CN108565252A - A kind of heat dissipating method of power-type part - Google Patents
A kind of heat dissipating method of power-type part Download PDFInfo
- Publication number
- CN108565252A CN108565252A CN201810026684.0A CN201810026684A CN108565252A CN 108565252 A CN108565252 A CN 108565252A CN 201810026684 A CN201810026684 A CN 201810026684A CN 108565252 A CN108565252 A CN 108565252A
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- China
- Prior art keywords
- power
- type part
- heat dissipation
- heat
- epoxy resin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Abstract
A kind of heat dissipating method of power-type part and a kind of power-type part of heat radiating type are proposed, increases one layer of heat-conducting glue newly in epoxy resin surface, the thermal coefficient of heat-conducting glue can accelerate distributing for piece surface heat 2.0 or more.In addition, it is very thin after due to heat-conducting glue film, do not interfere with the normal use of other parts around.Ensure on the basis of increasing heat dissipation, not influencing the Performance And Reliability of other any parts.Due to reducing the temperature of power-type part in actual use, it ensure that the reliability of the performance of power-type part, protect the electronic component of surrounding, to ensure that stability and the safety of product.
Description
Technical field
The present invention relates to hardware parts technical field, more particularly to the design method of a kind of power-type part heat dissipation and
Corresponding power-type part.
Background technology
With the development of universal, the various data cloud of PC, the application range of server and PC is increasingly
It is mostly wide.The function of server and PC in this way is more and more, and the power for resulting in server and PC is increasing,
Power-type part on corresponding mainboard is more and more.
But in practical application, power-type part can not radiate since power is excessive, this part can rapidly heat up,
It is serious to reach 100 ° or more often more than 85 °, cause self performance to decline, and caused seriously to peripheral component and PCB
Pyrolytic damage, 100 ° or more of temperature PCB have the risk of thawing, can lead to part and the reliability dramatic decrease of PCB.
The present invention uses following technical term：
PCB：Printed circuit board (Printed Circuit Board)
MOSFET：Mos field effect transistor (metal oxide semiconductor Field-
Effect Transistor)
IC：Integrated circuit (integrated circuit)
Invention content
In order to solve technical problem as above, set forth herein a kind of design methods of improvement power-type part heat dissipation.The party
The main thought of method is：In the front of power-type part, the part of the epoxy resin of urged against surface is additional to increase by one layer of heat dissipation
Glue, formed one can directly contact air heat dissipation thermal paste, due to thermal paste heat-conducting effect and heat dissipation effect much
More than epoxy resin, can the heat dissipation of accelerating power type part, ensure itself stability and surrounding other parts and PCB it is reliable
Property, to ensure that the stability of product.
Wherein, the present invention proposes a kind of heat dissipating method of power-type part, and described method includes following steps：
Step 1：A power-type part is provided, epoxy resin layer is posted on the positive surface of the power-type part；
Step 2：In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, is formed
One can directly contact the heat dissipation glue-line that air radiates；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are dissipated with accelerating power type part
Heat.
Preferably, the thermal coefficient of the epoxy resin is 0.2 or so, and the thermal coefficient of the thermal paste is 2.0 or more；
Preferably, the heat dissipation glue-line is a thin layer, and the thickness of the thin layer should meet following condition：It avoids to limited
The normal use of the other parts of the power pack in high area impacts.
Preferably, the heat dissipation glue-line is coated on the positive whole surface of power-type part；
Preferably, the heat dissipation glue-line is coated on the positive part surface of power-type part.
Accordingly, the present invention also proposes a kind of power-type part of heat radiating type, wherein：
Post epoxy resin layer in the positive surface of the power-type part；
In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, and forming one can
To directly contact the heat dissipation glue-line that air radiates；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are dissipated with accelerating power type part
Heat.
Preferably, the thermal coefficient of the epoxy resin is 0.2 or so, and the thermal coefficient of the thermal paste is 2.0 or more；
Preferably, the heat dissipation glue-line is a thin layer, and the thickness of the thin layer should meet following condition：It avoids to limited
The normal use of the other parts of the power pack in high area impacts.
Preferably, the heat dissipation glue-line is coated on the positive whole surface of power-type part；
Preferably, the heat dissipation glue-line is coated on the positive part surface of power-type part.
The apparatus and method as above proposed through the invention can solve to cause because power-type part heat dissipation effect is bad
The surface of the positive epoxy resin of power-type part is increased by one layer and led by the problem of performance declines and interferes other surrounding components
Hot glue increases the heat-conducting effect of epoxy resin.The temperature of power-type part in actual use is reduced, ensure that power-type
The reliability of the performance of part protects the electronic component of surrounding, to ensure that stability and the safety of product.
Description of the drawings
Fig. 1 is the front schematic view of power-type MOSFET in the prior art；
Fig. 2 is upper current limits of the power-type MOSFET in different room temperatures；
Fig. 3 is the front elevation of the improved power-type MOSFET in the embodiment of the present invention；
Specific embodiment
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
In the prior art, on the surface of power-type part, electronic component industry the most commonly used is epoxy encapsulation, according to
Thermal coefficient calculates, and the thermal coefficient of epoxy resin is in 0.2 or so, the thermal coefficient of metal substance such as aluminium, copper etc
200 or more, but the material of metal class has conductive risk.In addition thermal coefficient is generally less than to 0.2 material, referred to as thermal insulating material
Material, hence it is evident that epoxy resin is the material for being unfavorable for the heat dissipation of power-type part completely, can limit the electrical parameter of power-type part,
The performance of part is caused to decline.
Since power-type part category is various, therefore the embodiment of the present invention is illustrated by taking power MOSFET as an example, referring to Fig. 1
Shown in power-type MOSFET in the prior art front schematic view, carried out epoxy resin envelope on the surface of the power-type part
Dress, the similar structure in other power-type part fronts.
Referring to the upper current limit of power-type MOSFET as shown in Figure 2 in different room temperatures, pass through second and third
Parameter can be seen that temperature is higher in similarity condition, and the upper limit of current parameters is lower namely temperature is to the power-type
The influence of part is further apparent with the raising of temperature.
In order to solve this technical problem, following design has been carried out in the embodiment of the present invention：It is newly-increased in epoxy resin surface
One layer of heat-conducting glue, and the thermal coefficient of heat-conducting glue is 2.0 or more, compared to the promotion that epoxy resin has 10 times or more heat-conducting effects,
It can accelerate distributing for piece surface heat.
In addition, it is very thin after due to heat-conducting glue film, the normal use of other parts around is not interfered with, is especially supplied
There is the part of height-limit area in electric part.Ensure on the basis of increasing heat dissipation, not influencing the Performance And Reliability of other any parts.
More specifically, referring to Fig. 3, the present invention, which designs, proposes a kind of power-type part of heat radiating type, wherein：
Post epoxy resin layer in the positive surface of the power-type part；
In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, and forming one can
To directly contact the heat dissipation glue-line that air radiates；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are dissipated with accelerating power type part
Heat.
Preferably, the thermal coefficient of the epoxy resin is 0.2 or so, and the thermal coefficient of the thermal paste is 2.0 or more；
Preferably, the heat dissipation glue-line is a thin layer, and the thickness of the thin layer should meet following condition：It avoids to limited
The normal use of the other parts of the power pack in high area impacts.
Preferably, the heat dissipation glue-line is coated on the positive whole surface of power-type part；
Preferably, the heat dissipation glue-line is coated on the positive part surface of power-type part.
Accordingly, the present invention proposes a kind of heat dissipating method of power-type part, and described method includes following steps：
Step 1：A power-type part is provided, epoxy resin layer is posted on the positive surface of the power-type part；
Step 2：In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, is formed
One can directly contact the heat dissipation glue-line that air radiates；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are dissipated with accelerating power type part
Heat.
Preferably, the thermal coefficient of the epoxy resin is 0.2 or so, and the thermal coefficient of the thermal paste is 2.0 or more；
Preferably, the heat dissipation glue-line is a thin layer, and the thickness of the thin layer should meet following condition：It avoids to limited
The normal use of the other parts of the power pack in high area impacts.
Preferably, the heat dissipation glue-line is coated on the positive whole surface of power-type part；
Preferably, the heat dissipation glue-line is coated on the positive part surface of power-type part.
The apparatus and method as above proposed through the invention can solve to cause because power-type part heat dissipation effect is bad
The surface of the positive epoxy resin of power-type part is increased by one layer and led by the problem of performance declines and interferes other surrounding components
Hot glue increases the heat-conducting effect of epoxy resin.The temperature of power-type part in actual use is reduced, ensure that power-type
The reliability of the performance of part protects the electronic component of surrounding, to ensure that stability and the safety of product.
The foregoing description of the disclosed embodiments enables those skilled in the art to realize or use the present invention.To this
A variety of modifications of a little embodiments will be apparent for a person skilled in the art, and the general principles defined herein can
Without departing from the spirit or scope of the present invention, to realize in other embodiments.Therefore, the present invention will not be limited
It is formed on the embodiments shown herein, but meets widest model consistent with the principles and novel features disclosed in this article
It encloses.
Claims (10)
1. a kind of heat dissipating method of power-type part, which is characterized in that described method includes following steps：
Step 1：A power-type part is provided, epoxy resin layer is posted on the positive surface of the power-type part；
Step 2：In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, forms one
The heat dissipation glue-line that air radiates can be directly contacted；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are radiated with accelerating power type part.
2. heat dissipating method as described in claim 1, which is characterized in that the thermal coefficient of the epoxy resin is 0.2 or so, institute
The thermal coefficient of thermal paste is stated 2.0 or more.
3. heat dissipating method as claimed in claim 2, which is characterized in that the heat dissipation glue-line is a thin layer, the thickness of the thin layer
Degree should meet following condition：It avoids to there is the normal use of the other parts of the power pack of height-limit area to impact.
4. as claimed in claim 3 from heat dissipating method, which is characterized in that the heat dissipation glue-line is being coated on power-type part just
The whole surface in face.
5. heat dissipating method as claimed in claim 4, which is characterized in that the heat dissipation glue-line is coated on the front of power-type part
Part surface.
6. a kind of power-type part of heat radiating type, which is characterized in that wherein：
Post epoxy resin layer in the positive surface of the power-type part；
In the front of power-type part, the part of the epoxy resin of urged against surface is coated with one layer of thermal paste, and forming one can be straight
Touch the heat dissipation glue-line that air radiates；
The heat-conducting effect and heat dissipation effect of the heat dissipation glue-line are far longer than epoxy resin, are radiated with accelerating power type part.
7. power-type part as claimed in claim 6, which is characterized in that the thermal coefficient of the epoxy resin 0.2 or so,
The thermal coefficient of the thermal paste is 2.0 or more.
8. power-type part as claimed in claim 7, which is characterized in that the heat dissipation glue-line is a thin layer, the thin layer
Thickness should meet following condition：It avoids to there is the normal use of the other parts of the power pack of height-limit area to impact.
9. power-type part as claimed in claim 8, which is characterized in that the heat dissipation glue-line is being coated on power-type part just
The whole surface in face.
10. power-type part as claimed in claim 9, which is characterized in that the heat dissipation glue-line is coated on power-type part
Positive part surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026684.0A CN108565252A (en) | 2018-01-11 | 2018-01-11 | A kind of heat dissipating method of power-type part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026684.0A CN108565252A (en) | 2018-01-11 | 2018-01-11 | A kind of heat dissipating method of power-type part |
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| Publication Number | Publication Date |
|---|---|
| CN108565252A true CN108565252A (en) | 2018-09-21 |
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| CN201810026684.0A Pending CN108565252A (en) | 2018-01-11 | 2018-01-11 | A kind of heat dissipating method of power-type part |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569208A (en) * | 2010-12-31 | 2012-07-11 | 三星电子株式会社 | Semiconductor packages and methods of fabricating the same |
| CN103107148A (en) * | 2011-11-11 | 2013-05-15 | 南茂科技股份有限公司 | Packaging structure for enhancing heat dissipation |
| CN103594434A (en) * | 2013-10-23 | 2014-02-19 | 孔星 | Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer |
| CN106169449A (en) * | 2015-05-22 | 2016-11-30 | 南茂科技股份有限公司 | Thin film flip chip package and heat dissipation method thereof |
-
2018
- 2018-01-11 CN CN201810026684.0A patent/CN108565252A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569208A (en) * | 2010-12-31 | 2012-07-11 | 三星电子株式会社 | Semiconductor packages and methods of fabricating the same |
| CN103107148A (en) * | 2011-11-11 | 2013-05-15 | 南茂科技股份有限公司 | Packaging structure for enhancing heat dissipation |
| CN103594434A (en) * | 2013-10-23 | 2014-02-19 | 孔星 | Composite heat dissipation layer of power component, technology of composite heat dissipation layer of power component and power component with composite heat dissipation layer |
| CN106169449A (en) * | 2015-05-22 | 2016-11-30 | 南茂科技股份有限公司 | Thin film flip chip package and heat dissipation method thereof |
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Application publication date: 20180921 |