CN108819404A - A kind of protection diaphragm entering foreign matter when preventing soft copy from crossing high-temperature service - Google Patents

Abstract

The invention discloses it is a kind of prevent soft copy from crossing high-temperature service when enter the protection diaphragm of foreign matter, including PI substrate；The side of PI substrate is coated with layer of silica gel；The intermediate position of layer of silica gel is compounded with PI layers；Portion is torn to be structure as a whole with PI layers or PI substrate；Product is easily peelable, is suitble to automation to use, equal Pasting is secured on metal and plastic product, is torn after taking from metal and plastics without residue glue, and do not influence metalwork（Such as silicon wheat outer casing member）And plastic products（Such as PCB）Subsequent use, has a wide range of application, and reduces cost, improves efficiency about 42.86%；Automation is compared with labour saving 64.55%.

Description

A protective diaphragm to prevent foreign matter from entering electronic parts when the equipment is overheated

technical field

The invention relates to an electronic product, in particular to a protective diaphragm for preventing foreign objects from entering into the electronic parts when the equipment is overheated, and belongs to the field of electronic technology.

Background technique

The market's demand for silicon wheat is increasing day by day. In the production process of electronic products, silicon wheat or PCB boards attached to silicon wheat need to pass through high-temperature equipment such as reflow soldering or reflow furnace. The entry of impurities and foreign objects from the sound hole will cause poor acoustics and lead to product failure.

At present, most silicon mics or PCB boards with silicon mics need to be pasted manually, which is low in efficiency and high in cost. It takes about 35 minutes for 1000PCS to be pasted by one person; according to 3 million PCS per month, the number of labor is required About 9 people/day, the labor cost is calculated at 3.5K per month, and the required cost is about 37.8W yuan/year.

There is a protective product on the market that can be attached to the silicon wheat metal shell, but no protective product for attaching the silicon wheat to the PCB board has been found. The applicant found in the process of realizing the present invention that the current protective product has the following defects :

1. Unstability during peeling makes it difficult for automatic equipment to pick up, greatly reducing the attachment efficiency and yield;

2. After attaching, there is residual glue after being torn off by high-temperature equipment such as reflow soldering or reflow furnace;

3. It can be attached to metal, but it cannot be firmly attached to plastic products such as PCB, which will cause it to fall off easily when passing high-temperature equipment such as reflow soldering or reflow furnace, and cannot play a protective role;

4. The side is easy to overflow glue, so it is easy to stick to the automatic equipment suction head or auxiliary peeling device;

5. At present, it is not possible to realize the common use of different automation equipment, and it needs to be redesigned for different electronic products, and the equipment cost is high.

6. The investment is large. At present, one lamination equipment on the market is about 50W/set. To realize the protection of different products,

Need to invest in multiple lamination equipment.

Contents of the invention

The problem to be solved by the present invention is to provide a protective diaphragm to prevent foreign matter from entering the electronic parts when the equipment is overheated. It can be used, and can be attached to metal parts and plastic parts at the same time, with low cost and high economic benefit.

In order to solve the above-mentioned technical problems, the technical solution of the present invention is: a protective film for preventing foreign matter from entering the electronic parts when the equipment is overheated, which is characterized in that it includes a PI substrate;

One side of the PI substrate is coated with a silicone layer;

The middle part of the silica gel layer is compounded with a PI layer;

It also includes a tearing part, and the tearing part is integrated with the PI layer or the PI substrate.

Further, the protective membranes are evenly arranged on the material tape to form a reel.

Further, the thickness of the PI substrate is 25-70u.

Further, the thickness of the silica gel layer is 20-40u, and the viscosity is 400-1000g.

Further, the thickness of the PI layer is 10-50u.

Further, the temperature resistance of the PI substrate, the silica gel layer, the PI layer and the tearing part is above 260°C.

Further, PI is polyimide produced by EAIPI Company of the United States.

Further, the thickness of the PI substrate is 50u; the thickness of the silica gel layer is 25u, the viscosity is 600g; the thickness of the PI layer is 25u.

The present invention has adopted above-mentioned technical scheme, compared with prior art, has following advantage:

1. The product is easy to peel off and is suitable for automatic use. The existing placement machine can use the protective film of the present invention to realize automatic bonding, and it is easy to peel off.

2. The protective film of the present invention can be firmly pasted on metal and plastic products. After the pasting, there is no side glue overflow after standing for a week; it has been passed through high-temperature equipment such as reflow soldering or reflow oven three times in a row, and observation: the adhesion is firm and falls off , shrinkage, coking phenomenon, and no side overflow phenomenon, which proves that it can play a 100% protective role.

3. After attaching, pass high-temperature equipment such as reflow soldering or reflow furnace, and there will be no adhesive residue after being torn off from metal and plastic, and it will not affect the subsequent use of metal parts (such as silicon wheat shell parts) and plastic products (such as PCB). wide range.

4. Tearing part: prevent impurities and foreign matter from entering the product after reflow soldering or reflow furnace and other high-temperature equipment, and facilitate manual automatic clamping with auxiliary tools or equipment to realize the easy-peeling function.

5. Reduce costs, it takes 20 minutes to use automatic lamination equipment for lamination of 1000PCS, and the efficiency is increased by about 42.86%; according to 3 million PCS per month, the use of automation requires 2 laborers, 5 sets of automation equipment, and labor costs are calculated on a monthly basis 3.5K calculation, equipment 1W yuan, a total of 13.4W/year, automation saves 24.4W yuan/year compared with manual labor, saving 64.55%.

The present invention will be described in detail below in conjunction with the embodiments and accompanying drawings.

Description of drawings

Accompanying drawing 1 is the structural representation of protective diaphragm in the embodiment of the present invention 1;

Accompanying drawing 2 is the side view of accompanying drawing 1;

Accompanying drawing 3 is the structural representation of protective diaphragm in the embodiment of the present invention 2;

Accompanying drawing 4 is the side view of accompanying drawing 3;

Accompanying drawing 5 is the arrangement diagram of protective diaphragm on the strip in the embodiment of the present invention;

Accompanying drawing 6 is the structural diagram of tape in the embodiment of the present invention;

In the figure,

1-PI substrate, 2-silica gel layer, 3-PI layer, 4-tear part, 5-material tape, 6-tape.

Detailed ways

Embodiment 1, as shown in accompanying drawing 1, Fig. 2, Fig. 5, Fig. 6, a kind of protective diaphragm that prevents foreign matter from entering when electronic parts are overheated equipment, comprises PI base material 1, and the thickness of PI base material 1 is 25 -70u, temperature resistance above 260°C;

One side of the PI substrate 1 is coated with a silica gel layer 2, the thickness of the silica gel layer 2 is 20-40u, and the viscosity is 400-1000g;

The middle part of the silica gel layer 2 is compounded with a PI layer 3, which is a PI material with a high temperature resistance higher than 260°C. The current test range is 10-50u.

PI is polyimide produced by American EAIPI company.

It also includes a tearing part 4, which is integrated with the PI layer 3. The tearing part 4 is made of PI material, which is convenient for removing the protective diaphragm after the process is completed.

The above protective membranes are evenly arranged on the material belt 5 to form a reel 6, and a 0.5m material-free area is reserved at the head and tail of each reel. The inner diameter of the material reel is 76mm; the material belt 5 is PET release paper, the thickness 30-70u, preferably 50u, the adhesive side of the protective diaphragm is attached to the material tape 5 .

When in use, put the reel 6 on the feeding end of the automatic equipment, pull the material belt 5 through the equipment and pull it to the peeling position, start the machine, the protective film will be automatically peeled to the feeding platform, and the sensor will stop feeding after sensing the material , the suction head sucks the protective diaphragm from the material picking platform, the PI substrate 1 on both sides of the PI layer 3 is pasted on the silicon wheat or PCB board, the PI layer 3 seals the silicon wheat hole, and the bonded silicon wheat or Put the PCB board into high-temperature equipment such as reflow soldering or reflow furnace, take out the silicon wheat or PCB board after the set time is completed, and use tweezers to grab the tearing part 4 to tear off the protective film.

Embodiment 2, as shown in accompanying drawing 3, Fig. 4, Fig. 5, Fig. 6, a kind of protective diaphragm that prevents foreign matter from entering when the electronic parts are overheated equipment, comprises PI base material 1, and the thickness of PI base material 1 is 25 -70u, temperature resistance above 260°C;

One side of the PI substrate 1 is coated with a silica gel layer 2, the thickness of the silica gel layer 2 is 20-40u, and the viscosity is 400-1000g;

The middle part of the silica gel layer 2 is compounded with a PI layer 3, a PI material with a high temperature resistance higher than 260°C, and a thickness of 10-50u.

PI is polyimide produced by American EAIPI company.

It also includes a tearing part 4, which is an integral structure with the PI base material 1, and is arranged on the upper or lower end of the PI base material 1. The tearing part 4 is made of PI material, which is convenient for removing the protective film after the process is completed.

The above protective membranes are evenly arranged on the material belt 5 to form a reel 6, and a 0.5m material-free area is reserved at the head and tail of each reel. The inner diameter of the material reel is 76mm; the material belt 5 is PET release paper, the thickness 30-70u, preferably 50u, the adhesive side of the protective diaphragm is attached to the material tape 5 .

When in use, put the reel 6 on the feeding end of the automatic equipment, pull the material belt 5 through the equipment and pull it to the peeling position, start the machine, the protective film will be automatically peeled off to the feeding platform, and the sensor will stop feeding after sensing the material , the suction head sucks the protective diaphragm from the reclaiming platform, the PI substrate 1 on both sides of the PI layer 3 is pasted on the silicon wheat or PCB board, the PI layer 3 seals the silicon wheat holes, and the bonded silicon wheat or Put the PCB board into high-temperature equipment such as reflow soldering or reflow furnace, take out the silicon wheat or PCB board after the set time is completed, and use tweezers to grab the tearing part 4 to tear off the protective film.

The test shows that: after using the above protective diaphragm, the defects in the prior art can be solved, and the different parameters of the PI substrate 1, the silica gel layer 2, the PI layer 3 and the material tape 5 are subjected to an orthogonal test;

The thickness of PI substrate 1 is selected from 25u, 30u, 35u, 40u, 45u, 50u, 55u, 60u, 65u, 70u;

The thickness of the silica gel layer 2 is selected from 20u, 25u, 30u, 35u, 40u, the viscosity of the silica gel layer 2 is selected from 400g-1000g, and the interval is 50g;

The thickness of the PI layer 3 is selected from 10u, 15u, 20u, 25u, 30u, 35u, 40u, 45u, 50u;

Orthogonal tests show that:

The thickness of the PI substrate 1 is 50u; the thickness of the silica gel layer 2 is 25u, and the viscosity is 600g; the thickness of the PI layer 3 is 25u; the effect is best when the thickness of the tape 5 is 50u.

The product is easy to peel off and is suitable for automatic use. The existing placement machine can use the above protective film to achieve automatic bonding, and it is easy to peel off.

The protective film can be firmly pasted on both metal and plastic products. After pasting, let it stand for a week without overflowing glue on the side; pass through high-temperature equipment such as reflow soldering or reflow furnace three times in succession, observe: the adhesion is firm, falling off, shrinking, and coking Phenomenon, and there is no side overflow phenomenon, which proves that it can play a 100% protective role.

After being attached, pass through high-temperature equipment such as reflow soldering or reflow furnace, and there will be no adhesive residue after being torn off from metal and plastic, and it will not affect the subsequent use of metal parts (such as silicon wheat shell parts) and plastic products (such as PCB), with a wide range of applications

Tear part: It can effectively prevent impurities and foreign matter from entering the product after reflow soldering or reflow furnace and other high-temperature equipment, and it is convenient for manual use of auxiliary tools or equipment for automatic clamping to realize the easy-peeling function.

Cost calculation: Laminating 1000PCS, it takes 20 minutes to use automatic laminating equipment, and the efficiency is improved by about 42.86%; at 3 million PCS per month, using automation requires 2 manual workers, 5 sets of automatic equipment, and labor costs are based on 3.5K per month Calculated, the equipment is 1W yuan, a total of 13.4W/year, automation saves 24.4W yuan/year compared with manual labor, saving 64.55%.

The above descriptions are examples of the best implementation modes of the present invention, and the parts not mentioned in detail are common knowledge of those skilled in the art. The protection scope of the present invention is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the present invention is also within the protection scope of the present invention.

Claims (8)

1. a kind of protection diaphragm for entering foreign matter when preventing soft copy from crossing high-temperature service, it is characterised in that：Including PI substrate（1）；

PI substrate（1）Side be coated with layer of silica gel（2）；

Layer of silica gel（2）Intermediate position be compounded with PI layers（3）；

It further include the portion of tearing（4）, tear portion（4）With PI layers（3）Or PI substrate（1）It is structure as a whole.

2. protection diaphragm as described in claim 1, it is characterised in that：Protection diaphragm is evenly spaced in material strip（5）On, volume is made Band（6）.

3. protection diaphragm as described in claim 1, it is characterised in that：PI substrate（1）With a thickness of 25-70u.

4. protection diaphragm as described in claim 1, it is characterised in that：Layer of silica gel（2）With a thickness of 20-40u, sticky 400- 1000g。

5. protection diaphragm as described in claim 1, it is characterised in that：PI layers（3）Thickness 10-50u.

6. protection diaphragm as described in claim 1, it is characterised in that：PI substrate（1）, layer of silica gel（2）, PI layers（3）And it tears Portion（4）260 DEG C of heatproof or more.

7. protection diaphragm as described in claim 1, it is characterised in that：PI is that U.S. EAIPI Yi Erpuai company produces polyamides Asia Amine.

8. protection diaphragm as described in claim 1, it is characterised in that：PI substrate（1）With a thickness of 50u；Layer of silica gel（2）Thickness Degree is 25u, sticky 600g；

PI layers（3）Thickness 25u.