CN108648991B - Wafer photoetching process - Google Patents
Wafer photoetching process Download PDFInfo
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- CN108648991B CN108648991B CN201810534838.7A CN201810534838A CN108648991B CN 108648991 B CN108648991 B CN 108648991B CN 201810534838 A CN201810534838 A CN 201810534838A CN 108648991 B CN108648991 B CN 108648991B
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000001259 photo etching Methods 0.000 title claims abstract description 32
- 230000006698 induction Effects 0.000 claims abstract description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 5
- 238000001459 lithography Methods 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 4
- 230000033001 locomotion Effects 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000000206 photolithography Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer photoetching, in particular to a wafer photoetching process, wherein a wafer glue homogenizing device for a photoetching machine comprises a fixing frame, a base, a horizontal adjusting device, a fixing support, a rotating device, a vacuum sucker, a vacuum generator, an adjustable spring and an induction device; the base is positioned at the upper part of the fixed frame; the horizontal adjusting device is fixed in the fixed frame; the fixed bracket is arranged above the base; the rotating device is arranged on the fixed bracket; the vacuum chuck is positioned above the rotating device; the vacuum generator is positioned at the right lower part of the vacuum sucker and communicated with the vacuum sucker; the number of the adjustable springs is three, the adjustable springs are distributed in an angle of 120 degrees and are positioned between the base and the fixed frame; the induction device is positioned above the fixed frame; the device can effectively ensure that the wafer is horizontally fixed on the vacuum chuck, thereby ensuring that the thickness of the coating adhesive on the surface of the wafer is uniform.
Description
Technical Field
The invention belongs to the technical field of wafer photoetching, and particularly relates to a wafer photoetching process.
Background
The photoetching technology is widely applied to the field of micromachining, can realize efficient and accurate template copying, and is an important process for manufacturing a semiconductor integrated circuit. The development of the lithography technology directly affects the nanometer scale of the microelectronic process, and is a precise micro-processing technology. The photolithography process comprises the steps of wafer leveling (i.e. coating the glue layer), exposure, development, film hardening, etching, removing the glue, and the like. The thickness of the coating on the wafer surface directly affects the subsequent photolithography process, which is particularly important for the photolithography process, and the conventional photoresist evening device cannot ensure the uniform thickness of the coating on the wafer surface.
Therefore, the wafer photoetching process can ensure that the thickness of the coating adhesive on the surface of the wafer is uniform, ensure the quality of photoetching products and improve the qualification rate of finished products.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a wafer photoetching process which is mainly used for realizing photoetching of a wafer. The wafer glue homogenizing device for the photoetching machine can ensure that the wafer is horizontally placed through the mutual matching of the vacuum chuck, the vacuum generator, the horizontal adjusting device, the sensing device, the rotating device and the adjustable spring, so that the thickness of the glue coated on the surface of the wafer is ensured to be uniform.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a wafer photoetching process, which comprises the following steps:
the method comprises the following steps: fixing the prepared wafer on a wafer spin coater for a photoetching machine to carry out spin coating treatment;
step two: after the photoresist is homogenized in the first step, taking out the wafer, aligning the wafer coated with the photoresist with a photoetching plate through an alignment system of a photoetching machine, and exposing the wafer by using ultraviolet rays;
step three: after the exposure in the second step is finished, taking out the exposed photoresist by using a developing solution, and forming a required pattern on the wafer;
step four: after the development in the third step is finished, drying the wafer by an infrared radiation heating method so as to improve the adhesiveness and the corrosion resistance of the photoresist;
step five: after the wafer is dried in the fourth step, etching the wafer by a dry etching method;
step six: after the etching of the wafer is finished in the step five, removing the photoresist on the surface of the wafer through dry photoresist removal;
the wafer spin coater for the photoetching machine comprises a fixing frame, a base, a horizontal adjusting device, a fixing support, a rotating device, a vacuum chuck, a vacuum generator, an adjustable spring and an induction device, wherein the fixing frame is fixed on the base; the base is positioned at the upper part of the fixed frame and used for installing the fixed support; the horizontal adjusting device is fixed in the fixed frame and used for adjusting the level of the base; the fixed support is arranged above the base and is used for installing the rotating device; the rotating device is arranged on the fixed support and is used for driving the vacuum chuck to rotate; the vacuum chuck is positioned above the rotating device and used for fixing the wafer; the vacuum generator is positioned at the lower right part of the vacuum sucker and communicated with the vacuum sucker, and the vacuum generator is used for providing vacuum conditions for the vacuum sucker; the number of the adjustable springs is three, the adjustable springs are distributed in an angle of 120 degrees, the adjustable springs are positioned between the base and the fixed frame, the upper ends of the adjustable springs are connected with the bottom end of the base, the lower ends of the adjustable springs are connected with the top of the fixed frame, the adjustable springs are used for fixing the base, and meanwhile, the adjustable springs are also used for adjusting the level of the base; the induction device is positioned above the fixed frame and comprises a fixed rod and an inductor, and the induction device is used for judging whether the base is horizontal or not; the number of the fixed rods is two, the fixed rods are symmetrically arranged on the two sides of the base left and right, and the fixed rods are used for fixing the inductor; the inductor is fixed on the fixed rod and used for judging whether the base is horizontal.
A hollow cavity is arranged in the vacuum sucker, a plurality of suction holes connected with the hollow cavity are formed in the upper surface of the vacuum sucker, and the hollow cavity is further communicated with a vacuum generator. When the vacuum chuck works, the wafer is placed on the vacuum chuck, the vacuum generator provides vacuum conditions for the hollow cavity, and the vacuum chuck firmly adsorbs the wafer.
The horizontal adjusting device comprises a fixing plate, a first rotating motor, a threaded rod, a sliding block, a guide rod, a guide wheel and an adjusting wheel; the number of the fixed plates is six, the fixed plates are divided into three pairs and fixed on the bottom surface inside the fixed frame, the three pairs of fixed plates are distributed in an angle, and the distribution of the fixed plates corresponds to that of the adjustable springs; the threaded rods are positioned in the fixed frame, the number of the threaded rods is three, and the threaded rods are fixed on the fixed plate; the first rotating motors are respectively fixed on a fixing plate positioned on one side of the inner wall of the fixing frame, an output shaft of each rotating motor is connected with the threaded rod, and the first rotating motors are used for driving the threaded rods to rotate; the sliding blocks are three in number, the sliding blocks are of right-angle trapezoidal structures, the inclined surfaces of the sliding blocks face upwards and are placed on the bottom surface inside the fixed frame, and the sliding blocks move horizontally at the bottom of the fixed frame along with rotation of the threaded rods; the fixing frame is provided with three through holes, and the distribution of the through holes corresponds to that of the fixing plate; the guide rods penetrate through the through holes in the fixing frame and are vertically arranged between the base and the sliding block, the number of the guide rods is three, one ends of the guide rods are connected with the adjusting wheel, the other ends of the guide rods are in contact with the sliding block, the guide rods move up and down in the vertical direction along with the horizontal movement of the sliding block, and the guide rods are used for adjusting the height of the adjusting wheel; the guide wheels are positioned on two sides of the guide rod, the number of the guide wheels outside each guide rod is four, two of the guide wheels are positioned outside the fixed frame, the other two guide wheels are positioned inside the fixed frame, and the guide wheels are used for ensuring the guide rods to slide up and down; the regulating wheel contacts with the base bottom, and regulating wheel quantity is three, and the regulating wheel is connected with the guide arm, and the regulating wheel is used for adjusting the base level. When the device works, the first rotating motor drives the screw rod to rotate, the screw rod drives the sliding block to slide, the sliding block slides to enable the guide rod to move up and down on the guide wheel, the guide rod moves to drive the adjusting wheel to roll at the bottom of the base, and the height of the base is adjusted; the three rotating motors are coordinated with each other, and the rotating motor on one side with large height difference of the base is started first, so that the height of the base is basically horizontal through adjustment, then fine adjustment is carried out, and finally the base is horizontal.
An adjustable threaded sleeve and a rectangular groove are arranged inside the sliding block; the number of the rectangular grooves is multiple, and the rectangular grooves are symmetrically distributed on two sides of the inner wall of the sliding block; the adjustable threaded sleeve consists of an electromagnet, a spring and a push rod, threads are arranged on the adjustable threaded sleeve, and the adjustable threaded sleeve is fixed in the rectangular groove; the number of the adjustable thread sleeves corresponds to the number of the rectangular grooves. When the adjustable threaded sleeve works, the spring pushes the push rod under the action of the electromagnet, so that the threads on the threaded rod are matched with the adjustable threaded sleeve, and the threaded rod rotates to drive the sliding block to move.
An adjusting cylinder and a fixed block are arranged between each section of the adjustable spring; the number of the fixing blocks is two, a semicircular groove is formed in one side of each fixing block, a screw is arranged on each fixing block, one fixing block is fixed on a piston rod of the air cylinder, the other fixing block is fixed at the bottom of the air cylinder, the openings of the semicircular grooves of the two fixing blocks are horizontal and in the same direction, and each section of the spring is fixed on each fixing block through the semicircular groove; the cylinder is located between two fixed blocks, and the cylinder is used for providing tensile force for the fixed of spring. During operation, open inlet port and the venthole on the cylinder earlier, but adjustable spring this moment is elastic state, and through the level of level adjustment device regulation base, after guaranteeing the base level through induction system, close the inlet port and the venthole of cylinder, but adjustable spring changes rigid state from elastic state into this moment, and the base is fixed motionless.
The rotating device comprises a second rotating motor and a connecting shaft; the second rotating motor is fixed below the fixed support and used for driving the connecting shaft to rotate; one end of the connecting shaft is connected with an output shaft of the second rotating motor, the other end of the connecting shaft is connected with the bottom of the vacuum chuck, and the connecting shaft is used for driving the vacuum chuck to synchronously rotate with the second rotating motor. When the wafer processing device works, the second rotating motor drives the connecting shaft to synchronously rotate with the vacuum chuck, and the wafer is placed on the vacuum chuck and synchronously rotates along with the second rotating motor.
The invention has the beneficial effects that:
1. according to the wafer photoetching process, the practical glue homogenizing device is adopted in the glue homogenizing step of the photoetching process, the glue homogenizing device is matched with the induction device through the level adjusting device, the level in the wafer etching process is guaranteed, the uniform thickness of the coating glue on the surface of the wafer is guaranteed, the photoetching process is facilitated, and the quality of a finished product is improved.
2. According to the wafer photoetching process, the wafer is etched by a dry etching method, and the obtained pattern is accurate; meanwhile, the process adopts a dry method to remove the photoresist, so that the efficiency is high, the environmental pollution is small, and the photoresist removing process is easy to accurately control.
3. According to the wafer photoetching process, each sliding block in the horizontal adjusting device of the photoresist homogenizing device of the photoetching process is internally provided with a plurality of adjustable threaded sleeves, the photoresist can work only by opening one pair of the threaded sleeves, and the threaded sleeves can be replaced, so that the abrasion of the threaded sleeves is reduced, the service life of the sliding blocks is prolonged, and the production cost is reduced.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a flow chart of a photolithographic process of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a cross-sectional view B-B of FIG. 2;
FIG. 4 is a schematic view of the adjustable threaded sleeve of the present invention installed inside a slider;
FIG. 5 is a cross-sectional view A-A of FIG. 4;
FIG. 6 is a schematic view of an adjustable spring according to the present invention;
FIG. 7 is a schematic view of the adjustable spring upper fixed block and cylinder configuration of the present invention;
in the figure: the device comprises a fixed frame 1, a base 2, a horizontal adjusting device 3, a fixed support 4, a rotating device 5, a vacuum chuck 6, a vacuum generator 7, an adjustable spring 8, a sensing device 9, a fixed plate 31, a first rotating motor 32, a threaded rod 33, a sliding block 34, a guide rod 35, a guide wheel 36, an adjusting wheel 37, an adjustable threaded sleeve 341, a second rotating motor 51, a connecting shaft 52, a hollow cavity 61, an air cylinder 81, a fixed block 82, a fixed rod 91 and a sensor 92.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 7, the photolithography process for a wafer according to the present invention includes the following steps:
the method comprises the following steps: fixing the prepared wafer on a wafer spin coater for a photoetching machine to carry out spin coating treatment;
step two: after the photoresist is homogenized in the first step, taking out the wafer, aligning the wafer coated with the photoresist with a photoetching plate through an alignment system of a photoetching machine, and exposing the wafer by using ultraviolet rays;
step three: after the exposure in the second step is finished, taking out the exposed photoresist by using a developing solution, and forming a required pattern on the wafer;
step four: after the development in the third step is finished, drying the wafer by an infrared radiation heating method so as to improve the adhesiveness and the corrosion resistance of the photoresist;
step five: after the wafer is dried in the fourth step, etching the wafer by a dry etching method;
step six: after the etching of the wafer is finished in the step five, removing the photoresist on the surface of the wafer through dry photoresist removal;
the wafer spin coating device for the photoetching machine comprises a fixing frame 1, a base 2, a horizontal adjusting device 3, a fixing support 4, a rotating device 5, a vacuum chuck 6, a vacuum generator 7, an adjustable spring 8 and an induction device 9; the base 2 is positioned at the upper part of the fixed frame 1, and the base 2 is used for installing the fixed support 4; the horizontal adjusting device 3 is fixed in the fixed frame 1, and the horizontal adjusting device 3 is used for adjusting the level of the base 2; the fixed support 4 is arranged above the base 2, and the fixed support 4 is used for installing a rotating device 5; the rotating device 5 is arranged on the fixed support 4, and the rotating device 5 is used for driving the vacuum chuck 6 to rotate; the vacuum chuck 6 is positioned above the rotating device 5, and the vacuum chuck 6 is used for fixing the wafer; the vacuum generator 7 is positioned at the lower right of the vacuum sucker 6, the vacuum generator 7 is communicated with the vacuum sucker 6, and the vacuum generator 7 is used for providing vacuum conditions for the vacuum sucker 6; the number of the adjustable springs 8 is three, the adjustable springs 8 are distributed in an angle of 120 degrees, the adjustable springs 8 are located between the base 2 and the fixed frame 1, the upper ends of the adjustable springs 8 are connected with the bottom end of the base 2, the lower ends of the adjustable springs 8 are connected with the top of the fixed frame 1, the adjustable springs 8 are used for fixing the base 2, and meanwhile the adjustable springs 8 are also used for adjusting the level of the base 2; the sensing device 9 is positioned above the fixed frame 1, the sensing device 9 comprises a fixing rod 91 and a sensor 92, and the sensing device 9 is used for judging whether the base 2 is horizontal or not; the number of the fixing rods 91 is two, the fixing rods 91 are symmetrically arranged on the two sides of the base 2, and the fixing rods 91 are used for fixing the inductors 92; the sensor 92 is fixed on the fixing rod 91, and the sensor 92 is used for judging whether the base 2 is horizontal.
A hollow cavity 61 is arranged in the vacuum chuck 6, a plurality of suction holes 62 connected with the hollow cavity 61 are arranged on the upper surface of the vacuum chuck 6, and the hollow cavity 61 is also communicated with the vacuum generator 7. In operation, a wafer is placed on the vacuum chuck 6, and the vacuum generator 7 provides a vacuum condition for the hollow chamber 61, so that the wafer is firmly adsorbed by the vacuum chuck 6.
The horizontal adjusting device 3 comprises a fixed plate 31, a first rotating motor 32, a threaded rod 33, a sliding block 34, a guide rod 35, a guide wheel 36 and an adjusting wheel 37; the number of the fixing plates 31 is six, the fixing plates 31 are divided into three pairs and fixed on the bottom surface inside the fixing frame 1, the three pairs of the fixing plates 31 are distributed at 120 degrees, and the distribution of the fixing plates 31 corresponds to that of the adjustable springs 8; the threaded rods 33 are positioned in the fixed frame 1, the number of the threaded rods 33 is three, and the threaded rods 33 are fixed on the fixed plate 31; the number of the first rotating motors 32 is three, the first rotating motors 32 are respectively fixed on the fixing plate 31 located on one side of the inner wall of the fixing frame 1, the output shafts of the first rotating motors 32 are connected with the threaded rods 33, and the first rotating motors 32 are used for driving the threaded rods 33 to rotate; the number of the sliding blocks 34 is three, the sliding blocks 34 are of a right-angled trapezoid structure, the inclined surfaces of the sliding blocks 34 face upwards and are placed on the inner bottom surface of the fixed frame 1, and the sliding blocks 34 move horizontally at the bottom of the fixed frame 1 along with the rotation of the threaded rods 33; through holes are formed in the fixing frame 1, the number of the through holes is three, and the distribution of the through holes corresponds to that of the fixing plates 31; the guide rods 35 penetrate through holes in the fixed frame 1 and are vertically arranged between the base 2 and the sliding block 34, the number of the guide rods 35 is three, one ends of the guide rods 35 are connected with the adjusting wheel 37, the other ends of the guide rods 35 are in contact with the sliding block 34, the guide rods 35 move up and down in the vertical direction along with the horizontal movement of the sliding block 34, and the guide rods 35 are used for adjusting the height of the adjusting wheel 37; the guide wheels 36 are positioned on two sides of the guide rods 35, the number of the guide wheels 36 outside each guide rod 35 is four, two of the guide wheels 36 are positioned outside the fixed frame 1, the other two guide wheels 36 are positioned inside the fixed frame 1, and the guide wheels 36 are used for ensuring the guide rods 35 to slide up and down; the adjusting wheels 37 are in contact with the bottom of the base 2, the number of the adjusting wheels 37 is three, the adjusting wheels 37 are connected with the guide rod 35, and the adjusting wheels 37 are used for adjusting the level of the base 2. When the device works, the first rotating motor 32 drives the screw to rotate, the screw drives the sliding block 34 to slide, the sliding block 34 slides to enable the guide rod 35 to move up and down on the guide wheel 36, the guide rod 35 moves to drive the adjusting wheel 37 to roll at the bottom of the base 2, and the height of the base 2 is adjusted; the three first rotating motors 32 are coordinated with each other, and the first rotating motor 32 on the side with the large height difference of the base 2 is started first, is adjusted to enable the height of the base 2 to be basically horizontal, and is then finely adjusted to finally enable the base 2 to be horizontal.
An adjustable threaded sleeve 341 and a rectangular groove 342 are arranged inside the sliding block 34; the number of the rectangular grooves 342 is a plurality, and the rectangular grooves 342 are symmetrically distributed on two sides of the inner wall of the sliding block 34; the adjustable threaded sleeve 341 consists of an electromagnet, a spring and a push rod, the adjustable threaded sleeve 341 is provided with threads, and the adjustable threaded sleeve 341 is fixed in the rectangular groove 342; the number of adjustable thread sleeves 341 corresponds to the number of rectangular recesses 342. When the adjustable threaded sleeve 341 is started during work, the spring pushes the push rod under the action of the electromagnet, so that the threads on the threaded rod 33 are matched with the adjustable threaded sleeve 341, and the threaded rod 33 rotates to drive the sliding block 34 to move.
An adjusting cylinder 81 and a fixed block 82 are also arranged between each section of the adjustable spring 8; the number of the fixed blocks 82 is two, a semicircular groove is formed in one side of each fixed block 82, a screw is arranged on each fixed block 82, one fixed block 82 is fixed on a piston rod of the air cylinder 81, the other fixed block 82 is fixed at the bottom of the air cylinder 81, the semicircular grooves of the two fixed blocks 82 are horizontally and equidirectionally opened, and each section of the spring is fixed on each fixed block 82 through the semicircular groove; the cylinder 81 is located between two fixed blocks 82, and the cylinder 81 is used for providing tension for fixing of the spring. During operation, open inlet port and the venthole on the cylinder 81 earlier, but adjustable spring 8 is elastic state this moment, through the level of level adjustment device 3 regulation base 2, ensures 2 levels backs of base through induction system 9, closes the inlet port and the venthole of cylinder 81, but adjustable spring 8 changes rigid state into from elastic state this moment, and base 2 is fixed motionless.
The rotating device 5 comprises a second rotating motor 51 and a connecting shaft 52; the second rotating motor 51 is fixed below the fixed support 4, and the second rotating motor 51 is used for driving the connecting shaft 52 to rotate; one end of the connecting shaft 52 is connected with an output shaft of the second rotating motor 51, the other end of the connecting shaft 52 is connected with the bottom of the vacuum sucker 6, and the connecting shaft 52 is used for driving the vacuum sucker 6 and the second rotating motor 51 to rotate synchronously. When the wafer processing device works, the second rotating motor 51 drives the connecting shaft 52 to rotate synchronously with the vacuum chuck 6, and the wafer is placed on the vacuum chuck 6 and rotates synchronously with the second rotating motor 51.
The specific operation flow is as follows:
in operation, a wafer is placed on the vacuum chuck 6, and the vacuum generator 7 provides a vacuum condition for the hollow chamber 61, so that the wafer is firmly adsorbed by the vacuum chuck 6. After the wafer is placed, whether the base 2 is horizontal or not is judged through the inductor 92, if the base 2 is horizontal, the second rotating motor 51 is started, glue is dripped onto the wafer, and glue homogenizing operation is started; if not, the base 2 needs to be adjusted; firstly, opening an air inlet hole and an air outlet hole of an air cylinder 81 on the adjustable spring 8 to enable the adjustable spring 8 to be in an elastic state; then, the adjustable threaded sleeve 341 is started, and the spring pushes the push rod under the action of the electromagnet, so that the threads on the threaded rod 33 are matched with the adjustable threaded sleeve 341; at the moment, the first rotating motor 32 is started, and the first rotating motor 32 drives the threaded rod 33 to rotate; under the action of rotation of the threaded rod 33, the sliding block 34 moves in the horizontal direction, and the sliding block 34 drives the guide rod 35 to do linear motion in the vertical direction; the adjusting wheel 37 rolls at the bottom of the base 2 under the action of the guide rod 35, and the height of the base 2 is adjusted by the adjusting wheel 37 in the rolling process, so that the base 2 finally tends to be horizontal; at this time, the air inlet and the air outlet of the air cylinder 81 on the adjustable spring 8 are closed, so that the adjustable spring 8 is changed into a rigid state; after the base 2 is adjusted to be horizontal, the second rotating motor 51 is started to drop the glue on the wafer, and the glue homogenizing operation is started.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A wafer lithography process, comprising the steps of:
the method comprises the following steps: fixing the prepared wafer on a wafer spin coater for a photoetching machine to carry out spin coating treatment;
step two: after the photoresist is homogenized in the first step, taking out the wafer, aligning the wafer coated with the photoresist with a photoetching plate through an alignment system of a photoetching machine, and exposing the wafer by using ultraviolet rays;
step three: after the exposure in the second step is finished, taking out the exposed photoresist by using a developing solution, and forming a required pattern on the wafer;
step four: after the development in the third step is finished, drying the wafer by an infrared radiation heating method so as to improve the adhesiveness and the corrosion resistance of the photoresist;
step five: after the wafer is dried in the fourth step, etching the wafer by a dry etching method;
step six: after the etching of the wafer is finished in the step five, removing the photoresist on the surface of the wafer through dry photoresist removal;
the wafer spin coating device for the photoetching machine comprises a fixing frame (1), a base (2), a horizontal adjusting device (3), a fixing support (4), a rotating device (5), a vacuum chuck (6), a vacuum generator (7), an adjustable spring (8) and a sensing device (9); the base (2) is positioned at the upper part of the fixed frame (1), and the base (2) is used for installing the fixed support (4); the horizontal adjusting device (3) is fixed in the fixed frame (1), and the horizontal adjusting device (3) is used for adjusting the level of the base (2); the fixed support (4) is arranged above the base (2), and the fixed support (4) is used for installing the rotating device (5); the rotating device (5) is arranged on the fixed support (4), and the rotating device (5) is used for driving the vacuum chuck (6) to rotate; the vacuum chuck (6) is positioned above the rotating device (5), and the vacuum chuck (6) is used for fixing the wafer; the vacuum generator (7) is positioned at the lower right part of the vacuum sucker (6), the vacuum generator (7) is communicated with the vacuum sucker (6), and the vacuum generator (7) is used for providing vacuum conditions for the vacuum sucker (6); the number of the adjustable springs (8) is three, the adjustable springs (8) are distributed in 120 degrees, the adjustable springs (8) are located between the base (2) and the fixed frame (1), the upper ends of the adjustable springs (8) are connected with the bottom end of the base (2), the lower ends of the adjustable springs (8) are connected with the top of the fixed frame (1), the adjustable springs (8) are used for fixing the base (2), and meanwhile the adjustable springs (8) are also used for adjusting the level of the base (2); the induction device (9) is positioned above the fixed frame (1), the induction device (9) comprises a fixed rod (91) and an inductor (92), and the induction device (9) is used for judging whether the base (2) is horizontal or not; the number of the fixing rods (91) is two, the fixing rods (91) are symmetrically arranged on the two sides of the base (2) from left to right, and the fixing rods (91) are used for fixing the inductor (92); the sensor (92) is fixed on the fixing rod (91), and the sensor (92) is used for judging whether the base (2) is horizontal or not;
the horizontal adjusting device (3) comprises a fixing plate (31), a first rotating motor (32), a threaded rod (33), a sliding block (34), a guide rod (35), a guide wheel (36) and an adjusting wheel (37); the number of the fixing plates (31) is six, the fixing plates (31) are divided into three pairs and fixed on the inner bottom surface of the fixing frame (1), the three pairs of fixing plates (31) are distributed at 120 degrees, and the distribution of the fixing plates (31) corresponds to that of the adjustable springs (8); the threaded rods (33) are positioned in the fixed frame (1), the number of the threaded rods (33) is three, and the threaded rods (33) are fixed on the fixed plate (31); the number of the first rotating motors (32) is three, the first rotating motors (32) are respectively fixed on a fixing plate (31) located on one side of the inner wall of the fixing frame (1), the output shafts of the first rotating motors (32) are connected with a threaded rod (33), and the first rotating motors (32) are used for driving the threaded rod (33) to rotate; the number of the sliding blocks (34) is three, the sliding blocks (34) are of a right-angled trapezoid structure, the inclined surfaces of the sliding blocks (34) face upwards and are placed on the bottom surface inside the fixed frame (1), and the sliding blocks (34) move horizontally at the bottom of the fixed frame (1) along with the rotation of the threaded rods (33); through holes are formed in the fixing frame (1), the number of the through holes is three, and the distribution of the through holes corresponds to that of the fixing plate (31); the guide rods (35) penetrate through holes in the fixed frame (1) and are vertically arranged between the base (2) and the sliding block (34), the number of the guide rods (35) is three, one ends of the guide rods (35) are connected with the adjusting wheel (37), the other ends of the guide rods (35) are in contact with the sliding block (34), the guide rods (35) move up and down in the vertical direction along with the horizontal movement of the sliding block (34), and the guide rods (35) are used for adjusting the height of the adjusting wheel (37); the guide wheels (36) are positioned on two sides of the guide rods (35), the number of the guide wheels (36) outside each guide rod (35) is four, two of the guide wheels (36) are positioned outside the fixed frame (1), the other two guide wheels (36) are positioned inside the fixed frame (1), and the guide wheels (36) are used for ensuring the guide rods (35) to slide up and down; the adjusting wheels (37) are in contact with the bottom of the base (2), the number of the adjusting wheels (37) is three, the adjusting wheels (37) are connected with the guide rod (35), and the adjusting wheels (37) are used for adjusting the level of the base (2);
an adjustable threaded sleeve (341) and a rectangular groove (342) are arranged inside the sliding block (34); the number of the rectangular grooves (342) is multiple, and the rectangular grooves (342) are symmetrically distributed on two sides of the inner wall of the sliding block (34); the adjustable threaded sleeve (341) consists of an electromagnet, a spring and a push rod, threads are arranged on the adjustable threaded sleeve (341), and the adjustable threaded sleeve (341) is fixed in the rectangular groove (342); the number of the adjustable thread sleeves (341) corresponds to the number of the rectangular grooves (342).
2. The wafer lithography process as claimed in claim 1, wherein: a hollow cavity (61) is arranged in the vacuum sucker (6), a plurality of suction holes (62) connected with the hollow cavity (61) are formed in the upper surface of the vacuum sucker (6), and the hollow cavity (61) is further communicated with a vacuum generator (7).
3. The wafer lithography process as claimed in claim 1, wherein: an air cylinder (81) and a fixed block (82) are arranged between each section of the adjustable spring (8); the number of the fixing blocks (82) is two, a semicircular groove is formed in one side of each fixing block (82), a screw is arranged on each fixing block (82), one fixing block (82) is fixed on an ejector rod of the air cylinder (81), the other fixing block (82) is fixed at the bottom of the air cylinder (81), openings of the semicircular grooves of the two fixing blocks (82) are horizontal and in the same direction, and each section of the spring is fixed on each fixing block (82) through the semicircular groove; the cylinder (81) is located between the two fixing blocks (82), and the cylinder (81) is used for providing tension for fixing of the spring.
4. The wafer lithography process as claimed in claim 1, wherein: the rotating device (5) comprises a second rotating motor (51) and a connecting shaft (52); the second rotating motor (51) is fixed below the fixed support (4), and the second rotating motor (51) is used for driving the connecting shaft (52) to rotate; one end of the connecting shaft (52) is connected with an output shaft of the second rotating motor (51), the other end of the connecting shaft (52) is connected with the bottom of the vacuum sucker (6), and the connecting shaft (52) is used for driving the vacuum sucker (6) and the second rotating motor (51) to synchronously rotate.
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| US6878506B2 (en) * | 2002-03-01 | 2005-04-12 | Nec Electronics Corporation | Method for manufacturing semiconductor device |
| CN101206992A (en) * | 2006-12-20 | 2008-06-25 | 沈阳芯源先进半导体技术有限公司 | Even glue developing process process capable of economizing time and equipment improved structure |
| CN102114455A (en) * | 2010-12-23 | 2011-07-06 | 沈阳芯源微电子设备有限公司 | Planar module type equipment structure |
| CN103034047A (en) * | 2011-09-29 | 2013-04-10 | 上海微电子装备有限公司 | Photoetching technology capable of enhancing resolution ratio |
| CN105573068A (en) * | 2014-10-10 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Photoresist removal method and photoetching process reworking method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110278566A1 (en) * | 2010-05-17 | 2011-11-17 | Industry-Academic Cooperation Foundation, Yonsei University | Method of patterning thin film solution-deposited |
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| US6878506B2 (en) * | 2002-03-01 | 2005-04-12 | Nec Electronics Corporation | Method for manufacturing semiconductor device |
| CN101206992A (en) * | 2006-12-20 | 2008-06-25 | 沈阳芯源先进半导体技术有限公司 | Even glue developing process process capable of economizing time and equipment improved structure |
| CN102114455A (en) * | 2010-12-23 | 2011-07-06 | 沈阳芯源微电子设备有限公司 | Planar module type equipment structure |
| CN103034047A (en) * | 2011-09-29 | 2013-04-10 | 上海微电子装备有限公司 | Photoetching technology capable of enhancing resolution ratio |
| CN105573068A (en) * | 2014-10-10 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Photoresist removal method and photoetching process reworking method |
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