CN108513434A - 一种平板用多层柔性线路板 - Google Patents
一种平板用多层柔性线路板 Download PDFInfo
- Publication number
- CN108513434A CN108513434A CN201810475105.0A CN201810475105A CN108513434A CN 108513434 A CN108513434 A CN 108513434A CN 201810475105 A CN201810475105 A CN 201810475105A CN 108513434 A CN108513434 A CN 108513434A
- Authority
- CN
- China
- Prior art keywords
- board
- circuit board
- layer
- base material
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810475105.0A CN108513434B (zh) | 2018-05-17 | 2018-05-17 | 一种平板用多层柔性线路板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810475105.0A CN108513434B (zh) | 2018-05-17 | 2018-05-17 | 一种平板用多层柔性线路板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108513434A true CN108513434A (zh) | 2018-09-07 |
| CN108513434B CN108513434B (zh) | 2023-11-10 |
Family
ID=63400585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810475105.0A Active CN108513434B (zh) | 2018-05-17 | 2018-05-17 | 一种平板用多层柔性线路板 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108513434B (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232762A1 (zh) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | 可拼接式安全型印刷电路板 |
| CN113853057A (zh) * | 2021-08-30 | 2021-12-28 | 江苏华讯电子技术有限公司 | 一种具有缓冲功能的折叠式电路板结构 |
| CN118413932A (zh) * | 2024-07-03 | 2024-07-30 | 江苏裕荣光电科技有限公司 | 一种新能源汽车用柔性电路板 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030095389A1 (en) * | 2001-11-20 | 2003-05-22 | Samant Sanjiv Singh | Multilayered board comprising folded flexible circuits and method of manufacture |
| US20060273446A1 (en) * | 2003-01-22 | 2006-12-07 | Junya Sato | Circuit board device and method of interconnecting wiring boards |
| CN101111131A (zh) * | 2006-07-19 | 2008-01-23 | 比亚迪股份有限公司 | 一种多层柔性线路板的制作方法 |
| JP2008300889A (ja) * | 2004-08-26 | 2008-12-11 | Panasonic Electric Works Co Ltd | 多層リジッドフレキシブル配線板、多層フレキシブル配線板及びそれらの製造方法 |
| WO2015028716A1 (en) * | 2013-08-30 | 2015-03-05 | Elcoflex Oy | Method for manufacturing a flexible circuit board and a flexible circuit board |
| CN207340280U (zh) * | 2017-10-23 | 2018-05-08 | 扬州华盟电子有限公司 | 一种计算机散热系统用柔性线路板 |
-
2018
- 2018-05-17 CN CN201810475105.0A patent/CN108513434B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030095389A1 (en) * | 2001-11-20 | 2003-05-22 | Samant Sanjiv Singh | Multilayered board comprising folded flexible circuits and method of manufacture |
| US20060273446A1 (en) * | 2003-01-22 | 2006-12-07 | Junya Sato | Circuit board device and method of interconnecting wiring boards |
| JP2008300889A (ja) * | 2004-08-26 | 2008-12-11 | Panasonic Electric Works Co Ltd | 多層リジッドフレキシブル配線板、多層フレキシブル配線板及びそれらの製造方法 |
| CN101111131A (zh) * | 2006-07-19 | 2008-01-23 | 比亚迪股份有限公司 | 一种多层柔性线路板的制作方法 |
| WO2015028716A1 (en) * | 2013-08-30 | 2015-03-05 | Elcoflex Oy | Method for manufacturing a flexible circuit board and a flexible circuit board |
| CN207340280U (zh) * | 2017-10-23 | 2018-05-08 | 扬州华盟电子有限公司 | 一种计算机散热系统用柔性线路板 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232762A1 (zh) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | 可拼接式安全型印刷电路板 |
| CN113853057A (zh) * | 2021-08-30 | 2021-12-28 | 江苏华讯电子技术有限公司 | 一种具有缓冲功能的折叠式电路板结构 |
| CN118413932A (zh) * | 2024-07-03 | 2024-07-30 | 江苏裕荣光电科技有限公司 | 一种新能源汽车用柔性电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108513434B (zh) | 2023-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20231107 Address after: 225600 at the junction of Central Avenue and G233 in Chengnan Economic New Area, Gaoyou City, Yangzhou City, Jiangsu Province Applicant after: Jiangsu Zhuobao Zhizao Technology Co.,Ltd. Address before: 225600 Gaoyou South economic new area, Yangzhou City, Jiangsu Province Applicant before: YANGZHOU XUANYU ELECTRONICS Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A multi-layer flexible printed circuit board for a tablet Granted publication date: 20231110 Pledgee: Jiangsu Gaoyou Rural Commercial Bank Co.,Ltd. Pledgor: Jiangsu Zhuobao Zhizao Technology Co.,Ltd. Registration number: Y2025980051112 |