic signal representative of the sensed temperature or humidity value to control device 104 . Sensing device 108 may include electronic components, modules or subsystems with the purpose of detecting events or changes in the environment and sending the information to other electronic devices, such as a processor or an electronic control unit. The sensing device 108 may include or work with other electronic devices (including another sensing device) to sense one or more environmental values and transmit them via signals in a wired or wireless manner. By way of example and not limitation, sensing devices 108 may include temperature sensors, humidity sensors, pressure sensors, fluid flow sensors, and other sensors sensitive to physical aspects of the external or internal environment.

In another embodiment, the environmental signal transmitted to the control device 104 may include temperature-related parameters, humidity-related parameters, or both. For example, the sensing device 108 may sense a temperature value of about 30° C. around the RF generator 102 and then transmit an electronic signal representative of the sensed temperature value. The sensing device 108 may sense a humidity value of about 80% around the RF generator 102 and then transmit an electronic signal representative of the sensed humidity value. The sensing device 108 may sense a temperature value of about 30°C and a humidity value of about 80% around the RF generator 102, and then transmit an electronic signal representing these two values. Once the electronic signal from the sensing device 108 is received by the control device 104, the corresponding parameters are known and evaluation of the process can begin.

In an embodiment, the parameters may be compared to predetermined values stored in the control device 104 according to a heuristic algorithm to control the CDA purge device 106 . Heuristic algorithms may include reliable and efficient tests. The predetermined values stored in the control device 104 may include lower and upper limits operable for the parameters of the RF generator 102 . For example, control device 104 may have stored a set of operating conditions for RF generator 102, such as operating temperature and operating humidity. In a plasma processing system, the operating temperature of the RF generator 102 may be set, for example, in the range of 21°C to 25°C, ie, 23°C±2°C. The operating humidity of the RF generator 102 may be set, for example, to less than 50%. The control device 104 may compare the received temperature value to a predetermined operating temperature value or compare the received humidity value to a predetermined operating humidity value. Depending on the results of the comparison, CDA may or may not be supplied to the RF generator 102 manually or automatically.

In an example, if the received temperature value is far above the upper limit of the predetermined operating temperature value, the control device 104 may determine whether to shut down or suspend the RF generator 102, or allow the RF generator 102 performs a CDA purge, eg, activates a CDA purge 106 to provide CDA. In another example, if the received humidity value is just slightly above the predetermined operating humidity value, the control device 104 may determine to wait a short period of time (eg, a few seconds, such as 2 seconds) before allowing the CDA to blow off, to avoid false alarms (eg, due to noise from the sensing device 108). In another example, if a true alarm is determined, the control device 104 may allow a CDA blowdown of the RF generator 102 for a period of time, such as 6 hours, and send a signal to remind the semiconductor device 100 to terminate its operation. If the alarm continues after a time interval, the control device 104 may extend the CDA purge. After the alarm is resolved (e.g., the temperature or humidity values around the RF generator 102 are substantially back to its normal operating conditions), the control device 104 may stop the CDA purge (e.g., deactivate the CDA purge device 106), and A signal is sent to inform the semiconductor device 100 that the crisis has disappeared.

In an embodiment, the CDA purge 106 may be controlled by a controller by activating or deactivating the CDA purge 106 based on a parameter. For example, if the received temperature value is evaluated as abnormal, the control device 104 may determine to activate the CDA purge device 106 to provide CDA to the RF generator 102 to regulate the temperature. If the received temperature value is again evaluated as normal, the control device 104 may determine to stop the CDA purge device 106 .

Turning to FIG. 2 , a CDA purge apparatus 200 is shown that includes a CDA source 202 and a valve 204 connected to the CDA source 202 .

In an embodiment, the CDA source 202 may be configured to supply CDA. The CDA source 202 can be standalone, or part of a facility. In an example, the CDA source 202 may be a self-contained system including electronic components such as air compressors, precoolers, coalescing filters, athermal air dryers, air tanks, etc. as known in the art. In operation, ambient air may be drawn into the air compressor. The hot and humid air then flows through a precooler to lower the air temperature, and then through a coalescing filter to remove liquid moisture. The anhydrous air then enters an athermal air dryer where most of the remaining water is removed in vapor form. The dry air then flows into a tank that is kept at a constant pressure. Therefore, dry air from the air tank can be supplied. In another example, CDA source 202 may be part of a facility using RF generator 102 . For example, in a FAB facility, a CDA system may provide uncontaminated air at a pressure above atmospheric that is applied throughout the FAB for drying, pneumatic control, and other purposes.

In another embodiment, valve 204 may be configured to direct CDA from CDA source 202 . Valve 204 may be coupled to CDA source 202 by, for example, a conduit to receive CDA from CDA source 202 as a fluid input. For example, valve 204 may be responsive to a signal generated by control device 104 . In an example, when control device 104 sends an ON signal to valve 204 indicating the need to protect RF generator 102, valve 204 may begin to adjust the flow or pressure of CDA from CDA source 202 (e.g., open valve 204) to A constant flow of CDA is provided from CDA source 202 to RF generator 102 through valve 204 . In another example, control device 104 may send an OFF signal to valve 204 to stop valve 204 from providing any CDA to RF generator 102 .

In an embodiment, dry air from the CDA source 202 is directed toward an air inlet (also referred to as an air inlet) of the RF generator 102 . The local ambient of the RF generator 102 may be adjusted by activating the valve 204 of the CDA purge 200 . In an example, when valve 204 is open, CDA from CDA source 202 may be directed through valve 204 to the air inlet of RF generator 102 to effectively remove dew in RF generator 102 . In another example, if multiple RF generators are present, valve 204 may be connected to multiple auxiliary valves by, for example, conduits, tubing, and fittings. In this case, each auxiliary valve can be responsible for protecting the corresponding RF generator, ie regulating the corresponding local surroundings of the RF generator.

Figure 3 is a method of controlling the surrounding environment of a radio frequency generator. For example, semiconductor device 100 including RF generator 102 , control device 104 , CDA purge device 106 , and sensing device 108 may perform operations in method 300 for controlling.

At operation 302 , the local surroundings of the RF generator 102 may be sensed by the sensing device 108 . At operation 304 , a signal of the local surroundings of the RF generator 102 may be received from the sensing device 108 by the control device 104 . For example, sensing device 108 may detect temperature and humidity values in the vicinity of RF generator 102 . Electronic communication may be established between sensing device 108 and control device 104 . The temperature and humidity values detected by the sensing device 108 may be communicated to the control device 104 through signals used in electronic communication. Signals indicative of the detected temperature value and the detected humidity value may be received and stored by the control device 104 for further processing.

At operation 306, CDA may be provided to adjust the local surroundings of the RF generator 102 based on the received signal. For example, control device 104 may determine a different action based on the received signal.

In an embodiment, the RF generator 102 or even a device having the RF generator 102 can be completely turned off. The control device 104 may transmit alarm signals in response to various abnormal operating conditions (eg, when the temperature of the power amplifier in the RF generator exceeds a set limit, or when dew condensation is found on the water cooling components). The received signal can be regarded by the control device 104 as a true alarm to the RF generator 102 . The control device 104 can determine to give a safety warning to manually or automatically shut down the RF generator 102 or even the entire semiconductor manufacturing device with the RF generator 102 as soon as possible.

In another embodiment, CDA may be supplied. In an example, control device 104 may determine to enable CDA purge device 106 to provide CDA to RF generator 102 after comparing data from the signal with data associated with operating conditions of RF generator 102 and finding hazards. In another example, CDA purge 106 may use CDA source 202 and valve 204 to provide CDA to RF generator 102 . In another example, the CDA blower 106 can direct the CDA supplied from the CDA source 202 to the air inlet of the RF generator 102 by adjusting the valve 204 .

In another embodiment, the supply of CDA can be stopped. For example, the control device 104 may determine to deactivate the CDA purge device 106 if the local ambient environment of the RF generator 102 returns to normal.

Although implementations of the present disclosure are generally described herein with reference to semiconductor devices having RF generators, it is contemplated that other devices using RF generators may also benefit from implementations of the present disclosure. For example, in the rapid heating food industry, RF electric fields are ideal for rapid heating of food because of their good penetration and uniformity of heat generation. The heater can use an RF generator to generate the desired RF electric field. Additionally, although embodiments of the present disclosure are generally described herein with reference to temperature and humidity, it is contemplated that other parameters detectable by sensors, such as process cooling water flow, may be used with implementations of the present disclosure.

It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit or scope of the invention. Furthermore, features or configurations of one embodiment may be combined or implemented into other embodiments without further recitation. While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure can be devised without departing from the essential scope of the present disclosure, and the scope of the present disclosure is determined by the appended claims.

Claims (20)

1. a kind of radio-frequency signal generator (RFG) protects component, the RFG protection component includes:

Controller, the controller are configured as the local ambient environment of assessment RFG；And

Clean dry air (CDA) drier, the CDA drier are couple to the controller and are controlled by the controller The local ambient environment of the RFG is adjusted to provide CDA.

2. RFG according to claim 1 protects component, further comprising:

Sensor, the sensor are couple to the controller and being configured as and sense the local ambient environment and by environment Signal is transmitted to the controller.

3. RFG according to claim 2 protects component, wherein the environmental signal for being transmitted to the controller includes temperature Spend relevant parameter, humidity relevant parameter or the two.

4. RFG according to claim 3 protects component, wherein by the parameter and being stored in described according to heuritic approach Predetermined value in controller is compared, to control the CDA drier.

5. RFG according to claim 4 protects component, wherein the heuritic approach includes reliably and effectively testing.

6. RFG according to claim 4 protects component, wherein store the predetermined value in the controller include can Lower and upper limit of the operation for the parameter of the RFG.

7. RFG according to claim 3 protects component, wherein the CDA drier is enabled by based on the parameter Or it deactivates the CDA drier and is controlled by the controller.

8. RFG according to claim 1 protects component, wherein the CDA drier includes:

The source CDA, the source CDA are configured to supply the CDA；And

Valve, the valve are connected to the source CDA and are configured as guiding the CDA from the source CDA.

9. RFG according to claim 8 protects component, wherein guiding the dry air from the source CDA to described The air inlet of RFG.

10. RFG according to claim 8 protects component, wherein by the valve for enabling the CDA drier, to adjust Save the local ambient environment of the RFG.

11. the method for ambient enviroment of the one kind for controlling radio-frequency signal generator (RFG), which comprises

The local ambient environment of RFG is sensed by sensor；

The signal of the local ambient environment is received from the sensor by controller；And

Clean dry air (CDA) is provided based on the signal received to adjust the local ambient ring of the RFG Border.

12. according to the method for claim 11, further comprising: being closed based on the signal received described RFG。

13. according to the method for claim 11, wherein the signal of the local ambient environment includes temperature correlation ginseng Number, humidity relevant parameter or the two.

14. according to the method for claim 13, wherein providing the CDA based on the signal received to adjust Stating local ambient environment includes:

The signal received is compared with predetermined value by the controller according to heuritic approach, and

The CDA is supplied to the RFG according to comparison result.

15. according to the method for claim 13, wherein providing the CDA based on the signal received to adjust Stating local ambient environment includes: to enable or deactivate the CDA drier for being connected to the source CDA.

16. according to the method for claim 11, wherein providing the CDA based on the signal received to adjust Stating local ambient environment includes:

The CDA is supplied from the source CDA；And

The CDA being supplied is guided to the air inlet to the RFG.

17. according to the method for claim 16, wherein guide the CDA being supplied to institute by adjusting valve State the air inlet of RFG.

18. one kind has the semiconductor devices of radio-frequency signal generator (RFG), the semiconductor devices includes:

RFG, the RFG have local ambient environment controller；And

Clean dry air (CDA) drier, the CDA drier are couple to the local ambient environment controller and are matched It is set to the local ambient environment for providing CDA to adjust the RFG in the semiconductor devices.

19. semiconductor devices according to claim 18, wherein the CDA drier includes being couple to the semiconductor device The valve in the source CDA outside part.

20. semiconductor devices according to claim 18, wherein the local ambient environment controller is configured as being based on The local ambient environment of the RFG terminates the operation of the semiconductor devices.