CN108419370B - Auxiliary material attaching jig for circuit board and auxiliary material attaching technological method - Google Patents

Abstract

The application discloses auxiliary material laminating tool and laminating auxiliary material's technological method for circuit board, the auxiliary material is suitable for and establishes on the circuit board, and auxiliary material laminating tool includes: base, gland and pad pasting. The base is provided with a placing part suitable for placing the circuit board, the gland is suitable for being covered on the base, the pad pasting is arranged on the surface of the gland, which faces the base, and the auxiliary material is suitable for being pre-pasted on the pad pasting. According to the application, a base and a gland for circuit board, when utilizing this auxiliary material laminating tool to paste the auxiliary material and establish on the circuit board, can place the circuit board on the portion of placing of base, can once only paste the auxiliary material through the pad pasting and establish on the circuit board, and make the auxiliary material laminating in the corresponding position on the circuit board through exerting pressure to the gland, thereby can once only laminate the completion with the position of all required laminating auxiliary materials on the circuit board, the operating efficiency of this laminating tool is high, with low costs and the quality is secure.

Description

Auxiliary material lamination fixture for circuit boards and process method for laminating auxiliary materials

technical field

The present application relates to the technical field of manufacture of electronic equipment, and in particular, to an auxiliary material laminating jig for circuit boards and a process method for laminating auxiliary materials.

Background technique

After the SMT placement of the circuit board is completed, it is generally necessary to attach accessories on the circuit board, such as foam and other accessories on the circuit board. The accessories are generally attached around the components on the circuit board. The components play a protective role (for example, it has the function of dustproof and waterproof).

In the related art, there are tweezers used to manually attach the accessories, and some automated equipment is used to automatically attach the accessories. Both of the above two methods of pasting accessories have their own shortcomings. Manual single pasting of accessories is inefficient and has no guarantee of quality; automatic accessory pasting requires automatic equipment for pasting accessories, which requires a long lead-in cycle and high cost.

SUMMARY OF THE INVENTION

The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an auxiliary material laminating jig for a circuit board, the auxiliary material laminating jig has high operation efficiency, low cost and guaranteed quality.

The present application also proposes a process method for laminating auxiliary materials by applying the above-mentioned auxiliary materials to a jig.

According to an auxiliary material laminating jig for a circuit board according to an embodiment of the present application, the auxiliary material is suitable for being arranged on the circuit board, and the auxiliary material laminating jig includes: a base, and the base has a structure suitable for placing the The placement part of the circuit board; a press cover, which is suitable for being placed on the base; a film, which is provided on the surface of the press cover facing the base, and the auxiliary material is suitable for pre-processing affixed on the film.

According to the auxiliary material laminating jig for circuit boards according to the embodiments of the present application, through the provided base and pressing cover, when the auxiliary material laminating jig is used to attach the auxiliary material on the circuit board, the circuit board can be placed on the base On the placement part of the circuit board, the accessories can be placed on the circuit board at one time through the film, and the accessories can be attached to the corresponding positions on the circuit board by applying pressure to the gland, so that all the accessories on the circuit board that need to be attached to the accessories can be attached to the circuit board. The position is completed at one time, and the lamination jig has high operation efficiency, low cost and guaranteed quality.

According to the embodiment of the second aspect of the present application, the process method for laminating auxiliary materials using the above-mentioned auxiliary material laminating jig includes the following steps: placing the circuit board on the placing part of the base; placing the auxiliary materials in a preset position and order affixed to the film; set the gland cover on the circuit board and apply pressure to the gland, so that the accessories are pasted on the corresponding position on the circuit board; lift the gland , the film is peeled off from the circuit board at the same time, and the auxiliary material is attached to the circuit board; the circuit board with the auxiliary material is removed.

According to the process method for laminating auxiliary materials according to the embodiments of the present application, the above-mentioned auxiliary materials are used to attach the jig, and all the auxiliary materials required on the circuit board are firstly attached to the film, and the required auxiliary materials on the circuit board are firstly attached to the film through the film. The accessories are attached to the corresponding positions on the circuit board, so that all the positions on the circuit board that need to be attached to the accessories can be pasted at one time, and the film and the accessories are easy to peel off, making the accessories efficient and easy to fit. Operation and fit quality are guaranteed.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic diagram of an auxiliary material bonding jig for a circuit board according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a hinge structure of an accessory laminating jig for a circuit board according to an embodiment of the present application;

3 is a schematic diagram of the arrangement of accessories attached to a film according to an embodiment of the present application;

FIG. 4 is a schematic diagram of the use of an auxiliary material bonding jig for a circuit board according to an embodiment of the present application.

Reference number:

Auxiliary material fitting fixture 100;

The base 1; the placing part 11; the first positioning column 12; the second positioning column 13; the hand position 14;

Press cover 2; first positioning hole 21; buckle handle 22; buffer layer 23; avoidance hole 24;

Hinge structure 3; first hinge part 31; first shaft sleeve 311; first fixed part 312; second hinge part 32; second shaft sleeve 321; second fixed part 322;

film 4;

Circuit board 200 ; accessories 300 ; escape holes 301 .

Detailed ways

The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientations or positional relationships indicated by "radial direction", "circumferential direction", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying the indicated devices or elements. It must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present application. Furthermore, features delimited with "first", "second" may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The following describes an auxiliary material bonding jig 100 for a circuit board according to an embodiment of the present application with reference to FIGS. 1 to 4 .

As shown in FIG. 1 to FIG. 4 , according to the auxiliary material laminating jig 100 for circuit boards according to the embodiment of the first aspect of the present application, the auxiliary material 300 is suitable for being arranged on the circuit board 200 , and the auxiliary material 300 may be a foam piece or the like. , the auxiliary material 300 is suitable for sticking around the components on the circuit board 200, and can protect the components, for example, can play the role of dustproof and waterproof.

Specifically, referring to FIG. 1 and FIG. 4 , the accessory fitting jig 100 includes: a base 1 and a pressing cover 2 , the base 1 has a placing portion 11 suitable for placing a circuit board 200 , and the circuit board 200 can be placed on the base 1 . On the placing portion 11 , the circuit board 200 can be positioned on the placing portion 11 through the positioning structure, and the pressing cover 2 is suitable for being placed on the base 1 . The circuit board 200 may be an FPC board, and the circuit board 200 may be a single board or a panel. The base 1 may be provided with one placing portion 11 or a plurality of placing portions 11 . When a plurality of placing parts 11 are provided on the base 1 , a plurality of circuit boards 200 can be placed on the base 1 at the same time.

The sticking film 4 is arranged on the surface of the pressing cover 2 facing the base 1 , and the auxiliary material 300 is suitable for pre-sticking on the sticking film 4 . The accessories 300 that need to be attached on the circuit board 200 can be pre-attached on the film 4 , and the accessories 300 are pre-attached on the film 4 according to the arrangement of the accessories 300 on the circuit board 200 .

Referring to FIGS. 1 to 4 , when the auxiliary material 300 is pasted using the above-mentioned auxiliary material laminating jig 100 , the circuit board 200 can be placed on the placing portion 11 of the base 1 and can be positioned by the positioning structure, and then the circuit board 200 can be positioned on the All the auxiliary materials 300 required are pre-attached on the film 4 according to the preset position and quantity, and the film 4 and the auxiliary materials 300 can be peeled off in the later stage. stripped.

After all the accessories 300 required for the circuit board 200 are pre-pasted on the film 4 in a preset arrangement, the cover 2 is placed on the circuit board 200 and pressure is applied to the cover 2, so that all the materials on the film 4 are covered. All the accessories 300 can be attached to corresponding positions on the circuit board 200 . After the auxiliary material 300 is attached to the circuit board 200 , the press cover 2 is lifted upwards. At this time, the film 4 on the press cover 2 is also peeled off from the circuit board 200 , and the film 4 is separated from the auxiliary material 300 attached to the circuit board 200 . Finally, the circuit board 200 attached to the auxiliary material 300 is removed, so as to complete the attaching work of the auxiliary material 300 of the circuit board 200 . The laminating jig has high operation efficiency, low cost and guaranteed quality.

It should be noted that, referring to FIG. 3 , the surface of the auxiliary material 300 facing the circuit board 200 has avoidance holes 301 for avoiding components at corresponding positions on the circuit board 200 . When the auxiliary material 300 is attached to the circuit board 200 , the auxiliary material 300 Fitted around the corresponding components to protect the components.

Optionally, the base 1 may be an aluminum alloy. As a result, the base 1 will not easily move during mounting and operation.

Optionally, the press cover 2 may be a bakelite piece. As a result, the operation of the press cover 2 is relatively easy, and the labor intensity of the operator is reduced.

According to the auxiliary material bonding jig 100 for a circuit board according to the embodiment of the present application, when the auxiliary material bonding jig 100 is used to attach the auxiliary material 300 on the circuit board 200 through the provided base 1 and the pressing cover 2, the auxiliary material 300 can be attached to the circuit board 200. By placing the circuit board 200 on the placement portion 11 of the base 1 , the auxiliary material 300 can be attached to the circuit board 200 at one time through the film 4 , and the auxiliary material 300 can be attached to the circuit board 200 by applying pressure to the cover 2 . Therefore, all the positions on the circuit board 200 that need to be attached with the auxiliary material 300 can be attached at one time, and the attachment jig has high operation efficiency, low cost and guaranteed quality.

According to some embodiments of the present application, the sticking film 4 is detachably provided on the pressing cover 2 . Therefore, when the sticking film 4 is damaged during repeated use, it is convenient to replace the sticking film 4 with a new one.

According to some embodiments of the present application, the sticker film 4 may be a release film. Thus, the sticker film 4 is easier to peel off from the circuit board 200 and the auxiliary material 300 .

Further, the thickness of the release film may be 0.1 mm. In this way, the release film has a certain strength to meet the needs of use, and at the same time, it can be avoided that the thickness of the release film is too large to affect the bonding effect of the auxiliary material 300 .

According to some embodiments of the present application, referring to FIGS. 1 and 4 , the surface of the gland 2 facing the base 1 is provided with a buffer layer 23 , and the projection of the placement portion 11 on the horizontal plane is within the projection of the buffer layer 23 on the horizontal plane. Therefore, the buffer layer 23 provided on the press cover 2 can play a buffering role when the press cover 2 is covered on the base 1 , so that the circuit board 200 can be better protected. In addition, the area of the buffer layer 23 is made larger than the area of the placement portion 11 on which the circuit board 200 is placed, so that the entire circuit board 200 can be well protected. Optionally, the buffer layer 23 may be a silicone pad or a sponge pad.

According to some optional embodiments of the present application, an installation groove is formed on the surface of the press cover 2 facing the base 1 , and the buffer layer 23 is provided in the installation groove. In this way, the installation of the buffer layer 23 is facilitated, and it can be avoided that the surface of the buffer layer 23 protruding from the gland 2 is too high to affect the pressing effect of the gland 2 . Optionally, the buffer layer 23 may be glued in the mounting groove.

According to some embodiments of the present application, referring to FIG. 1 and FIG. 4 , the base 1 is provided with a plurality of first positioning columns 12 , and the press cover 2 is formed with a plurality of first positioning columns 12 arranged in a one-to-one correspondence with the first positioning columns 12 . A positioning hole 21 . Therefore, through the cooperation of the first positioning post 12 and the first positioning hole 21, the gland 2 can be conveniently connected and positioned on the base 1, and the lifting and pressing operations of the gland 2 can be facilitated.

For example, in the example of FIG. 1 and FIG. 4 , the base 1 and the press cover 2 are both rectangular, the first positioning columns 12 are four and are located at the four corners of the base 1 respectively, and the first positioning holes 21 are four and respectively It is located at the four corners of the cover 2, so that the cover 2 and the base 1 can be evenly pressed and positioned.

According to some embodiments of the present application, referring to FIGS. 1 , 3 and 4 , a plurality of second positioning posts 13 are provided on the base 1 , and a plurality of second positioning posts 13 are formed on the circuit board 200 in a one-to-one correspondence with the plurality of second positioning posts 13 . A plurality of second positioning holes, and a plurality of avoidance holes 24 corresponding to the plurality of second positioning columns 13 are formed on the press cover 2 in a one-to-one manner. When positioning the circuit board 200 on the placement portion 11 of the base 1 , the second positioning posts 13 on the base 1 pass through the second positioning holes on the circuit board 200 and the avoidance holes 24 on the cover 2 in sequence. Therefore, through the cooperation of the second positioning post 13 and the second positioning hole, the circuit board 200 can be conveniently connected and positioned on the base 1, and the positioning and removal operations of the circuit board 200 can be facilitated.

For example, in the examples of FIG. 1 and FIG. 4 , the base 1 , the pressing cover 2 and the circuit board 200 are all rectangular, the above-mentioned buffer layer 23 is provided on the pressing cover 2 , the buffer layer 23 is also rectangular, and the second positioning column 13 is Four are located on two opposite sides of the placing portion 11 , the second positioning holes are four and are located on two opposite sides of the circuit board 200 , the avoidance holes 24 are four and are located on two opposite sides of the buffer layer 23 , the The avoidance hole 24 penetrates through the buffer layer 23 and the portion corresponding to the press cover 2 , so that the circuit board 200 can be stably positioned on the base 1 .

According to some embodiments of the present application, the bottom surface of the base 1 is provided with a plurality of anti-skid pads, and the plurality of anti-skid pads are distributed along the circumference of the base 1 at intervals. In this way, the base 1 can be prevented from sliding during the operation, and the fitting quality of the auxiliary material 300 can be ensured. For example, when the base 1 is formed into a rectangle, the above-mentioned anti-skid pads may be four, and the four anti-skid pads are located at the four corners of the bottom surface of the base 1 respectively, so that the structure of the base 1 can be symmetrical and stable. Optionally, the anti-skid pads can be rubber pieces.

According to some embodiments of the present application, referring to FIG. 1 and FIG. 4 , the base 1 is formed with a handle position 14 , and the handle position 14 is a groove formed on the base 1 . The groove can be a rectangle. Part 11 of the groove is located below the circuit board 200 . Thus, the pick-and-place operation of the circuit board 200 is facilitated.

According to some embodiments of the present application, referring to FIGS. 1 and 4 , the pressing cover 2 is provided with a clasp part 22 , and the clasp part 22 is a lug formed on the pressure cover 2 . Thereby, the lifting and pressing operations of the press cover 2 are facilitated.

According to some embodiments of the present application, referring to FIGS. 1 and 4 , the press cover 2 is rotatably connected to the base 1 , and the press cover 2 can be rotatably connected to one side of the base 1 . Therefore, the lifting and pressing actions of the pressing cover 2 can be conveniently realized by rotating the pressing cover 2 , and the separation and loss of the pressing cover 2 from the base 1 can be prevented.

According to some optional embodiments of the present application, referring to FIG. 1 , FIG. 2 and FIG. 4 , the press cover 2 and the base 1 are rotatably connected by a hinge structure 3 , and the hinge structure 3 includes a rotating shaft, a first hinge portion 31 and The second hinge part 32, the first hinge part 31 has a first sleeve 311 which is matched with the rotating shaft and has a first fixing part 312 which is connected with the base 1, and the second hinge part 32 has a second shaft which is matched with the rotating shaft The sleeve 321 has a second fixing part 322 connected with the pressing cover 2 . Therefore, the hinge structure 3 provided can conveniently realize the rotational connection between the press cover 2 and the base 1 .

For example, in the examples shown in FIGS. 1 , 2 and 4 , the cover 2 and the base 1 are rotatably connected through the hinge structure 3 , and the cover 2 is also provided with the above-mentioned buckle portion 22 . 22 and the hinge structure 3 are respectively located on opposite sides of the cover 2, so that the lifting and pressing operations of the cover 2 are more convenient and labor-saving.

According to the embodiment of the second aspect of the present application, the process method for laminating auxiliary materials using the above-mentioned auxiliary material laminating jig 100 includes the following steps:

Place the circuit board 200 on the placing portion 11 of the base 1, for example, the circuit board 200 can be positioned on the base 1 through the cooperation of the first positioning post 12 and the first positioning hole 21 described above;

The auxiliary material 300 is attached to the film 4 in a preset position and sequence, and the auxiliary material 300 can be attached to the low-viscosity surface of the film 4, so that the auxiliary material 300 can be temporarily fixed on the film 4 and can be easily peeled off;

Cover the cover 2 on the circuit board 200 (for example, by turning the cover 2 to cover the cover 2 on the circuit board 200) and apply pressure to the cover 2 to make the auxiliary material 300 firmly adhere to the circuit board 200. corresponding position;

Lift the cover 2 (for example, by turning the cover 2 to lift the cover 2 upward), the film 4 is peeled off from the circuit board 200 at the same time, and the auxiliary material 300 is attached to the circuit board 200. At this time, the attachment of the auxiliary material 300 to the circuit is completed. operations on board 200;

Remove the circuit board 200 with the accessories 300 attached, and the whole process can be completed in about 10 seconds.

According to the process method for laminating auxiliary materials according to the embodiments of the present application, the above-mentioned auxiliary materials are used to attach the jig 100, and the auxiliary materials 300 required on the circuit board 200 are firstly attached to the sticker film 4, and the sticker film 4 once The auxiliary materials 300 required on the circuit board 200 are all attached to the corresponding positions on the circuit board 200 , so that all the positions on the circuit board 200 that need to be attached with the auxiliary materials 300 can be pasted at one time. It is easy to peel off, so that the attachment efficiency of the auxiliary material 300 is high, the operation is easy, and the lamination quality is guaranteed.

Optionally, the surface of the auxiliary material 300 suitable for sticking with the circuit board 200 is covered with easily peelable fiber paper for protection. The sticking film 4 of the auxiliary material 300 covers the circuit board 200 . Therefore, the above-mentioned fiber paper can protect the sticking surface of the auxiliary material 300 (that is, the surface of the auxiliary material 300 suitable for sticking with the circuit board 200 ), so that the sticking surface of the auxiliary material 300 can keep a good stickiness, so as to ensure the auxiliary material The fibrous paper 300 can be reliably attached to the circuit board 200 , and the fiber paper is easy to peel off. When the auxiliary material 300 is attached to the circuit board 200 , the fiber paper can be peeled off from the auxiliary material 300 .

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (19)

1. The utility model provides an auxiliary material laminating tool for circuit board, a serial communication port, the auxiliary material is suitable for and establishes on the circuit board, auxiliary material laminating tool includes:

a base having a placing portion adapted to place the circuit board thereon;

the gland is suitable for being covered on the base;

the adhesive film is arranged on the surface of the gland facing the base, and the auxiliary material is suitable for being pre-attached to the adhesive film;

the circuit board is characterized in that the circuit board is provided with a plurality of auxiliary materials, the auxiliary materials are arranged in advance according to preset arrangement and are attached to the film, the gland cover is arranged on the circuit board and applies pressure to the gland, so that all the auxiliary materials on the film are attached to corresponding positions on the circuit board, the gland is lifted upwards after the auxiliary materials are attached to the circuit board, the film on the gland is also peeled off from the circuit board, the film is separated from the auxiliary materials attached to the circuit board, and finally the circuit board attached to the auxiliary materials is taken down.

2. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein the adhesive film is detachably provided on the press cover.

3. The auxiliary material attaching jig for the circuit board according to claim 1, wherein the adhesive film is a release film.

4. The auxiliary material attaching jig for the circuit board according to claim 3, wherein the thickness of the release film is 0.1 mm.

5. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein a buffer layer is provided on a surface of the pressing cover facing the base, the adhesive film is provided on a surface of the buffer layer facing the base, and a projection of the placing portion on a horizontal plane is located within a projection of the buffer layer on the horizontal plane.

6. The auxiliary material attaching jig for the circuit board as claimed in claim 5, wherein a mounting groove is formed on a surface of the pressing cover facing the base, and the buffer layer is provided in the mounting groove.

7. The auxiliary material attaching jig for the circuit board as claimed in claim 5, wherein the buffer layer is a silica gel pad or a sponge pad.

8. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein a plurality of first positioning posts are provided on the base, and a plurality of first positioning holes are formed on the pressing cover in one-to-one correspondence with the plurality of first positioning posts.

9. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein a plurality of second positioning posts are provided on the base, a plurality of second positioning holes are formed on the circuit board in one-to-one correspondence with the plurality of second positioning posts, and a plurality of avoiding holes are formed on the pressing cover in one-to-one correspondence with the plurality of second positioning posts.

10. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein a plurality of anti-slip pads are provided on a bottom surface of the base, and the plurality of anti-slip pads are spaced apart from each other in a circumferential direction of the base.

11. The auxiliary material attaching jig for the circuit board according to claim 10, wherein the non-slip mat block is a rubber member.

12. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein the base is an aluminum alloy member.

13. The auxiliary material attaching jig for the circuit board according to claim 1, wherein the pressing cover is an electric wood piece.

14. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein a hand-taking position is formed on the base, the hand-taking position is a groove formed on the base, and when the circuit board is placed on the placing portion, a part of the groove is located below the circuit board.

15. The auxiliary material attaching jig for the circuit board as claimed in claim 1, wherein the pressing cover is provided with a hand fastening portion, and the hand fastening portion is a lug formed on the pressing cover.

16. An auxiliary material attaching jig for a circuit board according to any one of claims 1 to 15, wherein said pressing cover is rotatably attached to said base.

17. The auxiliary material attaching jig for the circuit board as claimed in claim 16, wherein the press cover and the base are rotatably connected through a hinge structure, the hinge structure includes a rotating shaft, a first hinge portion and a second hinge portion, the first hinge portion has a first shaft sleeve matched with the rotating shaft and has a first fixing portion connected with the base, and the second hinge portion has a second shaft sleeve matched with the rotating shaft and has a second fixing portion connected with the press cover.

18. A process method for attaching an auxiliary material by using the auxiliary material attaching jig according to any one of claims 1 to 17, comprising the steps of:

placing the circuit board on a placing part of the base;

attaching the auxiliary materials to the sticking film according to a preset position and a preset sequence;

covering the pressing cover on the circuit board and applying pressure to the pressing cover so as to enable the auxiliary materials to be pasted on the corresponding positions on the circuit board;

lifting the gland, peeling the sticking film from the circuit board at the same time, and sticking the auxiliary material on the circuit board;

and taking down the circuit board pasted with the auxiliary materials.

19. The process method for attaching auxiliary materials according to claim 18, wherein the surface of the auxiliary material to which the circuit board is attached is covered with easily peelable fiber paper for protection, the fiber paper on the auxiliary material is peeled off after the auxiliary material is attached to the film, and then the cover is covered on the circuit board.

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