CN108890423A - A kind of sapphire ingot cutting and polishing device - Google Patents

A kind of sapphire ingot cutting and polishing device Download PDF

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Publication number
CN108890423A
CN108890423A CN201810750664.8A CN201810750664A CN108890423A CN 108890423 A CN108890423 A CN 108890423A CN 201810750664 A CN201810750664 A CN 201810750664A CN 108890423 A CN108890423 A CN 108890423A
Authority
CN
China
Prior art keywords
chuck
cutting
servo motor
screw
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810750664.8A
Other languages
Chinese (zh)
Inventor
王慧远
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanxi Zhong Ke Ke Semiconductor Co Ltd
Original Assignee
Shanxi Zhong Ke Ke Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanxi Zhong Ke Ke Semiconductor Co Ltd filed Critical Shanxi Zhong Ke Ke Semiconductor Co Ltd
Priority to CN201810750664.8A priority Critical patent/CN108890423A/en
Publication of CN108890423A publication Critical patent/CN108890423A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The present invention provides a kind of sapphire ingot cutting and polishing device, including rack, brilliant bar fixing device, cutting sheet and spray system, the crystalline substance bar fixing device includes scroll chuck, the scroll chuck is set on chuck seat, chuck is connect with chuck seat by bearing, chuck is driven by first servo motor, chuck seat is set on guide rail, its bottom is equipped with screw, the screw is matched with screw rod, screw rod is laterally arranged and is driven by the second servo motor, and the cutting sheet includes outer slice and interior polished silicon wafer.The present invention will be cut, polishing two procedures are once completed, and is avoided repeating feeding, feeding, is greatly improved work efficiency, also greatly improve machining accuracy.

Description

A kind of sapphire ingot cutting and polishing device
Technical field
The present invention relates to a kind of cutting, burnishing device, in particular to a kind of cutting and polishing device for sapphire ingot.
Background technique
In sapphire crystal ingot process, needs to cut crystal bar after drawing stick, remove the part for not meeting size end to end, so End face is polished afterwards, so as to subsequent detection.In currently used processing method, cutting, polishing are two procedures, and are mostly Manual operation, so that working efficiency is low, machining accuracy is poor.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of sapphire ingot cutting and polishing device.
The technical solution adopted by the present invention is that：A kind of sapphire ingot cutting and polishing device, including the fixed dress of rack, crystal bar It sets, cutting sheet and spray system, the crystalline substance bar fixing device includes scroll chuck, and the scroll chuck is set on chuck seat, Chuck is connect with chuck seat by bearing, and chuck is driven by first servo motor, and chuck seat is set on guide rail, bottom installation There is screw, the screw is matched with screw rod, and screw rod is laterally arranged and is driven by the second servo motor, and the cutting sheet includes circumscribed Piece and interior polished silicon wafer.
The present invention will be cut, polishing two procedures are once completed, and avoid repeating feeding, feeding, substantially increase work effect Rate also greatly improves machining accuracy.
Detailed description of the invention
Fig. 1 schematic structural view of the invention；
Fig. 2 is cutting sheet structural front view of the present invention；
Fig. 3 is cutting sheet structural side view of the present invention；
In figure：1- rack, 2- cutting sheet, 21- ring flange, 22- are sliced outside, polished silicon wafer in 23-, 3- driving motor, 4- chuck seat, 41- scroll chuck, 42- bearing, 43- first servo motor, 44- guide rail, 45- screw rod, 46- screw, the second servo motor of 47-, 5- reservoir, 51- immersible pump, 52- spray pipeline, 6- crystal bar.
Specific embodiment
As shown in Figure 1, 2, a kind of sapphire ingot cutting and polishing device, including rack 1 are provided with cutting sheet in rack 1 2, driving motor 3, chuck seat 4, first servo motor 43, the second servo motor 47, reservoir 5.Cutting sheet 2 passes through driving motor The driving of 3 belts, chuck seat 4 are provided with scroll chuck 41, are connected between chuck seat and chuck by bearing 42, and scroll chuck 31 is logical The driving of 43 belt of first servo motor is crossed, chuck seat 4 is set on lateral guide rail 44, and 4 bottom of chuck seat connects screw 46, silk Mother 46 is socketed on screw rod 45, and screw rod 45 connects the second servo motor drive shaft, and immersible pump 51, immersible pump is arranged in reservoir 5 Connect spray pipeline 52.
As shown in Fig. 2, cutting sheet includes ring flange 21, and outer slice 22, interior polished silicon wafer 23, the setting of 21 1 side end face of ring flange There is mounting groove, be fixedly connected on the outside of outer slice 22 and ring flange, in the fixed installation of polished silicon wafer 23 and ring flange mounting groove.
When device works, after sapphire ingot 6 is fixed on scroll chuck, start driving motor 3, first servo motor 43, the second servo motor 47, immersible pump 51, driving motor drive cutting sheet 2 to rotate, and first servo motor drives scroll chuck to turn It is dynamic, crystal bar is rotated, the second servo motor drives screw rod rotation, and screw 46 drives chuck seat 4 to cutting sheet direction transverse shifting, Outer slice 22 first cuts crystal bar, and when crystal bar is run at interior polished silicon wafer 23, interior polished silicon wafer is to the end being cut into Face is polished, and while cutting and polishing, immersible pump 51 sprays the cutting fluid in reservoir in cutting sheet through spray pipeline 52 Lubrication cooling on working face.After cutting and polishing, driving motor 3 and first servo motor 43, the second servo motor 47 are closed Reversion makes chuck seat 4 return initial position, closes immersible pump, pickup, disposable completion cutting and polishing two procedures, whole Automatic operation greatly promotes working efficiency, and can obtain better machining accuracy.
Crystal bar outer diameter is smaller in the above embodiment of the present invention, easy to cut, even if crystal bar outer diameter is larger, since chuck is being cut Cut in polishing process and also rotating, as long as therefore crystal bar radius be no more than interior polished silicon wafer inner ring to outer slice outer ring radial dimension, Same achievable cutting will not all throw end face for crystal bar biggish for outer diameter although polished silicon wafer radial dimension is smaller Light, but due in sapphire ingot is processed, polishing to end face is only to facilitate detect its crystal orientation, therefore by end face part Polishing has no effect on detection.In conclusion the present invention while raising efficiency and machining accuracy, does not influence being applicable in for size Property.
The belt transfer structure of each motor, the connection structure between chuck seat and guide rail have not been able in specification in the present invention And all illustrated in attached drawing, because it is machinery field conventional technical means, have no effect on the integrality of the technology of the present invention content.

Claims (1)

1.一种蓝宝石晶棒切割抛光装置，包括机架、晶棒固定装置、切割片和喷淋系统，其特征是：所述晶棒固定装置包括三爪卡盘，所述三爪卡盘设置于卡盘座上，卡盘与卡盘座通过轴承连接，卡盘由第一伺服电机驱动，卡盘座设置于导轨上，其底部安装有丝母，所述丝母匹配有丝杆，丝杆横向设置并由第二伺服电机驱动，所述切割片包括外切片和内抛光片。1. A sapphire crystal rod cutting and polishing device, comprising a frame, a crystal rod fixing device, a cutting sheet and a spray system, is characterized in that: the crystal rod fixing device includes a three-jaw chuck, and the three-jaw chuck is set On the chuck seat, the chuck and the chuck seat are connected by bearings, the chuck is driven by the first servo motor, the chuck seat is set on the guide rail, and a nut is installed on the bottom of the nut, the nut is matched with a screw rod, and the screw The rod is arranged transversely and is driven by a second servo motor, and the cutting sheet includes an outer slicing sheet and an inner polishing sheet.
CN201810750664.8A 2018-07-10 2018-07-10 A kind of sapphire ingot cutting and polishing device Pending CN108890423A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810750664.8A CN108890423A (en) 2018-07-10 2018-07-10 A kind of sapphire ingot cutting and polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810750664.8A CN108890423A (en) 2018-07-10 2018-07-10 A kind of sapphire ingot cutting and polishing device

Publications (1)

Publication Number Publication Date
CN108890423A true CN108890423A (en) 2018-11-27

Family

ID=64348947

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810750664.8A Pending CN108890423A (en) 2018-07-10 2018-07-10 A kind of sapphire ingot cutting and polishing device

Country Status (1)

Country Link
CN (1) CN108890423A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110961553A (en) * 2019-11-01 2020-04-07 李钰宁 Explosion-proof technical method for cutting steel wire rope

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202357016U (en) * 2011-10-28 2012-08-01 浠水三高新材料有限责任公司 Combinatorial diamond cutting and grinding tool integrated with functions of cutting, chamfering and grinding
CN206953309U (en) * 2017-05-22 2018-02-02 浙江晶瑞电子材料有限公司 A kind of sapphire ingot cutting device
CN209335278U (en) * 2018-07-10 2019-09-03 山西中聚晶科半导体有限公司 A kind of sapphire ingot cutting and polishing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202357016U (en) * 2011-10-28 2012-08-01 浠水三高新材料有限责任公司 Combinatorial diamond cutting and grinding tool integrated with functions of cutting, chamfering and grinding
CN206953309U (en) * 2017-05-22 2018-02-02 浙江晶瑞电子材料有限公司 A kind of sapphire ingot cutting device
CN209335278U (en) * 2018-07-10 2019-09-03 山西中聚晶科半导体有限公司 A kind of sapphire ingot cutting and polishing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110961553A (en) * 2019-11-01 2020-04-07 李钰宁 Explosion-proof technical method for cutting steel wire rope

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Application publication date: 20181127

RJ01 Rejection of invention patent application after publication