CN108461288A - A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof - Google Patents
A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof Download PDFInfo
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- CN108461288A CN108461288A CN201810169766.0A CN201810169766A CN108461288A CN 108461288 A CN108461288 A CN 108461288A CN 201810169766 A CN201810169766 A CN 201810169766A CN 108461288 A CN108461288 A CN 108461288A
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- embedded
- hole
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- 239000000919 ceramic Substances 0.000 title claims abstract description 79
- 239000003990 capacitor Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 15
- 239000008188 pellet Substances 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000003475 lamination Methods 0.000 abstract description 2
- 238000004080 punching Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a kind of square-outside and round-inside ceramic chip capacitors and preparation method thereof, belong to electronic technology field；Including ceramic dielectric, the ceramic dielectric is rectangle, and the ceramic dielectric is internally provided with embedded electrode A and embedded electrode B, the centrally disposed circular through hole of ceramic dielectric, the through-hole surfaces are provided with interior termination electrode, the ceramic dielectric outer surface is provided with external electrode, and the interior termination electrode connection embeds electrode A, and the external electrode connection embeds electrode B, using rectangular shape, the utilization rate for improving material, reduces the generation of tailing, still maintains the argument structure of feedthrough capacitor.Using this configuration reduces technology difficulties, the use of work die clamper is reduced, it is more cost-effective than more, the capacity bigger of disc monolithic ceramic capacitance production under equivalent material, it is formed by the way of lamination, simple shape improves production efficiency.
Description
Technical field
The present invention relates to electronic technology fields, and in particular to a kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof.
Background technology
With electronic device module, integrated and bussed development, between electronic equipment internal subsystem circuit
Mutual electromagnetic interference problem necessarily becomes more complicated and sternness.To solve the subsystem circuit Conducted Electromagnetic Interference of itself, with
And interfering with each other between system and system, it is situated between using punching structure ceramic and filters component, is irreplaceable and simple and effective
Method.
Now, the Core Feature element of punching structure ceramic Jie filter, mostly using annulus monolithic ceramic capacitance.But
It is that, because the production technology of existing annulus monolithic ceramic capacitance is immature and development and production excessive cycle, the demand that cannot be satisfied is body
The client that product is big, capacity is big, proof voltage is high, production life cycle is short.
Invention content
It is an object of the invention to：A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof is provided, is solved at present
The punching ceramic condenser production cycle is long, of high cost, capacitance utilizes the low technical problem of area occupation ratio.
The technical solution adopted by the present invention is as follows：
A kind of square-outside and round-inside ceramic chip capacitor, including ceramic dielectric, the ceramic dielectric are rectangle, the ceramic dielectric
It is internally provided with embedded electrode A and embedded electrode B, the centrally disposed circular through hole of ceramic dielectric, the through-hole surfaces setting
There are interior termination electrode, the ceramic dielectric outer surface to be provided with external electrode, the interior termination electrode connection embeds electrode A, described outer
Termination electrode connection embeds electrode B.
Further, the embedded electrode A is pellet electrode, and middle part is provided with through-hole identical with circular through hole size.
Further, the embedded electrode B is pellet electrode, and middle part is provided with the through-hole bigger than circular through hole diameter, institute
It states and is provided with extension on four sides of embedded electrode B, the extension is extended to outside ceramic dielectric and connect with external electrode.
Further, the embedded electrode A and embedded electrode B center overlap.
A kind of preparation method of square-outside and round-inside ceramic chip capacitor, includes the following steps：
Step 1：Ceramic diaphragm is chosen, using electric slurry respectively on ceramic diaphragm according to embedded electrode A and embedded electricity
The shape of pole B is printed；
Step 2：Diaphragm after printing is overlapped to form a bar block, and static pressure gas exhaust treatment is carried out to bar block；
Step 3：To treated, diaphragm is punched out, and obtains circular through hole；
Step 4：A bar block is cut into rectangular unit idiosome；And dumping and sintering are carried out, form monolithic ceramic body；
Step 5：Electrode to exposing ceramic idiosome carries out termination process, forms interior termination electrode and external electrode；
Step 6：Idiosome after termination process is used into high-temperature process.
Further, it needs to be ground removal sharp corners after forming monolithic ceramic body in the step 4, improves edges and corners
The intensity of external force resistance active force.
Further, the material for the electric slurry that termination process uses in the step 5 is silver.
In conclusion by adopting the above-described technical solution, the beneficial effects of the invention are as follows：
1. using rectangular shape, the utilization rate of material is improved, the generation of tailing is reduced, still maintains and wears
The argument structure that electrocardio holds.
2. the present invention is under conditions of same capacitance amount, volume smaller, practicability is stronger.
3. using this configuration reduces technology difficulties, the use of work die clamper is reduced, it is more only than disc under equivalent material
More, the capacity bigger of feldspar capacitance production, it is more cost-effective, it is formed by the way of lamination, simple shape carries
High production efficiency.
Description of the drawings
The present invention will illustrate by embodiment and with reference to the appended drawing, wherein：
Fig. 1 is the overall structure figure of the present invention；
Fig. 2 is the sectional view of the present invention；
Fig. 3 is the structure chart of the embedded electrode A of the present invention；
Fig. 4 is the structure chart of the embedded electrode B of the present invention；
Reference numeral：1- ceramic dielectrics, 2- external electrodes, 3- circular through holes, termination electrode in 4-, 5- embed electrode B, in 6-
Embedding electrode A, 7- embed electrode D, 8- and embed electrode C.
Specific implementation mode
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
It elaborates below in conjunction with the accompanying drawings to the present invention.
A kind of square-outside and round-inside ceramic chip capacitor, including ceramic dielectric 1, the ceramic dielectric 1 are rectangle, and the ceramics are situated between
Matter 1 is internally provided with embedded electrode A 6 and embedded electrode B 5,1 centrally disposed circular through hole 3 of the ceramic dielectric, the through-hole table
Face is provided with interior termination electrode 4, and 1 outer surface of the ceramic dielectric is provided with external electrode 2, the embedded electricity of the connection of interior termination electrode 4
Pole A6, the connection of the external electrode 2 embed electrode B 5.
The embedded electrode A 6 is pellet electrode, and middle part is provided with through-hole identical with 3 size of circular through hole.
The embedded electrode B 5 is pellet electrode, and middle part is provided with the through-hole bigger than 3 diameter of circular through hole, the embedded electricity
Extension is provided on four sides of pole B5, the extension is extended to outside ceramic dielectric 1 and connect with external electrode 2.
The embedded electrode A 6 and 5 center of embedded electrode B overlap.
A kind of preparation method of square-outside and round-inside ceramic chip capacitor, includes the following steps：
Step 1：Ceramic diaphragm is chosen, using electric slurry respectively on ceramic diaphragm according to embedded electrode A 6 and embedded electricity
The shape of pole B5 is printed；
Step 2：Diaphragm after printing is overlapped to form a bar block, and static pressure gas exhaust treatment is carried out to bar block；
Step 3：To treated, diaphragm is punched out, and obtains circular through hole 3；
Step 4：A bar block is cut into rectangular unit idiosome；And dumping and sintering are carried out, form monolithic ceramic body；
Step 5：Electrode to exposing ceramic idiosome carries out termination process, forms interior termination electrode 4 and external electrode 2；
Step 6：Idiosome after termination process is used into high-temperature process.
It needs to be ground removal sharp corners after forming monolithic ceramic body in the step 4, improves edges and corners external force resistance and make
Intensity firmly.
The material for the electric slurry that termination process uses in the step 5 is silver.
Specific embodiment 1
A kind of square-outside and round-inside ceramic chip capacitor, including ceramic dielectric 1, the ceramic dielectric 1 are rectangle, and thickness is
0.03mm, the ceramic dielectric 1 are internally provided with embedded electrode A 6, embedded electrode B 5,1 centrally disposed circle of the ceramic dielectric
Through-hole 3, the through-hole surfaces are provided with interior termination electrode 4, and 1 outer surface of the ceramic dielectric is provided with external electrode 2, the inner end
The connection of electrode 4 embeds electrode A 6, and the connection of the external electrode 2 embeds electrode B 5.
Multiple embedded electrodes can be arranged as required in ceramic dielectric 1, to change the number and capacity of capacitance, including it is interior
Embedding electrode A 6, embedded electrode B 5 and embedded electrode C8, embedded electrode D7, form 3 capacitances.
Embedded electrode A 6 and embedded electrode C8 are all made of circle, and are arranged concentrically circular hole, the circle of circular hole and ceramic dielectric 1
Through-hole 3 it is equal in magnitude, so that embedded electrode A 6 and embedded electrode C8 is connected with interior termination electrode 4, embed electrode A 6 and embedded electric
The outside diameter of pole C8 is slightly less than the length of 1 short side of rectangle ceramic dielectric, prevents embedded electrode A 6 and embedded electrode C8 and outer end
Electrode 2 connects；Embedded electrode B 5 and embedded electrode D7 are all made of circle, and are arranged concentrically circular hole, and the diameter of circular hole is more than ceramics
The diameter of circular through hole 3 in medium 1 embeds electrode B 5 to prevent embedded electrode B 5 and embedded electrode D7 from being connect with interior termination electrode 4
It is slightly larger than the length of the long side of rectangle ceramic dielectric 1 with the outside diameter of embedded electrode D7, makes embedded electrode B 5 and embedded electrode
D7 exposes ceramic dielectric 1, is blocked convenient for the electrode to exposed portion, forms external electrode 2；It is real using the embedded electrode of circle
Existing stepped construction, convenient for manufacture, but the utilization rate of electrode is low.
Specific embodiment 2
The embedded electrode A 6 is pellet electrode, and it is rectangle to embed electrode A 6, and the area of the rectangle is slightly less than rectangular ceramic
The area of 1 cross section of medium, and be arranged concentrically with ceramic dielectric 1, it prevents embedded electrode A 6 from exposing ceramic dielectric 1, embeds electrode
It is provided with through-hole identical with 3 size of circular through hole in the middle part of A6, embedded electrode A 6 is made to be electrically connected with interior termination electrode 4, it is described embedded
Electrode A 6 is identical with the shape of embedded electrode C8, and embedded electrode C8 is also electrically connected with interior termination electrode 4.
The embedded electrode B 5 is pellet electrode, is all rectangle, the rectangle size phase of the size of rectangle and embedded electrode A 6
Deng middle part is provided with the through-hole bigger than 3 diameter of circular through hole, prevents embedded electrode B 5 from being contacted with interior termination electrode 4；Embedded electrode B 5
4 sides be respectively arranged with extension, extension extends ceramic dielectric 1, to expose ceramic dielectric 1 extension seal
End forms external electrode 2, and external electrode 2 is connect with embedded electrode B 5, and embedded electrode D7 is identical as 5 shape of embedded electrode B,
It is connect with external electrode 2.Embedded electrode B 5 and embedded electrode D7 are arranged concentrically with ceramic dielectric 1, and with embedded electrode A 6 and
Embedded electrode C8 cooperatively forms capacitance, forms 3 capacitances, the feedthrough capacitor of this structure, utilization rate height altogether；Using in the structure
Embedding electrode saves material, to cost-effective.
Claims (7)
1. a kind of square-outside and round-inside ceramic chip capacitor, including ceramic dielectric, it is characterised in that：The ceramic dielectric is cuboid,
Ceramic dielectric (1) two sides is respectively arranged with embedded electrode A (6) and embedded electrode B (5), and ceramic dielectric (1) center is set
Circular through hole (3) is set, the through-hole surfaces are provided with interior termination electrode (4), and ceramic dielectric (1) outer surface is provided with outer end electricity
Pole (2), interior termination electrode (4) connection embed electrode A (6), and external electrode (2) connection embeds electrode B (5).
2. a kind of square-outside and round-inside ceramic chip capacitor according to claim 1, it is characterised in that：The embedded electrode A (6)
For pellet electrode, middle part is provided with through-hole identical with circular through hole (3) size.
3. a kind of square-outside and round-inside ceramic chip capacitor according to claim 1, it is characterised in that：The embedded electrode B (5)
For pellet electrode, middle part is provided with the through-hole bigger than circular through hole (3) diameter, is set on four sides of the embedded electrode B (5)
It is equipped with extension, the extension extends to ceramic dielectric (1) and connect outside with external electrode (2).
4. a kind of square-outside and round-inside ceramic chip capacitor according to claim 1, it is characterised in that：The embedded electrode A (6)
It is overlapped with embedded electrode B (5) center.
5. a kind of preparation method of square-outside and round-inside ceramic chip capacitor, it is characterised in that：Include the following steps：
Step 1：Ceramic diaphragm is chosen, using electric slurry respectively on ceramic diaphragm according to embedded electrode A (6) and embedded electrode
The shape of B (5) is printed；
Step 2：Diaphragm after printing is overlapped to form a bar block, and static pressure gas exhaust treatment is carried out to bar block；
Step 3：To treated, diaphragm is punched out, and obtains circular through hole (3)；
Step 4：A bar block is cut into rectangular unit idiosome；And dumping and sintering are carried out, form monolithic ceramic body；
Step 5：Electrode to exposing ceramic idiosome carries out termination process, forms interior termination electrode (4) and external electrode (2)；
Step 6：Idiosome after termination process is used into high-temperature process.
6. a kind of preparation method of square-outside and round-inside ceramic chip capacitor according to claim 5, it is characterised in that：The step
It needs to be ground removal sharp corners after forming monolithic ceramic body in rapid 4, improves the intensity of edges and corners external force resistance active force.
7. a kind of preparation method of square-outside and round-inside ceramic chip capacitor according to claim 5, it is characterised in that：The step
The material for the electric slurry that termination process uses in rapid 5 is silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810169766.0A CN108461288A (en) | 2018-02-28 | 2018-02-28 | A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810169766.0A CN108461288A (en) | 2018-02-28 | 2018-02-28 | A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108461288A true CN108461288A (en) | 2018-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810169766.0A Pending CN108461288A (en) | 2018-02-28 | 2018-02-28 | A kind of square-outside and round-inside ceramic chip capacitor and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466841A (en) * | 2020-11-24 | 2021-03-09 | 复旦大学 | TSV structure with embedded capacitor and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731548A (en) * | 2004-08-04 | 2006-02-08 | 广东风华邦科电子有限公司 | Ring ceramic dielectric capacitors |
| CN102842422A (en) * | 2011-06-24 | 2012-12-26 | 特拉华资本构造公司 | High capacitance single layer capacitor |
| CN103280287A (en) * | 2013-04-30 | 2013-09-04 | 成都迪博电子科技有限公司 | Exporting method for mulitlayer embedded electrodes of feed-through tubular ceramic capacitor |
| CN207765335U (en) * | 2018-02-28 | 2018-08-24 | 成都宇鑫洪科技有限公司 | A kind of square-outside and round-inside ceramic chip capacitor |
-
2018
- 2018-02-28 CN CN201810169766.0A patent/CN108461288A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1731548A (en) * | 2004-08-04 | 2006-02-08 | 广东风华邦科电子有限公司 | Ring ceramic dielectric capacitors |
| CN102842422A (en) * | 2011-06-24 | 2012-12-26 | 特拉华资本构造公司 | High capacitance single layer capacitor |
| CN103280287A (en) * | 2013-04-30 | 2013-09-04 | 成都迪博电子科技有限公司 | Exporting method for mulitlayer embedded electrodes of feed-through tubular ceramic capacitor |
| CN207765335U (en) * | 2018-02-28 | 2018-08-24 | 成都宇鑫洪科技有限公司 | A kind of square-outside and round-inside ceramic chip capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466841A (en) * | 2020-11-24 | 2021-03-09 | 复旦大学 | TSV structure with embedded capacitor and preparation method thereof |
| CN112466841B (en) * | 2020-11-24 | 2022-09-27 | 复旦大学 | TSV structure with embedded capacitor and preparation method thereof |
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Application publication date: 20180828 |