CN108816669B - Automatic dispensing curing system and method for silicon rod - Google Patents

Automatic dispensing curing system and method for silicon rod Download PDF

Info

Publication number
CN108816669B
CN108816669B CN201810945753.8A CN201810945753A CN108816669B CN 108816669 B CN108816669 B CN 108816669B CN 201810945753 A CN201810945753 A CN 201810945753A CN 108816669 B CN108816669 B CN 108816669B
Authority
CN
China
Prior art keywords
silicon rod
curing
unit
silicon
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201810945753.8A
Other languages
Chinese (zh)
Other versions
CN108816669A (en
Inventor
沈皓然
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Goldway Technologies Co Ltd
Original Assignee
Suzhou Goldway Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Goldway Technologies Co Ltd filed Critical Suzhou Goldway Technologies Co Ltd
Priority to CN201810945753.8A priority Critical patent/CN108816669B/en
Publication of CN108816669A publication Critical patent/CN108816669A/en
Application granted granted Critical
Publication of CN108816669B publication Critical patent/CN108816669B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles

Abstract

The invention provides an automatic dispensing and curing system and an automatic curing method for a silicon rod, which comprise a silicon rod body feeding device, a substrate feeding device, a fixing clamp feeding device, a dispensing chamber, a dispensing device arranged in the dispensing chamber, a primary curing device, a secondary curing device for carrying out secondary curing on the silicon rod preliminarily cured by the primary curing device and a control unit, wherein the substrate discharging end of the substrate feeding device is close to the fixing clamp feeding end; the whole silicon wafer processing process does not need manual operation, so that automatic dispensing and curing of the silicon rod are realized, the labor cost is saved, and the silicon wafer can be prevented from being damaged and lost due to manual operation in the production process; and the fixing clamp can be recycled.

Description

Automatic dispensing curing system and method for silicon rod
Technical Field
The invention relates to a monocrystalline silicon bonding machine, in particular to an automatic dispensing and curing system and an automatic dispensing and curing method for silicon rods, which are used for realizing automatic dispensing and curing of the silicon rods in an unmanned workshop.
Background
When silicon wafers are manufactured, a fixing jig for fixing the silicon rod, a base plate and the silicon rod need to be bonded together in order by glue. At present, the fixing clamp, the substrate and the silicon rod are generally bonded manually, so that the production efficiency of the silicon wafer is low, the labor cost is high, and the large-scale production of the silicon wafer is not facilitated.
Meanwhile, when the silicon wafer is just produced, the glue is not completely solidified, at the moment, the silicon wafer bonded on the substrate is easy to be inclined due to the action of external force (such as mistaken collision of operators and light collision of other objects in the carrying process), and the qualification rate of the silicon wafer is reduced.
In view of the above, there is a need to provide a novel automatic dispensing curing system and method for silicon rods to solve the above problems.
Disclosure of Invention
The invention aims to provide an automatic dispensing and curing system and an automatic dispensing and curing method for silicon rods, which are used for realizing automatic dispensing and curing of the silicon rods in an unmanned workshop.
In order to achieve the purpose, the invention adopts the following technical scheme: the automatic dispensing and curing system for the silicon rod comprises a silicon rod body feeding device for providing a silicon rod body, a substrate feeding device for providing a substrate, a fixing clamp feeding device for providing a fixing clamp, a dispensing chamber for bonding the substrate positioned in the fixing clamp and the silicon rod body together to form the silicon rod, a dispensing device arranged in the dispensing chamber, a primary curing device connected with a dispensing outlet of the dispensing chamber and used for carrying out primary curing on the silicon rod, a secondary curing device for carrying out secondary curing on the silicon rod subjected to primary curing by the primary curing device and a control unit, wherein the substrate discharging end of the substrate dispensing device is close to the fixing clamp feeding end, and the automatic dispensing and curing system for the silicon rod further comprises a second manipulator unit, a second manipulator unit and a third manipulator unit, wherein the second manipulator unit is used for mounting the substrate at the substrate discharging end onto the fixing clamp at the fixing clamp feeding end, And locate the preliminary solidification export of preliminary solidification device with the dismantlement transfer device between the mounting fixture material loading end of mounting fixture material loading attachment, the second manipulator unit, dismantle the transfer device all with the control unit communication is connected.
As a further improved technical solution of the present invention, the disassembling and transferring device includes a first manipulator unit that disassembles the silicon rod from the fixing clamp and conveys the silicon rod to the secondary curing device, and a first conveying unit that conveys the fixing clamp to the feeding end of the fixing clamp, and both the first manipulator unit and the first conveying unit are in communication connection with the control unit.
As a further improved technical scheme of the invention, the first conveying unit is a roller line which connects the primary curing outlet and the feeding end of the fixing clamp.
As a further improved technical solution of the present invention, the silicon rod body feeding device includes a detection device for detecting the number of segments of the silicon rod body and the related information of the segment point, and the detection device is in communication connection with the control unit.
As a further improved technical solution of the present invention, the detection device is a camera device or an infrared sensing device.
As a further improved technical solution of the present invention, the secondary curing device includes a curing chamber having a plurality of curing cells, and a third robot unit for transferring the silicon rod on the first robot unit into the curing chamber, and the third robot unit is in communication connection with the control unit.
As a further improved technical solution of the present invention, the automatic dispensing and curing system for silicon rods further comprises a sensor for determining whether the secondary curing of the silicon rods is completed and a fourth manipulator unit for moving the silicon rods after the secondary curing out of the curing chamber; the sensor and the fourth manipulator unit are in communication connection with the control unit.
In order to achieve the above object, the present invention further provides an automatic dispensing and curing method of the above silicon rod automatic dispensing and curing system, wherein the disassembling and transferring device includes a first robot unit for disassembling the silicon rod from the fixing clamp and conveying the silicon rod to the secondary curing device, and a first conveying unit for conveying the fixing clamp to the feeding end of the fixing clamp, and the automatic dispensing and curing method includes the following steps:
conveying the fixed clamp and the substrate into a dispensing chamber, spraying glue on the substrate, and conveying the silicon rod body into the dispensing chamber to be bonded with the substrate to form a silicon rod;
conveying the fixing clamp with the silicon rod to a primary curing device for primary curing;
after the preliminary curing is completed, conveying the fixing clamp with the silicon rod to a first conveying unit;
after the silicon rod and the fixed clamp are detached by the first mechanical hand unit, the silicon rod is conveyed to the secondary curing device by the first mechanical hand unit, and the fixed clamp is conveyed to the feeding end of the fixed clamp by the first conveying unit after the first conveying unit is started.
As a further improved technical solution of the present invention, after the first conveying unit starts to convey the fixing clamp to the feeding end of the fixing clamp, the automatic dispensing curing method further includes the following steps:
and controlling the second manipulator unit to grab the substrate at the substrate discharging end and installing the substrate into the fixing clamp at the fixing clamp feeding end.
As a further improved technical solution of the present invention, the silicon rod body feeding device includes a detection device for detecting the number of segments and the segmentation point of the silicon rod body, and the detection device is in communication connection with the control unit; before the silicon rod body is conveyed into the dispensing chamber to be bonded with the substrate to form the silicon rod, the automatic dispensing and curing method further comprises the following steps:
the detection device detects the number of sections of the silicon rod body and relevant information of the section points and feeds the information back to the control unit;
and the control unit controls the dispensing device to dispense glue according to the related information.
The invention has the beneficial effects that: according to the automatic dispensing and curing system for the silicon rod, the secondary curing device for carrying out secondary curing on the primarily cured silicon rod and the dismounting and transferring device for transferring the primarily cured silicon rod into the secondary curing device are arranged, so that manual operation is not needed in the whole silicon wafer processing process, automatic dispensing and curing of the silicon rod are realized, namely, full-automatic production of the silicon wafer is realized, the labor cost is saved, and the damage and the loss caused by the damage of the silicon wafer which is just produced due to manual operation in the production process can be avoided; and the fixing clamp can be recycled.
Drawings
Fig. 1 is a schematic view of an automatic dispensing curing system according to the present invention.
Fig. 2 is an enlarged schematic view of a structure at a in fig. 1.
Fig. 3 is a schematic view of a structure of a holding jig carrying a silicon rod.
Fig. 4 is a schematic structural view of a unit for detaching the transfer device from the second robot.
Fig. 5 is a schematic structural view of the first robot unit in fig. 4.
Detailed Description
The present invention will be described in detail with reference to the embodiments shown in the drawings, and reference is made to fig. 1 to 5, which are preferred embodiments of the present invention.
The invention provides an automatic dispensing and curing system 100 for silicon rods, which is used for realizing full-automatic production of silicon wafers, so that the labor cost is reduced, and the damage to the silicon wafers which are just produced and caused by manual operation in the production process is avoided.
The automatic dispensing and curing system 100 for the silicon rod comprises a silicon rod body feeding device 1 for providing a silicon rod body 11, a substrate feeding device 2 for providing a substrate 21, a fixing clamp feeding device 3 for providing a fixing clamp 31, a dispensing chamber 4 for bonding the substrate 21 in the fixing clamp 31 and the silicon rod body 11 together to form the silicon rod, a dispensing device (not shown) arranged in the dispensing chamber 4, a primary curing device 5 connected with a dispensing outlet (not numbered) of the dispensing chamber 4 and used for carrying out primary curing on the silicon rod, a secondary curing device 6 for carrying out secondary curing on the silicon rod primarily cured by the primary curing device 5, and a control unit, wherein the silicon rod body feeding device 1, the substrate feeding device 2, the fixing clamp feeding device 3, the dispensing device, the primary curing device 5 and the secondary curing device 6 are all in communication connection with the control unit, so as to control the operation of the automatic dispensing curing system 100 for silicon rods through the control unit.
The control unit is a programmable logic controller PLC, and of course, the control unit may also be another controller capable of controlling the operation of the automatic dispensing curing system 100 for silicon rods.
The silicon rod body feeding device 1 comprises a detection device (not shown) for detecting the number of segments of the silicon rod body 11 and the related information of the segment points, the detection device is in communication connection with the control unit, and the control unit controls the dispensing curve of the dispensing device according to the number of segments fed back by the detection device and the related information of the segment points, so that the dispensing device coats glue on the substrate and the silicon rod body 11 are matched, namely, the position of the substrate 21 corresponding to the segment points is in a glue-free state, and the cost is saved.
Further, the silicon rod body feeding device 1 further comprises a detection chamber for accommodating the silicon rod body 11, and the detection device is arranged in the detection chamber.
Specifically, the detection device is a camera device or an infrared sensing device, and detection by the camera device or the infrared sensing device is prior art and is not described herein again.
The automatic dispensing and curing system 100 for silicon rods of the present invention comprises a plurality of dispensing chambers 4 arranged side by side to achieve synchronous dispensing of a plurality of substrates 21 and increase the production efficiency of silicon rods.
Further, the automatic dispensing and curing system for the silicon rod further comprises a conveying line connecting the outlet of the detection chamber with the plurality of dispensing chambers 4, so as to convey the silicon rod bodies which are detected to the corresponding dispensing chambers 4.
Of course, it is understood that a robot may be additionally provided to transfer the silicon rod bodies 11 on the transfer line into the corresponding dispensing chambers 4.
After being conveyed out of the dispensing chamber 4, the fixing clamp 31 with the silicon rod slowly advances on the primary curing device 5 for 2 hours and then reaches a primary curing outlet, and primary curing is completed.
The fixing clamp 31 includes a bottom wall 311, side walls 312 disposed at two opposite ends of the bottom wall 311 in the width direction, a plurality of support rods 313 protruding upward from the side walls, a limit frame 314 detachably connected to one end of the support rod 313 far from the side wall 312 and used for limiting the silicon rod, and a limit block 315 protruding from the inner side of the side wall 312 and used for limiting the substrate 21, wherein the limit frame 314 has an opening for the silicon rod body 11 to pass through.
After the substrate 21 is mounted in the fixing clamp 31, the limiting block 315 limits the movement of the substrate 21, so as to prevent the substrate 21 from falling off from the fixing clamp 31, and improve the accuracy of the dispensing device.
After the fixing jig 31 with the substrate 21 is transferred into the dispensing chamber 4 and the substrate 21 is coated with the glue, the silicon rod body 11 is transferred into the dispensing chamber 4 and the silicon rod body 11 is placed into the fixing jig 31 from the opening to be bonded with the substrate 21.
A plurality of first grooves 211 are concavely formed in both sides of the substrate 21 in the length direction, and after the substrate 21 is placed in the fixing jig 31, the first grooves 211 are opened toward the outer side of the fixing jig 31 to enable the silicon rod to be grasped by the first grooves 211, so that the silicon rod is separated from the fixing jig 31.
Further, the automatic dispensing and curing system 100 for silicon rods further comprises a disassembling and transferring device 7 arranged between a preliminary curing outlet of the preliminary curing device and a fixing clamp feeding end of the fixing clamp feeding device 3, and the disassembling and transferring device 7 is in communication connection with the control unit.
The disassembling and transferring device 7 includes a first manipulator unit 71 for disassembling the silicon rod from the fixing clamp 31 and conveying the silicon rod to the secondary curing device 6, and a first conveying unit (not shown) for conveying the disassembled fixing clamp 31 to the feeding end of the fixing clamp, wherein the first manipulator unit 71 and the first conveying unit (not shown) are both in communication connection with the control unit.
The first conveying unit (not shown) is a roller line connecting the preliminary curing outlet and the feeding end of the fixing fixture, after the preliminary curing of the fixing fixture 31 loaded with the silicon rod is completed, the control unit controls the first conveying unit to start, and controls the first conveying unit to stop after the fixing fixture 31 loaded with the silicon rod after the preliminary curing is transferred onto the first conveying unit, so that the fixing fixture 31 loaded with the silicon rod stays on the first conveying unit, and the first manipulator unit 71 is convenient for detaching and separating the silicon rod from the fixing fixture 31.
The first robot unit 71 includes a first frame 711, a first driving unit 712 provided on the first frame 711, and a gripper unit 73 fixed to the first driving unit 712 and positioned above the first transfer unit (not shown).
The first driving assembly 712 includes a first rack 7121 fixed to the first bracket 711 and extending from the first conveying unit to the secondary curing device, a first guide plate 7122 slidably connected to the first bracket 711, a first driving member 7123 fixed to the first guide plate 7122 and engaged with the first rack 7121, and a second driving member 7124 fixed to the first guide plate 7122 and configured to drive the grabbing unit 73 to move up and down, where the grabbing unit 73 is connected to the second driving member 7124.
Specifically, a protruding strip is disposed on the first bracket 711, and a long groove matched with the protruding strip is disposed on the first guide plate 7122, so that when the first driving member 7123 is started to drive the first guide plate 7122 to move along the first rack 7121, the protruding strip is matched with the long groove to limit the first guide plate 7122, so that the first guide plate 7122 moves along the first rack 7121, and the grabbing unit is driven to switch between the secondary curing device 6 and the first conveying unit (not shown).
The second driving member 7124 drives the grasping unit 73 to move up and down to grasp the silicon rod, so that the silicon rod is separated from the fixing jig 31.
Specifically, the first driving member 7123 and the second driving member 7124 are both motors.
The grabbing unit 73 includes a first fixing plate 731 fixed on the second driving member 7124 and matching with the shape of the fixing fixture 31, a plurality of first claw groups 732 disposed below the first fixing plate 731, and first fixing members 733 disposed on two opposite sides of the first fixing plate 731 in the width direction and used for fixing the limiting frame 314.
Further, the automatic dispensing and curing system 100 for silicon rods further includes a positioning member (not shown) for positioning the fixing clamp 31, and after the fixing clamp 31 carrying the silicon rods is located on the first conveying unit (not shown), the positioning member is controlled to position the fixing clamp 31, so that the grasping unit 73 can grasp the silicon rods and the limiting frame 31 synchronously.
Specifically, each of the first jaw sets 732 includes a first guide rib fixed below the first fixing plate 731 and extending in the width direction of the base plate 21, and two first jaws slidably coupled to the first guide rib, and the first jaws are engaged with the first grooves 211 on the base plate 21 to grip the silicon rod.
Further, the first manipulator unit 71 further includes a first driving motor for driving the two first jaws of each first jaw group to move along the first guide rib 731 and position the first jaws, and during the process of grabbing the silicon rod, the two first jaws are controlled to move in opposite directions so that the distance between the two first jaws is greater than the width of the silicon rod, thereby preventing the first jaws from interfering with the silicon rod during the grabbing process, damaging the silicon rod body or preventing the silicon rod from being grabbed; then, the second driving part 8124 is controlled to drive the first fixing plate 731 to drive the first jaw set 732 to move downwards, after the lower end of the first jaw moves to the position of the first groove 211, the two first jaws are controlled to move towards each other so that the lower end of the first jaw protrudes into the first groove 211, and finally, the second driving part 8124 is controlled to drive the first fixing plate 731 to drive the first jaw set 732 to move upwards, so that the silicon rod can be separated from the fixing clamp 31.
Meanwhile, after controlling the two first jaws to move in opposite directions so that the lower ends of the first jaws protrude into the first groove 211, the control unit controls the first fixing part 733 to fix the limiting frame 314, so that when controlling the second driving part 8124 to drive the first fixing plate 731 to move upwards, the limiting frame 314 and the supporting rod 313 are synchronously separated, so as to prevent the limiting frame 314 from blocking the silicon rod from being separated from the fixing clamp 31.
After the grabbing unit 73 grabs the silicon rod and the limiting frame 314, the control unit controls the first driving part 7123 to start, drives the grabbing unit 73 to move to the position of the secondary curing device 6, and then controls the two first jaws to move in opposite directions to place the silicon rod at the position of the secondary curing device 6 for secondary curing; finally, the first driving member 7123 is controlled to start to drive the grabbing unit 73 to return to the position of the first conveying unit (not shown), the second driving member 7124 is controlled to start to drive the grabbing unit 73 to move downwards, and the first fixing member 733 is controlled to loosen the limiting frame 314 after the limiting frame 314 is remounted on the supporting rod 313.
After the first fixing part 733 loosens the limiting frame 314, the control unit controls the positioning part to stop and controls the first conveying unit (not shown) to start, so as to convey the fixing clamp 31 to the feeding end of the fixing clamp, thereby realizing the reuse of the fixing clamp 31.
Specifically, the number of the first jaw sets 732 is two to improve the stability of the grasping unit 73 in grasping the silicon rod.
Further, the first fixing part 733 includes a first mounting plate 7331 fixed to the first fixing plate 731 and extending downward, a second driving motor 7332 fixed to the first mounting plate 7331, and a first clamping block 7333 connected to the second driving motor 7332 and used for cooperating with the position-limiting frame 314, and the second driving motor 7332 is in communication connection with the control unit to drive the first clamping block 7333 to approach the position-limiting frame 314 to fix the position-limiting frame or to move away from the position-limiting frame 314 to release the position-limiting frame 314.
Specifically, one side of the first clamping block 7333, which faces the limiting frame 314, is provided with a step portion matched with the limiting frame 314, so as to enhance the stability of the first fixing part 733 fixing the limiting frame 314.
Further, the substrate discharge end of the substrate feeding device 2 is close to the fixing fixture feeding end, the automatic dispensing curing system 100 for silicon rods further comprises a second manipulator unit 8 for mounting the substrate 21 at the substrate discharge end onto the fixing fixture 31 at the fixing fixture feeding end, and the second manipulator unit 8 is in communication connection with the control unit.
The second manipulator unit 8 is identical to the first manipulator unit 71 in structure, and specifically, the second manipulator unit 8 includes a second support 81, a second driving assembly 82 disposed on the second support 81, a second fixing plate fixed on the second driving assembly 82 and matched with the shape of the fixing clamp 31, a plurality of second jaw sets disposed below the second fixing plate and matched with the first groove 211, and second fixing members disposed on two opposite sides of the second fixing plate in the width direction and used for fixing the limiting frame 314.
The second driving assembly 82 comprises a second rack fixed on the second support 81 and extending from the feeding end of the fixing clamp to the discharging end of the substrate, a second guide plate slidably connected with the second support, a third driving piece fixed on the second guide plate and matched with the second rack, and a fourth driving piece fixed on the second guide plate and used for driving the second fixing plate to move up and down, wherein the second fixing plate is connected with the fourth driving piece.
The third driving piece drives the second fixing plate to move so as to switch between the substrate discharging end and the fixing clamp feeding end.
Specifically, each of the second jaw sets includes a second guide rib fixed below the second fixing plate and extending along the width direction of the substrate, and two second jaws slidably connected to the second guide rib, and the second jaws are matched with the first grooves on the substrate 21 to grab the substrate 21, so as to place the substrate 21 into the fixing fixture 31.
Further, the second robot unit 8 further includes a third driving motor for driving the two second claws of each second claw group to move along the second guide ribs and position the second claws, and during the process of grabbing the substrate 21, the two second claws are controlled to move in opposite directions so that the distance between the two second claws is greater than the width of the substrate 21, thereby preventing the second claws from interfering with the substrate 21 during the grabbing process and causing the substrate to be unable to be grabbed; and then, controlling the fourth driving part to drive the second fixing plate to drive the second jaw group to move downwards, controlling the two second jaws to move in opposite directions after the lower end of the second jaw moves to the position of the first groove, so that the lower end of the second jaw protrudes into the first groove 211, and finally controlling the fourth driving part to drive the second fixing plate to drive the second jaw group to move upwards and controlling the third driving part to drive the second jaw group to move to the feeding end of the fixed clamp, so that the substrate 21 is mounted in the fixed clamp 31.
Meanwhile, before the third driving part is controlled to drive the second jaw group to move to the substrate blanking end, the fourth driving part is controlled to drive the second fixing part to move downwards, the second fixing part is controlled to fix the limiting frame 314, then the fourth driving part is controlled to drive the second fixing part to move upwards, so that the limiting frame 314 is separated from the support rod 313, and then the third driving part is controlled to drive the second jaw group to move to the substrate blanking end to grab the substrate 21, so that when the substrate 21 is installed in the fixing clamp 31, the substrate 21 cannot interfere with the limiting frame 314, and the substrate 21 is convenient to install.
It can be understood that after the second clamping jaw group grabs the substrate 21 and switches to the feeding end of the fixing clamp, when the fourth driving element is controlled to drive the second fixing element to move downward, the substrate 21 is installed and the limiting frame 314 and the supporting rod 313 are assembled at the same time.
Specifically, after the fixing clamp 31 is located at the feeding end of the fixing clamp, a positioning element for positioning the fixing clamp 31 is also provided, so that the support rod 313 and the limiting frame 314 can be separated by the second manipulator unit 8.
Specifically, the second fixing piece includes the second mounting panel that is fixed in on the second fixed plate and downwardly extending, be fixed in fourth driving motor on the second mounting panel, with fourth driving motor is connected be used for with spacing frame matched with second joint piece, fourth driving motor is used for driving second joint piece is close to or keeps away from spacing frame 314.
The working process of fixing and releasing the limiting frame 314 by the second fixing member is the same as that of the first fixing member 733, and is not described herein again.
Further, the secondary solidification device 6 comprises a solidification chamber having a plurality of solidification cells 61, and a third robot unit 62 for transferring the silicon rods on the first robot unit 72 into the solidification chamber, wherein the third robot unit 62 is communicatively connected to the control unit.
Specifically, each of the curing lattices 61 includes two oppositely disposed support frames 611 and support bar groups 612 disposed on two opposite sides of the two support frames 611, each of the support bar groups 612 includes two oppositely disposed support bars 6121, and a gap is formed between the two support bars, so that the silicon rod is supported by the support bar groups 612, and the silicon rod is secondarily cured.
The third manipulator unit 62 includes a third driving assembly 621, a supporting plate 622 connected to the third driving assembly 621, and a support 623 protruding on the supporting plate 622 for supporting the silicon rod, the support 623 is in a long strip shape, and the width of the support 623 is not greater than two opposite gaps between the support bars 6121.
The third driving assembly 621 includes a first driving unit for driving the silicon rod to move along a depth direction of the curing compartment 61, a second driving unit connected to the first driving unit for driving the silicon rod to move along a height direction of the curing compartment, and a third driving unit connected to the second driving unit for driving the silicon rod to move along a length direction of the curing compartment, and the supporting plate 622 is connected to the first driving unit.
After the first manipulator unit 71 transfers the silicon rod to the end close to the secondary solidification device 6, the control unit controls the third driving component 621 to start moving the supporting plate 622 to the position where the silicon rod is located, and then the control unit controls the two first jaws to move in opposite directions to place the silicon rod on the support 623; then, after the third driving assembly 621 is controlled to move the supporting plate 622 to the position where the empty curing grid 61 is located, the first driving unit is controlled to drive the supporting plate 622 to move towards the depth direction of the curing grid 61, and after the supporting member 623 penetrates through the gap between the two opposite supporting bars 6121, the second driving unit is controlled to drive the supporting plate 622 to move downwards, so that the silicon rod is placed on the supporting bars 6121.
Further, the automatic dispensing and curing system 100 for silicon rods further includes a sensor (not shown) for determining whether the silicon rod secondary curing is completed or not and a fourth manipulator unit for moving the silicon rod after the secondary curing out of the curing chamber, the sensor and the fourth manipulator unit are both in communication connection with the control unit, and after the sensor senses that the silicon rod secondary curing is completed and feeds back to the control unit, the control unit controls the fourth manipulator unit to move the silicon rod out of the curing chamber, so that the silicon rod is dispensed, cured and transferred automatically, the labor cost is saved, and the qualified rate of silicon wafers is increased.
Further, the invention also provides an automatic dispensing curing method of the automatic dispensing curing system for the silicon rod, wherein the automatic dispensing curing method comprises the following steps:
conveying the fixing clamp 31 and the substrate 21 into a dispensing chamber, spraying glue on the substrate 21, and conveying the silicon rod body 11 into the dispensing chamber to be bonded with the substrate 21 to form a silicon rod;
conveying the fixing clamp with the silicon rod to a primary curing device 5 for primary curing;
after the preliminary curing is completed, the fixing jig 31 having the silicon rod is conveyed to the first conveying unit;
after the silicon rod and the fixing clamp are detached by the first manipulator unit 71, the silicon rod is conveyed to the secondary curing device 6 by the first manipulator unit, and the fixing clamp 31 is conveyed to the feeding end of the fixing clamp by the first conveying unit.
Thus, the fixing jig 31 can be reused.
Further, after the first conveying unit starts to convey the fixing clamp to the feeding end of the fixing clamp, the automatic dispensing and curing method further comprises the following steps:
the second robot unit 8 is controlled to grasp the substrate 21 at the substrate discharge end and mount the substrate into the fixing jig 31 at the fixing jig feed end.
Therefore, the substrate 21 and the fixing clamp 31 are directly preassembled, and the subsequent dispensing operation in the dispensing chamber 4 is facilitated.
Further, before the silicon rod body is conveyed into the dispensing chamber to be bonded with the substrate to form the silicon rod, the automatic dispensing and curing method further comprises the following steps:
the detection device detects the number of sections of the silicon rod body and relevant information of the section points and feeds the information back to the control unit;
the control unit controls the dispensing device according to the relevant information to enable the glue formed by the dispensing device on the substrate to be matched with the silicon rod body.
In summary, the automatic dispensing and curing system 100 for silicon rods according to the present invention is provided with the secondary curing device 6 for performing secondary curing on the primarily cured silicon rods and the detaching and transferring device 7 for transferring the primarily cured silicon rods into the secondary curing device, so that manual operation is not required in the whole silicon wafer processing process, such that automatic dispensing and curing of the silicon rods, i.e., full-automatic production of silicon wafers, is achieved, labor cost is saved, and damage to the silicon wafers just produced due to manual operation in the production process, which causes loss, can be avoided.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims (10)

1. The utility model provides an automatic point of silicon rod is glued solidification system, is including the silicon rod body loading attachment that provides the silicon rod body, the base plate loading attachment that provides the base plate, the mounting fixture loading attachment that provides mounting fixture, be used for to bond the base plate that is located mounting fixture and silicon rod body together and form the some room of gluing of silicon rod, locate the indoor some glue device of gluing, with the point of gluing the room is glued the export and is connected and be used for carrying out the primary cure's preliminary curing device to the silicon rod, carries out the secondary cure's secondary cure device and the control unit to the silicon rod after the preliminary cure of preliminary curing device, its characterized in that: the automatic dispensing and curing system for the silicon rods further comprises a second manipulator unit and a dismounting and transferring device, wherein the second manipulator unit is used for mounting the substrate at the substrate discharging end on a fixing clamp at the fixing clamp feeding end, the dismounting and transferring device is arranged between a primary curing outlet of the primary curing device and the fixing clamp feeding end of the fixing clamp feeding device, and the second manipulator unit and the dismounting and transferring device are both in communication connection with the control unit; the fixing clamp comprises a bottom wall, side walls arranged at two opposite ends of the bottom wall in the width direction, a plurality of supporting rods protruding upwards from the side walls, and a limiting frame which is detachably connected with one end of each supporting rod far away from the side wall and used for limiting the silicon rod, wherein an opening for the silicon rod body to penetrate through is formed in the limiting frame, and first grooves are concavely arranged on two sides of the substrate in the length direction.
2. The automatic dispensing curing system for silicon rods according to claim 1, wherein: the disassembling and transferring device comprises a first mechanical hand unit which is used for disassembling the silicon rod and the fixed clamp and conveying the silicon rod to the secondary curing device, and a first conveying unit which is used for conveying the fixed clamp to the feeding end of the fixed clamp, wherein the first mechanical hand unit and the first conveying unit are in communication connection with the control unit.
3. The automatic dispensing curing system for silicon rods according to claim 2, wherein: the first conveying unit is a roller line which is used for connecting the primary curing outlet and the feeding end of the fixing clamp.
4. The automatic dispensing curing system for silicon rods according to claim 1, wherein: the silicon rod body feeding device comprises a detection device for detecting the segment number of the silicon rod body and the related information of the segmentation point, and the detection device is in communication connection with the control unit.
5. The automatic dispensing curing system for silicon rods according to claim 4, wherein: the detection device is a camera device or an infrared sensing device.
6. The automatic dispensing curing system for silicon rods according to claim 2, wherein: the secondary curing device comprises a curing chamber with a plurality of curing grids and a third manipulator unit used for transferring the silicon rod on the first manipulator unit into the curing chamber, and the third manipulator unit is in communication connection with the control unit.
7. The automatic dispensing curing system for silicon rods according to claim 6, wherein: the automatic dispensing and curing system for the silicon rod further comprises a sensor for judging whether the secondary curing of the silicon rod is finished and a fourth manipulator unit for moving the silicon rod after the secondary curing out of the curing chamber; the sensor and the fourth manipulator unit are in communication connection with the control unit.
8. The automatic dispensing curing method of the automatic dispensing curing system for silicon rods according to claim 1, wherein: the disassembling and transferring device comprises a first manipulator unit for disassembling the silicon rod and the fixed clamp and conveying the silicon rod to the secondary curing device, and a first conveying unit for conveying the fixed clamp to the feeding end of the fixed clamp, and the automatic dispensing and curing method comprises the following steps:
conveying the fixed clamp and the substrate into a dispensing chamber, spraying glue on the substrate, and conveying the silicon rod body into the dispensing chamber to be bonded with the substrate to form a silicon rod;
conveying the fixing clamp with the silicon rod to a primary curing device for primary curing;
after the preliminary curing is completed, conveying the fixing clamp with the silicon rod to a first conveying unit;
after the silicon rod and the fixed clamp are detached by the first mechanical hand unit, the silicon rod is conveyed to the secondary curing device by the first mechanical hand unit, and the fixed clamp is conveyed to the feeding end of the fixed clamp by the first conveying unit after the first conveying unit is started.
9. The automatic dispensing curing method of claim 8, wherein: after the first conveying unit starts to convey the fixing clamp to the feeding end of the fixing clamp, the automatic dispensing and curing method further comprises the following steps:
and controlling the second manipulator unit to grab the substrate at the substrate discharging end and installing the substrate into the fixing clamp at the fixing clamp feeding end.
10. The automatic dispensing curing method of claim 8, wherein: the silicon rod body feeding device comprises a detection device for detecting the number of sections and the segmentation points of the silicon rod body, and the detection device is in communication connection with the control unit; before the silicon rod body is conveyed into the dispensing chamber to be bonded with the substrate to form the silicon rod, the automatic dispensing and curing method further comprises the following steps:
the detection device detects the number of sections of the silicon rod body and relevant information of the section points and feeds the information back to the control unit;
and the control unit controls the dispensing device to dispense glue according to the related information.
CN201810945753.8A 2018-08-20 2018-08-20 Automatic dispensing curing system and method for silicon rod Expired - Fee Related CN108816669B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810945753.8A CN108816669B (en) 2018-08-20 2018-08-20 Automatic dispensing curing system and method for silicon rod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810945753.8A CN108816669B (en) 2018-08-20 2018-08-20 Automatic dispensing curing system and method for silicon rod

Publications (2)

Publication Number Publication Date
CN108816669A CN108816669A (en) 2018-11-16
CN108816669B true CN108816669B (en) 2021-03-30

Family

ID=64150330

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810945753.8A Expired - Fee Related CN108816669B (en) 2018-08-20 2018-08-20 Automatic dispensing curing system and method for silicon rod

Country Status (1)

Country Link
CN (1) CN108816669B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112742668B (en) * 2020-12-24 2022-02-11 苏州桐力光电股份有限公司 Dispensing line for display screen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120180935A1 (en) * 2011-01-19 2012-07-19 Vannorden Jeffrey James Robotic placement machine for optical bonding, system and method of use thereof
CN202343376U (en) * 2011-11-17 2012-07-25 东莞广泽汽车饰件有限公司 Horizontal type spraying clamp
CN106206379B (en) * 2016-07-28 2019-02-22 苏州高登威科技股份有限公司 A kind of the automatically dropping glue solidification equipment and automatically dropping glue curing method of monocrystalline silicon
CN106995140A (en) * 2017-05-05 2017-08-01 天津中环半导体股份有限公司 A kind of full-automatic sticky stick unit for being used to be bonded crystal bar
CN207682956U (en) * 2017-12-18 2018-08-03 福建铁工机智能机器人有限公司 It is a kind of to utilize the equipment that 3D printing is refrigerator doors installation adhesive tape

Also Published As

Publication number Publication date
CN108816669A (en) 2018-11-16

Similar Documents

Publication Publication Date Title
CN105290786B (en) A kind of automatic assembly equipment of motor
CN108816669B (en) Automatic dispensing curing system and method for silicon rod
CN103192261B (en) Automatic assembling machine and method of machine core cover plate of air conditioner remote controller
CN205237504U (en) Automatic assembly equipment of motor
CN211192779U (en) O-shaped ring assembling machine
CN111532529B (en) Automatic bar labeling machine and labeling method
CN108816670B (en) Automatic dispensing and curing system for silicon rods
CN111015212A (en) Moving contact assembling machine and assembling method thereof
CN209830580U (en) Automatic butt-welding equipment for battery
CN108943747B (en) Refrigerator door shell trim equipment production facility
CN208757948U (en) The automatically dropping glue curing system of silicon rod
CN110677799A (en) Loudspeaker magnetic circuit gluing automatic production line
CN208839912U (en) The automatically dropping glue curing system of silicon rod
CN110538771A (en) Square filter PU solidification annular assembly line
CN110391721B (en) Feeding and discharging method for straight bar stator core winding machine
CN212206558U (en) Boneless wiper head assembly detection device
CN211028832U (en) Automatic insert conveying line
CN109644563A (en) A kind of the sandblasting pipeline system and its blanking equipment of flexible circuit board
CN110539166A (en) Automatic assembling equipment for magnet pad feet
CN111048726B (en) Module AB glue is glued and is heated automatic equipment of dress busbar of pressurize
CN104709719B (en) A kind of vehicle glass base automatic feeding system
CN106624504A (en) Power and free chain feeding system of automobile cabin assembly flexible automatic production line
CN210636739U (en) Automatic gluing tile production line for producing integral bathroom chassis
CN211939808U (en) Moving contact assembling machine
CN107377309A (en) A kind of coating system for solar energy solar double-glass assemblies backing strip hook

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210330

Termination date: 20210820