CN108695190A - Cleaning equipment - Google Patents

Cleaning equipment Download PDF

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Publication number
CN108695190A
CN108695190A CN201710248501.5A CN201710248501A CN108695190A CN 108695190 A CN108695190 A CN 108695190A CN 201710248501 A CN201710248501 A CN 201710248501A CN 108695190 A CN108695190 A CN 108695190A
Authority
CN
China
Prior art keywords
liquid
cleaning equipment
cleaning
equipment according
cleaning solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710248501.5A
Other languages
Chinese (zh)
Inventor
蔡家寿
杨志仁
余昇峰
刘建成
林伟胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siliconware Precision Industries Co Ltd
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Publication of CN108695190A publication Critical patent/CN108695190A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67023Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

The present invention relates to cleaning equipments.A kind of cleaning equipment of manufacture of semiconductor, include the supply of liquid for loading cleaning solution, the filter to filter the cleaning solution, to feeding mechanism that the cleaning solution is sprayed on object and to detect the first sensor through the filtered cleaning solution quality of the filter, to ensure that the cleaning solution that the feeding mechanism is sprayed meets required specification.

Description

Cleaning equipment
Technical field
The present invention is in relation to a kind of semi-conductor processing equipment, espespecially a kind of cleaning equipment for manufacture of semiconductor.
Background technology
With the evolution of semiconductor packaging, market, which is evolved to electronic product, pursues light, thin, short, small demand, and Electronic component constantly reduces the size, and also weeds out the old and bring forth the new therewith relative to semiconductor packaging, to meet electronic product in the market Demand.However, the performance of semiconductor product will influence the key of final electronic goods function, so every in manufacture of semiconductor A stage has to be tested and examines layer by layer, is checked on the quality for final electronic product.
As shown in Figure 1, semiconductor chip 91 is first set to an encapsulation by existing flip chip manufacturing process by multiple solder bumps 92 On substrate 90, and in attaching scaling powder on the solder bump 92 with those solder bumps 92 of reflow (reflow), then with cleaning machine 1 by saponification agent and clear water hydro-peening, (such as arrow direction f), which washes away, is built-up in helping on the semiconductor chip 91 or package substrate 90 Solder flux.Later, primer 93 is inserted between the semiconductor chip 91 and the package substrate 90 to coat those solder bumps 92, and Semiconductor packaging part 9 is made, and is stained and is damaged to avoid those solder bumps 92 by the design of the primer 93.
Only, in existing flip chip manufacturing process, and it can not judge the water quality of the clear water used in cleaning machine, therefore often this is partly led in cleaning When scaling powder on body chip 91 or package substrate 90, the impurity in the clear water can remain on the semiconductor chip 91 or encapsulation base On plate 90, thus the quality of product is influenced, leads to production loss.
Therefore, how to overcome the problems of the prior art, have become the project for wanting to solve at present in fact.
Invention content
In view of the missing of the above-mentioned prior art, the present invention discloses a kind of cleaning equipment, to ensure that the feeding mechanism is sprayed Cleaning solution meet required specification.
The cleaning equipment of the present invention is used for manufacture of semiconductor, including:Supply of liquid, to load cleaning solution;Filtering Device, by the first pipeline connection supply of liquid, to filter by the cleaning solution of the supply of liquid feed-in filter;For Device is answered, by the second pipeline connection filter, which is sprayed on object;And first sense Device is surveyed, second pipeline is corresponded to and configures, to detect the quality of the filtered cleaning solution.
In cleaning equipment above-mentioned, which is electrode plate.
Further include that the corresponding supply of liquid makees configuration and is connected to the driving dress of first pipeline in cleaning equipment above-mentioned It sets.
Further include the bearing seat for carrying the object in cleaning equipment above-mentioned.It may include again after detecting cleaning The object surface cleanliness arrangement for detecting.
Further include the second sensor of the quality for detecting the cleaning solution for flowing through the object in cleaning equipment above-mentioned. For example, second sensor is electrode plate.
Further include that the corresponding feeding mechanism makees the retracting device configured in cleaning equipment above-mentioned.Preferably, the recycling fills It sets and is connected to the supply of liquid.
Further include data processing device in cleaning equipment above-mentioned, this is detected clearly to receive first sensing device further The data information of washing lotion, to judge whether the data information is more than setting value.
From the foregoing, it will be observed that the cleaning equipment of the present invention mainly corresponds to second pipeline by first sensor and configures, with The cleanliness factor of the filtered liquid of the filter is detected, and is able to ensure that the liquid that the feeding mechanism is sprayed meets required rule Model, therefore compared to the prior art, cleaning equipment of the invention is avoided that the impurity in the liquid remains on the object and influences The problem of product quality, thus the problem of be avoided that production loss.
Description of the drawings
Fig. 1 is the schematic cross-sectional view of existing flip chip manufacturing process;And
Fig. 2 is schematic diagram of the cleaning equipment of present invention when using.
Symbol description:
1 cleaning machine
2 cleaning equipments
20 supply of liquid
21 first sensors
22 second sensors
23 filters
24 feeding mechanisms
25 driving devices
26 bearing seats
27 retracting devices
28 data processing devices
29 displays
30 arrangement for detecting
31 first pipelines
32 second pipelines
33 third pipelines
8 objects
9 semiconductor package parts
90 package substrates
91 semiconductor chips
92 solder bumps
93 primers
A, B, F, f arrow direction
S liquid.
Specific implementation mode
Illustrate that embodiments of the present invention, those skilled in the art can be by this explanations below by way of particular specific embodiment The revealed content of book understands other advantages and effect of the present invention easily.
It should be clear that structure, ratio, size etc. depicted in this specification institute accompanying drawings, only coordinating specification to be taken off The content shown is not limited to the enforceable qualifications of the present invention for the understanding and reading of those skilled in the art, therefore Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the present invention Under the effect of can be generated and the purpose that can reach, it should all still fall and obtain the model that can cover in disclosed technology contents In enclosing.Meanwhile in this specification cited such as "upper" and " one " term, be also only being illustrated convenient for narration, Er Feiyong To limit the scope of the invention, relativeness is altered or modified, in the case where changing technology contents without essence, when also regarding For the enforceable scope of the present invention.
As shown in Fig. 2, the cleaning equipment 2 of the manufacture of semiconductor of the present invention includes:One supply of liquid 20, a filter 23, a feeding mechanism 24 and one first sensor 21.In this present embodiment, which only indicates each component in figure Relative position, do not show the detailed mechanism of each component and other relevant electromechanical be equipped with.
The manufacture of semiconductor is, for example, flip chip manufacturing process, but in other embodiments, also can be routing processing procedure or other The processing procedure that need to be cleaned.
The supply of liquid 20 include a container, be filled with when using the cleaning equipment 2 liquid S (such as to The cleaning solution of cleaning objects 8).
In this present embodiment, which is electronic packing piece, and the cleaning solution is saponification agent and clear water.For example, the object 8 be flip chip type semiconductor package part (can refer to semiconductor package part 9 shown in FIG. 1) comprising a load-bearing part, one hold set on this Electronic component in holder and multiple solder bumps being incorporated between the electronic component and the load-bearing part.Specifically, the carrying Part be lead frame, package substrate, semiconductor plank (such as glass, Silicon Wafer or silicon intermediate plate), but be not limited to it is above-mentioned, and should Electronic component is active member, passive device or the two combination, wherein the active member is, for example, semiconductor chip, and is somebody's turn to do Passive device is such as resistance, capacitance and inductance, and there is no particular restriction.
In addition, the cleaning equipment 2 further includes the bearing seat 26 for carrying the object 8, the corresponding feeding mechanism 24 work is matched It sets, to enable the feeding mechanism 24 that liquid S is supplied to the object 8 being set on the bearing seat 26.
The filter 23 is connected to the supply of liquid 20 by the first pipeline 31, to enable liquid S flow through the filtering Device 23.
In this present embodiment, which further includes a driving device 25, the corresponding supply of liquid 20 make configuration and It is connected to first pipeline 31, the liquid S in the supply of liquid 20 is delivered to the filter 23 along first pipeline 31.Tool Body, which is motor, and but it is not limited to this.
The feeding mechanism 24 is connected to the filter 23 by the second pipeline 32, to enable liquid S flow through supply dress Set 24.
In this present embodiment, which includes nozzle and other relevant configurations, known to industry, therefore in This is repeated no more.
First sensor 21 corresponds to second pipeline 32 and configures, to detect the liquid in second pipeline 32 The quality of S.
In this present embodiment, which is an electrode plate, is used to detect the electrical conductivity of liquid S, with Know the cleanliness factor of liquid S.For example, the cleaning equipment 2 includes a data processing device 28 (such as computer), and built-in first sets Definite value (such as 100uA), with when first sensor 21 obtains the first sensing current value, which can receive this The data of first sensing current value is compared, to judge whether the first sensing current value is more than first setting value, that is, First setting value is the standard value whether the liquid S for judging by the filter 23 needs to change.
In addition, the cleaning equipment 2, which may also include, a display 29 (such as screen), to show the of first sensor 21 One sensing current value.
Also, the cleaning equipment 2 also may include an arrangement for detecting 30, the corresponding bearing seat 26 configures, after being cleaned with detecting Object 8 surface cleanliness, if the surface cleanliness of the object 8 after detecting does not meet specification, the police of the cleaning equipment 2 Showing device (figure omit), such as light, image (such as LCD, LED), sound or combinations thereof, can warn user need to clean again or Replace liquid S.Specifically, which may include photosensitive coupling element (Charge-coupled Device, abbreviation CCD), and it can be moved to 26 surrounding of bearing seat (the arrow direction A in such as figure), in favor of capturing the correlation on 8 surface of object Information.
When using the cleaning equipment 2, the liquid S in the supply of liquid 20 (is cleaned by the driving device 25 Liquid) it is delivered to the feeding mechanism 24, then liquid S (cleaning solution) is sprayed to the bearing seat 26 (as schemed by the feeding mechanism 24 In arrow direction F) to clean the object 8.Particularly, being removed via the filter 23 during conveying liquid S should Impurity (for example, cast of the wall surface from first pipeline 31) in liquid S, to purify liquid S, then by this first Sensor 21 measures the cleanliness factor of the filtered liquid S (i.e. in second pipeline 32), to ensure that the feeding mechanism 24 is sprayed The liquid S (cleaning solution) spilt meets required specification.
In addition, the cleaning equipment 2 may include one second sensor 22, the corresponding feeding mechanism 24 configures, with detection stream Whether the quality through the bearing seat 26 Yu the liquid S of object 8, the liquor quality used after judging cleaning are excessively dirty.For example, working as the confession When answering the liquid of device 24 unclean and the object 8 being caused not clean up, after the cleaning which is detected Liquid S can be especially dirty.Specifically, which is, for example, an electrode plate, is used to detect liquid S cleaning objects Electrical conductivity afterwards, to learn the cleanliness factor of liquid S.In another embodiment, felt when liquid S passes through the first sensor 21 The the first sensing current value surveyed meets specification, but liquid S flows what the when of passing through the second sensor 22 after object 8 was sensed Second sensing current value exceeds specification, and the cleaning solution that the representative of this situation is set out in advance to make arrangements is excessively dirty to cause object 8 not have wash clean, causes to clean Cleaning solution afterwards is dirtier, must confirm whether the cleaning solution in next stop must be replaced at this time.
Therefore, the data processing device 28 can built-in second setting value (such as 250uA), therefore when second sensor 22 obtain When the second sensing current value, the data which can receive the second sensing current value is compared, with judgement Whether the second sensing current value is more than second setting value, that is, second setting value is for judging the supply of liquid Whether 20 liquid S needs to change the standard value of (or indicating whether the associated components of the liquid path of the cleaning equipment 2 need to change).
Also, the cleaning equipment 2 may also comprise a retracting device 27, the corresponding feeding mechanism 24 is configured, is flowed through with recycling The liquid S (the arrow direction B in such as figure) of the bearing seat 26 and object 8.For example, the retracting device 27 can be by the liquid S of recycling Applied to required place, alternatively, the retracting device 27 can be connected to the supply of liquid 20 by third pipeline 33, to recycle liquid Body S.
It is configured (for example, second sensor 22 can be set in addition, the retracting device 27 can also correspond to second sensor 22 In on the third pipeline 33), to detect the cleanliness factor for the liquid S that the retracting device 27 is recycled by second sensor 22 Whether meet the demand, then considers and whether recycle liquid S.
In conclusion the cleaning equipment 2 of the present invention is in second pipeline 32 of connection filter 23 and the feeding mechanism 24 Upper setting first sensor 21, to detect the cleanliness factor of 23 filtered liquid S of the filter (i.e. in second pipeline 32), And be able to ensure that the liquid S that the feeding mechanism 24 is sprayed meets required specification, therefore compared to the prior art, of the invention is clear The problem of impurity that equipment 2 is avoided that in liquid S remains on the object 8 and influences product quality is washed, thus is avoided that production The problem of amount loss.
Above-described embodiment is only to be illustrated the principle of the present invention and its effect, and is not intended to limit the present invention.Appoint What one of ordinary skill in the art can without violating the spirit and scope of the present invention modify to above-described embodiment.Therefore The scope of the present invention, should be as listed in the claims.

Claims (10)

1. a kind of cleaning equipment is applied to manufacture of semiconductor, it is characterized in that, which includes:
Supply of liquid, to load cleaning solution;
Filter, by the first pipeline connection supply of liquid, to filter by the supply of liquid feed-in filter Cleaning solution;
The filtered cleaning solution is sprayed on object by feeding mechanism by the second pipeline connection filter;And
First sensor corresponds to second pipeline and configures, to detect the quality of the filtered cleaning solution.
2. cleaning equipment according to claim 1, it is characterized in that, which is electrode plate.
3. cleaning equipment according to claim 1, it is characterized in that, which further includes that the corresponding supply of liquid is made Configure and be connected to the driving device of first pipeline.
4. cleaning equipment according to claim 1, it is characterized in that, which further includes carrying holding for the object Carry seat.
5. cleaning equipment according to claim 1, it is characterized in that, which further includes being somebody's turn to do after detecting cleaning The arrangement for detecting of the surface cleanliness of object.
6. cleaning equipment according to claim 1, it is characterized in that, which further includes detecting to flow through the object Cleaning solution quality the second sensor.
7. cleaning equipment according to claim 6, it is characterized in that, which is electrode plate.
8. cleaning equipment according to claim 1, it is characterized in that, which further includes data processing device, to The data information that first sensing device further detects the cleaning solution is received, to judge whether the data information is more than setting value.
9. cleaning equipment according to claim 1, it is characterized in that, which further includes recycling the cleaning solution Retracting device.
10. cleaning equipment according to claim 9, it is characterized in that, which is connected to the supply of liquid.
CN201710248501.5A 2017-04-07 2017-04-17 Cleaning equipment Pending CN108695190A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW106111697 2017-04-07
TW106111697A TWI625170B (en) 2017-04-07 2017-04-07 Cleaning apparatus

Publications (1)

Publication Number Publication Date
CN108695190A true CN108695190A (en) 2018-10-23

Family

ID=63255650

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710248501.5A Pending CN108695190A (en) 2017-04-07 2017-04-17 Cleaning equipment

Country Status (2)

Country Link
CN (1) CN108695190A (en)
TW (1) TWI625170B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112170411A (en) * 2019-07-05 2021-01-05 长鑫存储技术有限公司 Automatic carrier cleaning and detecting device and method
CN116147408A (en) * 2022-12-27 2023-05-23 爱赫德换热系统(无锡)有限公司 Heat exchanger washes cleanliness check out test set

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272040A (en) * 1987-04-30 1988-11-09 Fujitsu Ltd Circulating filtering and washing equipment
JP2002096012A (en) * 2000-09-26 2002-04-02 Dainippon Screen Mfg Co Ltd Device for treating substrate
CN101295622A (en) * 2007-04-24 2008-10-29 中芯国际集成电路制造(上海)有限公司 Device and method for cleaning wafer
EP1243372B1 (en) * 2001-03-22 2010-07-21 Fanuc Ltd Electric discharge machine with working fluid processing device.
CN202238756U (en) * 2011-09-05 2012-05-30 中芯国际集成电路制造(上海)有限公司 Wet-process cleaning equipment
CN106971966A (en) * 2017-04-06 2017-07-21 安徽熙泰智能科技有限公司 A kind of semiconductor chip cleaning device
CN107086188A (en) * 2016-09-09 2017-08-22 深圳市新纶科技股份有限公司 A kind of wafer cleaning device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265286B1 (en) * 1998-04-20 2000-10-02 윤종용 Apparatus of supplying chemical for manufacturing semiconductor device and its operation method
TWI224824B (en) * 2001-03-06 2004-12-01 Mosel Vitelic Inc Method of increasing cleaning-water recycling rate of chemical cleaning platen in semiconductor manufacture process
JP2004298752A (en) * 2003-03-31 2004-10-28 Se Techno Co Ltd Washing device and draining method of washing liquid
TWM436497U (en) * 2012-04-24 2012-09-01 Yung Yen Hsin Ind Co Ltd Filtering device for component cleaning machine
JP5978123B2 (en) * 2012-12-25 2016-08-24 株式会社東芝 Cleaning quality control system using electromagnetic flow meter and cleaning quality control method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272040A (en) * 1987-04-30 1988-11-09 Fujitsu Ltd Circulating filtering and washing equipment
JP2002096012A (en) * 2000-09-26 2002-04-02 Dainippon Screen Mfg Co Ltd Device for treating substrate
EP1243372B1 (en) * 2001-03-22 2010-07-21 Fanuc Ltd Electric discharge machine with working fluid processing device.
CN101295622A (en) * 2007-04-24 2008-10-29 中芯国际集成电路制造(上海)有限公司 Device and method for cleaning wafer
CN202238756U (en) * 2011-09-05 2012-05-30 中芯国际集成电路制造(上海)有限公司 Wet-process cleaning equipment
CN107086188A (en) * 2016-09-09 2017-08-22 深圳市新纶科技股份有限公司 A kind of wafer cleaning device
CN106971966A (en) * 2017-04-06 2017-07-21 安徽熙泰智能科技有限公司 A kind of semiconductor chip cleaning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112170411A (en) * 2019-07-05 2021-01-05 长鑫存储技术有限公司 Automatic carrier cleaning and detecting device and method
CN112170411B (en) * 2019-07-05 2024-01-12 长鑫存储技术有限公司 Automatic cleaning and detecting device and method for carrier
CN116147408A (en) * 2022-12-27 2023-05-23 爱赫德换热系统(无锡)有限公司 Heat exchanger washes cleanliness check out test set
CN116147408B (en) * 2022-12-27 2024-02-23 爱赫德换热系统(无锡)有限公司 Heat exchanger washes cleanliness check out test set

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Publication number Publication date
TWI625170B (en) 2018-06-01
TW201836721A (en) 2018-10-16

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