CN108764440A - Single sided board contact type IC card strip and preparation method thereof - Google Patents

Single sided board contact type IC card strip and preparation method thereof Download PDF

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Publication number
CN108764440A
CN108764440A CN201810989127.9A CN201810989127A CN108764440A CN 108764440 A CN108764440 A CN 108764440A CN 201810989127 A CN201810989127 A CN 201810989127A CN 108764440 A CN108764440 A CN 108764440A
Authority
CN
China
Prior art keywords
stainless steel
steel substrates
band body
contact type
single sided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810989127.9A
Other languages
Chinese (zh)
Inventor
刘瑛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Three Smart Card Technology Co Ltd
Original Assignee
Dongguan Three Smart Card Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Three Smart Card Technology Co Ltd filed Critical Dongguan Three Smart Card Technology Co Ltd
Priority to CN201810989127.9A priority Critical patent/CN108764440A/en
Publication of CN108764440A publication Critical patent/CN108764440A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • G06K19/07722Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/07762Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement making the record carrier wearable, e.g. having the form of a ring, watch, glove or bracelet

Abstract

The present invention discloses a kind of single sided board contact type IC card strip and preparation method thereof, the single sided board contact type IC card strip includes band body and at least two rows of IC card chip structures being set in band body, the IC card chip structure includes the flexible PCB being set on band body, the integrated circuit and several stainless steel substrates being fixed on the flexible PCB by insulating cement water layer and be used as terminal being set on flexible PCB, one pin of a piece of stainless steel substrates and integrated circuit electrically conducts, the stainless steel substrates are in the same plane, and it is formed with interval between adjacent two stainless steel substrates.The present invention is connected as terminal with the external world using stainless steel substrates, the cost of material is low for the stainless steel substrates, intensity is big and wear-resisting property is ideal, it is wear-resisting, larger abrasion will not be caused after being used for a long time, so that can guarantee conducting quality, and then improves communication quality, and structure of the invention is relatively simple, and the present invention is enabled to have the extremely strong market competitiveness.

Description

Single sided board contact type IC card strip and preparation method thereof
Technical field:
The present invention relates to field of communication technology, a kind of single sided board contact type IC card strip and preparation method thereof is refered in particular to.
Background technology:
IC card (Integrated Circuit Card, integrated circuit card), also referred to as smart card (Smart card), wisdom Card (Intelligent card), microcircuit card (Microcircuit card) or chip card etc..It is by a microelectronics Chip insertion meets in the card base of 7816 standards of ISO, makes card form.Communication modes between IC card and reader can be with It is contact, can also be contactless.IC card is divided into Contact Type Ic Card, non-contact IC and double interfaces according to communication interface Block (being provided simultaneously with contact and contactless communication interface).
The advantages that IC card is due to its intrinsic information security, easy to carry, fairly perfect standardization, authentication, Bank, telecommunications, public transport, parking lot management etc. fields just more and more applied, such as China second-generation identity card, bank electricity Sub- wallet, the SIM cards of mobile phones of telecommunications, the mass transit card of public transport, subway card, the parking card etc. for collecting parking fee, all exist It plays an important role in people's daily life.
Contact Type Ic Card in the prior art, which is all made of copper sheet, to carry out contact with the external world as terminal and is connected, but copper sheet material Expect of high cost, insufficient strength and wear-resisting property is not ideal enough, it is easy to wear, so that being influenced after long-term use due to wearing larger Quality is connected, and then influences communication quality.
In view of this, the present inventor proposes following technical scheme.
Invention content:
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of single sided board contact type IC card strip and its systems Preparation Method.
In order to solve the above-mentioned technical problem, present invention employs the first following technical solutions:Single sided board contact IC Strip band includes band body and at least two rows of IC card chip structures being set in the band body, and band body both sides are all provided with Several location holes are equipped with, the location hole is rectangular;The IC card chip structure include the flexible PCB being set on band body, It the integrated circuit that is set on flexible PCB and several are fixed on the flexible PCB and are used as by insulating cement water layer One pin of the stainless steel substrates of terminal, a piece of stainless steel substrates and integrated circuit electrically conducts, which is located at same flat On face, and interval is formed between adjacent two stainless steel substrates.
Furthermore, in above-mentioned technical proposal, the stainless steel substrates upper surface is electroplate with one layer of brassy conductive film.
Furthermore, in above-mentioned technical proposal, the quantity of the stainless steel substrates is six or eight.
Furthermore, in above-mentioned technical proposal, by welding gold between the stainless steel substrates and the pin of integrated circuit Line or implantation tin ball mode connect, and are formed and electrically conducted.
Furthermore, in above-mentioned technical proposal, the thickness of the stainless steel substrates is 0.02mm-0.07mm.
Furthermore, in above-mentioned technical proposal, the thickness of the conductive film is 0.005mm-0.01mm.
In order to solve the above-mentioned technical problem, present invention employs following second of technical solutions:Single sided board contact IC The preparation method of strip band includes the following steps:Step a:Two rows of flexible PCBs, the flexible PCB are set on band body It is solidified as a whole by insulative glue with band body;Step b:Gold thread is welded at the pin of integrated circuit on flexible PCB, it should Gold thread extends outwardly and is connect with a pad, step c:One layer of insulating cement water layer of band body and flexible PCB overlying, and exhausted A compound stainless steel plate, the stainless steel plate are fixed on flexible PCB on edge glue layer;Step d:It corresponds on stainless steel The position laser opening of pad, and using tin cream filling perforation or plating blind hole, stainless steel plate is made to electrically conduct with pad;Step e:It is right Stainless steel plate carries out cutting and forms several discontiguous stainless steel substrates, forms an IC card chip structure, wherein a piece of stainless One pin of steel disc and integrated circuit electrically conducts, so that forming the IC card chip structure described in two rows on the band body.
Furthermore, in above-mentioned technical proposal, in one layer of brassy conductive film of stainless steel substrates upper surface vacuum coating.
After adopting the above technical scheme, the present invention has the advantages that compared with prior art:The present invention uses Stainless steel substrates are connected as terminal with the external world, and the cost of material is low for the stainless steel substrates, and intensity is big and wear-resisting property is ideal, wear-resisting, i.e., Larger abrasion will not be caused after making long-time service, so that can guarantee conducting quality, and then improves communication quality, and knot of the present invention Structure is relatively simple, and the present invention is enabled to have the extremely strong market competitiveness.The stainless steel substrates upper surface be electroplate with one layer it is brassy Conductive film further increases the electric conductivity of the present invention with this.In addition, the preparation side of single sided board contact type IC card strip of the present invention Method step is simple, reasonable.
Description of the drawings:
Fig. 1 is the stereogram of the present invention;
Fig. 2 is the stereogram of IC card chip structure in the present invention;
Fig. 3 be Fig. 2 along A-A to sectional view.
Specific implementation mode:
With reference to specific embodiments and the drawings, the present invention is further described.
See shown in Fig. 1-3, be a kind of single sided board contact type IC card strip comprising band body 1 and at least two rows of settings IC card chip structure 2 in the band body 1.
The IC card chip structure 2 includes the flexible PCB 21 being set on band body 1, is set to flexible PCB 21 On integrated circuit 22 and several be fixed on the flexible PCB 21 by insulating cement water layer 23 and stainless as terminal Steel disc 24, a piece of stainless steel substrates 24 and a pin of integrated circuit 22 electrically conduct, which is generally aligned in the same plane On, and it is formed with interval between adjacent two stainless steel substrates 24.The present invention is connected as terminal with the external world using stainless steel substrates 24, should The cost of material is low for stainless steel substrates 24, and intensity is big and wear-resisting property is ideal, wear-resisting, and larger mill will not be caused after being used for a long time Damage so that can guarantee conducting quality, and then improves communication quality, and structure of the invention is relatively simple, enables the present invention have extremely strong The market competitiveness.
24 upper surface vacuum coating of the stainless steel substrates has one layer of brassy conductive film 25, this hair is further increased with this Bright electric conductivity.Certainly, not only can be with the brassy conductive film 25 of vacuum coating, it equally can be according to actual requirement vacuum coating The conductive film 25 of various different colours, these are all easily achieved.
The quantity of the stainless steel substrates 24 is six or eight.The pin of the stainless steel substrates 24 and integrated circuit 22 it Between by weld gold thread or implantation tin ball mode connect, and formed electrically conduct.
1 both sides of band body are both provided with several location holes 11, and the location hole 11 is rectangular, the location hole 11 be same as with Extraneous positioning mold is positioned, so as to the working process in later stage.
The thickness of the stainless steel substrates 24 is 0.02mm-0.07mm.The thickness of the conductive film 25 is 0.005mm- 0.01mm。
The preparation method of above-mentioned single sided board contact type IC card strip comprising following steps:
Step a:Two rows of flexible PCBs 21 are set on band body 1, which passes through insulation with band body 1 Glue is solidified as a whole;
Step b:Gold thread is welded at the pin of integrated circuit 22 on flexible PCB 21, which extends outwardly and with one Pad connects;
Step c:Band body 1 and flexible PCB 21 overlying, one layer of insulating cement water layer 23, and it is multiple on insulating cement water layer 23 Unify stainless steel plate, which is fixed on flexible PCB 21;
Step d:The position laser opening of pad is corresponded on stainless steel, and using tin cream filling perforation or plating blind hole, is made Stainless steel plate electrically conducts with pad;
Step e:Cutting is carried out to stainless steel plate and forms several discontiguous stainless steel substrates 24, forms an IC card chip Structure 2, wherein a piece of stainless steel substrates 24 and a pin of integrated circuit 22 electrically conduct, so that being formed on the band body 1 IC card chip structure 2 described in two rows;In stainless steel substrates 24 upper surface vacuum coating, one layer of brassy conductive film 25;
Step f:1 both sides of band body are provided with several location holes 11 by laser boring technique.
In conclusion the present invention is connected as terminal with the external world using stainless steel substrates 24,24 material cost of stainless steel substrates Low, intensity is big and wear-resisting property is ideal, wear-resisting, and larger abrasion will not be caused after being used for a long time, so that can guarantee conducting Quality, and then communication quality is improved, and structure of the invention is relatively simple, and the present invention is enabled to have the extremely strong market competitiveness.It is described 24 upper surface of stainless steel substrates is electroplate with one layer of brassy conductive film 25, and the electric conductivity of the present invention is further increased with this.Separately Outside, the preparation method step of single sided board contact type IC card strip of the present invention is simple, reasonable.
Certainly, the above is only a specific embodiment of the present invention, be not to limit the scope of the present invention, it is all according to The equivalent change or modification that structure, feature and principle described in scope of the present invention patent is done should all be included in Shen of the present invention It please be in the scope of the claims.

Claims (8)

1. single sided board contact type IC card strip comprising band body (1) and at least two rows are set to the IC in the band body (1) The core of the card chip architecture (2), band body (1) both sides are both provided with several location holes (11), and the location hole (11) is rectangular;
It is characterized in that:The IC card chip structure (2) includes the flexible PCB (21) being set on band body (1), setting In on flexible PCB (21) integrated circuit (22) and several the flexible PCB is fixed on by insulating cement water layer (23) (21) on and as terminal stainless steel substrates (24), a piece of stainless steel substrates (24) and a pin of integrated circuit (22) are electrically led Logical, the stainless steel substrates (24) are in the same plane, and are formed with interval between adjacent two stainless steel substrates (24).
2. single sided board contact type IC card strip according to claim 1, it is characterised in that:Stainless steel substrates (24) upper end Face is electroplate with one layer of brassy conductive film (25).
3. single sided board contact type IC card strip according to claim 1, it is characterised in that:The stainless steel substrates (24) Quantity is six or eight.
4. single sided board contact type IC card strip according to claim 1, it is characterised in that:The stainless steel substrates (24) and collection It is connected between the pin of circuit (22) by welding gold thread or implantation tin ball mode, and is formed and electrically conducted.
5. single sided board contact type IC card strip according to claim 1, it is characterised in that:The thickness of the stainless steel substrates (24) Degree is 0.02mm-0.07mm.
6. single sided board contact type IC card strip according to claim 1, it is characterised in that:The thickness of the conductive film (25) For 0.005mm-0.01mm.
7. the preparation method of single sided board contact type IC card strip, it is characterised in that:It includes the following steps:
Step a:Two rows of flexible PCBs (21) are set on band body (1), which passes through with band body (1) Insulative glue is solidified as a whole;
Step b:Gold thread is welded at the pin of integrated circuit (22) on flexible PCB (21), which extends outwardly and with one Pad connects;
Step c:One layer of insulating cement water layer (23) of band body (1) and flexible PCB (21) overlying, and in insulating cement water layer (23) A upper compound stainless steel plate, the stainless steel plate are fixed on flexible PCB (21);
Step d:The position laser opening of pad is corresponded on stainless steel, and using tin cream filling perforation or plating blind hole, is made stainless Steel plate electrically conducts with pad;
Step e:Cutting is carried out to stainless steel plate and forms several discontiguous stainless steel substrates (24), forms an IC card chip knot Structure (2), wherein a piece of stainless steel substrates (24) and a pin of integrated circuit (22) electrically conduct, so that in the band body (1) The upper IC card chip structure (2) formed described in two rows;
Step f:Band body (1) both sides are provided with several location holes (11) by laser boring technique.
8. the preparation method of single sided board contact type IC card strip according to claim 7, it is characterised in that:In stainless steel substrates (24) the brassy conductive film (25) of one layer of upper surface vacuum coating.
CN201810989127.9A 2018-08-28 2018-08-28 Single sided board contact type IC card strip and preparation method thereof Pending CN108764440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810989127.9A CN108764440A (en) 2018-08-28 2018-08-28 Single sided board contact type IC card strip and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810989127.9A CN108764440A (en) 2018-08-28 2018-08-28 Single sided board contact type IC card strip and preparation method thereof

Publications (1)

Publication Number Publication Date
CN108764440A true CN108764440A (en) 2018-11-06

Family

ID=63967514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810989127.9A Pending CN108764440A (en) 2018-08-28 2018-08-28 Single sided board contact type IC card strip and preparation method thereof

Country Status (1)

Country Link
CN (1) CN108764440A (en)

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