CN108430670A - Silver powder and silver paste and its application - Google Patents
Silver powder and silver paste and its application Download PDFInfo
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- CN108430670A CN108430670A CN201680076145.7A CN201680076145A CN108430670A CN 108430670 A CN108430670 A CN 108430670A CN 201680076145 A CN201680076145 A CN 201680076145A CN 108430670 A CN108430670 A CN 108430670A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
- B22F2301/255—Silver or gold
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
It provides：The silver powder of the low wiring of resistivity can be formed.According to the present invention, a kind of silver powder for the electrode being used to form electronic component is provided.The silver powder meets the full terms of following (1)~(4)：(1) calcination loss when being heated to 600 DEG C is 0.05% or less；(2) tap density is 5g/cm3More than；(3) maximum draw ratio is 1.4 or less；(4) specific surface area based on BET method is 0.8m2/ g or less.
Description
Technical field
The present invention relates to the silver powder of the formation for the wiring that can be suitable in electronic component etc. and silver pastes.
This application claims preferential based on Japanese Patent Application filed in 25 days December in 2015 2015-253416
Power, all the contents of the application are incorporated by reference this specification.
Background technology
It is widely used not use conducting wire in the electronic component of electric/electronic device, and printed in insulative substrate
Be equivalent to conducting wire, powder comprising conductive material to wiring technology.The conductive material for being used to form wiring is general
For printing in a manner of being scattered in conductive paste made of decentralized medium together with adhesive.
Conductive paste is distinguished according to purposes and uses various types.For example, requiring special high conductivity, (low-resistivity is special
Property) use on the way, as conductive material, use the silver paste comprising silver powder.Corresponding thereto, relatively wanting to inhibit cost
In purposes etc., the conductive paste etc. comprising copper powders, aluminium powder, nickel by powder etc. is used.In addition, for example, for use environment,
Manufacturing environment is the electronic component of high temperature, uses the paste by roasting the roasting type being fired on substrate.In addition, for not
It can be exposed to the sun in the electronic component of high temperature, using passing through the paste for the heat-curing type for making it anchor at substrate that is heating and curing at low temperature
Agent.As the prior art for the silver paste for being related to roasting type, such as documents 1~2 can be enumerated.
Existing technical literature
Patent document
Patent document 1：Japanese Patent Application Publication 2009-062558 bulletins
Patent document 2：Japanese Patent Application Publication 2011-181538 bulletins
Invention content
Problems to be solved by the invention
Patent document 1 is to be related to low temperature fired ceramic (Low Temperature Co-fired Ceramics simultaneously：
LTCC) the technology of the conductive paste of circuit board is disclosed to inhibit the generation in crack, delamination, is had using surface
The Argent grain of concave-convex polyhedral.In addition patent document 2 is the electric conductivity for the electrode formation for being related to solar cell device
The technology of paste discloses the Argent grain and glass powder for including regulation character in conductive paste.
The conductive paste of such roasting type is known can to form resistivity under relatively high calcination temperature when roasting
Lower silver electrode (wiring).For example, for existing conductive paste, compare as 600 DEG C~700 DEG C of calcination temperatures
Resistivity (specific resistance) compared with the electrode obtained when being roasted under low temperature is 2.3 μ Ω cm or so or more, corresponding thereto, at 800 DEG C
The resistivity of the electrode obtained when being roasted at a high temperature of above is 2.1 μ Ω cm or so or more.The value is substantially low according to purposes
Resistivity.However, for example, the theoretical value of the resistivity of block silver be 1.6 μ Ω cm, therefore for silver electrode require higher water
The low resistance of flat (such as 2 μ Ω cm or less).Further, it is desirable that reach the low-resistance value under lower calcination temperature.This hair
Bright is to complete in view of the above fact, its purpose is to provide：As the conductive material that can form the low wiring of resistivity
Silver powder.And in another side, provide：Use the conductive paste of above-mentioned silver powder.
The solution to the problem
In order to solve the project of the above-mentioned prior art, technology disclosed herein provides the electrode for being used to form electronic component
Silver powder.The silver powder meets the full terms of following (1)~(4)：(1) calcination loss when being heated to 600 DEG C is 0.05%
Below；(2) tap density is 5g/cm3More than；(3) maximum draw ratio is 1.4 or less；(4) specific surface area based on BET method is
0.8m2/ g or less.
The inventors of the present invention further investigate repeatedly, find：Defined range proper combination silver powder above-mentioned 4 characters simultaneously
Adjustment, to reach the silver powder for the electrode formation that can realize low-resistivity no so far, so far completes this hair
It is bright.According to the above configuration, such as by silver powder it supplies on base material and roasting, so as to inhibit the shape of the hole in electrode
At can be formed less than previous low-resistance electrode (wiring).For example, it is that 2 μ Ω cm are below low that resistivity, which may be implemented,
The electrode of resistance.In turn, when being roasted under less than previous calcination temperature, above-mentioned low-resistance electrode can be formed.
It should be noted that " calcination loss (Ig-loss) " is to indicate that silver powder is straight from room temperature heating in this specification
The index of the ratio (%) of Mass lost when to 600 DEG C.The calcination loss can be based on JIS K0067：1992 definedization
The weightlessness and residual test method for learning product measure.
In addition, " tap density " in this specification is indicated the powder after silver powder jolt ramming 1000 times in regulation container
The index of the apparent density at end.The measurement of tap density can be based on JIS Z2512：Metal powder-tap density as defined in 2012
Assay method is measured.
Further, " the maximum draw ratio " in this specification is in electron microscope observation, respectively more than 3 visuals field
It observes in image, the meaning of the arithmetic mean of instantaneous value of the draw ratio for being considered the highest 3 Argent grains measurement of draw ratio.
" specific surface area " in this specification is the gas molecule adsorption isotherm of the silver powder measured by gas adsorption method
The specific surface area that characteristic is parsed based on BET method.The specific surface area can be based on JIS Z8830：2013(ISO 9277：
2010) specific surface area measurement method of the powder (solid) of gas absorption as defined in is measured.
In a preferred mode for silver powder disclosed herein, which is characterized in that (5) based on electron microscope observation
Average grain diameter is 1 μm or more and 3 μm or less.By such composition, above-mentioned 4 characters easy to implement, are easy to form low resistance
Electrode, therefore it is preferred that.
In a preferred mode for silver powder disclosed herein, which is characterized in that (6) proportion is 10.4g/cm3More than.
The purpose of technology disclosed herein is the low-resistivity of higher levels of electrode.Therefore, the Argent grain of silver powder is constituted certainly
Body is preferably free of hole, the high person of proportion.By such composition, the low silver electrode of resistivity can more reliably be formed.
In another side, invention disclosed herein provides a kind of silver paste.Above-mentioned silver paste includes：Arbitrary silver powder among the above
End；Binder resin；With decentralized medium.By such composition, above-mentioned silver powder can suitably be supplied to desired base
Material can be simply forming low-resistance electrode well with efficiency.It, can effectively will be multiple micro- for example, using printing technology
Thin electrode pattern is printed to a base material.
In a preferred mode for silver paste disclosed herein, it is configured in 700 DEG C or more and 800 DEG C of temperature below
The resistivity of the silver-colored calcining matter obtained when degree range roasting reaches 2 μ Ω cm or less.Thus, it is possible to be stably formed resistivity
For 2 μ Ω cm electrodes below.
In a preferred mode for silver paste disclosed herein, it is configured in 600 DEG C or more and 900 DEG C of temperature below
The resistivity of the silver-colored calcining matter obtained when degree range roasting reaches 2.1 μ Ω cm or less.As a result, from the width compared with the supreme temperature of low temperature
Calcination temperature under, can be stably formed resistivity be 2.1 μ Ω cm electrodes below.
In a preferred mode for silver paste disclosed herein, it is configured in 600 DEG C or more and 800 DEG C of temperature below
The resistivity of the silver-colored calcining matter obtained when degree range roasting reaches 2 μ Ω cm or less.As a result, in 600 DEG C of roastings lower in this way
At a temperature of, it is 2 μ Ω cm electrodes below that can also be stably formed resistivity.
As described above, by technology disclosed herein, the low electricity being suppressed by roasting the formation of hole can be made
The silver electrode of resistance.In addition, the silver electrode can be by by roasting with arbitrary shape printing block letter on base material
It is simply forming.It may be thus possible, for example, to especially suitable for the electronic component to use or manufacturing at high temperature at high temperature, it is special
The purposes of the electrode of low-resistivity maybe be sought.From the point of view of the viewpoint, technology disclosed herein, which also provides, has the silver electrode
Electronic component.
Description of the drawings
Fig. 1 is cuing open for the composition for the Stacked inductor that conceptual illustration is formed using the silver powder of an embodiment
Face figure.
Fig. 2 is the section SEM pictures for the silver electrode for roasting the silver paste of an embodiment.
Fig. 3 is the section SEM pictures for the silver electrode for roasting existing silver paste.
Specific implementation mode
Illustrate the suitable embodiment of the present invention below.It should be noted that thing of this specification in addition to special instruction
Thing other than (for example, character of silver powder), i.e. for the necessary thing of implementation of the invention (for example, the supply of silver paste
Method, composition of electronic component etc.) can be based on the technology contents and those skilled in the art instructed according to this specification one
As common technical knowledge understood.The common technical knowledge of content and the field that the present invention can be based on this disclosure is implemented.
It should be noted that indicating that the label of " A~B " of range is A or more and B meanings below in this specification.
[silver powder]
Silver powder disclosed herein is that the electric conductivity for the conducting wire being used to form in electronic component etc. (only claims " to lead below sometimes
Electrically ".) high wiring material.Silver-colored (Ag) golden (Au) is expensive like that, is difficult to be aoxidized and excellent electric conductivity due to not having, because
This is preferably as electrode material.Silver powder forms it as long as the powder (set of particle) using silver as principal component without spy
Other limitation can use the silver powder for having desired electric conductivity or other physical property.Principal component is to constitute silver powder herein
Ingredient among maximum composition meaning.As silver powder, for example, can enumerate as an example by silver and silver alloy with
And they mixture or the compositions such as complex powder.As silver alloy, for example, can enumerate silver-palladium (Ag-Pd) alloy,
Silver-platinum (Ag-Pt) alloy, silver-copper (Ag-Cu) alloy etc. are used as preferred example.It is, for example, possible to use other than core is by silver
The metals such as copper, silver alloy are constituted, and cover the core shell particle etc. that the shell of core is formed by silver.There are its purity (content) is higher for silver powder
The higher tendency of electric conductivity, therefore it is preferable to use the high persons of purity.Silver powder is preferably 95% or more purity, more preferably 97% with
On, particularly preferably 99% or more.By technology disclosed herein, such as even if the use of purity is 99.5% degree or more (example
As more than 99.8% degree) silver powder, extremely low-resistance electrode can also be formed.It should be noted that in the viewpoint, this
In the disclosed technology in place, such as even if using 99.99% or less purity (99.9% or less) silver powder, can also abundant landform
At low-resistance electrode.
Above-mentioned silver powder is integrated by roasting, forms electrode.Constitute burning of the Argent grain of silver powder with roasting when
Knot, multiple particles are integrated and apparent volume is reduced.That is, Argent grain moves position in sintering.In addition, Argent grain is with burning
Knot, shape are changed in a manner of losing particulate interspaces.In technology disclosed herein, the various characters of silver powder are adjusted so that roasting
When Argent grain more densely fill, form the few electrode of hole.That is, (1) calcination loss of silver powder, (2) tap density, (3)
Maximum draw ratio and (4) specific surface area are defined as being in prescribed limit.It is illustrated below for each physics value.
(1) calcination loss (Ig-loss)
Calcination loss is the finger of the ratio (%) of Mass lost amount when indicating from room temperature to heat silver powder up to 600 DEG C
Mark.The ingredient of heating in this way and reduction is the ingredient (volatile ingredient) burnt when roasting, can be in roasting silver powder
When hinder Argent grain smoothly move and fill.Think that the volatile ingredient is mainly made of organic matter, such as can come to be
Improve the dispersibility of silver powder and in the ingredient of dispersant, the surfactant of the attachment of the surface of silver powder etc..It is disclosed herein
Technology in, in order to inhibit above-mentioned Argent grain fillibility reduction, the calcination loss of silver powder is limited to 0.05% or less.
The calcination loss is preferably 0.045% hereinafter, more preferably 0.04% hereinafter, particularly preferably 0.035% or less.Calcination loss
Substantially can be 0% depending on the performance of measurement device.
(2) tap density
Tap density is to indicate that gap caused by the powder aggregation after naturally being filled in container passes through defined light
Impact under the conditions of striking and when releasing, the index of the bulk density of light compaction state.Herein, it is set as using the condition of tapping
Jolt ramming height：5cm, jolt ramming speed：100 beats/min, tapping number：Tap density at 1000 times.The tap density of silver powder
Too low, it is big that the arrangement of Argent grain when being supplied on base material is easy to become gap, further, is filled out when Argent grain moves when roasting
Filling property also becomes difficult to improve, and it is not preferable.From the point of view of the viewpoint, in technology disclosed herein, the vibration density metric of silver powder
It is set to 5g/cm3More than.Tap density is preferably 5.1g/cm3More than, more preferably 5.2g/cm3More than, particularly preferably 5.3g/
cm3More than.The upper limit of tap density is not particularly limited.There are tap densities for the density of powder<Apparent density≤proportion
Relationship.It is therefore preferable that closer to the most close packed density by calculatings such as the average grain diameters of silver powder and then the ratio of closer silver
Weight (10.50g/cm3)。
(3) maximum draw ratio
Silver powder disclosed herein is for roasting, therefore the Argent grain for constituting silver powder becomes closer to spheroidal, fillibility
It is better to obtain, and can densely constitute the electrode as calcining matter.Therefore, the aspherical particle of the fillibility when roasting is interfered
In the presence of being undesirable.In technology disclosed herein, by the way that the maximum draw ratio of Argent grain is limited to 1.4 hereinafter, can be true
Protect the fillibility for the Argent grain for constituting silver powder.It should be noted that the particle that shape deviates ball most possibly hinders particle
Fillibility, this is related to the more macroporous formation of electrode, from the point of view of the viewpoint, using maximum draw ratio as evaluation finger
Mark, rather than using average aspect ratio as the index of evaluation.The maximum draw ratio of silver powder is preferably 1.35 hereinafter, more preferably
1.3 hereinafter, particularly preferably 1.25 or less.
It should be noted that maximum draw ratio refers to, in the observation image more than 3 visuals field in electron microscope observation
Highest 3 Argent grains of draw ratio are thought in selection respectively, for the arithmetic mean of instantaneous value for the draw ratio that these Argent grains measure.Separately
Outside, draw ratio is the silver that will observe the maximum major diameter (maximum length) of the Argent grain in image as a, vertical with the maximum major diameter
When the maximum width of particle is as b, according to the index of the form calculating of " a/b ".
(4) specific surface area
Specific surface area is the value that the surface area that silver powder has is indicated according to the form of per unit weight, is that can reflect structure
At the size of the Argent grain of silver powder and the index of configuration of surface.Generally for the identical powder of average grain diameter, there are specific surfaces
Accumulate the remoter tendency of the shape distance spheroidal of more bulky grain.Therefore, regulation is used based on BET method in technology disclosed herein
Specific surface area is 0.8m2/ g silver powders below.It should be noted that the 0.8m2The specific surface area of/g be equivalent to it is a diameter of about
The specific surface area of the Argent grain of 0.7 μm of ball.In the present invention, as being used to form the silver powder used in the electrode of electronic component
End, whether appropriate according to value evaluation.The specific surface area of silver powder is preferably 0.75m2/ g is hereinafter, more preferably 0.65m2/ g with
Under, particularly preferably 0.6m2/ g or less.It should be noted that specific surface area is small to also imply that the average grain diameter of silver powder is coarse.
It is thus impossible to which the purposes according to electronic component is lumped together, the specific surface area based on BET method is substantially preferably 0.1m2/ g or more,
More preferably 0.15m2/ g or more.
In technology disclosed herein, as described above, fillibility when in order to by the roasting of silver powder improves better, adopt
With combining above-mentioned 4 indexs, by its value be adjusted to most just when.Therefore, in order to form more low-resistance electrode, silver powder is full simultaneously
Above-mentioned 4 important documents of foot are indispensable.It, can as a result, by the silver powder when being roasted under than block silver point (about 962 DEG C) more low temperature
To obtain finer and close calcining matter.In turn, the low electrode of resistivity can be formed.
(5) average grain diameter
It should be noted that the average grain diameter of silver powder is not particularly limited as long as meeting above-mentioned important document.However, from can
From the viewpoint of the manufacture suitable for present electronic component, it is preferred state that average grain diameter, which is set as prescribed limit,.
It is carried out although being sintered under the too small then more low temperature of the average grain diameter of silver powder, silver when primary particle becomes easy aggregation and roasts
The fillibility of particle reduces, and it is not preferable.Therefore, for silver powder, being based on can be by primary particle and second particle (aggregation
Grain) distinguish and the electron microscope observed, such as the average grain diameter of primary particle is suitably 1 μm or more.Average grain diameter is excellent
It is selected as 1.1 μm or more, more preferably 1.2 μm or more, particularly preferably 1.3 μm or more.For example, 1.5 μm or more can be set as.Separately
Outside, it if the average grain diameter of the primary particle of silver powder is excessive, needs to be exposed to high temperature for a long time to be sintered, and cannot
Meet and realizes that the aspect of the requirement of sintering is not preferred under low temperature.Therefore, the average grain based on electron microscope observation of silver powder
Diameter for example can be to be set as 5 μm or less for target.Average grain diameter be preferably 4.5 μm hereinafter, more preferably 4 μm hereinafter, especially
Preferably 3.5 μm or less.
It should be noted that " average grain diameter based on electron microscope observation " refers in this specification, for example, by with
Scanning electron microscope (Scanning Electron Microscope：SEM), transmission electron microscope
(Transmission Electron Microscope：) etc. TEM it is 100 silver powders of the electron microscope observation of representative
50% grain size (D of accumulation in grain, size distribution (number benchmark) based on equivalent circle diameterEM50)。
It should be noted that the average grain diameter as powder, can also be evaluated by laser diffraction scattering method.Profit
With laser diffraction scattering method, average grain diameter is measured in the case that primary particle and second particle are not exclusively distinguished ground.For
Silver powder disclosed herein, about the average grain diameter of the silver powder based on laser diffraction scattering method, such as suitable for 0.5 μm with
Upper is target.Average grain diameter based on laser diffraction scattering method is preferably 0.7 μm or more, is more preferably 1 μm or more, is especially excellent
It is selected as 1.2 μm or more.On the other hand, for the upper limit of the average grain diameter of silver powder, in laser diffraction scattering method and electronic display
Big difference is had no in micro mirror observation, such as can be with 5 μm or less the targets for optimum range.Average grain diameter is preferably 4.5 μ
M or less, more preferably 4 μm or less, particularly preferably 3.5 μm or less.
It should be noted that " average grain diameter based on laser diffraction scattering method " in this specification is using logical
Cross the grain size (D when cumulative volume 50% in the size distribution of the volume reference of laser diffraction scattering methodL50)。
In addition, as silver powder, sharp (narrow) person of preferred size distribution.Such as it is preferable to use do not wrap substantially
Silver powder containing the particle that average grain diameter is 10 μm or more.Further, it as the index having sharp grain size distribution, may be used from base
Grain size (D when 10% volume is accumulated small particle side in the size distribution of laser diffraction scattering methodL10) and accumulation 90%
Grain size (D when volumeL90) the ratio between (DL10/DL90).The D when grain size of composition powder is all equalL10/DL90Value be 1, opposite grain
Degree is distributed wider, the DL10/DL90Value become closer to 0.It is preferable to use DL10/DL90Value be 0.15 or more, for example, 0.15
Above and the powder of 0.5 narrow size distribution below.
In another side, 2 kinds of different particle groups of average grain diameter can also be mixed and be used by silver powder.At this point, for example,
It can enumerate：By the average grain diameter (D of the 1st particle groupL50) be set as the range of 2 μm~5 μm (such as 2 μm), the 2nd particle group it is flat
Equal grain size (DL50) range of 0.5 μm~2 μm (such as 0.5 μm) is set as suitable for example.The size distribution of each particle group is such as at this time
Above-mentioned preferably sharp person.Moreover, for example, with the 1st particle group as 65~90 mass % (such as 70 mass %) ratio, the 2nd
Particle group is mixed as the ratio of 35~10 mass % (such as 30 mass %).Thus, it is possible to which it is good to prepare fillibility
Silver powder.
Silver powder with such average grain diameter and particle size distribution characteristics can form fine and close electricity well with fillibility
Pole.In the lower electrode of formation resistivity, this is favourable.
(6) proportion
Although to the proportion of silver powder without strict restriction, for example, more preferably constitute the Argent grain itself of silver powder
Including hole ratio it is few.Thus, for example the proportion preferably measured by constant volume plavini for silver powder is (also referred to as very close
Degree.) high.In this specification, the proportion of silver powder uses the value that the constant volume plavini by using helium measures.The ratio of silver powder
Great cause can be to be set as 10.3g/cm3It is target above, for example, it can be set to being 10.35g/cm3More than.Further, silver powder
The proportion at end is preferably 10.4g/cm3More than, more preferably 10.45g/cm3More than, particularly preferably 10.5g/cm3More than.
Then above silver powder can be roasted and be made the silver of composition silver powder by supplying to arbitrary base material
Grain is integrally sintered, to obtain the silver electrode (can be wiring) as sinter.Calcination temperature additionally depends on silver powder
Composition, for being considered as the silver powder of fine silver (such as 99.9% or more purity), can be set below the temperature of fusing point i.e. 962 DEG C.
Therefore, calcination temperature can for example be set as 800 DEG C~900 DEG C or so of temperature range in the same manner as previous silver powder.However,
Silver powder disclosed herein can obtain low-resistance silver electricity compared with when roasting previous silver powder at that same temperature
Pole.In turn, it even if in the case of to be roasted at a temperature of less than previous silver powder, can also realize and previous same
Degree or electrode less than previous resistivity.Therefore, the silver powder is for example preferably in the temperature of 900 DEG C or less (being less than 900 DEG C)
The lower roasting of degree.More preferable 850 DEG C of calcination temperature or less (being less than 850 DEG C), further preferred 800 DEG C or less (being less than 800 DEG C), spies
Not preferably 750 DEG C or less (being less than 750 DEG C).For example, calcination temperature can be set as 700 DEG C or less (are less than 700 DEG C), particularly
650 DEG C or less (being less than 650 DEG C), such as 600 DEG C or so (typically 580 DEG C~620 DEG C).For the lower limit of calcination temperature,
It is not particularly limited, for example, being set as 550 DEG C or more.
[silver paste]
The above-mentioned method for supplying silver powder to binder resin is not particularly limited.In technology disclosed herein, by
It is good in the supply and treatability of above-mentioned silver powder, accordingly it is also possible to be scattered in made of organic carrier constituent with silver powder
The form of silver paste provides.The silver paste substantially includes silver powder and organic carrier constituent.
As organic carrier constituent, as expected purpose, can use existing this kind of silver without particular limitation
The various organic carrier constituents used in paste.Typically, organic carrier constituent is with the various binder resins formed and dispersion
The form of the mixture of medium is constituted.In the organic carrier constituent, can all it be dissolved in a dispersion medium with binder resin,
It a part of can dissolve or dispersion (can be the organic carrier of so-called emulsion types.).
The silver paste prepared in the stage at membranization, is being to play by being printed, being dried etc. by binder resin
Argent grain is set to be bonded to each other and make the ingredient of Argent grain and the effect of base material bonding.Therefore, Argent grain one by roasting
After change, binder resin can become unwanted resistance components.Therefore, the binder resin is preferably than calcination temperature
It is disappeared at low temperature without remaining ingredient in the electrodes.It can be without particular limitation as such binder resin
Use the organic compound with binder function.Specifically, for example suitable for use：Ethyl cellulose, hydroxyethyl cellulose,
The cellulose polymers such as carboxymethyl cellulose, polybutyl methacrylate, polymethyl methacrylate, polymethylacrylic acid second
The acrylic resins such as ester, epoxy resin, phenolic resin, alkyd resin, polyvinyl alcohol, the ethylene base system such as polyvinyl butyral
The binder resin as matrix such as rosin series resins such as resin, rosin, maleic rosin.In particular, can be in order to suitably realize
The viscosity characteristics of good silk-screen printing are carried out, it is preferable to use cellulose polymer (such as ethyl cellulose).
It should be noted that as described above, fillibility when agglutinating property and the sintering of the silver powder is excellent.Therefore, with shape
For the purpose of the lower electrode of resistivity, silver paste does not preferably include the ingredient in addition to silver powder and organic carrier constituent.For example,
The preferred embodiment of the silver paste is other than organic carrier constituent for example not comprising the glass powder that could also say that inorganic binder.
It is that substantially 200 DEG C or more of boiling point (is typically about as the preferred substance of decentralized medium of organic carrier is constituted
200 DEG C~260 DEG C) organic solvent.More preferably using substantially 230 DEG C or more of boiling point (typically about 230 DEG C~260
DEG C) organic solvent.It, can be suitable for using butyl cellosolve acetate, butyl carbitol acetate as such organic solvent
Ester (BCA：Butyl carbitol acetate) etc. ester series solvents, butyl carbitol (BC：Diethylene glycol monobutyl ether) etc. ethers system it is molten
Agent, ethylene glycol and diethylene glycol derivative, toluene, dimethylbenzene, Mineral spirits, terpineol, Meng's alkanol, the organic solvents such as Texanol.
As particularly preferred solvent ingredient, butyl carbitol (BC), acetate of butyl carbitol (BCA), 2,2,4- tri- can be enumerated
Methyl-1,3- pentanediol mono isobutyrates etc..
The compounding ratio for each constituent for including in silver paste can be according to the forming method of electrode, typically printing side
Method etc. suitable for adjustment, substantially may be used based on the compounding ratio on the basis of this kind of conductive composition used in the past into
Row is constituted.As an example, for example, being the ratio that target can determine each constituent with compounding below.
That is, the containing ratio in silver paste shared by silver powder is approximately set to 80 matter when paste is generally 100 mass %
Amount % or more (typically the 80 mass % of mass %~98) be it is appropriate, more preferably 83 mass of mass %~96 % or so,
Such as be preferably set to 85 mass of mass %~95 % or so.It improves the containing ratio of silver powder and reduces the ratio of binder resin
Rate is related, preferred from the viewpoint of it can form the few fine and close electrode pattern of hole well with form accuracy.On the other hand,
The containing ratio it is excessively high then sometimes the treatability of paste, to reductions such as the adaptability of various printings.
Also, among organic carrier constituent binder resin with the quality of silver powder be 100 mass % when, substantially 10 matter
It is preferred to measure % or less, typically contained with the ratio of 0.3 mass of mass %~8 % or so.Particularly preferably relative to
100 mass % of silver powder is contained with the ratio of 0.5 mass of mass %~6 %.It should be noted that the binder resin can wrap
Containing undissolved binder resin ingredient in the binder resin ingredient dissolved in such as organic solvent and organic solvent.Include
It is not special to their ratio when the binder resin ingredient dissolved in solvent and undissolved binder resin ingredient
Limitation, such as can be arranged in such a way that the binder resin ingredient dissolved in organic solvent accounts for (1 one-tenth~10 one-tenth).
It should be noted that the overall containing ratio as above-mentioned organic carrier, it can according to the character of obtained paste
Become, as reference value value, when being generally 100 mass % with conductive composition, for example, amount of 2 mass of mass %~20 %
It is appropriate, the preferably 5 mass % of mass %~15, the especially more preferably amount of 5 mass of mass %~10 %.
In addition, conductive composition disclosed herein in the range of not departing from the purpose of the present invention can include it is above-mentioned with
Outer various inorganic and/or organic matter additive.As the Suitable examples of the additive, such as can enumerate, surface-active
The additives such as agent, antifoaming agent, antioxidant, dispersant, viscosity modifier.
Above-mentioned material can be compounded (quality ratio) according to the rules to weigh by such silver paste, mixed and made to uniformly
It is standby.Three-roll grinder, roller mill, magnetic stirring apparatus, planetary-type mixer, dispersion machine can be used for example in being stirred for material
Implement Deng well known various mixing stirring devices.
The suitable viscosity of paste is different according to thickness (in turn, the thickness of paste block letter) of the electrode of target etc.,
Therefore there is no particular limitation.For example, the internal electrode for forming suitable stacking potsherd shape (such as thickness is 50 μm
Left and right) block letter when, the viscosity of silver paste is preferred according to 350~450Pas (10rpm, 25 DEG C) to prepare.Thus, it is possible to carry
High position accuracy and form accuracy the ground pattern that prints electrode.
Aforesaid paste is preferably, and in supply to base material, then stands 15~30 minutes or so with 50~150 DEG C, will be divided
It is roasted after dispersion media removal.Calcination temperature can determine in the same manner as the calcination temperature of above-mentioned silver powder.Silver is formed as a result,
Silver electrode made of particle is densely sintered on base material.
The resistivity of the calcining matter of above silver paste is especially low (such as 2 μ Ω cm or less), accordingly, it is considered to suitable for conduct
It is required that the electrode of the purposes of especially low resistivity utilizes.For example, can be as the electricity of the electronic component of various compositions and purposes
Pole utilizes.As Suitable examples, such as calcination temperature can be enumerated and be reduced to potteries of 900 DEG C or so the LTCC below as base material
Porcelain circuit board is as Suitable examples.In the manufacture of the LTCC, it is patterned with silver paste in the blank of ceramic substrate, from
And ceramic substrate and electrode can with concurrent roasting in terms of be preferred.Therefore, the base for being printed with the wiring pattern can be enumerated
For piece through being laminated, roasting, the laminated ceramic piece for having electrode as internal electrode (internal layer wiring) is especially desirable purposes.Make
It for the laminated ceramic piece, is not particularly limited, laminated ceramic capacitor (Multi-Layer Ceramic can be enumerated
Capacitor：MLCC), laminated ceramic inductor, laminated ceramic rheostat, stacking PTC thermistor, stacking NTC thermistor
Deng.Wherein, the loss of the Joule heat in order to inhibit internal electrode can be enumerated, it is desirable that the laminated ceramic of the lower resistivity of electrode
Inductor is as ideal application examples.
Fig. 1 is the sectional view for schematically showing Stacked inductor 1.Size relationship (length, width, thickness in the figure
Degree etc.), the compositions such as the stacking number of dielectric layer might not reflect actual size relationship and state.
Stacked inductor 1 is for example using multiple dielectric layers (ceramic layer) 12 of ferrite powder formation through stacking
The laminated ceramic piece of integrally-formed monolithic type.Have between each dielectric layer 12 and is led as the coil of internal electrode 22
Body.Coil-conductor is the part that coil is formed between each dielectric layer 12, by the conducting for being set to dielectric layer 12
Hole is clamped dielectric layer 12 and 2 coil-conductors is connected.As a result, according to the generally three dimensional coils shape (spiral) of internal electrode 22
Mode constitute.In addition, Stacked inductor 1 has outside among its outer surface positioned at the position of the side of dielectric layer 12
Portion's electrode 20.
The Stacked inductor 1 can typically be manufactured according to following step.That is, first, it will be with ferrite powder
Based on dispersion be supplied on carrying tablet, formed and include the blank of dielectric substance.The calcination temperature of the blank is reduced to
900 DEG C or so following compoundings.And via hole is formed by laser irradiation etc. in the specified position of the blank.It then, will herein
Disclosed silver paste is printed in specified position according to regulation electrode pattern (coil pattern).As long as needing, can be printed on via hole
Brush prepares the silver paste for through-hole.The blank that multiple (such as 100 or more) carry such electrode pattern is made, by their layers
It folds, crimp to make the electronic component main body 10 not roasted.Then, the laminates are made to dry, (highest roasts in regulation heating condition
Burn temperature be 900 DEG C or less) under roasting the stipulated time (as maintenance highest calcination temperature time be, for example, 10 minutes~5 small
When or so).Blank is calcined as a result, and blank is fired one, forms the dielectric layer 12 of monolithic.And electrode paste
The fired formation internal electrode of agent 22.The stacking of the form of clamping internal electrode 22 between multiple dielectric layers 12 is made as a result,
The electronic component main body 10 of chip inductor 1.Thereafter, in the desired place of the electronic component main body 10, it is coated with external electrode
The conductive paste of formation forms external electrode 20 by carrying out roasting.In this way, Stacked inductor 1 can be manufactured.It changes
The form that the Stacked inductor 1 of internal electrode is equipped as dielectric inside of ceramic base material may be implemented in Yan Zhi
Electronic component main body 10.It should be noted that can't especially be assigned for the construction technology of above-mentioned Stacked inductor 1
The present invention is with feature, therefore detailed description will be omitted.
The calcination loss of the silver powder used is suppressed to low by silver paste used in the formation of internal electrode 22 herein, can
Form the few fine and close silver electrode of hole.In addition, can for example be roasted in a low temperature of 600 DEG C~700 DEG C or so.Even if at this
When being roasted in a low temperature of sample, internal electrode 22 can also realize such as 2 μ Ω cm low-resistivities below.And dielectric layer 12
It is made of the excellent dielectric substance of DC superposition characteristic.Due to that can realize that internal electrode 22 is 2 Ω cm low electricity below
Resistance rate, therefore the chip inductor of the loss electric power loop that is small, can be used for flowing through high current of the Joule heat of electrode can be provided
Device 1.Such as the rulers such as 1608 shapes (1.6mm × 0.8mm), 2520 shapes (2.5mm × 2.0mm) may be implemented in the shape of sheet
It is very little.
Illustrate the relevant several embodiments of the present invention below, but is not meant to limit the invention to shown in embodiment
Scheme.
(silver powder)
First, the silver powder as the main body as silver paste, the silver powder of Preparation Example 1~8.
The silver powder of example 1 and example 6 is the silver powder manufactured by atomization.The powder of the preparation larger example 1 of average grain diameter,
The powder of the example 6 smaller with average grain diameter.
The silver powder of example 2, example 7 and example 8 is the silver powder manufactured by damp process.Prepare the smaller example 8 of average grain diameter
The powder of powder and the larger example 2 and example 7 of average grain diameter.
The silver powder of 3~example of example 5 is the silver powder manufactured by PVD method.The powder of the preparation smaller example 3 of average grain diameter,
The powder of the powder and in-between example 4 of the larger example 5 of average grain diameter.
Moreover, measuring the calcination loss of these powder with following step, tap density, maximum draw ratio, specific surface area, putting down
Equal grain size, heap density and dry density.
[calcination loss (Ig-loss)]
Each silver powder is respectively weighed into about 25mg, is used differential thermobalance (Rigaku Corporation manufactures, TG8120)
Measure calcination loss.Determination condition is that drying temperature is set as 110 DEG C, relative to the quality of the sample after drying, from room temperature
The ratio (%) of Mass lost amount when being heated to 600 DEG C is used as calcination loss.It should be noted that it is dry empty to measure atmosphere
Gas, heating rate are set as 10 DEG C/min.By gained calcination loss column " Ig-loss " shown in table 1.
[tap density]
Each silver powder is respectively weighed into 20g (20.00 ± 0.02g), the graduated cylinder of input capacity 20mL passes through tapping device later
Jolt ramming.The condition of tapping is set as jolt ramming height：5cm, jolt ramming speed：100 beats/min, number of taps：1000 times.Then it surveys
Determine the powder volume after jolt ramming, the quality of silver powder divided by powder volume (apparent volume) after jolt ramming calculate tap density.
It should be noted that the measurement of tap density is based on JIS Z2512：Metal powder as defined in 2012-tap density assay method into
Row.By gained tap density " Tap density " column shown in table 1.
[maximum draw ratio]
By scanning electron microscope (KEYENCE CORPORATION the manufacture, VE-9800) observation of each silver powder, to 3
The visual field obtains the observation image of 10000 times of multiplying power.Then these observation images are respectively selected and is judged as maximum 3 silver
Particle measures draw ratio.Then using the average value of the draw ratio obtained for 9 particles of meter as maximum draw ratio.It needs
Bright, draw ratio is that the maximum major diameter (maximum length) for the Argent grain observed in image is set as a, is hung down with the maximum major diameter
When straight width is set as b, according to the index of the form calculating of " a/b ".It " most greatly enhances gained maximum draw ratio is shown in table 1
Diameter ratio " column.
[specific surface area]
The specific surface area of each silver powder using automatic specific surface area pore size distribution measurement device (Mac-View manufacture,
Macsorb HM model-1210) it measures.Nitrogen is used as adsorbed gas.In addition, specific surface area is calculated by BET1 point methods
Go out.By gained specific surface area " BET specific surface area " column shown in table 1.
[average grain diameter]
The average grain diameter of each silver powder is measured with electronics microscopic observation and laser diffraction scattering method both methods.
In electron microscope observation method, first, double faced adhesive tape is pasted on to the sample table of SEM observations, to relatively thin thereon
Ground sparsely supplies the silver powder of measure object, and powder is fixed on platform.It is then, gold-plated to being fixed with the platform implementation of silver powder,
It is installed on electron microscope (KEYENCE CORPORATION systems, VE-9800), in 10,000 times of accelerating potential 20kV, multiplying power
Under conditions of, particle can sparsely the powder on platform be fixed in shooting in existing powder end regions.Then, using image
Analytic expression particle size distribution software (Moundec Corporation systems, Mac-View Ver.4), from the particle of gained SEM
Image, the size distribution based on arbitrary 100 particles carry out automatic measurement.Accumulation 50% is found out by above-mentioned size distribution
Diameter, as the average grain diameter based on electron microscope observation.It the results are shown in " the D of table 1SEM50 " columns.
In addition, in laser diffraction scattering method, laser diffraction and scattering formula particle size distribution device (Co., Ltd. is used
Hole field makes manufactured, LA-920) automatic measurement granularity.Average grain diameter is the volume reference obtained by particle size distribution
50% grain size of accumulation in size distribution.Show the result in " the D of table 1L50 " columns.
[proportion]
Use dry type automatic densitometer (Shimadzu Scisakusho Ltd's manufacture, Micromeritics accpyc
II1340), the proportion of each silver powder is measured by constant volume plavini.Helium (He) is used as substitution gas.
By gained true specific gravity " proportion " column shown in table 1.
(silver paste)
Relative to 90 mass parts of ready silver powder, using as binder 1.5 mass parts of ethyl cellulose, as point
The ratios of 8.5 mass parts of butyl carbitol of dispersion media is compounded, and is mixed to uniform with 3 roller mills, to the silver of preparation example 1~8
Paste.It should be noted that in present embodiment, in order to keep the printing of the silver paste of each example consistent, become 350 with the viscosity of paste
The mode of~450Pas (10rpm, 25 DEG C) is adjusted.
[dry density]
The thickness that each silver paste is supplied on base material using coating device to about 150 μm, made it dry at 130 DEG C 1 hour from
And form dry coating.And the dry coating is dug out into the discoid of diameter 15mm and prepares 5 measurement samples.And it surveys
Weight, radius and the thickness of the fixed measurement sample calculate the density (dry density) of dry coating to be based on following formula.
(dry density)=(weight)/{ π × (radius)2× (thickness) }
1 weight and radius are respectively measured to each measurement sample.Thickness uses digital and electronic micrometer (Anritsu
Corporation manufactures, K351C), each measurement sample is measured at 3, using its average value.Dry density is used to be surveyed by 5
The average value (n=5) of the fixed value obtained with sample, " dry density " column shown in table 1.
(electrode)
The silver paste is subjected to pattern printing by silk screen print method on base material, after making it dry 30 minutes at 130 DEG C,
By roasting, silver wire electrode (calcining matter) is made on base material.As base material, alumina plate is used.In addition, silver paste is according to roasting
The form printing that line width afterwards is 200 μm, roasting thickness is the striated that spacing is 200 μm between 20~40 μm, line.Calcination temperature
It is set as 600 DEG C, 700 DEG C, 800 DEG C, 900 DEG C this 4 kinds.
Show the silver paste by example 4 (or example 5) with the section of silver electrode obtained from 900 DEG C of roastings in order to refer to, in Fig. 2
SEM pictures show in Fig. 3 the silver paste by example 7 (or example 3,6) with the section SEM pictures of silver electrode obtained from 900 DEG C of roastings.
[resistivity]
It is measured using Digital Multimeter (rock, which amounts to, surveys Co., Ltd.'s manufacture, SC-7401) as made above
The resistivity of silver-colored pattern wiring.By gained resistivity according to each calcination temperature " resistivity " column shown in table 1.
[table 1]
Table 1
As shown in table 1 like that, it is known that consider whole silver pastes calcination temperature and resistivity relationship when, have substantially in high temperature
It is lower to be roasted so as to form the tendency of the low electrode of resistivity.However it is found that if close to block silver point i.e. 962
DEG C 900 DEG C at roasted, then for a part of silver paste (example 7), resistivity can drastically be got higher.It is thought that due to being originated from
Organic matter, the gas contained in electrode interior, burning expansion occurs to form very great gap in electrode interior in they.
It is additionally contemplated that the combustion residue of the binder resin when organic matter of electrode interior, gas are originated from the silver powder used, roasting.
For using the silver paste of the example 2 for having character disclosed herein, example 4, the silver powder of example 5, it is known that, by relatively low
Roasting under temperature, can form the low electrode of resistivity.In addition, as shown in Figure 2, it is known that, thus locate disclosed silver paste shape
At electrode the gap remained in electrode it is small.In contrast, as shown in Figure 3, it is known that, it is formed by previous silver paste
Electrode forms very great gap in electrode.Therefore the formation of conductive path in the larger hindrance electrode in big gap can carry
The resistivity of high electrode, therefore it may be said that not preferably.
More specifically, for example, for example 2 silver paste, calcination temperature be less than 900 DEG C in the range of, even if be 600 DEG C
Low temperature, can also realize that the resistivity of the calcining matter obtained by roasting is the low in this way resistivity of 2.0 μ Ω cm or less.It can
Know, calcination temperature be 700 DEG C~800 DEG C in the range of, may be implemented calcining matter resistivity be 1.9 μ Ω cm or less this
The low resistivity of sample.
In addition, for the silver paste of example 4 and example 5, it is known that, in the range of calcination temperature is higher than 600 DEG C, it may be implemented by roasting
The resistivity for burning obtained calcining matter is 2.0 μ Ω cm or less (1.9 μ Ω cm or less) resistivity low in this way.And it can be with
Confirm, for the silver paste of example 4 and example 5, the resistivity of calcining matter when being roasted with 600 DEG C is also 2.1 μ Ω of lower value
cm。
In contrast, for the silver paste of example 1, based on the roasting at a high temperature of 800 DEG C~900 DEG C, although can obtain
More low-resistance calcining matter, but in a low temperature of 600 DEG C~700 DEG C compared with other examples, resistivity is got higher.Especially it is found that
In roasting at 600 DEG C, the resistivity of calcining matter becomes highest in full example.It is thought that the silver big due to being mixed into draw ratio
Particle, therefore, when roasting the movement of the big particle of draw ratio interfered, the fillibility of silver powder is impaired, as a result, roasting
It burns in object and forms larger gap.
For the silver paste of example 3, it is known that, how not influenced, can be stablized by the resistivity calcination temperature of calcining matter
Realize 2.1~2.3 μ Ω cm resistivity low in this way in ground.However, in order to realize the low resistance of 2.1 μ Ω cm, need 900
Roasting at DEG C, it is known that, low-resistance electrode based on low-temperature bake can not be carried out and formed.For what is used in the paste of example 3
Silver powder, it is known that since average grain diameter is small, specific surface area is high, and silver powder is easy aggregation, and therefore, tap density is low.It is thought that
Due to, character in this way, in the electrode in roasting, gap is also easy residual in the state of keeping being formed between Argent grain
It stays.
For the silver paste of example 6, it is known that, based on the roasting at a high temperature of 800 DEG C~900 DEG C, although can obtain relatively low
The calcining matter of resistance, but not as in example 1, compared with other examples based on the low-temperature bake at 600 DEG C, the resistance of calcining matter
Rate is got higher.For the silver powder of example 6, average grain diameter less becomes smaller, but there are the high particle of draw ratio, specific surface areas
It is high, it may be said that it is few to connect subglobular particle.Therefore, tap density is lower, it is believed that this is because, in electrode in roasting,
Gap is also easy residual in the state of keeping being formed between Argent grain.
For the silver paste of example 7 and example 8, the high calcining matter of resistivity can be integrally obtained and independent of calcination temperature.Recognize
For this is because, the silver powder of example 7 and 8 Ig-loss high, the volatile quantity of the organic principle in the roasting of electrode is also more, therefore,
It is easy to form gap in electrode.Ig-loss is few, for example, advantageous feature can also be become when the manufacture of MLCC, therefore it is preferred that.It needs
It is noted that when comparing between example 7 and the silver paste of example 8, the paste of example 8 uses finer silver powder.Result, it is believed that example 8
Silver paste agglutinating property it is high, reach slightly lower resistivity.
It should be noted that silver powder is characterized in that, the degree with character approximately according to its preparation method.For example, logical
Damp process, atomization etc. are crossed, whens in material liquid when forming silver powder comprising a large amount of protection materials etc., the silver powder of manufacture
Ig-loss can be got higher.In addition, according to PVD method, it can be easy to make the small silver powder of maximum draw ratio for being closer to spheroidal
End.However, as shown in above-mentioned example, it is known that, as the silver powder of electrode formation, it is not limited to preparation method, it can basis
The character of Argent grain itself and judge whether it is suitable.
It should be noted that meet the example 2 of character disclosed herein, example 4, the silver powder of example 5 proportion be 10.4g/
cm3More than.In addition we know, its drying is close to be realized when forming desciccator diaphragm for the silver paste of use example 2, example 4, the silver powder of example 5
Degree is 6.9g/cm3Above high value.So it is found that the silver powder for meeting character disclosed herein is being supplied in the form of paste
To on base material and formed electrode use it is particularly useful on the way.
More than, the specific example of the present invention is described in detail, these are only illustrated, and do not limit claim.For example, this
Field technology personnel are appreciated that in above-mentioned example the formula of silver paste is set as fixed value, the binder in the silver paste and dispersion
Agent is the ingredient by roasting burn-up and the difference according to print process and printing condition etc., is not generated to technology disclosed herein
Substantial influence.Technical solution recorded in claim includes carrying out various modifications and changes to the concrete example illustrated above and obtaining
The scheme arrived.
Reference sign
1 Stacked inductor
10 electronic component main bodys
12 dielectric layers
20 external electrodes
22 internal electrodes
Claims (10)
1. a kind of silver powder is the silver powder for the electrode for being used to form electronic component,
Meet the full terms of following (1)~(4)：
(1) calcination loss when being heated to 600 DEG C is 0.05% or less；
(2) tap density is 5g/cm3More than；
(3) maximum draw ratio is 1.4 or less；
(4) specific surface area based on BET method is 0.8m2/ g or less.
2. silver powder according to claim 1, wherein (5) average grain diameter based on electron microscope observation is 1 μm or more
And 3 μm or less.
3. silver powder according to claim 1 or 2, wherein (6) proportion is 10.4g/cm3More than.
4. a kind of silver paste, it includes：Silver powder according to any one of claims 1 to 3；Binder resin；With dispersion Jie
Matter.
5. silver paste according to claim 4 is configured in 700 DEG C or more and 800 DEG C temperature range roastings below
When the obtained resistivity of silver-colored calcining matter reach 2 μ Ω cm or less.
6. silver paste according to claim 4 or 5 is configured in 600 DEG C or more and 900 DEG C temperature range roastings below
The resistivity of the silver-colored calcining matter obtained when burning reaches 2.1 μ Ω cm or less.
7. the silver paste according to any one of claim 4~6 is configured in 600 DEG C or more and 800 DEG C of temperature below
The resistivity of the silver-colored calcining matter obtained when degree range roasting reaches 2 μ Ω cm or less.
8. a kind of electronic component has the calcining matter of the silver paste described in any one of claim 4~7 as electrode.
9. electronic component according to claim 8, wherein the resistivity of the electrode is 2 μ Ω cm or less.
10. electronic component according to claim 8 or claim 9, has：Ceramic base material；Be disposed in the ceramic base material
The internal electrode in portion,
Has the electrode as the internal electrode.
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| JP2015-253416 | 2015-12-25 | ||
| JP2015253416 | 2015-12-25 | ||
| PCT/JP2016/082442 WO2017110255A1 (en) | 2015-12-25 | 2016-11-01 | Silver powder, silver paste, and use therefor |
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| JP (1) | JP6158461B1 (en) |
| KR (1) | KR102505753B1 (en) |
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| CN113677458A (en) * | 2019-03-29 | 2021-11-19 | 大洲电子材料株式会社 | Mixed silver powder and conductive paste containing the same |
| CN113677458B (en) * | 2019-03-29 | 2024-03-29 | 大洲电子材料株式会社 | Mixed silver powder and conductive paste containing the same |
| CN111739675A (en) * | 2020-06-19 | 2020-10-02 | 潮州三环（集团）股份有限公司 | Thick film resistor paste |
| CN114255907A (en) * | 2021-12-23 | 2022-03-29 | 江苏飞特尔通信有限公司 | Conductive silver paste for low-temperature sintering LTCC and preparation method thereof |
Also Published As
| Publication number | Publication date |
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| KR20180099724A (en) | 2018-09-05 |
| WO2017110255A1 (en) | 2017-06-29 |
| TWI714681B (en) | 2021-01-01 |
| JPWO2017110255A1 (en) | 2017-12-21 |
| JP6158461B1 (en) | 2017-07-05 |
| CN108430670B (en) | 2020-04-24 |
| TW201734218A (en) | 2017-10-01 |
| KR102505753B1 (en) | 2023-03-06 |
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