CN108459182A - Probe apparatus - Google Patents
Probe apparatus Download PDFInfo
- Publication number
- CN108459182A CN108459182A CN201810068560.9A CN201810068560A CN108459182A CN 108459182 A CN108459182 A CN 108459182A CN 201810068560 A CN201810068560 A CN 201810068560A CN 108459182 A CN108459182 A CN 108459182A
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- Prior art keywords
- probe
- module
- electrode
- substrate
- control unit
- Prior art date
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- 239000000523 sample Substances 0.000 title claims abstract description 276
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000001514 detection method Methods 0.000 claims description 17
- 230000005611 electricity Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000003993 interaction Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000003139 buffering Effects 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
Abstract
Probe can be pressed against on the electrode in the state that probe and electrode are in alignment with each other with best contact by the probe apparatus of exemplary embodiment according to the present invention, and probe apparatus may include：Mobile module is configured to be moveable towards substrate；Probe module is mounted to be moveable relative to mobile module, and with the probe contacted with the electrode of substrate；Image capturing unit, the image of capture probe when the electrode of probe and substrate contacts；And control unit, determine whether probe contacts with the electrode of substrate based on the image of the probe captured by image capturing unit.
Description
Technical field
The present invention relates to a kind of probe apparatus, which is configured to make probe to be contacted with the electrode of substrate and to electrode
Apply electric signal, to test the electric conductivity etc. of substrate.
Background technology
In general, probe apparatus is mounted in inspecting substrate equipment, probe is set to be contacted with the electrode of substrate, and applied to electrode
Power up signal.
By will there is the probe module of multiple probes to be located in above substrate, keep probe module mobile towards substrate so that
Multiple probes contact with the multiple electrodes being disposed on the substrate and apply scheduled electric signal then to multiple electrodes, execute logical
Cross the process that substrate is tested using probe apparatus.
During testing substrate, probe is pressed against on the electrode with contact appropriate and makes probe and electrode pair
It is critically important together.
If be pressed against probe on the electrode with excessively high contact, a large amount of load is applied on probe, this causes
Probe and/or electrode damage or abrasion.In addition, if with too low contact by probe be pressed against on the electrode, probe with
Contact between electrode is low, it is thus impossible to fully apply electric signal to electrode by probe.
In addition, in order to make probe be aligned with electrode, prevent probe module about mobile module transverse shifting be it is critically important,
The mobile module is connected to probe module, and probe module is made to be moved along the direction towards or away from substrate.
Thus, it may be considered that prevent probe module about shifting by installing leaf spring between mobile module and probe module
The method of the transverse shifting of dynamic model block.However, in the case that leaf spring is installed between mobile module and probe module, it is not only right
Probe module applies cross force, and applies a large amount of power to probe module along towards the direction of substrate.Therefore, when pass through move
The movement of dynamic model block and when the probe of probe module is pressed against on the electrode, it is excessive that probe is pressed against contact on the electrode
Increase, therefore, probe and/or electrode may be damaged or worn out.
Invention content
This invention address that a kind of probe apparatus is provided, the state which can be in alignment with each other in probe and electrode
Under with best contact by probe be pressed against on the electrode.
A kind of exemplary embodiment of the present invention provides a kind of probe apparatus, including：Mobile module is configured to direction
Substrate is moveable；Probe module is mounted to be moveable relative to mobile module, and with the electrode with substrate
The probe of contact；Image capturing unit, the image of capture probe when the electrode of probe and substrate contacts；And control unit,
It determines whether probe contacts with the electrode of substrate based on the image of the probe captured by image capturing unit.
Whether control unit detection probe can reach the coke of image capturing unit when probe module is moved towards substrate
Point, and control unit can determine that probe is contacted with the electrode of substrate when probe reaches the focus of image capturing unit.
Control unit can the image based on the probe captured by image capturing unit whether deformed come detection probe, and
Control unit can determine that probe is contacted with the electrode of substrate in probe deformations.
Probe module may include the multiple probes contacted respectively with the multiple electrodes of substrate, and control unit can lead to
It crosses and detects whether multiple probes with multiple electrodes contact carry out pose of the detection probe module about mobile module.
Probe apparatus can also include pose adjustment unit, and when the electrode of probe and substrate contacts, pose adjustment is single
Pose of the member adjustment probe module about mobile module.
Control unit can the image based on the probe captured by image capturing unit come the deflection of detection probe, and
Control unit can determine that probe is contacted with the electrode of substrate when the deflection of probe is in term of reference.
Probe module may include the multiple probes contacted respectively with the multiple electrodes of substrate, and control unit can lead to
It crosses and detects the deflections of multiple probes and carry out pose of the detection probe module about mobile module.
Probe apparatus can also include pose adjustment unit, and when the electrode of probe and substrate contacts, pose adjustment is single
Pose of the member adjustment probe module about mobile module.
Exemplary embodiment according to the present invention can be with most in the state that the electrode of probe and substrate is in alignment with each other
Good contact makes probe be contacted with the electrode of substrate, therefore, can suitably apply electricity to the electrode of substrate by probe
Signal.
Description of the drawings
Fig. 1 is the top plan view for the probe apparatus for schematically showing exemplary embodiment according to the present invention.
Fig. 2 is the side view for the probe apparatus for schematically showing exemplary embodiment according to the present invention.
Fig. 3 is the cylinder for the probe apparatus for schematically showing exemplary embodiment according to the present invention and the transverse direction of bar
Sectional view.
Fig. 4 is the cylinder for the probe apparatus for schematically showing exemplary embodiment according to the present invention and the longitudinal direction of bar
Sectional view.
Fig. 5 is the operation for the probe apparatus for showing exemplary embodiment according to the present invention, the electrode of probe and substrate
The view of the state of contact.
Fig. 6 is the view for the state for showing probe and electrode, and image is by exemplary embodiment according to the present invention
The image capturing unit of probe apparatus captures.
Fig. 7 and Fig. 8 is the side of the operation for the probe apparatus for schematically showing exemplary embodiment according to the present invention
View.
Specific implementation mode
Hereinafter, the probe apparatus of property embodiment according to an example of the present invention will be described with reference to the drawings.
As shown in Figures 1 to 4, the probe apparatus of exemplary embodiment according to the present invention may include：Mobile module 10,
It is configured to move towards substrate S along Z-direction；Probe module 20 is provided with probe 21, the probe 21 and is arranged in base
Electrode E contacts on the surface of plate S；Cylinder 30 is mounted on mobile module 10；Bar 40, it is prominent from probe module 20 respectively
Go out to be inserted into cylinder 30, and is arranged so that the inner surface of each bar 40 and each cylinder 30 at predetermined spaced intervals；Gas supplies
Unit 50 is answered, is supplied a gas in the space between the inner surface of cylinder 30 and the outer surface of bar 40；Image capturing unit
60, the image of capture probe 21 when the electrode E of probe 21 and substrate S is contacted；With control unit 70, it is based on being caught by image
The image of the probe 21 of the capture of unit 60 is obtained to determine whether probe 21 contacts with the electrode E of substrate S.
Mobile module 10 and probe module 20 can be connected to each other, and are moved relative to each other along Z-direction.It is mobile
Module 10 and probe module 20 can be connected to each other when bar 40 is inserted into cylinder 30.Such as pass through air pressure or the cause of hydraulic operation
Dynamic device may be coupled to mobile mould by the linear electric machine of electromagnetic interaction operation or the motion of ball screw mechanism
Block 10.Therefore, it is logical towards or away from the direction (that is, Z-direction) that substrate S is moved can to move along module 10 for mobile module 10
It crosses motion and moves.In addition, probe module 20 can be moved along Z-direction together with mobile module 10.
Probe module 20 is provided with multiple probes 21.Multiple probes 21 can be along the circle at the center based on probe module 20
Circumferential direction is arranged.Multiple probes 21 can radially extend.For example, can be with 90 μm 24 probes 21 of arranged for interval.Multiple spies
Needle 21 is connected to signal input unit (not shown), the signal input unit to 21 input electrical signal of multiple probes so that
Electric signal can be applied to the electrode E of substrate S by multiple probes 21.
Multiple electrodes E is arranged on substrate S, and multiple electrodes E can be come with arrangement form identical with multiple probes 21
Arrangement.
Multiple cylinders 30 can be along the circumferential directions at the center based on mobile module 10, and multiple bars 40 can edge
The circumferential directions for the center based on probe module 20, with corresponding with multiple cylinders 30.
Cylinder 30 is formed as the cylinder being open at both ends, and but the invention is not restricted to this.Cylinder 30 one end (on
End) it can be closed by lid 32.Here, one end of cylinder 30 is incompletely closed by lid 32, and gas can be the one of cylinder 30
It is flowed between end and lid 32.The other end (lower end) of cylinder 30 is closed by bar 40.Here, the other end of cylinder 30 is endless by bar 40
It closes entirely, and gas can flow between the other end and bar 40 of cylinder 30.
Air inlet 31 is formed at the side of cylinder 30, and is drawn gas from gas supply unit 50 by air inlet 31
Enter in cylinder 30.When being introduced a gas into cylinder 30 by air inlet 31, in the outer surface of the inner surface and bar 40 of cylinder 30
Between form scheduled pressure.By the pressure maintain cylinder 30 inner surface and the outer surface of bar 40 between it is constant between
Every.Therefore, bar 40 cannot relative to 30 transverse shifting of cylinder, and bar 40 only can along cylinder 30 longitudinal direction (that is, along
Z-direction) it is moved with low friction resistance.Therefore, the probe module 20 for being connected to bar 40 cannot be relative to being connected to cylinder 30
10 transverse shifting of mobile module, and probe module 20 can only be hindered along Z-direction (upper and lower directions in attached drawing) with low friction
Power moves.
Therefore, during the electrode E of probe module 20 towards substrate S movements and probe 21 and substrate S is contacted, probe
The not transverse shifting of module 20, therefore, probe 21 can be contacted accurately with the electrode E of substrate S.
In addition, probe module 20 can be moved along Z-direction relative to mobile module 10 with low friction resistance, in the mistake
Cheng Zhong is applied to almost without power on probe module 20 along Z-direction.Accordingly it is possible to prevent probe 21 or electrode E are in movement
It is damaged or wears during probe module 20.
In addition, in order to form uniform pressure in cylinder 30, the gas needs being introduced into cylinder 30 are uniformly discharged into
It is external.Therefore, cylinder 30 can be made of gas with porous material through them.
Air blower or compressor can be used as gas supply unit 50.
Image capturing unit 60 may be mounted on mobile module 10.In this case, when motion makes mobile mould
When block 10 moves, image capturing unit 60 can be moved together with mobile module 10.As another example, image capturing unit
60 can be installed separately with mobile module 10.In this case, mobile module 10 can be relative to 60 edge of image capturing unit
Z-direction to independently move.Space 12 can be formed at the center of mobile module 10, and can be in probe module 20
Through-hole 22 is formed, so that image capturing unit 60 can be with the image of capture probe 21.
For example, image capturing unit 60 can be arranged in the surface of probe 21, and can be with the image of capture probe 21.
As an example, image capturing unit 60 can be configured to the camera for the lens that there is at least one focal length to be predetermined.
In this case, when probe 21 is contacted with the electrode E of best contact and substrate S, image capturing unit 60 can be with
It is positioned at a position, at this location, the tip of the focal length and image capturing unit 60 and probe 21 of image capturing unit 60
The distance between it is consistent.That is, when probe 21 is contacted with the electrode E of best contact and substrate S, probe 21
Tip can be positioned at the focal point of image capturing unit 60.Can by set image capturing unit 60 position experiment or
It emulates to set the position of image capturing unit 60, so that when probe 21 is with the electrode E of best contact and substrate S
When contact, the tip of probe 21 is positioned at the focal point of image capturing unit 60.Therefore, when probe 21 and substrate S electrode E most
When good contact, that is to say, that when probe 21 reaches the focal point of image capturing unit 60, image capturing unit 60 can obtain
The most clearly image of probe 21.
Here, when probe module 20 is moved towards substrate S, the tip of the continuously capture probe 21 of image capturing unit 60
Image.In addition, whether the tip of 70 detection probe 21 of control unit reaches the focal point of image capturing unit 60.In addition, working as
When the tip of probe 21 reaches the focal point of image capturing unit 60, control unit 70 can determine the electricity of probe 21 and substrate S
Pole E optimum contacts.
As described above, control unit 70 can determine whether probe 21 reaches the focal point of image capturing unit 60, and
Then, control unit 70 can be determined when probe 21 reaches the focal point of image capturing unit 60, the electricity of probe 21 and substrate S
Pole E is contacted.Therefore, therefore can be accurately determined the time point that probe 21 is contacted with electrode E can accurately adjust movement
Module 10 and probe module 20 and can enable probe 21 with best contact along the amount of movement of Z-direction
It is contacted with electrode E.
As another example, image capturing unit 60 can be configured to the lens that there is at least one focal length to change automatically
Camera.In this case, image capturing unit 60 can be configured to the position adjust automatically according to the tip of probe 21
Focus.
Here, the continuously tip of capture probe 21 when probe module 20 is moved towards substrate S of image capturing unit 60
Image.In addition, the image based on the probe 21 captured by image capturing unit 60, whether 70 detection probe 21 of control unit becomes
Shape.
As shown in Figure 5 and Figure 6, when electrode E movement of the probe module 20 towards substrate S, probe 21 is indeformable.In addition,
When probe module 20 still moves, probe 21 is contacted with electrode E, and then, probe 21 deforms.In this case, probe 21
Tip can be deformed along the longitudinal direction of probe 21.Therefore, when the tip of probe 21 deforms, it may be determined that probe 21
Tip is contacted with electrode E.
Therefore, control unit 70 can the image based on the probe 21 captured by image capturing unit 60 come detection probe 21
Whether deform, then, when probe 21 deforms, control unit 70 can determine that probe 21 is contacted with the electrode E of substrate S.
Meanwhile as shown in Figure 5 and Figure 6, when probe 21 and electrode E are contacted, the deflection of probe 21 can be according to probe
The amount of movement of module 20 and change.That is, probe 21 is pressed against the degree on electrode E, probe according to probe module 20
21 deform according to the sequence of 21a, 21b and 21c, and therefore, the deflection of probe 21 can change.Here, 21a indicates a kind of shape
State, wherein when probe 21 with electrode E is insufficient contact when or after probe 21 is just contacted with electrode E, due to probe 21 and
Contact between electrode E is low, therefore does not suitably apply electric signal to electrode E by probe 21.In addition, 21b indicates one
Kind state, wherein probe 21 is contacted with best contact with electrode E, and is suitably applied to electrode E by probe 21
Electric signal.In addition, 21c indicates a kind of state, wherein probe 21 is pressed against with excessively high contact on electrode E, and to spy
Needle 21 applies excessive load, so that probe 21 and/or electrode E are likely to be broken or wear.
Therefore, the deformation of the probe 21 detected according to the image based on the probe 21 captured by image capturing unit 60
Amount, it may be determined that whether probe 21 is pressed against with best contact on electrode E.That is, in the deflection of probe 21
In the case of in scheduled term of reference, it may be determined that probe 21 is contacted with electrode E with best contact.Here,
Term of reference can be set by testing or emulating, when probe 21 is pressed against with best contact on electrode E, the reality
It tests or the deflection of probe 21 that simulated measurement is detected based on the image of the probe 21 captured by image capturing unit 60.
As described above, control unit 70 can be visited based on the image of the probe 21 captured by image capturing unit 60 to detect
Whether needle 21 deforms, and then, when probe 21 deforms, control unit 70 can determine that probe 21 is contacted with the electrode E of substrate S.
In addition, control unit 70 can the image based on the probe 21 captured by image capturing unit 60 come the deformation of detection probe 21
Amount, then, when the deflection of probe 21 is in term of reference, control unit 70 can determine the electrode E of probe 21 and substrate S
Contact.Therefore, therefore can be accurately determined the time point that probe 21 is contacted with electrode E can accurately adjust mobile module
10 and probe module 20 along Z-direction amount of movement, and can enable probe 21 with best contact with electricity
Pole E is contacted.
Meanwhile the probe apparatus of exemplary embodiment according to the present invention may include pose adjustment unit (posture
Adjusting units) 80, when the electrode E of probe 21 and substrate S is contacted, which adjusts probe module
20 pose about mobile module 10.Multiple pose adjustment units 80 can be along the circumference side at the center based on mobile module 10
To arrangement.Pose of the probe module 20 about mobile module 10 can be adjusted by operating multiple pose adjustment units 80.
For example, each pose adjustment unit 80 may include interval adjustment part 81, mobile device 83 and connector 85, the interval
Adjustment part 81 is arranged between mobile module 10 and probe module 20, and adjusts between mobile module 10 and probe module 20
Interval, the mobile device 83 movement interval adjustment part 81, the connector 85 connection interval adjustment part 81 and mobile device 83.
Mobile device 83 can be configured to such as grasp by the actuator of air pressure or hydraulic operation, by electromagnetic interaction
The linear electric machine of work or the motion of ball screw mechanism.
Interval adjustment part 81 is positioned to separate with probe module 20.In addition, when mobile module 10 moves and presses probe mould
When block 20, interval adjustment part 81 can be contacted with probe module 20.When mobile device 83 moves interval adjustment part 81, Ke Yiyan
The position of Z-direction adjustment interval adjustment part 81, therefore, when the electrode E of probe 21 and substrate S is contacted, shifting can be adjusted
Interval between dynamic model block 10 and probe module 20.Therefore, probe 21 can be adjusted along Z-direction about multiple electrodes E's
Amount of movement.
Therefore, mobile module 10 and probe module 20 can be adjusted at the part that multiple pose adjustment units 80 are positioned
Between interval therefore can adjust pose of the probe module 20 about mobile module 10.Meanwhile in order to absorb interval adjustment
The impact occurred between part 81 and probe module 20, buffering pad 87 can be attached to interval adjustment part 81 towards probe module
20 end.
Meanwhile spring 89 may be coupled to interval adjustment part 81.When mobile module 10 moves and presses probe module 20,
Spring 89 is for absorbing the impact occurred between mobile module 10 and probe module 20.In addition, when the pressing probe of mobile module 10
When the electrode E of module 20 and probe 21 and substrate S are contacted, probe 21 is pressed against connecing on electrode E by spring 89 for providing
Touch pressure.
In addition, control unit 70 can be by detecting whether multiple probes 21 contact come detection probe mould with multiple electrodes E
Pose of the block 20 about mobile module 10.Exceed scheduled term of reference about the pose of mobile module 10 in probe module 20
In the case of, some among multiple probes 21 can not be contacted with multiple electrodes E.Here, control unit 70 detects multiple probes
Whether 21 all contact with multiple electrodes E.In addition, all contacted with multiple electrodes E when multiple probes 21 are not all of, and only one
In the case that a little probes 21 are contacted with electrode E, control unit 70 can determine pose of the probe module 20 about mobile module 10
It is inaccurate.In this case, control unit 70 can be by controlling the mobile device 83 of multiple pose adjustment units 80 come smart
Really adjust pose of the probe module 20 about mobile module 10.
In addition, control unit 70 can the deflection based on multiple probes 21 come detection probe module 20 about mobile module
10 pose.In the case where probe module 20 exceeds scheduled term of reference about the pose of mobile module 10, multiple probes
The deflection of some among 21 can be different from the deflection of other probes 21.Here, control unit 70 detects multiple probes
Whether 21 all deformed amount is in term of reference.In addition, the deflection in multiple probes 21 is not all of all in term of reference
The interior but deflection of some probes 21 exceed term of reference in the case of, control unit 70 can determine probe module 20 about
The pose of mobile module 10 is incorrect.In this case, control unit 70 can be by controlling multiple pose adjustment units 80
Mobile device 83 accurately adjust pose of the probe module 20 about mobile module 10.
Hereinafter, the operation of the probe apparatus of exemplary embodiment according to the present invention will be described with reference to figure 7 and Fig. 8.
First, mobile module 10 is moved towards substrate S, so that probe 21 is contacted with the electrode E of substrate S and applied to electrode E
Power up signal.Since probe module 20 is connected to mobile module 10 to be moveable along Z-direction, so when mobile mould
When block 10 moves, probe module 20 can be moved together with mobile module 10, as shown in Figure 7.
Moreover, as shown in figure 8, when mobile module 10 still moves, probe 21 is contacted with the electrode E of substrate S, and is moved
Probe module 20 is pressed while module 10 is contacted with probe module 20.Therefore, probe 21 can with contact appropriate with
Therefore the electrode E contacts of substrate S suitably can apply electric signal by probe 21 to electrode E.
In this process, it is introduced a gas into cylinder 30 by entrance 31, and in the inner surface of cylinder 30 and bar 40
Scheduled pressure is formed between outer surface, so that remaining constant between the inner surface and the outer surface of bar 40 of cylinder 30
Interval.Therefore, be connected to bar 40 probe module 20 cannot relative to 10 transverse shifting of mobile module for being connected to cylinder 30, and
Probe module 20 only can be mobile along Z-direction (upper and lower directions in attached drawing) with low friction resistance.
Therefore, it during in probe module 20, towards substrate S, mobile and probe 21 and substrate S electrode E is contacted, visits
The not transverse shifting of head module 20, therefore, probe 21 can be contacted accurately with the electrode E of substrate S.In addition, working as probe module 20
When being moved relative to mobile module 10 along Z-direction, do not applied to probe module 20 along Z-direction by cylinder 30 and bar 40
Reinforcing, therefore, probe 21 is contacted with contact appropriate with the electrode E of substrate S.
In this case, control unit 70 can the image based on the probe 21 captured by image capturing unit 60 come really
Determine whether probe 21 contacts with the electrode E of substrate S, and control unit 70 can be accurately determined probe 21 and be contacted with electrode E
Time point.Therefore, the amount of movement of mobile module 10 and probe module 20 along Z-direction can be accurately adjusted, therefore, is visited
Needle 21 can be contacted with best contact with electrode E.
In this process, whether control unit 70 can be contacted with multiple electrodes E by detecting multiple probes 21 and be detected
Pose of the probe module 20 about mobile module 10.As another example, control unit 70 can be based on multiple probes 21
Deflection carrys out pose of the detection probe module 20 about mobile module 10.In addition, in probe module 20 about mobile module 10
In the case that pose exceeds term of reference, between control unit 70 is adjusted by controlling the mobile device 83 of pose adjustment unit 80
Every adjustment part 81 along the position of Z-direction, therefore, position of the probe module 20 about mobile module 10 can be accurately adjusted
Appearance, and multiple probes 21 are contacted with best contact with multiple electrodes E.
By the process, in the state that the electrode E of probe 21 and substrate S is in alignment with each other, probe 21 can be with best
Contact is contacted with the electrode E of substrate S, therefore, can suitably apply electric signal to the electrode E of substrate S by probe 21.
For purposes of illustration, it has been described that exemplary embodiment of the present invention.However, it will be appreciated that this hair
Bright range is not limited to specific exemplary embodiment, and the range limited in without departing substantially from appended claims the case where
Under, various modifications can be carried out.
Claims (8)
1. a kind of probe apparatus, including：
Mobile module is configured to be moveable towards substrate；
Probe module is mounted to be moveable relative to mobile module, and with the probe contacted with the electrode of substrate；
Image capturing unit, the image of capture probe when the electrode of probe and substrate contacts；With
Control unit determines whether probe connects with the electrode of substrate based on the image of the probe captured by image capturing unit
It touches.
2. probe apparatus according to claim 1, wherein when probe module is moved towards substrate, control unit detection
Whether probe reaches the focus of image capturing unit, and when probe reaches the focus of image capturing unit, control unit is true
Determine probe to contact with the electrode of substrate.
3. probe apparatus according to claim 1, wherein control unit is based on the probe captured by image capturing unit
Image comes whether detection probe deforms, and when probe deformations, and control unit determines that probe is contacted with the electrode of substrate.
4. probe apparatus according to claim 2 or 3, wherein probe module includes that the multiple electrodes respectively with substrate connect
Tactile multiple probes, and control unit by detect multiple probes whether with multiple electrodes contact come detection probe module about
The pose of mobile module.
5. probe apparatus as claimed in claim 4, further includes：
Pose adjustment unit adjusts pose of the probe module about mobile module when the electrode of probe and substrate contacts.
6. probe apparatus according to claim 1, wherein control unit is based on the probe captured by image capturing unit
Image carrys out the deflection of detection probe, and when the deflection of probe is in term of reference, control unit determine probe with
The electrode of substrate contacts.
7. probe apparatus according to claim 6, wherein probe module includes being contacted respectively with the multiple electrodes of substrate
Multiple probes, and control unit is by detecting position of the deflection of multiple probes come detection probe module about mobile module
Appearance.
8. probe apparatus according to claim 7, wherein when the electrode of probe and substrate contacts, pose adjustment unit
Adjust pose of the probe module about mobile module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0012541 | 2017-01-26 | ||
| KR1020170012541A KR20180088030A (en) | 2017-01-26 | 2017-01-26 | Probe apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108459182A true CN108459182A (en) | 2018-08-28 |
Family
ID=63238848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810068560.9A Pending CN108459182A (en) | 2017-01-26 | 2018-01-24 | Probe apparatus |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20180088030A (en) |
| CN (1) | CN108459182A (en) |
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| TWI714103B (en) * | 2019-05-28 | 2020-12-21 | 楊潤善 | Apparatus for checking pin contact pressure using z-axial feeder of flat panel display inspection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102258116B1 (en) * | 2018-11-20 | 2021-06-01 | 주식회사 탑 엔지니어링 | Appratus for inspecting panel |
| KR102190485B1 (en) * | 2019-05-14 | 2020-12-15 | 주식회사 탑 엔지니어링 | Array Tester |
| KR102235475B1 (en) * | 2019-05-14 | 2021-04-05 | 주식회사 탑 엔지니어링 | Array Tester |
| KR102190482B1 (en) * | 2019-05-14 | 2020-12-15 | 주식회사 탑 엔지니어링 | Array Tester |
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| KR20180088030A (en) | 2018-08-03 |
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