CN108747952B - Filling device and filling method for glass bulb in patch voltage-stabilizing diode - Google Patents
Filling device and filling method for glass bulb in patch voltage-stabilizing diode Download PDFInfo
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- CN108747952B CN108747952B CN201810799072.5A CN201810799072A CN108747952B CN 108747952 B CN108747952 B CN 108747952B CN 201810799072 A CN201810799072 A CN 201810799072A CN 108747952 B CN108747952 B CN 108747952B
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- 239000011521 glass Substances 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005245 sintering Methods 0.000 claims description 48
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 32
- 229910002804 graphite Inorganic materials 0.000 claims description 32
- 239000010439 graphite Substances 0.000 claims description 32
- 230000006835 compression Effects 0.000 claims description 30
- 238000007906 compression Methods 0.000 claims description 30
- 230000004323 axial length Effects 0.000 claims description 7
- 238000011068 loading method Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The application provides a filling device for glass shells in a patch voltage-stabilizing diode, which comprises an upper positioning plate, a lower positioning plate and a sliding guide positioning pin; the application also provides a filling method of the glass bulb used in the patch voltage-stabilizing diode; the upper locating plate and the lower locating plate are assembled in the diameter positions of at most half glass shells in a staggered way, and before the glass shells enter the lower locating round holes through the upper locating round holes, the lower end faces of the glass shells are only in contact with the lower locating plate in a small half area, so that the probability of damaging the lower end faces of the glass shells is reduced, the problem of low efficiency of manual filling and the problem of end face damage and edge breakage of the glass shells caused when a drawing plate type glass shell filling tool pulls out a metal drawing plate are solved, the glass shell filling yield is greatly improved, the glass shells in the patch voltage-stabilizing diode are conveniently, rapidly, efficiently and high-quality filled, and the patch voltage-stabilizing diode is convenient for mass stable and high-quality production.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a filling device and a filling method for a glass bulb in a patch voltage-stabilizing diode.
Background
In the prior art, as shown in fig. 1, the patch voltage-stabilizing diode comprises two electrodes 12, a chip 14 and a glass shell 13, wherein the electrode is in a primary step shaft shape, the glass shell is a round glass tube, the inner diameter of the glass shell is larger than the outer diameter of a thin column section of the electrode, the outer diameter of the glass shell is smaller than the outer diameter of a thick column section of the electrode, and the thin column sections of the two electrodes 12 are respectively inserted into openings at two ends of the glass shell 13 and are contacted with the chip 14.
At present, glass bulb filling of a patch zener diode is mainly achieved by the following ways:
1. the traditional glass bulb filling adopts a manual pick-up filling mode, and the method comprises the following steps: firstly, placing one electrode in a graphite sintering die hole, then sequentially placing a glass bulb and a chip, and finally placing the other electrode; the glass shell is made of glass, so that the conditions of end face breakage and shell breakage of the glass shell are easy to occur in the filling process, and the method needs single picking operation by using tweezers or fingers with disposable gloves, is time-consuming and labor-consuming, and is not beneficial to mass production and use;
2. in addition, there is a drawer plate type glass shell filling tool suitable for batch production, which is a round hole positioning plate with the same appearance as a graphite sintering die, the bottom of the round hole positioning plate is provided with a U-shaped groove capable of accommodating a metal drawer plate, and the operation mode is as follows: placing the round hole positioning plate on a graphite sintering mold, then inserting a metal drawing plate, pouring a plurality of glass shells, shaking the graphite sintering mold to enable the glass shells to enter positioning holes in the round hole positioning plate, and then pulling out the metal drawing plate to enable the glass shells to fall into sintering holes in the graphite sintering mold; the method is beneficial to mass production, but the process of pulling out the metal drawing plate is a front-to-back movable process, the stress of the front glass bulb is minimum, but the force sequentially applied to the rear glass bulb is increased due to the length of the drawing plate, so that the lower end face of the rearmost glass bulb is damaged or broken due to the friction force generated in the moment of pulling out the metal drawing plate, thereby influencing the yield of diode production.
Therefore, how to conveniently, rapidly, efficiently and high-quality fill the glass bulb in the patch zener diode, and mass stable high-quality production of the patch zener diode is a problem to be solved by those skilled in the art.
Disclosure of Invention
The application aims to provide a filling device for glass shells in a patch voltage-stabilizing diode. Another object of the present application is to provide a method for filling the glass envelope in the patch zener diode.
In order to solve the technical problems, the technical scheme provided by the application is as follows:
a filling device for glass bulb in patch voltage-stabilizing diode comprises an upper locating plate, a lower locating plate and a sliding guide locating pin;
the top long and wide surface of the upper positioning plate is provided with a groove with a circumferential frame, the bottom of the groove is provided with a plurality of upper positioning round holes, the number and the hole spacing of which are the same as those of sintering holes on the graphite sintering die, the top long and wide surface of the upper positioning plate, which is positioned outside the groove, is provided with a plurality of guiding limit through holes, and the upper positioning round holes and the guiding limit through holes are communicated with the upper positioning plate;
the top long wide surface of the lower positioning plate is provided with a plurality of lower positioning round holes, the number and the hole spacing of which are the same as those of sintering holes on the graphite sintering die, the top long wide surface of the lower positioning plate is also provided with a plurality of internal thread through holes which are used for being aligned with the guiding limiting through holes in a one-to-one vertical direction, and the lower positioning round holes and the internal thread through holes are communicated with the lower positioning plate;
the upper positioning plate is stacked on the lower positioning plate, and the sliding guide positioning pin is inserted into the guide limiting through hole and the internal thread through hole which are aligned up and down;
the sliding guide positioning pin is provided with a sliding limiting guide part, the cross section length of the sliding limiting guide part is larger than the diameter of the sliding limiting guide part by at most half glass shell diameter, so that the upper positioning plate can slide on the top long and wide surface of the lower positioning plate along the length direction of the cross section of the sliding limiting guide part by at most half glass shell diameter distance, and the upper positioning round hole on the sliding upper positioning plate is aligned with the corresponding lower positioning round hole on the lower positioning plate vertically;
the lower part of the sliding guide positioning pin is exposed below the bottom long and wide surface of the lower positioning plate so as to be used as a positioning pin to be matched with a positioning hole on the graphite sintering die in a positioning way.
Preferably, the cross section length of the guiding limiting through hole is greater than the half glass shell diameter of the sliding limiting guiding part, so that the upper positioning plate can slide on the top long and wide surface of the lower positioning plate by a half glass shell diameter distance along the cross section length direction of the guiding limiting through hole, and the upper positioning round hole on the upper positioning plate after sliding is aligned with the corresponding lower positioning round hole on the lower positioning plate vertically.
Preferably, the needle roller further comprises at least one in-line needle bearing;
the upper positioning plate is characterized in that at least one upper bearing groove is formed in the bottom long and wide surface of the upper positioning plate, at least one lower bearing groove is formed in the top long and wide surface of the lower positioning plate, the upper bearing grooves and the lower bearing grooves are spliced into a bearing cavity for wrapping the in-line needle bearings in a one-to-one correspondence manner, and the length of the bearing cavity is at least greater than the distance of half the glass shell diameter of the length of the in-line needle bearings;
the in-line needle bearing is arranged in the bearing cavity, the axial length direction of the in-line needle bearing is parallel to the length direction of the cross section of the guide limiting through hole, and the inner top surface and the inner bottom surface of the bearing cavity are in rolling contact with the needles in the in-line needle bearing so as to be used for enabling the upper locating plate to stably slide on the top long wide surface of the lower locating plate along the length direction of the cross section of the guide limiting through hole.
Preferably, at least one compression spring is further included;
the bottom long and wide surface of the upper positioning plate is provided with at least one upper spring groove, the top long and wide surface of the lower positioning plate is provided with at least one lower spring groove, the upper spring groove and the lower spring groove are spliced into a spring cavity for wrapping the built-in compression spring in a one-to-one correspondence manner, and the length of the spring cavity is equal to the no-load non-stressed length of the compression spring;
the compression spring is arranged in the spring cavity, the axial length direction of the compression spring is parallel to the length direction of the cross section of the guide limiting through hole, two inner end surfaces in the length direction of the spring cavity are propped against the compression spring to control the initial original position of the upper positioning plate before sliding to be the distance between an upper positioning round hole on the upper positioning plate and a corresponding lower positioning round hole on the lower positioning plate, and the distance is at most half of the glass shell diameter, and the compression spring pushes the upper positioning plate back to the initial original position after sliding.
Preferably, a chamfer is arranged at the top hole of the upper positioning round hole so as to be used for conveniently guiding the glass shell to enter.
Preferably, the inner wall surface of the front frame of the groove is a slope surface so as to conveniently pour out the redundant glass shell.
Preferably, the top end of the sliding guide positioning pin is provided with a large-head wafer for preventing the upper positioning plate from sliding off the sliding guide positioning pin.
Preferably, the middle part of the sliding guide positioning pin is an external thread part, the external thread part of the sliding guide positioning pin is in threaded connection with the internal thread through hole, and the external thread part of the sliding guide positioning pin is fixed in the internal thread through hole through threaded connection and interpolation.
A loading method for a glass envelope in a patch zener diode, using the loading device of any one of the above, comprising the steps of:
1) Filling a patch zener diode by a graphite sintering die, axially positioning sintering holes, and firstly placing a specified number of electrodes in the sintering holes on the graphite sintering die;
2) Inserting the exposed lower part of the sliding guide positioning pin into a positioning hole on the graphite sintering mold to position and assemble the filling device on the graphite sintering mold;
3) Then a plurality of glass shells are placed in the grooves of the filling device, and then the graphite sintering mould is rocked to guide the glass shells to enter the upper positioning round holes;
4) The upper locating plate is pushed by hands to slide so that an upper locating round hole on the upper locating plate is aligned with a corresponding lower locating round hole on the lower locating plate up and down, at the moment, a glass shell positioned in the upper locating round hole can fall into the lower locating round hole of the lower locating plate, and then continuously falls into a graphite sintering die sintering hole, so that the filling of the glass shell is completed.
Compared with the prior art, the application provides a filling device for a glass bulb in a patch voltage-stabilizing diode, which comprises an upper locating plate, a lower locating plate and a sliding guide locating pin; the application also provides a filling method of the glass bulb used in the patch voltage-stabilizing diode; the upper locating plate and the lower locating plate are assembled in the diameter positions of at most half glass shells in a staggered way, and before the glass shells enter the lower locating round holes through the upper locating round holes, the lower end faces of the glass shells are only in contact with the lower locating plate in a small half area, so that the probability of damaging the lower end faces of the glass shells is reduced, the glass shell has higher practicability, is easy and convenient to operate, the problems of low efficiency of manual filling and the problems of end face damage and edge breakage of the glass shells caused when a metal drawing plate is pulled out by a drawing plate type glass shell filling tool are solved, the glass shell filling yield is greatly improved, and the glass shells in the patch voltage-stabilizing diode are conveniently, quickly, efficiently and high-quality filled, and are convenient for mass stable and high-quality production of the patch voltage-stabilizing diode.
Drawings
FIG. 1 is an enlarged schematic diagram of a prior art SMD zener diode;
fig. 2 is a schematic structural diagram of a filling device for a glass bulb in a patch zener diode according to an embodiment of the present application.
In the figure: the device comprises an upper positioning plate 1, a lower positioning plate 2, a left straight row needle bearing 3, a right straight row needle bearing 4, a left compression spring 5, a right compression spring 6, a sliding guide positioning pin 7, an upper positioning round hole 8, a lower positioning round hole 9, a guide limiting through hole 10 and an external thread part 11;
12 electrodes, 13 glass bulb and 14 chips.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be understood that the terms "center," "axial," "radial," "longitudinal," "transverse," "length," "width," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "vertical," "horizontal," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the application.
In the present application, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is less level than the second feature.
Referring to fig. 1 to 2, fig. 1 is an enlarged schematic structure of a patch zener diode in the prior art; fig. 2 is a schematic structural diagram of a filling device for a glass bulb in a patch zener diode according to an embodiment of the present application.
The application provides a filling device for glass shells in a patch voltage-stabilizing diode, which comprises an upper positioning plate 1, a lower positioning plate 2 and a sliding guide positioning pin 7;
a groove with a circumferential frame is formed in the top long and wide surface of the upper positioning plate 1, a plurality of upper positioning round holes 8 which are the same as the sintering holes in the graphite sintering die in number and hole spacing are formed in the bottom of the groove, a plurality of guiding limit through holes 10 are formed in the top long and wide surface of the upper positioning plate 1 and outside the groove, and the upper positioning round holes 8 and the guiding limit through holes 10 are communicated with the upper positioning plate 1;
a plurality of lower positioning round holes 9 which are the same as the sintering holes on the graphite sintering die in number and hole spacing are formed in the top long and wide surface of the lower positioning plate 2, a plurality of internal thread through holes which are used for being aligned with the guiding limit through holes 10 in a one-to-one vertical direction are also formed in the top long and wide surface of the lower positioning plate 2, and the lower positioning round holes 9 and the internal thread through holes are communicated with the lower positioning plate 2;
the upper positioning plate 1 is stacked on the lower positioning plate 2, and the sliding guide positioning pin 7 is inserted into the guide limiting through hole 10 and the internal thread through hole which are aligned up and down;
the part of the sliding guiding locating pin 7, which is positioned in the guiding limit through hole 10, is a sliding limit guiding part, the cross section length of the guiding limit through hole 10 is larger than the diameter of the sliding limit guiding part by at most half glass shell diameter for the distance that the upper locating plate 1 can slide by at most half glass shell diameter on the top long and wide surface of the lower locating plate 2 along the cross section length direction of the guiding limit through hole 10, and the upper locating round hole 8 on the upper locating plate 1 after sliding is aligned with the lower locating round hole 9 on the corresponding lower locating plate 2 vertically;
the lower part of the sliding guide positioning pin 7 is exposed below the bottom long and wide surface of the lower positioning plate 2 to be used as a positioning pin for positioning and matching with a positioning hole on a graphite sintering mold.
In one embodiment of the present application, the cross-sectional length of the guiding and limiting through hole 10 is greater than the half diameter of the glass shell of the sliding and limiting guiding portion, so that the upper positioning plate 1 can slide on the top long wide surface of the lower positioning plate 2 along the cross-sectional length direction of the guiding and limiting through hole 10 by a half diameter of the glass shell, and the upper positioning round hole 8 on the upper positioning plate 1 after sliding is aligned up and down with the corresponding lower positioning round hole 9 on the lower positioning plate 2.
In an embodiment of the application, the filling device for the glass bulb in the patch zener diode further includes at least one in-line needle bearing;
the upper positioning plate 1 is provided with at least one upper bearing groove on the bottom long and wide surface, the top long and wide surface of the lower positioning plate 2 is provided with at least one lower bearing groove, the upper bearing groove and the lower bearing groove are spliced into a bearing cavity for wrapping the in-line needle bearing in a one-to-one correspondence manner, and the length of the bearing cavity is at least greater than the distance of half the diameter of the glass bulb of the length of the in-line needle bearing;
the in-line needle roller bearing is arranged in the bearing cavity, the axial length direction of the in-line needle roller bearing is parallel to the length direction of the cross section of the guide limiting through hole 10, and the inner top surface and the inner bottom surface of the bearing cavity are in rolling contact with the needle roller in the in-line needle roller bearing so as to be used for the sliding of the upper positioning plate 1 on the top long and wide surface of the lower positioning plate 2 along the length direction of the cross section of the guide limiting through hole 10 as stable as possible;
preferably, the number of the at least one in-line needle bearings is two, namely a left in-line needle bearing 3 and a right in-line needle bearing 4.
In an embodiment of the application, the filling device for the glass bulb in the patch zener diode further includes at least one compression spring;
at least one upper spring groove is formed in the bottom long and wide surface of the upper positioning plate 1, at least one lower spring groove is formed in the top long and wide surface of the lower positioning plate 2, the upper spring grooves and the lower spring grooves are spliced into a spring cavity for wrapping the built-in compression spring in a one-to-one correspondence mode, and the length of the spring cavity is equal to the no-load non-stressed length of the compression spring;
the compression springs are arranged in the spring cavities, the axial length direction of the compression springs is parallel to the length direction of the cross section of the guide limiting through holes 10, two inner end surfaces in the length direction of the spring cavities prop against the compression springs so as to control the initial original position of the upper positioning plate 1 before sliding to be the distance that an upper positioning round hole 8 on the upper positioning plate 1 is staggered with a corresponding lower positioning round hole 9 on the lower positioning plate 2 by at most half of the glass shell diameter, and the compression springs are used for pushing the upper positioning plate 1 back to the initial original position after sliding;
preferably, the compression spring is arranged in the spring cavity, the axial length direction of the compression spring is parallel to the length direction of the cross section of the guiding limit through hole 10, two inner end surfaces in the length direction of the spring cavity are propped against the compression spring for controlling the initial position of the upper positioning plate 1 before sliding to be the distance that an upper positioning round hole 8 on the upper positioning plate 1 is staggered with a corresponding lower positioning round hole 9 on the lower positioning plate 2 by half glass shell diameter, and the compression spring is used for pushing the upper positioning plate 1 back to the initial position after sliding;
preferably, the number of the at least one compression spring is two, namely a left compression spring 5 and a right compression spring 6.
In one embodiment of the present application, a chamfer is provided at the top hole of the upper positioning round hole 8 for facilitating the introduction of the glass envelope.
In one embodiment of the application, the inner wall surface of the front frame of the groove is a slope surface so as to facilitate pouring out the redundant glass bulb.
In one embodiment of the present application, the top end of the sliding guide positioning pin 7 is provided with a large-head disc for preventing the upper positioning plate 1 from slipping off the sliding guide positioning pin 7.
In one embodiment of the present application, the diameter of the sliding limit guide is equal to the width of the guide limit through hole 10.
In one embodiment of the present application, the middle portion of the sliding guide positioning pin 7 is an external threaded portion 11, the external threaded portion 11 of the sliding guide positioning pin 7 is in threaded connection with the internal threaded through hole, and the external threaded portion 11 of the sliding guide positioning pin 7 is fixed in the internal threaded through hole through threaded connection interpolation.
The application also provides a filling method for the glass bulb in the patch voltage-stabilizing diode, which uses the filling device of any one of the above steps, and comprises the following steps:
1) Filling a patch zener diode by a graphite sintering die, axially positioning sintering holes, and firstly placing a specified number of electrodes 12 in the sintering holes on the graphite sintering die;
2) Inserting the exposed lower part of the sliding guide positioning pin 7 into a positioning hole on the graphite sintering mold to position and assemble the filling device on the graphite sintering mold;
3) Then a plurality of glass shells 13 are placed in the grooves of the filling device, and then a graphite sintering die is rocked to guide the glass shells 13 into the upper positioning round holes 8;
4) The upper locating plate 1 is pushed by hand to slide so that the upper locating round hole 8 on the upper locating plate 1 is aligned with the corresponding lower locating round hole 9 on the lower locating plate 2, at the moment, the glass bulb 13 in the upper locating round hole 8 falls into the lower locating round hole 9 of the lower locating plate 2, and then continuously falls into the sintering hole of the graphite sintering die, so that the filling of the glass bulb 13 is completed.
Compared with the prior art, the application provides a filling device for a glass bulb in a patch voltage-stabilizing diode, which comprises an upper locating plate 1, a lower locating plate 2 and a sliding guide locating pin 7; the application also provides a filling method of the glass bulb used in the patch voltage-stabilizing diode; the upper locating plate 1 and the lower locating plate 2 are assembled in a staggered way at most half glass shell diameter positions, the lower end face of the glass shell is only in contact with the lower locating plate 2 in a small half area before the glass shell is guided into the lower locating round hole 9 through the upper locating round hole 8, the probability of damaging the lower end face of the glass shell is reduced, the method has higher practicability, is simple and convenient to operate, solves the problems of low efficiency of manual filling and the problems of end face damage and edge breakage of the glass shell caused when a drawer plate type glass shell filling tool pulls out a metal drawer plate, greatly improves the glass shell filling yield, realizes the convenient, quick, efficient and high-quality filling of the glass shells in the patch voltage-stabilizing diode, and is convenient for mass stable and high-quality production of the patch voltage-stabilizing diode.
The method and the device which are not described in detail in the application are all the prior art and are not described in detail.
The principles and embodiments of the present application have been described herein with reference to specific examples, which are intended to be merely illustrative of the methods of the present application and their core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.
Claims (8)
1. A filling method for glass bulb in patch voltage-stabilizing diode adopts a filling device which comprises an upper locating plate (1), a lower locating plate (2) and a sliding guiding locating pin (7);
the top long and wide surface of the upper positioning plate (1) is provided with a groove with a circumferential frame, the bottom of the groove is provided with a plurality of upper positioning round holes (8) which are the same as the sintering holes on the graphite sintering die in number and hole spacing, the top long and wide surface of the upper positioning plate (1) which is positioned outside the groove is provided with a plurality of guiding limit through holes (10), and the upper positioning round holes (8) and the guiding limit through holes (10) are communicated with the upper positioning plate (1);
a plurality of lower positioning round holes (9) which are the same as the sintering holes on the graphite sintering die in number and hole spacing are formed in the top long and wide surface of the lower positioning plate (2), a plurality of internal thread through holes which are used for being aligned with the guiding limiting through holes (10) in a one-to-one up-down direction are also formed in the top long and wide surface of the lower positioning plate (2), and the lower positioning round holes (9) and the internal thread through holes are communicated with the lower positioning plate (2);
the upper positioning plate (1) is stacked on the lower positioning plate (2), and the sliding guide positioning pin (7) is inserted into the guide limiting through hole (10) and the internal thread through hole which are aligned up and down;
the part of the sliding guide locating pin (7) which is positioned in the guide limit through hole (10) is a sliding limit guide part, the cross section length of the guide limit through hole (10) is larger than the diameter of the sliding limit guide part by at most half glass shell diameter, so that the upper locating plate (1) can slide on the top long and wide surface of the lower locating plate (2) by at most half glass shell diameter distance along the cross section length direction of the guide limit through hole (10), and an upper locating round hole (8) on the upper locating plate (1) after sliding is aligned with a lower locating round hole (9) on the corresponding lower locating plate (2) up and down;
the lower part of the sliding guide positioning pin (7) is exposed below the bottom long and wide surface of the lower positioning plate (2) to be used as a positioning pin to be matched with a positioning hole on the graphite sintering die in a positioning way;
the filling method is characterized by comprising the following steps of:
1) Filling a patch zener diode by a graphite sintering die, axially positioning sintering holes, and firstly placing a specified number of electrodes in the sintering holes on the graphite sintering die;
2) Inserting the exposed lower part of the sliding guide positioning pin (7) into a positioning hole on the graphite sintering mold so as to position and assemble the filling device on the graphite sintering mold;
3) Then a plurality of glass shells are placed in the grooves of the filling device, and then the graphite sintering mould is rocked to guide the glass shells to enter the upper positioning round holes (8);
4) The upper locating plate (1) is pushed by hands to slide so that an upper locating round hole (8) on the upper locating plate (1) is aligned with a corresponding lower locating round hole (9) on the lower locating plate (2) up and down, at the moment, a glass bulb in the upper locating round hole (8) can fall into the lower locating round hole (9) of the lower locating plate (2), and then continuously falls into a graphite sintering die sintering hole, so that the filling of the glass bulb is completed.
2. The filling method for glass bulb in a patch zener diode according to claim 1, characterized in that the cross-sectional length of the guiding limit through hole (10) is larger than the half-diameter glass bulb diameter of the sliding limit guiding portion for the distance that the upper positioning plate (1) can slide by half-diameter glass bulb diameter on the top long and wide surface of the lower positioning plate (2) along the cross-sectional length direction of the guiding limit through hole (10), and the upper positioning round hole (8) on the upper positioning plate (1) after sliding is aligned up and down with the lower positioning round hole (9) on the corresponding lower positioning plate (2).
3. The method of loading a bulb for use in a patch zener diode of claim 1 further comprising at least one in-line needle bearing;
at least one upper bearing groove is formed in the bottom long and wide surface of the upper positioning plate (1), at least one lower bearing groove is formed in the top long and wide surface of the lower positioning plate (2), the upper bearing grooves and the lower bearing grooves are spliced into a bearing cavity for wrapping the in-line needle bearings in a one-to-one correspondence mode, and the length of the bearing cavity is at least greater than the distance of half of the glass shell diameter of the length of the in-line needle bearings;
the in-line needle bearing is arranged in the bearing cavity, the axial length direction of the in-line needle bearing is parallel to the length direction of the cross section of the guide limiting through hole (10), and the inner top surface and the inner bottom surface of the bearing cavity are in rolling contact with the needle rollers in the in-line needle bearing so as to be used for stably sliding the upper locating plate (1) on the top long wide surface of the lower locating plate (2) along the length direction of the cross section of the guide limiting through hole (10).
4. The method of loading a bulb for use in a patch zener diode of claim 1 further comprising at least one compression spring;
at least one upper spring groove is formed in the bottom long and wide surface of the upper positioning plate (1), at least one lower spring groove is formed in the top long and wide surface of the lower positioning plate (2), the upper spring grooves and the lower spring grooves are spliced into a spring cavity for wrapping the built-in compression spring in a one-to-one correspondence mode, and the length of the spring cavity is equal to the no-load non-stressed length of the compression spring;
the compression spring is arranged in the spring cavity, the axial length direction of the compression spring is parallel to the length direction of the cross section of the guide limiting through hole (10), two inner end surfaces in the length direction of the spring cavity are propped against the compression spring to be used for controlling the initial original position of the upper positioning plate (1) before sliding to be the distance that an upper positioning round hole (8) on the upper positioning plate (1) and a corresponding lower positioning round hole (9) on the lower positioning plate (2) are staggered to be at most half glass shell diameters, and the compression spring is used for pushing the upper positioning plate (1) back to the initial original position after sliding.
5. The filling method for the glass bulb in the patch zener diode according to claim 1, wherein a chamfer is provided at a top hole of the upper positioning round hole (8) for facilitating the introduction of the glass bulb.
6. The method of filling a bulb for a chip zener diode as claimed in claim 1, wherein an inner wall surface of a front frame of the recess is a slope surface to facilitate pouring out of the excess bulb.
7. The method for loading a glass bulb in a patch zener diode according to claim 1, wherein the top end of the sliding guide positioning pin (7) is provided with a large-head wafer for preventing the upper positioning plate (1) from slipping off the sliding guide positioning pin (7).
8. The filling method for the glass bulb in the patch zener diode according to claim 1, characterized in that the middle part of the sliding guide positioning pin (7) is an external threaded part (11), the external threaded part (11) of the sliding guide positioning pin (7) is in threaded connection with the internal threaded through hole, and the external threaded part (11) of the sliding guide positioning pin (7) is fixed in the internal threaded through hole through threaded connection interpolation.
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| CN201810799072.5A CN108747952B (en) | 2018-07-19 | 2018-07-19 | Filling device and filling method for glass bulb in patch voltage-stabilizing diode |
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| CN201810799072.5A CN108747952B (en) | 2018-07-19 | 2018-07-19 | Filling device and filling method for glass bulb in patch voltage-stabilizing diode |
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| CN108747952B true CN108747952B (en) | 2023-10-20 |
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| CN108747952A (en) | 2018-11-06 |
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