CN108735642B - Silicon wafer transmission device, silicon wafer transmission system and silicon wafer transmission method - Google Patents

Abstract

The present invention discloses a silicon wafer transmission device, a silicon wafer transmission system and a silicon wafer transmission method, and relates to the technical field of solar energy processing equipment. The silicon wafer transmission device includes a transport platform and an external force mechanism, and the transport platform is used to transport the first silicon wafer and the second silicon wafer to the designated position in sequence; the external force mechanism corresponds to the designated position, and can apply an external force to the first silicon wafer that arrives at the designated position first, so that a storage space for accommodating the second silicon wafer is formed between the first silicon wafer and the transport platform. In the silicon wafer transmission device, the first silicon wafer that arrives at the designated position first is separated from the transport platform under the force of the external force mechanism, and the second silicon wafer is transported to the storage space through the transport platform, so that the second silicon wafer is located at the bottom of the first silicon wafer, thereby realizing the stacking of silicon wafers during transportation, which is convenient for the storage and processing of silicon wafers.

Description

Silicon wafer transmission device, silicon wafer transmission system and silicon wafer transmission method

Technical Field

The present invention relates to the technical field of solar cell processing equipment, and in particular to a silicon wafer transmission device, a silicon wafer transmission system and a silicon wafer transmission method.

Background Art

In the processing and production of silicon wafers, in order to meet different application requirements, it is often necessary to perform various chemical treatments on silicon wafers. With the popularization of automated production, silicon wafers are generally transported to various processing stations through assembly lines. In order to improve production efficiency, some processing sections need to stack one silicon wafer at the bottom of another silicon wafer for subsequent processing, transportation or storage. In the prior art, the stacking of silicon wafers is generally achieved by manpower, which is not only time-consuming and labor-intensive, but also has low stacking efficiency, is not conducive to industrialization, and has high costs. In addition, it is easy to cause silicon wafer contamination or damage due to improper operation. Therefore, a new type of silicon wafer transmission device is urgently needed to solve the above problems.

Summary of the invention

One object of the present invention is to provide a silicon wafer transmission device, which can stack silicon wafers during the transmission process, thereby facilitating subsequent processing, transportation and storage of the silicon wafers.

To achieve this object, the present invention adopts the following technical solutions:

A silicon wafer transmission device, comprising:

A transport platform, used to transport the first silicon wafer and the second silicon wafer to designated locations in sequence; and

The external force mechanism corresponds to the designated position and can apply external force to the first silicon wafer that arrives at the designated position first, so that an accommodating space for accommodating the second silicon wafer is formed between the first silicon wafer and the transport platform.

Wherein, the external force mechanism applies force to the first silicon wafer in an intermittent force application manner.

The external force mechanism stops applying force after the second silicon wafer enters the accommodation space, so that the first silicon wafer and the second silicon wafer at least partially overlap.

Wherein, the external force mechanism includes a blowing component or a suction component.

Wherein, when the external force mechanism includes the blowing component, the blowing component is located below the designated position; when the external force mechanism includes the suction component, the suction component is located above the designated position.

Wherein, the silicon wafer transmission device further includes a limiting structure, and the limiting structure corresponds to the designated position.

Wherein, the silicon wafer transmission device further includes a storage mechanism, the storage mechanism corresponds to the designated position, and a limiting structure is arranged inside the storage mechanism.

Wherein, the limiting structure includes an upper limiting member and a lower limiting member which are correspondingly arranged up and down, and a side baffle plate arranged between the upper limiting member and the lower limiting member.

Wherein, the distance between the upper limit member and the lower limit member is at least the sum of the thicknesses of the first silicon wafer and the second silicon wafer.

Wherein, the blowing assembly includes a blowing hole, an air duct and a blower, the blower is connected to the air duct, and the air duct is connected to the blowing hole.

Wherein, the blowing hole is located below the transport platform or on the surface of the transport platform.

There are a plurality of blowing holes, and the plurality of blowing holes are distributed at the wafer feeding end of the first silicon wafer close to the second silicon wafer.

There are a plurality of blowing holes, and the plurality of blowing holes are distributed on both sides of the center line of the first silicon wafer.

Wherein, the air intake assembly comprises:

A suction cup, a first fixing frame and a vacuum device, wherein the first fixing frame is arranged on the frame of the silicon wafer transmission device, the vacuum device is arranged on the fixing frame, the vacuum device is connected to the suction cup, and the suction cup is arranged toward the transport platform.

The suction cup can slide up and down relative to the frame and/or slide along the transportation direction of the silicon wafer.

Wherein, the external force mechanism includes a clamping assembly.

Wherein, when the external force mechanism includes a clamping assembly, the clamping assembly is located at at least one side of the first silicon wafer that reaches the designated position and has a certain degree of freedom in the horizontal and vertical directions.

The clamping assembly includes a clamping claw, a second fixed frame and a sliding mechanism. The second fixed frame is arranged on the frame of the silicon wafer transmission device. The sliding mechanism is arranged on the second fixed frame. The sliding mechanism is connected to the clamping claw.

Wherein, the sliding mechanism comprises a horizontal sliding component and a vertical sliding component, the horizontal sliding component is installed on the second fixed frame, the horizontal sliding component is connected to the vertical sliding component, and the vertical sliding component is connected to the clamping claw.

Wherein, the transport platform includes a transport track.

Wherein, the designated location is located at the transport terminal of the transport track.

Wherein, the transport terminal of the transport track also includes a telescopic platform.

Wherein, the transport platform includes two transport tracks at right angles.

Wherein, the designated position is located at the intersection of the extension directions of the two transport tracks.

Wherein, the transport terminal of at least one of the two transport tracks comprises a telescopic platform.

Another object of the present invention is to provide a silicon wafer transmission system that enables silicon wafers to be stacked during the transmission process, thereby facilitating the storage and processing of silicon wafers.

To achieve this object, the present invention adopts the following technical solutions:

A silicon wafer transmission system comprises a control system and the silicon wafer transmission device as described above, wherein the control system is respectively connected to the transport platform and the external force mechanism.

Among them, the control system includes a PLC control system and a sensing device, the sensing device corresponds to the designated position and is used to detect the position of the first silicon wafer, and the PLC control system is respectively connected to the sensing device, the transport platform and the external force mechanism.

Another object of the present invention is to provide a silicon wafer transmission method, which can stack silicon wafers during the transmission process to facilitate the storage and processing of silicon wafers.

To achieve this object, the present invention adopts the following technical solutions:

A silicon wafer transmission method comprises the following steps:

Placing the first silicon wafer and the second silicon wafer on a transport platform and transporting them to a designated location;

Applying force to the first silicon wafer that arrives at the designated position first, so that the first silicon wafer is completely or partially separated from the transport platform, so as to form a receiving space between the first silicon wafer and the transport platform;

The second silicon wafer is transported into the containing space and is located below the first silicon wafer.

Wherein, the first silicon wafer is subjected to intermittent force.

The first silicon wafer starts to be subjected to force when it reaches the designated position, and when the second silicon wafer partially or completely enters the accommodation space, the first silicon wafer stops being subjected to force and is superimposed on the second silicon wafer.

The force on the first silicon wafer comes from the gas blown out by the blowing component.

Wherein, air blowing starts when the first silicon wafer reaches the designated position, and air blowing stops when the second silicon wafer partially enters the accommodation space.

The force on the first silicon wafer comes from the air suction component.

Wherein, the first silicon wafer and the second silicon wafer are transported to the designated location successively on the same transport track.

Wherein, the designated location is located at the transport terminal of the transport track.

The first silicon wafer and the second silicon wafer are respectively located on two mutually perpendicular transport tracks and arrive at the designated position in sequence, and the designated position is located at the intersection of the extension directions of the two transport tracks.

The first silicon wafer and the second silicon wafer are stacked at a designated position and enter a storage mechanism, and the storage mechanism can move vertically to perform multi-unit storage.

Beneficial effects: The present invention provides a silicon wafer transmission device, a silicon wafer transmission system and a silicon wafer transmission method. In the silicon wafer transmission device, the first silicon wafer that arrives at the designated position first is separated from the transport platform under the force of the external force mechanism to form a storage space for the second silicon wafer. The second silicon wafer is transported to the storage space through the transport platform, so that the second silicon wafer is located at the bottom of the first silicon wafer, thereby realizing the stacking of silicon wafers during transportation, which is convenient for the subsequent processing, transportation and storage of silicon wafers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a flower basket and a silicon wafer provided in Example 1 of the present invention;

2 is a schematic structural diagram of a silicon wafer transport system provided in Example 1 of the present invention when a blowing assembly applies force to a first silicon wafer;

3 is a schematic structural diagram of a first silicon wafer and a second silicon wafer stacked in a silicon wafer transportation system provided in Example 1 of the present invention;

FIG4 is a partial structural schematic diagram of a silicon wafer transportation system provided in Example 1 of the present invention;

5 is a schematic diagram of the structure of the transport platform provided in Example 1 of the present invention;

6 is a partial structural schematic diagram of a silicon wafer transportation system provided in Example 2 of the present invention;

7 is a schematic structural diagram of a silicon wafer transport system provided in Example 3 of the present invention when an air intake assembly applies force to a first silicon wafer;

8 is a schematic structural diagram of a first silicon wafer and a second silicon wafer stacked in a silicon wafer transportation system provided in Example 3 of the present invention;

FIG9 is a schematic structural diagram of an air intake assembly provided in Example 3 of the present invention;

FIG10 is a schematic diagram of the structure of a suction cup provided in Example 3 of the present invention;

FIG. 11 is a schematic diagram of the structure of the clamping assembly provided in Example 4 of the present invention.

in:

1. Transport platform; 11. Transmission frame; 12. First belt assembly; 121. First belt; 122. First pulley; 21. Telescopic platform; 22. Second belt assembly; 221. Second belt; 222. Second pulley; 3. Blowing assembly; 31. Blowing hole; 32. Air duct; 33. Blower; 4. Suction assembly; 41. Suction cup; 411. Suction hole; 421. First bracket; 4211. Long strip hole; 422. Second bracket; 5. Clamping assembly; 51. Clamping claw; 52. Vertical sliding assembly; 53. Horizontal sliding assembly; 54. Clamping claw fixing frame; 6. Flower basket; 61. Side panel; 62. Side support rod; 621. Gear; 63. Bottom support rod; 7. Silicon wafer.

DETAILED DESCRIPTION

In order to make the technical problem solved by the present invention, the technical solution adopted and the technical effect achieved more clearly, the technical solution of the present invention is further explained below with reference to the accompanying drawings and through specific implementation methods.

Example 1

This embodiment provides a silicon wafer transmission system, which can be used in the process of preparing solar cells, such as in the texturing process, to transport silicon wafers 7, and can stack silicon wafers 7 during transportation to facilitate storage or processing of silicon wafers 7.

The silicon wafer transmission system includes a silicon wafer transmission device and a control component. The silicon wafer transmission device includes a frame, a transport platform 1 and an external force mechanism. The external force mechanism and the transport platform 1 can be installed on the frame. The transport platform 1 can be used to carry the silicon wafer 7, and transport the first silicon wafer and the second silicon wafer to the designated position in sequence for stacking. The external force mechanism corresponds to the designated position so that an external force can be applied to the first silicon wafer that arrives at the designated position first, so that a storage space for the second silicon wafer is formed between the first silicon wafer and the transport platform 1.

Specifically, the silicon wafer 7 that arrives at the designated position first is the first silicon wafer, and the silicon wafer 7 that arrives at the designated position later is the second silicon wafer. Since the external force mechanism applies force to the first silicon wafer, the external force mechanism can apply force to the first silicon wafer in an intermittent manner, and after partially or completely separating the first silicon wafer from the transport platform 1, the second silicon wafer is transported to the accommodation space formed by the first silicon wafer and the transport platform 1 under the action of the transport platform 1, and then the external force mechanism stops applying force, and the first silicon wafer falls and at least partially overlaps with the second silicon wafer.

In this embodiment, the external force mechanism may include a blowing assembly 3. The blowing assembly 3 may be located below the designated position, thereby generating airflow from bottom to top to lift part or all of the first silicon wafer upward.

During the process of lifting the first silicon wafer, in order to prevent the first silicon wafer from deviating from the specified position, the silicon wafer transmission device may further include a limiting structure, and the limiting structure is arranged corresponding to the specified position so as to limit the position of the first silicon wafer and the second silicon wafer transmitted to the specified position, thereby preventing the first silicon wafer or the second silicon wafer from deviating, which is beneficial to the transportation and stacking of the silicon wafer 7.

Specifically, the limiting structure may include an upper limiting member, a lower limiting member, and a side baffle plate arranged between the upper limiting member and the lower limiting member. The upper limiting member, the lower limiting member, and the side baffle plate may be arranged to enclose a space for accommodating the silicon wafer 7. The upper limiting member can abut against the top surface of the first silicon wafer to limit the upward movement distance of the first silicon wafer; the lower limiting member is located below the first silicon wafer, and after the second silicon wafer is transported into the accommodating space, the lower limiting member abuts against the bottom surface of the second silicon wafer to limit the position of the silicon wafer 7 from below; the side baffle plate may abut against at least two side surfaces of the first silicon wafer and the second silicon wafer (which may be two side surfaces parallel to each other, or two side surfaces perpendicular to each other, or three side surfaces of the silicon wafer 7). The upper limiting member, the lower limiting member, and the side baffle plate may limit the position of the silicon wafer 7, so that the first silicon wafer and the second silicon wafer are stacked and do not deviate from the transportation direction.

To facilitate the second silicon wafer to enter the accommodation space so as to be located below the first silicon wafer, the distance between the upper limit member and the lower limit member is not less than the sum of the thicknesses of the first silicon wafer and the second silicon wafer.

In this embodiment, the silicon wafer transmission system may further include a storage mechanism, which may be arranged corresponding to a designated position so as to transport the silicon wafer 7 to the storage mechanism for storage. Optionally, the first silicon wafer and the second silicon wafer may be stacked during transportation and then transported to the storage mechanism, or may be first transported to the storage mechanism so that the first silicon wafer and the second silicon wafer overlap in the storage mechanism. When the first silicon wafer and the silicon wafer 7 overlap in the storage mechanism, the storage mechanism includes the above-mentioned limiting structure.

In this embodiment, the transport platform 1 includes a transport track, and the first silicon wafer and the second silicon wafer successively reach the designated position through the same transport track, and the designated position can be located at the transport terminal of the transport track. The limiting structure can be set at the transport terminal of the transport track, and the side baffle can abut against at least two mutually perpendicular sides of the first silicon wafer and the second silicon wafer, and the first silicon wafer and the second silicon wafer can be neatly stacked through the upper limit member, the lower limit member and the side baffle. A storage mechanism can also be correspondingly set at the transport terminal of the transport track, which is conducive to the stacked first silicon wafer and the second silicon wafer entering the storage mechanism, or stacking in the storage mechanism including the above-mentioned limiting structure.

In this embodiment, the storage mechanism can be a flower basket 6, and the transport terminal of the transport track can extend into the flower basket 6, so that the first silicon wafer and the second silicon wafer are stacked in the flower basket 6. As shown in FIG1 , the flower basket 6 can be placed vertically, and the two side panels 61 of the flower basket 6 are arranged up and down. The side support rod 62 and the bottom support rod 63 are both provided with latches 621, and the two adjacent latches 621 are respectively the upper limit member and the lower limit member, and a latch groove is formed between the upper limit member and the lower limit member, and the side support rod 62 and the bottom support rod 63 can be side baffles. The silicon wafer 7 is horizontally fed into the flower basket 6, and two silicon wafers 7 can be placed on the two adjacent latches 621.

As shown in FIG. 2 and FIG. 3 , when transporting the silicon wafer 7, two silicon wafers 7 can be sequentially transported into two adjacent teeth 621, and when the first silicon wafer 7 enters the slot, the blowing assembly 3 is started, and the first silicon wafer is forced to move upward under the action of the blowing assembly 3, so that a storage space for the second silicon wafer is formed between the first silicon wafer and the teeth 621 below the slot; then the transport track continues to transport the second silicon wafer into the flower basket 6, and after at least part of the second silicon wafer 7 extends into the storage space, the blowing assembly 3 stops blowing, and the first silicon wafer falls under the action of gravity, and at least part of the first silicon wafer overlaps with the second silicon wafer. Finally, the transport track can continue to work, so that the second silicon wafer completely enters the slot, and the first silicon wafer and the second silicon wafer are stacked. During the transmission and stacking of the first silicon wafer and the second silicon wafer, the bottom support rod 63 and the side support rod 62 of the flower basket 6 can limit the silicon wafer 7 to ensure that the two silicon wafers 7 are neatly stacked.

When two silicon wafers 7 are stored between two adjacent latch teeth 621, the basket 6 can move in the vertical direction so that the transport terminal of the transport track corresponds to the position of the next slot of the basket 6, so as to continue to input the silicon wafers 7 into the basket 6. In other embodiments, when two silicon wafers 7 are stacked in a slot, the basket 6 can also remain stationary, and the transport platform 1 in the silicon wafer 7 transport system moves up and down so that the silicon wafer 7 is opposite to the next slot.

As shown in FIG4 , the transport terminal of the transport track may further include a telescopic platform 21, which is connected to the transport track and can be telescopic along the transport direction of the transport track so as to receive the silicon wafers 7 on the transport track and continue to deliver the silicon wafers 7 into the flower basket 6. The width of the telescopic platform 21 is smaller than the width of the opening of the flower basket 6 so that the telescopic platform 21 can smoothly enter the flower basket 6.

The telescopic platform 21 can be parallel to or slightly higher than the lower teeth 621 of the corresponding slot, so that the silicon wafer 7 can smoothly enter between the upper and lower teeth 621, thereby improving the accuracy of silicon wafer 7 transportation and reducing the breakage rate of silicon wafer 7. To ensure the stability of the silicon wafer 7 when entering the slot, the end of the telescopic platform 21 can be extended to the center of the basket 6.

The transport track can adopt a belt drive, chain drive or roller drive belt structure. As shown in FIG5 , in this embodiment, the transport track adopts a belt drive structure to transport the silicon wafer 7, which includes a transmission frame 11 and a first belt 121 assembly 12. Among them, the first belt 121 assembly 12 includes a first belt 121 and two first pulleys 122, one of the two first pulleys 122 is a first driving wheel, and the other is a first driven wheel. The first pulley 122 is rotatably matched with the transmission frame 11, and the first belt 121 is wound around the two first pulleys 122. The rotation of the first driving wheel drives the rotation of the first driven wheel, thereby driving the rotation of the first belt 121, so as to realize the transportation of the silicon wafer 7. The width of the transport track can be adapted to the width of the silicon wafer 7, so as to improve the stability of carrying and transporting the silicon wafer 7.

In order to make the force uniform during the process of transferring the silicon wafer 7 from the transport track to the telescopic platform 21, the telescopic platform 21 can be symmetrically arranged relative to the center line of the transport track. The two sides of the telescopic platform 21 are respectively provided with a transmission frame 11 and a first belt 121 assembly 12, and each transmission frame 11 is correspondingly provided with a first belt 121 assembly 12. The two first belt 121 assemblies 12 cooperate with the two sides of the silicon wafer 7 respectively to improve the stability of the silicon wafer transmission.

In order to enable the silicon wafer 7 on the telescopic platform 21 to completely enter the flower basket 6, a second belt assembly 22 is also provided on the telescopic platform 21. Specifically, the second belt assembly 22 includes a second belt 221 and two second pulleys 222, and the second pulleys 222 are rotatably connected to the telescopic platform 21. One of the two second pulleys 222 is a second driving wheel, and the other is a second driven wheel. The second driving wheel and the second driven wheel are respectively arranged at two ends of the telescopic platform 21 along the transportation direction of the silicon wafer 7, and the second driving wheel can be driven to rotate by a driving component. When transporting the silicon wafer 7, the telescopic platform 21 extends into the flower basket 6, and at this time, the silicon wafer 7 on the telescopic platform 21 is at least partially located in the card slot. After that, the second belt assembly 22 is started, and the second driving wheel rotates under the drive of the driving component, driving the second driven wheel and the second belt 221 to rotate, thereby driving the silicon wafer 7 to move, so that the silicon wafer 7 on the telescopic platform 21 is completely inserted into the card slot. Among them, the driving component can be a motor.

In order to ensure uniform force on the silicon wafer 7 during the conveying process, two second belt assemblies 22 can be provided on the telescopic platform 21. The two second belt assemblies 22 are symmetrically arranged relative to the center of the telescopic platform 21 to prevent the silicon wafer 7 from shifting during the conveying process.

In this embodiment, the external force mechanism includes a blowing assembly 3, and the airflow generated by the blowing assembly 3 makes the first silicon wafer 7 suspended in the card slot. Specifically, a blowing hole 31 may be provided on the telescopic platform 21, and the blowing assembly 3 includes an air duct 32 and a blower 33 connected to the air duct 32, and the air duct 32 is connected to the blowing hole 31. When the first silicon wafer is transferred to the card slot, the blowing assembly 3 is started, and the airflow generated by the blower 33 acts on the first silicon wafer through the air duct 32 and the blowing hole 31 in turn, thereby blowing the first silicon wafer in the card slot and making it suspended.

The telescopic platform 21 may be provided with a plurality of blowing holes 31, and the plurality of blowing holes 31 may be distributed at the wafer feeding end of the first silicon wafer close to the second silicon wafer, so that at least the wafer feeding end of the first silicon wafer is lifted upward under the action of the airflow, so as to form a receiving space with the telescopic platform 21. Optionally, the plurality of blowing holes 31 may be distributed in multiple rows, and the plurality of blowing holes 31 may be symmetrically distributed on both sides of the center line of the first silicon wafer, which is conducive to ensuring that the first silicon wafer is subjected to uniform force.

In this embodiment, two rows of blowing holes 31 are provided on the telescopic platform 21, and each row of blowing holes 31 is provided along the transport direction of the silicon wafer 7. By providing two rows of blowing holes, the contact area between the airflow and the silicon wafer 7 can be increased, so that the distance that the silicon wafer 7 is lifted upward can meet the insertion of the second silicon wafer, and the force on the silicon wafer 7 can be more uniform, and it can rise steadily, avoiding interference between the first silicon wafer and the second silicon wafer. In other embodiments, the blowing holes 31 can also be provided in one row, three rows or four rows, and each row of blowing holes 31 can be distributed along the insertion direction of the silicon wafer 7, or multiple blowing holes 31 can also be distributed in other ways, such as circular, triangular, etc. In this embodiment, there is no special restriction on the number and arrangement of the blowing holes 31.

In other embodiments, the blowing holes 31 may also be disposed on or below the transport track. When the blowing holes 31 are disposed below the transport track, the blowing holes 31 may be disposed corresponding to the hollow area formed between the two transport racks 11 so that the airflow contacts the first silicon wafer.

Since the thickness of the silicon wafer 7 is generally 180 μm and the width of the card slot is generally 4.2 mm, considering the thickness of the silicon wafer 7 and the width of the card slot, the airflow generated by the blowing assembly 3 can ensure that the first silicon wafer is lifted up by 2-3 mm, for example, 2 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm, 3 mm. In this embodiment, the first silicon wafer is lifted up by 2 mm.

In order to prevent the silicon wafer 7 from being broken due to excessive force of the airflow, the diameter of the blowing hole 31 can be 0.8-1.5 mm, for example, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm. In this embodiment, the diameter of the blowing hole 31 is selected to be 1.0 mm.

In order to make the transport platform 1 and the external force mechanism work better together, the control component includes a PLC control system and a sensing device. The PLC control system is electrically connected to the transport platform 1, the blowing component 3 and the sensing device respectively. The control component controls the start and stop of the transport platform 1 and the external force mechanism according to the signal fed back by the sensing device, so that the two can better cooperate to complete the transportation of the silicon wafer 7. Specifically, a solenoid valve is provided on the air duct 32, and the control component controls the start and stop of the blowing component 3 by controlling the opening and closing of the solenoid valve.

The sensing device is used to detect the transmission position of the first silicon wafer, so as to control the blowing assembly 3 to lift the first silicon wafer, thereby facilitating the insertion of the second silicon wafer and avoiding interference between the first silicon wafer and the second silicon wafer. Optionally, the sensing device can be arranged below or on the telescopic table 21, and the sensing device can detect the position of the first silicon wafer by contact sensing or non-contact sensing such as photoelectric sensing. Taking the photoelectric sensor as an example, the sensor can be arranged below the telescopic table 21. When the end of the first silicon wafer is transmitted to the bottom of the sensor, due to the refraction and reflection of the light by the silicon wafer 7, the light signal received by the sensor will change, thereby judging that the first silicon wafer has reached the specified position, and transmitting the signal to the control assembly through the sensor, and the control assembly can control the blowing assembly 3 to work.

To ensure smooth insertion of the second silicon wafer, when the second silicon wafer is inserted between the first silicon wafer and the telescopic platform 21, the airflow generated by the blowing assembly 3 does not contact the second silicon wafer, preventing the second silicon wafer from interfering with the first silicon wafer under the action of the airflow, thereby avoiding damage to the silicon wafer 7. When the second silicon wafer is partially inserted into the gap between the first silicon wafer and the card slot, the control assembly controls the blowing assembly 3 to close, and the second belt assembly 22 continues to work until the second silicon wafer is completely inserted into the card slot. In this embodiment, after one quarter of the second silicon wafer overlaps with the first silicon wafer, the blowing assembly 3 stops working.

In this embodiment, the distribution positions of the blowing holes 31 and the start and stop time of the blowing assembly 3 are designed by comprehensively considering factors such as the transmission speed of the silicon wafer 7, the size of the silicon wafer 7, and the depth of the flower basket 6. Specifically, taking the depth of the flower basket 6 as 160 mm as an example, the depth of the telescopic platform 21 extending into the flower basket 6 is 80 mm, and the distances between the two rows of blowing holes 31 and the end of the telescopic platform 21 are 20 mm and 50 mm, respectively.

In addition, the control component may further include a control panel, on which a selection button is provided, through which the silicon wafer transmission system may be used to select whether to stack the silicon wafers 7 during the process of transmitting the silicon wafers 7 .

The specific working process of the silicon wafer 7 transportation system in this embodiment is as follows:

The transport terminal of the transport platform 1 corresponds to the corresponding slot position in the flower basket 6 so as to transport the silicon wafer 7 into the flower basket 6. The telescopic platform 21 slides relative to the transmission frame 11 so as to extend into the flower basket 6. The first belt 121 component 12 works to transfer the first silicon wafer to the telescopic platform 21, and then the second belt component 22 works to allow the first silicon wafer to completely enter the slot. The sensing device senses that the first silicon wafer has reached the specified position and sends an electrical signal to the PLC control system. After receiving the electrical signal, the PLC control system controls the blowing component 3 to work so that the first silicon wafer moves upward. During this process, the second silicon wafer is transported to the telescopic table 21 under the action of the first belt 121 component 12. When part of the second silicon wafer is inserted into the accommodation space, in order to prevent the airflow generated by the blowing component 3 from affecting the normal transportation of the second silicon wafer, the blowing component 3 is closed after working for 0.3s. At this time, about a quarter of the second silicon wafer extends between the first silicon wafer and the card slot, overlapping with the first silicon wafer. The first silicon wafer falls and overlaps on the second silicon wafer under the action of gravity; the second belt component 22 continues to work, driving the second silicon wafer to completely enter the card slot. After the two silicon wafers 7 are inserted into the card slot, the telescopic table 21 slides in the opposite direction relative to the transmission frame 11 to be retracted from the flower basket 6, and the flower basket 6 moves relative to the silicon wafer 7 transport device to transport the silicon wafer 7 to the next card slot.

In the above steps, the first silicon wafer 7 may be firstly transferred to the telescopic table 21 through the first belt 121 assembly 12, and then the telescopic table 21 slides and extends into the flower basket 6.

By using the silicon wafer transmission system provided in this embodiment, the silicon wafers 7 can be stacked at a designated position, which is convenient for the storage and use of the silicon wafers 7. By using the above-mentioned silicon wafer transmission system to transport the silicon wafers 7 into containers such as flower baskets 6, the transportation efficiency of the silicon wafers 7 can be increased from 4000 wafers per hour to 4800 wafers per hour, and the breakage rate can be reduced from 0.05% to 0.02%.

This embodiment also provides a silicon wafer transfer method, which can be applied in the process of preparing solar cells, such as in the texturing process, to transport silicon wafers 7, and can stack silicon wafers 7 during transportation so as to be transferred to a container.

Specifically, a first silicon wafer and a second silicon wafer are placed on a transport platform 1 and transported to a designated position. A force is applied to the first silicon wafer that arrives at the designated position first, so that the first silicon wafer is completely or partially separated from the transport platform 1 that carries and transports the silicon wafer 7, so that a storage space for accommodating the second silicon wafer is formed between the first silicon wafer and the transport platform 1, and the second silicon wafer is sent into the storage space, so that the first silicon wafer is at least partially placed on the second silicon wafer, so that the first silicon wafer and the second silicon wafer are stacked. Among them, the first silicon wafer refers to the silicon wafer 7 that is first transported to the designated position on the transport platform 1, and the second silicon wafer refers to the silicon wafer 7 that reaches the designated position after the first silicon wafer.

In this embodiment, the first silicon wafer and the second silicon wafer successively reach the designated position through the same transport track. Since the first silicon wafer and the second silicon wafer are sequentially transported to the designated position, the force on the first silicon wafer can be intermittent, that is, after the first silicon wafer reaches the designated position, the first silicon wafer begins to be subjected to force, and when the second silicon wafer partially or completely enters the accommodation space, the first silicon wafer stops being subjected to force, so that the first silicon wafer and the second silicon wafer at least partially overlap, and external force is prevented from affecting the transportation of the second silicon wafer. In this embodiment, the force on the first silicon wafer can come from the gas blown upward by the blowing component 3, and the first silicon wafer is lifted up by the gas.

After the first silicon wafer and the second silicon wafer are stacked at a designated position, the first silicon wafer and the second silicon wafer can enter the storage mechanism. The storage mechanism is provided with a plurality of slots, each of which can accommodate the first silicon wafer and the second silicon wafer. When the first silicon wafer and the second silicon wafer enter a slot of the storage mechanism, the storage mechanism can move vertically to store multiple units.

Example 2

This embodiment provides a silicon wafer transmission system and method, which are substantially the same as the silicon wafer transmission system and method in Embodiment 1. The difference from Embodiment 1 is that, as shown in FIG6 , the transport platform 1 in this embodiment includes two transport tracks, the two transport tracks can be arranged at a certain angle, and the intersection of the extended lines of the two transport tracks is the designated position for stacking the silicon wafers 7. In this embodiment, the angle between the two transport tracks is a right angle, and the transport terminals of the two transport tracks intersect.

Specifically, the two transport tracks are a first track for transporting a first silicon wafer and a second track for transporting a second silicon wafer. When the first silicon wafer is transported to a designated position via the first track, the external force mechanism starts to apply force to the first silicon wafer, causing the first silicon wafer to move upward. Afterwards, the second silicon wafer is transported to a designated position via the second track. After the external force mechanism stops applying force, the first silicon wafer is stacked with the second silicon wafer.

In this embodiment, a transport terminal of one of the first track and the second track may be provided with a telescopic plate. Taking the connection of the telescopic plate and the second track as an example, the first track is not lower than the telescopic plate, and the optional first track is slightly higher than the telescopic plate. After the first track transports the first silicon wafer to the transport terminal, the first silicon wafer falls on the telescopic plate. The blowing hole 31 may be provided on the telescopic plate, and after the first silicon wafer is lifted by the airflow under the action of the blowing assembly 3, the second track transports the second silicon wafer to the telescopic plate, so that the first silicon wafer is stacked with the second silicon wafer.

In other embodiments, a receiving platform may be provided at a designated position, the receiving platform is located in the storage mechanism, and the surface of the receiving platform is not higher than the upper surface of the lower end tooth 621 of the groove. The blowing hole 31 is provided on the receiving platform. The transport terminals of the first track and the second track are connected to the receiving platform. The transport terminals of the first track and the second track may both be provided with a telescopic platform 21, which is connected to the receiving platform or located above the receiving platform after being extended, and the surface of the telescopic platform is not lower than the upper surface of the lower end tooth 621 of the groove. Optionally, the transport terminal of one of the first track and the second track is provided with a telescopic platform 21, which is connected to the receiving platform after being extended.

In order to facilitate the two transport tracks to deliver the silicon wafers 7 into the storage mechanism, the storage mechanism is only provided with limiting structures on two adjacent sides.

Example 3

This embodiment provides a silicon wafer transmission system and method, which are substantially the same as the silicon wafer transmission system and method in the above-mentioned embodiment. The difference from the above-mentioned embodiment is that the external force mechanism in this embodiment includes an air suction component 4 .

Specifically, as shown in Figures 7 and 8, the air suction assembly 4 can be located above the first silicon wafer that has reached the designated position, so that the air suction assembly 4 applies an upward suction force to the first silicon wafer from above the first silicon wafer, and the first silicon wafer is separated from the transport platform 1 to form a receiving space for the second silicon wafer. When the second silicon wafer at least partially enters the receiving space, the air suction assembly 4 stops working, so that the first silicon wafer falls under the action of gravity and is stacked with the second silicon wafer.

As shown in FIG9 , the suction assembly 4 includes a first fixed frame, a suction cup 41 and a vacuum device (not shown in the figure). The first fixed frame can be connected to the frame of the silicon wafer transmission device, the suction cup 41 and the vacuum device can be fixed on the first fixed frame, the vacuum device is connected to the suction cup 41, and the suction cup 41 is arranged toward the transport platform 1. Among them, the first fixed frame can be an L-shaped structure, including a vertically arranged first bracket 421 and a horizontally arranged second bracket 422, the first bracket 421 is connected to the frame, the second bracket 422 extends in the direction of the specified position, the suction cup 41 is fixed on the second bracket 422, and is arranged opposite to the transport platform 1. The vacuum device is connected to the suction cup 41 through a pipeline, and the silicon wafer 7 on the transport platform 1 is adsorbed onto the suction cup 41 by air suction.

In order to adjust the distance between the suction cup 41 and the first silicon wafer, so as to ensure that the suction cup 41 can adsorb the first silicon wafer, the first bracket 421 can slide up and down relative to the frame, so as to adjust the distance between the suction cup 41 and the first silicon wafer. Specifically, the first bracket 421 is provided with an elongated hole 4211 arranged in the height direction, and the frame is provided with a threaded hole. The screw passes through the elongated hole 4211 and cooperates with the threaded hole to fix the first fixing frame on the frame. By adjusting the relative position of the elongated hole 4211 and the threaded hole, the distance between the suction cup 41 and the first silicon wafer can be adjusted.

Optionally, the suction cup 41 can also slide relative to the frame along the transport direction of the silicon wafer, so that after the silicon wafer 7 is stored, the suction cup 41 can be pulled out of the flower basket 6. Specifically, the second bracket 422 can be a telescopic rod. Through the extension and retraction of the second bracket 422, the suction cup 41 can be driven to move along the transport direction of the silicon wafer, so that the suction cup 41 can be extended into the flower basket 6 or retracted from the flower basket 6. In addition, the suction cup 41 can be extended into the flower basket 6 or retracted from the flower basket 6 by the second bracket 422 sliding relative to the first bracket 421. The second bracket 422 can be provided with a sliding hole extending along the transport direction of the silicon wafer, and the upper end of the first bracket 421 is provided with a threaded hole. After the screw passes through the sliding hole, it cooperates with the threaded hole. By adjusting the position of the screw in the sliding hole, the extension length of the suction cup 41 can be adjusted. The sliding hole here has the same structure and function as the above-mentioned long strip hole, which will not be repeated here.

In other embodiments, the suction cup 41 can slide relative to the frame in the direction of transporting the silicon wafer 7 in addition to being able to slide up and down relative to the frame.

In other embodiments, the suction cup can slide along the transport direction and up and down direction of the silicon wafer by means of a slide rail or a slider. Specifically, the first bracket 421 is provided with a first slider, and the rack is provided with a first slide rail provided along the transport direction of the silicon wafer. The first slider cooperates with the first slide rail to realize the sliding of the first bracket 421 along the transport of the silicon wafer, thereby changing the depth of the suction cup 41 extending into the flower basket 6. The first bracket 421 is provided with a second slide rail extending in the vertical direction, and the second bracket 422 is provided with a second slider cooperating with the second slide rail, so that the second bracket 422 can slide up and down relative to the first bracket 421, thereby realizing the adjustment of the height direction of the suction cup 41.

As shown in FIG10 , a plurality of adsorption holes 411 are provided at the bottom of the suction cup 41, and the adsorption holes 411 are connected to the pipeline. In order to avoid the problem that the silicon wafer 7 is damaged due to uneven local force, the plurality of adsorption holes 411 are arranged in a plurality of concentric rings, and the number of adsorption holes 411 on the ring with a smaller diameter is small, and the number of adsorption holes 411 on the ring with a larger diameter is large, which is conducive to uniform force on the silicon wafer 7.

To prevent the silicon wafer 7 from being broken due to excessive adsorption force of the suction cup 41, the diameter of the adsorption hole 411 can be 0.6-1mm, such as 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm. The pressure in the suction cup 41 can be 0.4-0.5Mpa, such as 0.4Mpa, 0.45Mpa, 0.5Mpa, which can ensure that the silicon wafer 7 is sucked up and in a suspended state, and can also prevent the silicon wafer 7 from being broken due to excessive gas pressure difference. In this embodiment, the diameter of the adsorption hole 411 can be 0.8mm, and the pressure of the suction cup 41 is 0.45Mpa.

In order to facilitate the control component to control the start and stop of the adsorption component, a start valve and a manual valve can also be set on the pipeline. The control component is electrically connected to the pneumatic valve, and the start and stop of the adsorption component are controlled by controlling the opening and closing of the pneumatic valve. By setting a manual valve, the air pressure can be manually fine-tuned to obtain a better adsorption effect.

In this embodiment, the air suction component 4 can also be used in conjunction with the air blowing component 3 to better ensure the stability of the suspension of the first silicon wafer 7. When applying force to the first silicon wafer that has reached the specified position, the air blowing component 3 can be started first to lift the first silicon wafer a certain distance, and then the air suction component 4 can be started to reduce the distance between the silicon wafer 7 and the air suction component 4, which is conducive to reducing the gas pressure difference when the air suction component 4 is started, thereby further avoiding damage to the silicon wafer 7.

The silicon wafer transfer method in this embodiment is different from the method in the above embodiment in that the force applied to the first silicon wafer comes from the adsorption force of the air suction component 4. The working steps of the air suction component 4 are substantially the same as those of the air blowing component 3, and will not be described again here.

Example 4

This embodiment provides a silicon wafer transmission system and method, which are substantially the same as the silicon wafer transmission system and method in the above embodiment, and different from the above embodiment in that the external force mechanism in this embodiment includes a clamping assembly 5. The clamping assembly 5 can be located at least one side of the first silicon wafer that reaches the specified position, and the clamping assembly 5 has a certain degree of freedom in the horizontal and vertical directions.

When the external force mechanism needs to apply force to the first silicon wafer, the clamping assembly 5 can move vertically and horizontally to the side of the first silicon wafer, and be fixed to the first silicon wafer by clamping at least one side of the first silicon wafer, and then the clamping assembly 5 moves vertically upward to drive the first silicon wafer to separate from the transport platform 1.

As shown in FIG11 , the clamping assembly 5 includes a clamping jaw 51, a second fixing frame, and a sliding mechanism, wherein the second fixing frame is disposed on the frame of the silicon wafer transmission device, and the sliding mechanism is disposed on the second fixing frame and connected to the clamping jaw 51. The sliding mechanism can drive the clamping jaw 51 to move in the horizontal and vertical directions, so that the clamping jaw 51 moves to the side of the first silicon wafer to clamp the first silicon wafer.

In order to realize the horizontal and vertical freedom of the clamping jaw 51, the sliding mechanism includes a horizontal sliding assembly 53 and a vertical sliding assembly 52. The horizontal sliding assembly 53 includes a horizontal bracket, and the horizontal bracket is connected to the second fixed bracket. The vertical sliding assembly 52 includes a vertical bracket, one end of the vertical bracket is slidably connected to the horizontal bracket, and the clamping jaw 51 is connected to the vertical bracket through a clamping jaw fixing frame 54, and the clamping jaw fixing frame 54 can slide in the vertical direction along the vertical bracket.

Specifically, the horizontal bracket may be provided with a first slide groove extending in the horizontal direction, and the vertical bracket may be provided with a first slider matched with the first slide groove. To realize the sliding of the first slider along the first slide groove, a first lead screw may be provided in the first slide groove, and the first slider is spirally connected to the first lead screw. When the first lead screw is driven to rotate by the motor, the first slider may be driven to slide along the first slide groove.

In other embodiments, the sliding of the first sliding block along the first sliding groove may also be driven by a linear motor or a cylinder.

The vertical bracket may be provided with a second slide groove extending in the vertical direction, and the clamping fixed frame may be provided with a second slider matched with the second slide groove. The cooperation between the second slider and the second slide groove may be the same as that between the first slider and the first slide groove, and both may be driven by a screw nut mechanism, a linear motor or a cylinder, which will not be described in detail here.

To facilitate the contact between the clamping assembly 5 and the first silicon wafer, at least the clamped side edge of the first silicon wafer may extend out of the side of the transport platform 1 so as to contact with the clamping assembly 5 .

During the operation of the clamping assembly 5, the clamping jaw 51 is first moved vertically and horizontally to the side of the first silicon wafer to ensure that the opening of the clamping jaw 51 is aligned with the side of the first silicon wafer. Then, the clamping jaw 51 moves closer to the first silicon wafer by moving the vertical support relative to the horizontal support, so that the side edge of the first silicon wafer enters the opening of the clamping jaw 51. The control assembly controls the clamping jaw 51 to close and clamp the first silicon wafer, so as to drive the first silicon wafer to move upward by sliding the clamping frame relative to the vertical support. Among them, the control assembly controls the opening or closing of the clamping jaw 51, which is a relatively mature technical means in the prior art and will not be described in detail here.

When the second silicon wafer completely enters the accommodation space, the sliding assembly moves in the direction to stack the first silicon wafer on the second silicon wafer.

The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims (29)

1. A silicon wafer transfer device, comprising: A transport platform (1) is used to transport the first silicon wafer and the second silicon wafer to designated locations in sequence; and an external force mechanism corresponding to the designated position and capable of applying an external force to the first silicon wafer that arrives at the designated position first, so that a receiving space for receiving the second silicon wafer is formed between the first silicon wafer and the transport platform (1); The external force mechanism comprises an air blowing component (3) or an air suction component (4); When the external force mechanism includes the blowing component (3), the blowing component (3) is located below the first silicon wafer at the designated position; when the external force mechanism includes the suction component (4), the suction component (4) is located above the first silicon wafer at the designated position; The external force mechanism applies force to the first silicon wafer in an intermittent force application manner. 2. The silicon wafer transfer device according to claim 1, wherein the external force mechanism stops applying force after the second silicon wafer enters the accommodation space, so that the first silicon wafer and the second silicon wafer at least partially overlap. 3. The silicon wafer transmission device as described in claim 1 is characterized in that the silicon wafer transmission device also includes a limiting structure, and the limiting structure corresponds to the specified position. 4. The silicon wafer transmission device as described in claim 1 is characterized in that the silicon wafer transmission device also includes a storage mechanism, the storage mechanism corresponds to the designated position, and a limiting structure is arranged inside the storage mechanism. 5. The silicon wafer transmission device according to claim 3 or 4, characterized in that the limiting structure includes an upper limiting member and a lower limiting member correspondingly arranged up and down, and a side baffle arranged between the upper limiting member and the lower limiting member. 6 . The silicon wafer transmission device according to claim 5 , wherein the distance between the upper limit member and the lower limit member is at least the sum of the thicknesses of the first silicon wafer and the second silicon wafer. 7. The silicon wafer transfer device according to claim 1, characterized in that the blowing component (3) comprises a blowing hole (31), an air duct (32) and a blower (33), the blower (33) is connected to the air duct (32), and the air duct (32) is communicated with the blowing hole (31). 8. The silicon wafer transfer device according to claim 7, characterized in that the blowing hole (31) is located below the transport platform (1) or on the surface of the transport platform (1). 9. The silicon wafer transfer device according to claim 8, characterized in that there are a plurality of blowing holes (31), and the plurality of blowing holes (31) are distributed at a wafer feeding end of the first silicon wafer close to the second silicon wafer. 10. The silicon wafer transfer device according to claim 8, characterized in that there are a plurality of the blowing holes (31), and the plurality of the blowing holes (31) are distributed on both sides of the center line of the first silicon wafer. 11. The silicon wafer transfer device according to claim 1, characterized in that the air suction component (4) comprises: A suction cup (41), a first fixing frame and a vacuum device, wherein the first fixing frame is arranged on a frame of the silicon wafer transmission device, the vacuum device is arranged on the fixing frame, the vacuum device is connected to the suction cup (41), and the suction cup (41) is arranged toward the transport platform (1); The suction cup (41) can slide up and down relative to the frame and/or slide along the transport direction of the silicon wafer (7). 12. The silicon wafer transfer device according to any one of claims 1-4 and 7-11, characterized in that the transport platform (1) comprises a transport track. 13. The silicon wafer transmission device according to claim 12, wherein the designated position is located at a transport terminal of the transport track. 14. The silicon wafer transport device according to claim 13, characterized in that the transport terminal of the transport track further comprises a telescopic platform (21). 15. The silicon wafer transport device according to any one of claims 1-4 and 7-11, characterized in that the transport platform (1) comprises two transport rails at right angles. 16. The silicon wafer transmission device according to claim 15, characterized in that the designated position is located at the intersection of the extension directions of the two transport tracks. 17. The silicon wafer transport device according to claim 16, characterized in that the transport terminal of at least one of the two transport tracks comprises a telescopic platform (21). 18. A silicon wafer transmission system, comprising a control system, characterized in that it also comprises a silicon wafer transmission device according to any one of claims 1 to 17, wherein the control system is respectively connected to the transport platform (1) and the external force mechanism. 19. The silicon wafer transmission system according to claim 18, characterized in that the control system comprises a PLC control system and a sensing device, the sensing device corresponds to the designated position and is used to detect the position of the first silicon wafer, and the PLC control system is respectively connected to the sensing device, the transport platform (1) and the external force mechanism. 20. A silicon wafer transmission method, characterized in that the silicon wafer transmission device according to any one of claims 1 to 17 is used, comprising the following steps: Placing the first silicon wafer and the second silicon wafer on a transport platform and transporting them to a designated location; Applying force to the first silicon wafer that arrives at the designated position first, so that it is completely or partially separated from the transport platform (1), so as to form a second silicon wafer accommodating space between the first silicon wafer and the transport platform; The second silicon wafer is transported into the second silicon wafer accommodation space and is located below the first silicon wafer. 21. The silicon wafer transfer method according to claim 20, wherein the force applied to the first silicon wafer is intermittent. 22. The silicon wafer transfer method according to claim 20 is characterized in that the first silicon wafer starts to be subjected to force when it reaches the specified position, and when the second silicon wafer partially or completely enters the accommodation space, the first silicon wafer stops being subjected to force and is superimposed on the second silicon wafer. 23. The silicon wafer transfer method according to claim 20, characterized in that the force applied to the first silicon wafer comes from the gas blown out by the blowing component (3). 24. The silicon wafer transfer method according to claim 23, wherein air blowing starts when the first silicon wafer reaches a designated position, and air blowing stops when the second silicon wafer partially enters the accommodation space. 25. The silicon wafer transfer method according to claim 20, characterized in that the force applied to the first silicon wafer comes from an air suction component (4). 26. The silicon wafer transmission method according to claim 20, characterized in that the first silicon wafer and the second silicon wafer are transported to the designated location successively on the same transport track. 27. The silicon wafer transmission method according to claim 26, wherein the designated position is located at a transport terminal of the transport track. 28. The silicon wafer transmission method as described in claim 20 is characterized in that the first silicon wafer and the second silicon wafer are respectively located on two mutually perpendicular transport tracks and arrive at the designated position in sequence, and the designated position is located at the intersection of the extension directions of the two transport tracks. 29. The silicon wafer transmission method according to claim 26 or 28, characterized in that the first silicon wafer and the second silicon wafer are stacked at a designated position and enter a storage mechanism, and the storage mechanism can move vertically to perform multi-unit storage.