CN108789764A - A kind of processing method of high density oriented wood chipboard - Google Patents
A kind of processing method of high density oriented wood chipboard Download PDFInfo
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- CN108789764A CN108789764A CN201810635815.5A CN201810635815A CN108789764A CN 108789764 A CN108789764 A CN 108789764A CN 201810635815 A CN201810635815 A CN 201810635815A CN 108789764 A CN108789764 A CN 108789764A
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- Prior art keywords
- high density
- density oriented
- wood chipboard
- wood
- wood shavings
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
- B27N3/10—Moulding of mats
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N1/00—Pretreatment of moulding material
- B27N1/02—Mixing the material with binding agent
- B27N1/0209—Methods, e.g. characterised by the composition of the agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/08—Moulding or pressing
- B27N3/10—Moulding of mats
- B27N3/14—Distributing or orienting the particles or fibres
- B27N3/143—Orienting the particles or fibres
Abstract
The invention discloses a kind of processing methods of high density oriented wood chipboard, are related to wood processing technique field, include the following steps：(1) particle drying, the processing of (2) glue mixing wood shavings, the processing of (3) slab, (4) high density oriented shaving sheet metal forming.High density oriented wood chipboard is made by the technique in the present invention, and technological operation is simple and practicable, good process repeatability, and product qualification rate is high, and wood shavings used can derive from log and also derive from Wood leftover, greatly improve timber utilization rate；And the excellent in mechanical performance of made high density oriented wood chipboard, can improve the structural behaviour of boxboard, ensure the use quality of boxboard, therefore suitable for the processing of boxboard.
Description
Technical field：
The present invention relates to wood processing technique fields, and in particular to a kind of processing method of high density oriented wood chipboard.
Background technology：
Wood-based plate refers to that it is each to be processed into the shapes such as veneer, wood shavings or fiber using timber or other non-wood plants as raw material
Different group element material reconfigures manufactured plank, main includes gluing through applying or being not added with adhesive and other additives
Plate, particieboard and fiberboard three classes product.
Particieboard is the fragment that the raw material such as timber are cut into certain specification, by drying, is mixed with adhesive, hardening
Agent, waterproofing agent, a kind of artificial board made of suppressing at a certain temperature.Oriented wood chipboard is a kind of new particieboard, plane
Flower, which is mated formation, is arranged glue mixing wood shavings by its machine direction stringer when being molded, to be pressed into particieboard, the character of this particieboard
It is similar to glued board, often glued board is replaced to use, has and make full use of small dimension wood, fast growing wood, improve timber utilization rate etc. significantly
Advantage.
When oriented wood chipboard is processed, the use of adhesive has critical influence for board quality.In wood shavings
With adhesive mixed process, adhesive can penetrate into the inside of wood shavings, improve the mechanical strength of wood shavings.Adhesive includes at present
Solvent-based adhesive and aqueous adhesive, although solvent-based adhesive adhesive property is good, environmental pollution is strong；And water-base cement
Stick not can cause environmental pollution, but adhesive property is limited, and if resin used in adhesive poorly water-soluble, glue
The water content of stick will be very high, and in high temperature hot pressing, moisture is heated in this way vaporizes, and increases gas flow to increase plate bursting
Risk.
Invention content：
Technical problem to be solved by the present invention lies in provide a kind of processing method of high density oriented wood chipboard, the technique
Operation is simple, good process repeatability, and product qualification rate is high；And the mechanical property of made high density oriented wood chipboard is excellent
It is different, the structural behaviour of boxboard can be improved, ensures the use quality of boxboard, therefore suitable for the processing of boxboard.
The technical problems to be solved by the invention are realized using technical solution below：
A kind of processing method of high density oriented wood chipboard, includes the following steps：
(1) particle drying：Wood shavings are dried using 300-400 DEG C of mixed flue gas, moisture content is made to be down to 2-4%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 70-80 DEG C to be stirred, make mass water content
5% is down to hereinafter, up to glue mixing wood shavings；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 40-50 DEG C, in advance
Pressure pressure is 2-5MPa, and squeeze time is per mm thickness high density oriented wood chipboards precompressed 30-120s, hot pressing temperature 130-140
DEG C, hot pressing pressure 3-6MPa, hot pressing time is fixed to get high density per mm thickness high density oriented wood chipboard hot pressing 60-150s
To particieboard；
The aqueous adhesive is made of the raw material of following parts by weight：30-40 parts of epoxy acrylic resin, gas phase dioxy
1-5 parts of SiClx, 1-5 parts of hydroxypropyl methyl cellulose, 1-5 parts of emulsifier, 1-5 parts of rilanit special, nano-titanium dioxide 0.5-1
Part, preparation method is：All raw materials are added in Xiang Shuizhong, and it is constant to viscosity to be warming up to 60-70 DEG C of stirring, then gained is mixed
Object is sent into ball mill, is milled to fineness and is less than 30 μm of aqueous adhesives to get solid content 70-80%.
The amount of application of the aqueous adhesive is per kg wood shavings mixing 0.05-0.5kg aqueous adhesives.
The preparation method of the epoxy acrylic resin is：Epoxy resin is first dissolved in the mixed of n-butanol and ethylene glycol monomethyl ether
In bonding solvent, and it is warming up to 100-110 DEG C, adds methacrylic acid and N, N- dimethylethanolamines are protected at 100-110 DEG C
Temperature reaction, esterification to acid value are less than 5mg/KOH, then N hydroxymethyl acrylamide, diformazan is added in cooled to room temperature
Base Magnesium Acrylate Prepared and azodiisobutyronitrile, are warming up to 80-90 DEG C of insulation reaction, and polymerisation recycles just after terminating through vacuum distillation
Butanol and ethylene glycol monomethyl ether, condensate residue are epoxy acrylic resin.
The epoxy resin, methacrylic acid, N, N- dimethylethanolamines, N hydroxymethyl acrylamide, dimethyl allene
The mass ratio of sour magnesium and azodiisobutyronitrile is 25-40:1-10:0.05-0.5:1-10:10-20:0.5-1.
The emulsifier is selected from fatty alcohol polyoxyethylene ether, oleic acid polyoxyethylene, alkyl phenol polyoxyethylene ether, castor oil
One kind in polyoxyethylene ether.
The emulsifier uses polyglutamic acid/polyethylene glycol ester, by soil grade polyglutamic acid and polyethylene glycol
400 are made through esterification, and preparation method is：It is first that soil grade polyglutamic acid and polyethylene glycol 400 is soluble in water, and drip
Add dilute sulfuric acid to adjust pH value to 4-5, then be warming up to 70-80 DEG C of insulation reaction, is sent into gained mixture after esterification
In spray dryer, micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in dry gained particle.
The soil grade polyglutamic acid, polyethylene glycol 400 mass ratio be 1-10:1-10.
The beneficial effects of the invention are as follows：
(1) first with methacrylic acid and epoxy resin esterification occurs for the present invention, then with N hydroxymethyl acrylamide,
Magnesium dimethacrylate occurs polymerisation and generates epoxy acrylic resin, the epoxy acrylic resin good hydrophilic property and glue of generation
It is viscous to have excellent performance；
(2) being used cooperatively by emulsifier of the invention, further enhances the hydrophily of made epoxy acrylic resin, makes
It forms transparent colloid after being dissolved in water, to be made using the strong aqueous adhesive of the feature of environmental protection, so as to improve sizing environment；And lead to
That crosses self-control emulsifier is used cooperatively the glueability for further increasing adhesive, so that adhesive is penetrated into inside wood shavings and then carries
The mechanical strength of high wood shavings；
(3) high density oriented wood chipboard is made by the technique in the present invention, and technological operation is simple and practicable, process repeatability
Good, product qualification rate is high, and wood shavings used can derive from log and also derive from Wood leftover, greatly improve timber utilization rate；
And the excellent in mechanical performance of made high density oriented wood chipboard, can improve the structural behaviour of boxboard, ensure the use of boxboard
Quality, therefore suitable for the processing of boxboard.
Specific implementation mode：
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific embodiment is closed, the present invention is further explained.
Embodiment 1
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g emulsifier AEO-9,2g rilanit special, 0.5g nano-titanium dioxides, and 70 DEG C of stirrings are warming up to viscosity
It is constant, then gained mixture is sent into ball mill, it is milled to fineness and is less than 30 μm of aqueous gluings to get solid content 75%
Agent.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
Embodiment 2
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g Emulsifier EL-40s, 2g rilanit specials, 0.5g nano-titanium dioxides, and 70 DEG C of stirrings are warming up to viscosity
It is constant, then gained mixture is sent into ball mill, it is milled to fineness and is less than 30 μm of aqueous gluings to get solid content 75%
Agent.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
Embodiment 3
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g emulsifiers, 2g rilanit specials, 0.5g nano-titanium dioxides, and it is constant to viscosity to be warming up to 70 DEG C of stirrings,
Gained mixture is sent into ball mill again, fineness is milled to and is less than 30 μm of aqueous adhesives to get solid content 75%.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
The preparation of emulsifier：It is first that 2.5g soil grade polyglutamic acids and 10g polyethylene glycol 400s is soluble in water, and be added dropwise
Dilute sulfuric acid adjusts pH value to 4-5, then is warming up to 80 DEG C of insulation reactions, and gained mixture is sent into spraying after esterification and is done
In dry machine, micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in dry gained particle.
Reference examples 1
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g polyethylene glycol 400s, 2g rilanit specials, 0.5g nano-titanium dioxides, and 70 DEG C of stirrings are warming up to viscosity
It is constant, then gained mixture is sent into ball mill, it is milled to fineness and is less than 30 μm of aqueous gluings to get solid content 75%
Agent.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
Reference examples 2
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g food-grades polyglutamic acid, 2g rilanit specials, 0.5g nano-titanium dioxides, and it is warming up to 70 DEG C of stirrings
It is constant to viscosity, then gained mixture is sent into ball mill, fineness is milled to less than 30 μm to get the aqueous of solid content 75%
Adhesive.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
Reference examples 3
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy resin E-51,4g aerosil, 3g hydroxypropyl first is added in Xiang Shuizhong
Base cellulose, 3g emulsifiers, 2g rilanit specials, 0.5g nano-titanium dioxides, and it is constant to viscosity to be warming up to 70 DEG C of stirrings, then
Gained mixture is sent into ball mill, fineness is milled to and is less than 30 μm of aqueous adhesives to get solid content 75%.
The preparation of emulsifier：It is first that 2.5g soil grade polyglutamic acids and 10g polyethylene glycol 400s is soluble in water, and be added dropwise
Dilute sulfuric acid adjusts pH value to 4-5, then is warming up to 80 DEG C of insulation reactions, and gained mixture is sent into spraying after esterification and is done
In dry machine, micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in dry gained particle.
Reference examples 4
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g emulsifiers, 2g rilanit specials, 0.5g nano-titanium dioxides, and it is constant to viscosity to be warming up to 70 DEG C of stirrings,
Gained mixture is sent into ball mill again, fineness is milled to and is less than 30 μm of aqueous adhesives to get solid content 75%.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g hydroxyethyl methacrylates, 20g is added in cooled to room temperature
Magnesium dimethacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
The preparation of emulsifier：It is first that 2.5g soil grade polyglutamic acids and 10g polyethylene glycol 400s is soluble in water, and be added dropwise
Dilute sulfuric acid adjusts pH value to 4-5, then is warming up to 80 DEG C of insulation reactions, and gained mixture is sent into spraying after esterification and is done
In dry machine, micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in dry gained particle.
Reference examples 5
The processing of high density oriented wood chipboard：
(1) particle drying：Wood shavings are dried using 350 DEG C of mixed flue gas, moisture content is made to be down to 3%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 75 DEG C to be stirred, mass water content is made to be down to
3% to get glue mixing wood shavings；The amount of application of aqueous adhesive is per kg wood shavings mixing 0.25kg aqueous adhesives；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer,
Sandwich layer is laterally to mat formation, and upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 50 DEG C, precompressed
Pressure is 3.5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 90s, and hot pressing temperature is 135 DEG C, hot pressing pressure
For 5MPa, hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 120s to get high density oriented wood chipboard；
The preparation of aqueous adhesive：40g epoxy acrylic resins, 4g aerosils, 3g hydroxypropyls is added in Xiang Shuizhong
Methylcellulose, 3g emulsifiers, 2g rilanit specials, 0.5g nano-titanium dioxides, and it is constant to viscosity to be warming up to 70 DEG C of stirrings,
Gained mixture is sent into ball mill again, fineness is milled to and is less than 30 μm of aqueous adhesives to get solid content 75%.
The preparation of epoxy acrylic resin：40g epoxy resin E-51 is first dissolved in the mixing of n-butanol and ethylene glycol monomethyl ether
In solvent, and 110 DEG C are warming up to, add 4g methacrylic acids and 0.5g N, N- dimethylethanolamines, kept the temperature at 110 DEG C
Reaction, esterification to acid value are less than 5mg/KOH, then 8g N hydroxymethyl acrylamides, 20g is added in cooled to room temperature
Methyl methacrylate and 1g azodiisobutyronitriles, are warming up to 90 DEG C of insulation reactions, polymerisation terminate after through being evaporated under reduced pressure back
It is epoxy acrylic resin to receive n-butanol and ethylene glycol monomethyl ether, condensate residue.
The preparation of emulsifier：It is first that 2.5g soil grade polyglutamic acids and 10g polyethylene glycol 400s is soluble in water, and be added dropwise
Dilute sulfuric acid adjusts pH value to 4-5, then is warming up to 80 DEG C of insulation reactions, and gained mixture is sent into spraying after esterification and is done
In dry machine, micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in dry gained particle.
Embodiment 4
Based on embodiment 3, using polyethylene glycol 400 as the reference examples 1 of emulsifier, glue when prepared by setting adhesive
Epoxy resin E- is used when being prepared as the reference examples 2 of emulsifier, adhesive using soil grade polyglutamic acid when prepared by stick
N- is substituted using hydroxyethyl methacrylate when 51 substitute the reference examples 3 of epoxy acrylic resin, prepared by epoxy acrylic resin
Dimethyl allene is substituted using methyl methacrylate when prepared by the reference examples 4 of hydroxymethyl acrylamide, epoxy acrylic resin
The reference examples 5 of sour magnesium.
It is utilized respectively the high density oriented wood chipboard of embodiment 1-3, reference examples 1-5 processing same specifications, wherein wood shavings use
With the wood shavings criticized by rounding.And performance test, testing standard GB/T are carried out to made high density oriented wood chipboard
17657-1999, test result are as shown in table 1.
The performance of the made high density oriented wood chipboard of 1 embodiment of the present invention of table
As shown in Table 1, the use of adhesive is very big to the Effect on Mechanical Properties of made high density oriented wood chipboard, adhesive
The addition of preparation emulsifier and the difference of major ingredient resin will directly affect the mechanical property of made high density oriented wood chipboard
Energy.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (7)
1. a kind of processing method of high density oriented wood chipboard, which is characterized in that include the following steps：
(1) particle drying：Wood shavings are dried using 300-400 DEG C of mixed flue gas, moisture content is made to be down to 2-4%；
(2) glue mixing wood shavings are processed：Wood shavings and aqueous adhesive are warming up to 70-80 DEG C to be stirred, mass water content is made to be down to
5% hereinafter, up to glue mixing wood shavings；
(3) slab is processed：Mated formation to glue mixing wood shavings using three layers of spreading head, including upper epidermis, sandwich layer and layer, sandwich layer
Laterally to mat formation, upper epidermis and layer are that longitudinal direction is mated formation, and obtain slab；
(4) high density oriented shaving sheet metal forming：The hot repressing after precompressed by above-mentioned slab, precompressed temperature are 40-50 DEG C, precompressed pressure
Power is 2-5MPa, and squeeze time is per mm thickness high density oriented wood chipboard precompressed 30-120s, and hot pressing temperature is 130-140 DEG C, heat
Pressure pressure is 3-6MPa, and hot pressing time is per mm thickness high density oriented wood chipboard hot pressing 60-150s to get high density oriented shaving
Plate；
The aqueous adhesive is made of the raw material of following parts by weight：30-40 parts of epoxy acrylic resin, aerosil
1-5 parts, 1-5 parts of hydroxypropyl methyl cellulose, 1-5 parts of emulsifier, 1-5 parts of rilanit special, 0.5-1 parts of nano-titanium dioxide,
Preparation method is：All raw materials are added in Xiang Shuizhong, and it is constant to viscosity to be warming up to 60-70 DEG C of stirring, then by gained mixture
It is sent into ball mill, is milled to fineness and is less than 30 μm of aqueous adhesives to get solid content 70-80%.
2. the processing method of high density oriented wood chipboard according to claim 1, it is characterised in that：The aqueous adhesive
Amount of application be per kg wood shavings mixing 0.05-0.5kg aqueous adhesives.
3. the processing method of high density oriented wood chipboard according to claim 1, it is characterised in that：The epoxy acrylic
The preparation method of resin is：Epoxy resin is first dissolved in the in the mixed solvent of n-butanol and ethylene glycol monomethyl ether, and is warming up to 100-
110 DEG C, add methacrylic acid and N, N- dimethylethanolamines, the insulation reaction at 100-110 DEG C, esterification to acid value
Less than 5mg/KOH, then it is different that N hydroxymethyl acrylamide, magnesium dimethacrylate and azo two is added in cooled to room temperature
Butyronitrile, is warming up to 80-90 DEG C of insulation reaction, polymerisation terminate after through vacuum distillation recycling n-butanol and ethylene glycol monomethyl ether, it is dense
Contracting residue is epoxy acrylic resin.
4. the processing method of high density oriented wood chipboard according to claim 3, it is characterised in that：The epoxy resin,
Methacrylic acid, N, N- dimethylethanolamines, N hydroxymethyl acrylamide, magnesium dimethacrylate and azodiisobutyronitrile matter
Amount is than being 25-40:1-10:0.05-0.5:1-10:10-20:0.5-1.
5. the processing method of high density oriented wood chipboard according to claim 1, it is characterised in that：The emulsifier is selected from
One kind in fatty alcohol polyoxyethylene ether, oleic acid polyoxyethylene, alkyl phenol polyoxyethylene ether, castor oil polyoxyethylene ether.
6. the processing method of high density oriented wood chipboard according to claim 1, it is characterised in that：The emulsifier uses
Polyglutamic acid/polyethylene glycol ester is made with polyethylene glycol 400 through esterification of soil grade polyglutamic acid, system
Preparation Method is：It is first that soil grade polyglutamic acid and polyethylene glycol 400 is soluble in water, and dilute sulfuric acid is added dropwise and adjusts pH value to 4-5,
It is warming up to 70-80 DEG C of insulation reaction again, gained mixture is sent into spray dryer after esterification, dry gained
Micro mist is made to get polyglutamic acid/polyethylene glycol ester through micronizer in grain.
7. the processing method of high density oriented wood chipboard according to claim 6, it is characterised in that：The soil grade poly
Glutamic acid, polyethylene glycol 400 mass ratio be 1-10:1-10.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181616A (en) * | 2019-04-16 | 2019-08-30 | 千年舟新材科技集团有限公司 | Activated carbon board and preparation method thereof with high VOC absorption property |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4364984A (en) * | 1981-01-23 | 1982-12-21 | Bison-Werke, Bahre & Greten Gmbh & Co., Kg | Surfaced oriented strand board |
| CN202088256U (en) * | 2010-12-15 | 2011-12-28 | 东莞市兴林木业有限公司 | Wood-bamboo composite shaving board |
| CN103770187A (en) * | 2012-10-19 | 2014-05-07 | 北京泛欧瑞得科技有限公司 | Special type oriented strand board and manufacturing process thereof |
| CN104448162A (en) * | 2014-12-23 | 2015-03-25 | 河北科技大学 | Method for preparing epoxy acrylic resin used in waterborne ink for printing plastic film |
| CN105647329A (en) * | 2016-01-19 | 2016-06-08 | 深圳市长辉新材料科技有限公司 | Waterborne polyurethane-epoxy resin modified alanine ester emulsion and preparation method thereof |
| CN107011770A (en) * | 2017-05-19 | 2017-08-04 | 江苏三木化工股份有限公司 | A kind of self-drying paint aqueous epoxy resins and preparation method and application |
| CN107379205A (en) * | 2017-07-06 | 2017-11-24 | 广西祥盛木业有限责任公司 | A kind of production method of particieboard |
| CN108077874A (en) * | 2017-12-28 | 2018-05-29 | 安徽佛子岭面业有限公司 | A kind of preparation method of vermicelli flavoring processing oleoresin ginger microcapsule |
-
2018
- 2018-06-20 CN CN201810635815.5A patent/CN108789764B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4364984A (en) * | 1981-01-23 | 1982-12-21 | Bison-Werke, Bahre & Greten Gmbh & Co., Kg | Surfaced oriented strand board |
| CN202088256U (en) * | 2010-12-15 | 2011-12-28 | 东莞市兴林木业有限公司 | Wood-bamboo composite shaving board |
| CN103770187A (en) * | 2012-10-19 | 2014-05-07 | 北京泛欧瑞得科技有限公司 | Special type oriented strand board and manufacturing process thereof |
| CN104448162A (en) * | 2014-12-23 | 2015-03-25 | 河北科技大学 | Method for preparing epoxy acrylic resin used in waterborne ink for printing plastic film |
| CN105647329A (en) * | 2016-01-19 | 2016-06-08 | 深圳市长辉新材料科技有限公司 | Waterborne polyurethane-epoxy resin modified alanine ester emulsion and preparation method thereof |
| CN107011770A (en) * | 2017-05-19 | 2017-08-04 | 江苏三木化工股份有限公司 | A kind of self-drying paint aqueous epoxy resins and preparation method and application |
| CN107379205A (en) * | 2017-07-06 | 2017-11-24 | 广西祥盛木业有限责任公司 | A kind of production method of particieboard |
| CN108077874A (en) * | 2017-12-28 | 2018-05-29 | 安徽佛子岭面业有限公司 | A kind of preparation method of vermicelli flavoring processing oleoresin ginger microcapsule |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181616A (en) * | 2019-04-16 | 2019-08-30 | 千年舟新材科技集团有限公司 | Activated carbon board and preparation method thereof with high VOC absorption property |
| CN110181616B (en) * | 2019-04-16 | 2022-01-14 | 千年舟新材科技集团股份有限公司 | Activated carbon sheet material with high VOC adsorption performance and preparation method thereof |
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