CN108381045B - Laser cutting method and laser cutting equipment - Google Patents
Laser cutting method and laser cutting equipment Download PDFInfo
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- CN108381045B CN108381045B CN201810170616.1A CN201810170616A CN108381045B CN 108381045 B CN108381045 B CN 108381045B CN 201810170616 A CN201810170616 A CN 201810170616A CN 108381045 B CN108381045 B CN 108381045B
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- cutting table
- cutting
- display screen
- motherboard
- laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
Abstract
The invention discloses a laser cutting method and laser cutting equipment, and belongs to the technical field of display. The laser cutting apparatus includes: the mother board moving assembly comprises a first cutting table, a second cutting table and a laser assembly, wherein the bearing surfaces of the first cutting table and the second cutting table are arranged oppositely and parallelly; the mother board moving assembly is used for moving the display screen mother board to the first cutting table, the first cutting table is used for fixedly attaching the first surface to the bearing surface of the first cutting table, and the laser assembly is used for carrying out laser cutting on the protective layer from the side where the second surface is located; the motherboard moving assembly is further used for moving the display screen motherboard to a second cutting table, the second cutting table is used for attaching and fixing a second face to the bearing face of the second cutting table, the laser assembly is used for carrying out laser cutting on the motherboard body from the side where the first face is located, the first face is the face of the motherboard body away from the protective layer, and the second face is the face of the protective layer away from the motherboard body. The invention solves the problem of low universality of the cutting table in the related technology. The cutting method is used for cutting the display screen mother board.
Description
Technical Field
The invention relates to the technical field of display, in particular to a laser cutting method and laser cutting equipment.
Background
At present, in the manufacturing process of a display screen, a display screen mother board is generally manufactured on a substrate, the display screen mother board includes a plurality of display screens arranged in an array, and then the display screen mother board is cut to obtain the display screen. The display screen motherboard generally includes a motherboard body and a protective layer disposed on one side of the motherboard body.
In the related art, a flexible display screen motherboard is generally cut by a laser cutting process to obtain a plurality of flexible display screens, and the cutting process includes: placing the display screen mother board on a cutting table, so that one surface, away from the protective layer, of the mother board body is attached to a bearing surface of the cutting table, and the cutting table is provided with adsorption holes and grooves, wherein the adsorption holes are used for adsorbing the display screen mother board to ensure the flatness of the display screen mother board, and the positions of the grooves correspond to the cutting positions of the mother board body one by one; cutting the protective layer by adopting a first laser beam; after the protective layer is cut, cutting the mother board body by adopting a second laser beam; and stripping the protective layer to obtain a plurality of display panels. In order to ensure that the mother board body can be separated after cutting, the second laser beam is adopted to cut the mother board body, the cutting table and the mother board body are not damaged by the design of the groove on the cutting table.
However, because the cutting positions of the motherboard bodies of different display products are different, the positions of the grooves on the cutting table for bearing the display screen motherboard need to be correspondingly arranged, so that different cutting tables need to be designed for different display products in the related art, and the universality of the cutting table is low.
Disclosure of Invention
The embodiment of the invention provides a laser cutting method and laser cutting equipment, which can solve the problem of low universality of a cutting table in the related technology. The technical scheme is as follows:
in one aspect, a laser cutting device is provided for cutting a display screen mother board, the display screen mother board includes a mother board body and sets up the protective layer of one side of the mother board body, the display screen mother board has relative first face and second face, first face does the mother board body is kept away from the one face of protective layer, the second face does the protective layer is kept away from the one face of mother board body, the laser cutting device includes: the mother board moving assembly comprises a first cutting table, a second cutting table and a laser assembly, wherein the bearing surfaces of the first cutting table and the second cutting table are arranged oppositely and parallelly;
the mother board moving assembly is used for moving the display screen mother board to a first cutting table, the first cutting table is used for attaching and fixing the first surface and a bearing surface of the first cutting table, and the laser assembly is used for carrying out laser cutting on the protective layer from the side where the second surface is located;
the motherboard moving assembly is further used for moving the display screen motherboard to a second cutting table, the second cutting table is used for attaching and fixing the second face to the bearing face of the second cutting table, and the laser assembly is used for carrying out laser cutting on the motherboard body from the side where the first face is located.
Optionally, the laser assembly includes a first laser and a second laser, the first laser is disposed on a side of the second cutting table away from the first cutting table, and the second laser is disposed on a side of the first cutting table away from the second cutting table;
the first laser is used for carrying out laser cutting on the protective layer from the side of the second face;
the second laser is used for carrying out laser cutting on the motherboard body from the side of the first face.
Optionally, the motherboard moving assembly is configured to move in a direction perpendicular to the carrying surface, and the laser cutting apparatus further includes a cutting table moving assembly;
the cutting table moving assembly is for moving at least one of the first cutting table and the second cutting table.
Optionally, the cutting table moving assembly comprises a first cutting table moving part and a second cutting table moving part;
the first cutting table moving part is used for moving the first cutting table;
the second cutting table moving section is for moving the second cutting table.
Optionally, the motherboard moving assembly includes at least two moving support frames arranged oppositely, and each moving support frame is used for fixing the edge of the display screen motherboard, so that the display screen motherboard is located between the bearing surface of the first cutting table and the bearing surface of the second cutting table.
Optionally, each of the movable supporting frames is a telescopic supporting frame.
Optionally, the first cutting table and the second cutting table are arranged in a staggered manner, and the laser cutting equipment further includes a sliding assembly;
the sliding assembly is used for moving the motherboard moving assembly along a direction parallel to the bearing surface.
Optionally, the bearing surfaces of the first cutting table and the second cutting table are provided with adsorption holes which are uniformly distributed, and the adsorption holes are used for adsorbing and fixing the display screen mother board.
In another aspect, a laser cutting method is provided, the method including:
providing a display screen mother board to be cut, wherein the display screen mother board comprises a mother board body and a protective layer arranged on one side of the mother board body, the display screen mother board is provided with a first surface and a second surface which are opposite, the first surface is the surface of the mother board body far away from the protective layer, and the second surface is the surface of the protective layer far away from the mother board body;
the display screen mother board is moved to a first cutting table through a mother board moving assembly, so that the first surface is fixedly arranged on a bearing surface of the first cutting table;
carrying out laser cutting on the protective layer from the side where the second surface is located through a laser assembly;
moving the display screen motherboard to a second cutting table through the motherboard moving assembly so that the second face is fixedly arranged on the bearing surface of the second cutting table, wherein the bearing surface of the second cutting table is opposite to and parallel to the bearing surface of the first cutting table;
and carrying out laser cutting on the motherboard body from the side of the first surface through the laser assembly.
Optionally, the moving assembly of the display screen motherboard to the first cutting table includes:
moving at least one of the first cutting table and the second cutting table through a cutting table moving assembly, so that after the cutting table is moved, the orthographic projection of the bearing surface of the first cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the second cutting table on the display screen motherboard does not overlap with the display screen motherboard;
moving the display screen mother board to the first cutting table along a direction perpendicular to the bearing surface through the mother board moving assembly;
the moving the display screen motherboard to a second cutting table by the motherboard moving assembly includes:
moving the first cutting table and the second cutting table through the cutting table moving assembly, so that after the cutting table moves, the orthographic projection of the bearing surface of the second cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the first cutting table on the display screen motherboard does not have an overlapped part with the display screen motherboard;
and moving the display screen mother board to the second cutting table along the direction vertical to the bearing surface through the mother board moving assembly.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
according to the laser cutting method and the laser cutting equipment provided by the embodiment of the invention, the laser cutting equipment comprises a first cutting table and a second cutting table, wherein the bearing surfaces of the first cutting table and the second cutting table are opposite and parallel to each other; when the different display screen motherboards of cutting, compare with correlation technique, on the one hand, practiced thrift the cost of manufacture of cutting bed, on the other hand need not to change the cutting bed, has improved cutting efficiency.
Drawings
FIG. 1 is a schematic view of a cutting table of the related art;
fig. 2 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another laser cutting apparatus provided in an embodiment of the present invention;
fig. 4A is a schematic diagram of a protective layer cutting according to an embodiment of the present invention;
fig. 4B is a schematic diagram of a cutting motherboard body according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of another laser cutting apparatus provided in an embodiment of the present invention;
FIG. 6 is a flow chart of a laser cutting method according to an embodiment of the present invention;
fig. 7 is a flowchart of another laser cutting method according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
At present, in the manufacturing process of a flexible display screen, a flexible display screen mother board is generally cut by a laser cutting process to obtain a plurality of flexible display screens, as shown in fig. 1, the display screen mother board 101 includes a mother board body 101a and a protective layer 101b arranged on one side of the mother board body 101a, when the display screen mother board is cut, the display screen mother board 101 is placed on a cutting table 102, so that one surface of the mother board body 101a, which is far away from the protective layer 101b, is attached to a bearing surface of the cutting table 102, an adsorption hole 102a and a groove 102b are arranged on the cutting table 102, wherein the adsorption hole 102a is used for adsorbing the display screen mother board 101 to ensure the flatness of the display screen mother board, and the positions of the grooves 102b correspond to the cutting positions of the mother board body. However, because the cutting positions of the mother board bodies of different display products are different, and the positions of the grooves on the cutting table for bearing the display screen mother board need to be correspondingly arranged, different cutting tables need to be designed for different display products in the related art, the universality of the cutting table is lower, the manufacturing cost of the cutting table is higher, and the occupied placing space is larger; in addition, the cutting table needs to be frequently replaced when different display screen mother boards are cut, so that the cutting efficiency is low.
The embodiment of the present invention provides a laser cutting device, which is used for cutting a display screen motherboard, as shown in fig. 2, the display screen motherboard 20 includes a motherboard body 201 and a protection layer 202 disposed on one side of the motherboard body 201, the display screen motherboard 20 has a first surface and a second surface opposite to each other, the first surface is a surface of the motherboard body 201 away from the protection layer 202, the second surface is a surface of the protection layer 202 away from the motherboard body 201, and the laser cutting device includes: a motherboard moving assembly 301, first and second cutting tables 302 and 303 with opposite and parallel bearing surfaces, and a laser assembly 304.
The motherboard moving assembly 301 may be configured to move the display screen motherboard 20 to the first cutting table 302, the first cutting table 302 is configured to attach and fix the first surface to the bearing surface of the first cutting table 302, and the laser assembly 304 is configured to perform laser cutting on the protective layer 202 from the side where the second surface is located.
The motherboard moving assembly 301 can also be used for moving the display screen motherboard 20 to a second cutting table 303, the second cutting table 303 is used for attaching and fixing the second face to the bearing surface of the second cutting table 303, and the laser assembly 304 is used for performing laser cutting on the motherboard body 201 from the side where the first face is located.
Alternatively, as shown in fig. 2, the laser assembly 304 may include a first laser 304a and a second laser 304b, the first laser 304a being disposed on a side of the second cutting table 303 remote from the first cutting table 302, the second laser 304b being disposed on a side of the first cutting table 302 remote from the second cutting table 303.
The first laser 304a is used for performing laser cutting on the protection layer 202 from the side of the second surface;
the second laser 304b is used to laser cut the motherboard body 201 from the side of the first face.
In practical application, the laser assembly may also include a laser, that is, the first laser and the second laser are the same laser, and when laser cutting needs to be performed on the protection side from the side where the second face is located, the laser is arranged on the side, away from the first cutting table, of the second cutting table; when the mother board body needs to be subjected to laser cutting from the side where the first face is located, the laser is arranged on one side, away from the second cutting table, of the first cutting table. The number of lasers included in the laser assembly is not limited in the embodiment of the invention.
Optionally, the first laser and the second laser may be the same in type or different in type, and the laser component may include at least one of a carbon dioxide laser, an ultraviolet nanosecond laser, an ultraviolet picosecond laser, and an infrared femtosecond laser.
Optionally, the motherboard body may be a flexible display panel motherboard, such as an Organic Light-Emitting Diode (OLED) display panel motherboard or a Quantum Dot Light-Emitting Diode (QLED) display panel motherboard. The display screen motherboard formed by the motherboard body and the protective layer can be a flexible motherboard or a rigid motherboard, which is not limited in the embodiment of the invention.
In practical application, the protective layer in the display screen mother board is arranged on one side of the light-emitting surface of the mother board body, the protective layer is peeled off to obtain a plurality of display panels after the mother board body is cut, in order to avoid damage to the display panels when the protective layer is peeled off, the adhesion force between the protective layer and the mother board body cannot be too large, for example, the protective layer can be made of Polyethylene terephthalate (PET).
In summary, the laser cutting apparatus provided by the embodiment of the present invention includes the first cutting table and the second cutting table, in which the bearing surfaces are opposite and parallel to each other, when the protection layer is cut, the display screen motherboard can be disposed on the first cutting table, when the motherboard body is cut, the display screen motherboard can be disposed on the second cutting table, and since one surface of the protection layer, which is far away from the motherboard body, is attached to the bearing surface of the second cutting table when the motherboard body is cut, the protection layer can bear over-etching within a certain range when the motherboard body is cut over-etching, so that a groove does not need to be disposed at a corresponding position of the second cutting table, the laser cutting apparatus provided by the embodiment of the present invention can be used for cutting different display products, and has high versatility; when the different display screen motherboards of cutting, compare with correlation technique, on the one hand, practiced thrift the cost of manufacture of cutting bed, on the other hand need not to change the cutting bed, has improved cutting efficiency.
Optionally, as shown in fig. 2, the bearing surfaces of the first cutting table and the second cutting table are respectively provided with uniformly distributed adsorption holes a, and the adsorption holes are used for adsorbing and fixing the display screen mother board. Wherein, the caliber of the adsorption hole is not more than 1 mm.
In practical application, the adsorption holes can be connected with a vacuum pumping pump, when the mother board moving assembly moves the display screen mother board to the first cutting table, the vacuum pumping pump can pump air in the adsorption holes on the first cutting table, and the first surface of the display screen mother board is adsorbed and attached to the bearing surface of the first cutting table, so that the flatness of the display screen mother board is guaranteed, and the display screen mother board is fixed; when the motherboard moving assembly moves the display screen motherboard to the second cutting table, the vacuum pumping pump can pump air in the adsorption holes on the second cutting table, and the second surface of the display screen motherboard is adsorbed and attached on the bearing surface of the second cutting table, so that the display screen motherboard is smooth and fixed.
Alternatively, the platter moving assembly may be configured to move in a direction perpendicular to the bearing surface of the cutting table, as shown in fig. 3, the laser cutting apparatus further includes a cutting table moving assembly 305.
The cutting table moving assembly 305 is used to move at least one of the first cutting table 302 and the second cutting table 303.
It should be noted that when the protective layer is cut, the cutting table moving assembly moves at least one of the first cutting table and the second cutting table, so that after the cutting table moves, as shown in fig. 4A, an orthographic projection of the bearing surface of the first cutting table 302 on the display screen motherboard 20 covers the display screen motherboard 20, and an orthographic projection of the second cutting table 303 on the display screen motherboard 20 does not overlap with the display screen motherboard 20; when cutting the motherboard body, the cutting table moving assembly moves at least one of the first cutting table and the second cutting table so that after the cutting table is moved, as shown in fig. 4B, an orthographic projection of the bearing surface of the second cutting table 303 on the display screen motherboard 20 covers the display screen motherboard 20, and there is no overlapping portion of the orthographic projection of the first cutting table 302 on the display screen motherboard 20 and the display screen motherboard 20.
Alternatively, as shown in fig. 3 to 4B, the cutting table moving assembly may include a first cutting table moving part 305a and a second cutting table moving part 305B.
Wherein the first header moving portion 305a is used to move the first header 302; the second cutting table moving part 305b is used to move the second cutting table 303.
In practical applications, the cutting table moving assembly may also include a cutting table moving portion, and the cutting table moving portion may be used to move the first cutting table and the second cutting table, which is not limited in this embodiment of the present invention.
Alternatively, as shown in fig. 2 or 3, the motherboard moving assembly 301 may include at least two oppositely disposed moving support frames, each for fixing an edge of the display screen motherboard 20, so that the display screen motherboard 20 is located between the carrying surface of the first cutting table 302 and the carrying surface of the second cutting table 303. Each movable support frame can be a telescopic support frame so as to drive the display screen mother board to move along the direction of the bearing surface perpendicular to the cutting table, and the display screen mother board is arranged on the first cutting table or the second cutting table.
It should be noted that the motherboard moving assembly may also be other moving assemblies such as a robot arm, and the type of the motherboard moving assembly is not limited in the embodiment of the present invention.
Optionally, fig. 5 is a schematic structural diagram of a laser cutting apparatus according to an embodiment of the present invention, as shown in fig. 5, the first cutting table 302 and the second cutting table 303 are arranged in a staggered manner, the first laser 304a and the second laser 304b are also arranged in a staggered manner, and the laser cutting apparatus may further include a sliding assembly 306; the slide assembly 306 is used to move the platter moving assembly 301 in a direction parallel to the carrying surface of the cutting table. Wherein, the setting of staggering of first cutting platform and second cutting platform, also be, the orthographic projection of the loading surface of first cutting platform on the second cutting platform does not have the coincidence with the loading surface of second cutting platform, staggers fixed setting with first cutting platform and second cutting platform, need not to set up cutting platform and removes the subassembly, only needs to remove the motherboard and removes the subassembly and can set up the display screen motherboard on first cutting platform or second cutting platform.
Optionally, in the embodiment of the present invention, the first cutting table and the second cutting table may be made of any one of stainless steel, ceramic, aluminum, and quartz.
Further, the laser cutting apparatus provided in the embodiment of the present invention may further include a control assembly, and the motherboard moving assembly, the cutting table moving assembly, the sliding assembly, the laser assembly, and the like may all be controlled by the control assembly to move, which is not limited in the embodiment of the present invention.
In summary, the laser cutting apparatus provided by the embodiment of the present invention includes the first cutting table and the second cutting table, in which the bearing surfaces are opposite and parallel to each other, when the protection layer is cut, the display screen motherboard can be disposed on the first cutting table, when the motherboard body is cut, the display screen motherboard can be disposed on the second cutting table, and since one surface of the protection layer, which is far away from the motherboard body, is attached to the bearing surface of the second cutting table when the motherboard body is cut, the protection layer can bear over-etching within a certain range when the motherboard body is cut over-etching, so that a groove does not need to be disposed at a corresponding position of the second cutting table, the laser cutting apparatus provided by the embodiment of the present invention can be used for cutting different display products, and has high versatility; when the different display screen motherboards of cutting, compare with correlation technique, on the one hand, practiced thrift the cost of manufacture of cutting bed, on the other hand need not to change the cutting bed, has improved cutting efficiency.
Fig. 6 is a flowchart of a laser cutting method according to an embodiment of the present invention, and as shown in fig. 6, the method may include:
And 402, moving the display screen mother board to the first cutting platform through the mother board moving assembly so that the first surface is fixedly arranged on the bearing surface of the first cutting platform.
And step 403, performing laser cutting on the protective layer from the side of the second surface through the laser assembly.
And step 404, moving the display screen motherboard to a second cutting table through the motherboard moving assembly so that the second surface is fixedly arranged on the bearing surface of the second cutting table, and the bearing surface of the second cutting table is opposite to and parallel to the bearing surface of the first cutting table.
In summary, according to the laser cutting method provided by the embodiment of the invention, since the laser cutting device includes the first cutting table and the second cutting table, in which the bearing surfaces are opposite and parallel to each other, when the protection layer is cut, the display screen motherboard is arranged on the first cutting table, when the motherboard body is cut, the display screen motherboard is arranged on the second cutting table, and since one surface of the protection layer, which is far away from the motherboard body, is attached to the bearing surface of the second cutting table when the motherboard body is cut, the protection layer can bear over-etching within a certain range when the motherboard body is cut over-etching, so that grooves do not need to be arranged at corresponding positions of the second cutting table, the laser cutting device provided by the embodiment of the invention can be used for cutting different display products, and has high universality; when the different display screen motherboards of cutting, compare with correlation technique, on the one hand, practiced thrift the cost of manufacture of cutting bed, on the other hand need not to change the cutting bed, has improved cutting efficiency.
Fig. 7 is a flowchart of another laser cutting method provided in an embodiment of the present invention, and as shown in fig. 7, the method may include:
The display screen mother board comprises a mother board body and a protective layer arranged on one side of the mother board body, the display screen mother board is provided with a first face and a second face which are opposite, the first face is the face of the mother board body far away from the protective layer, and the second face is the face of the protective layer far away from the mother board body.
Optionally, the motherboard body may be a flexible display panel motherboard, for example, an OLED display panel motherboard or a QLED display panel motherboard. The display screen motherboard formed by the motherboard body and the protective layer can be a flexible motherboard or a rigid motherboard, which is not limited in the embodiment of the invention.
Optionally, move the display screen motherboard to first cutting platform through the motherboard removal subassembly, can include:
moving at least one of the first cutting table and the second cutting table through the cutting table moving assembly, so that after the cutting table moves, as shown in fig. 4A, the orthographic projection of the bearing surface of the first cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the second cutting table on the display screen motherboard does not have an overlapped part with the display screen motherboard; the display screen mother board is moved to the first cutting table along the direction perpendicular to the bearing surface through the mother board moving assembly.
And 503, performing laser cutting on the protective layer from the side of the second surface through the laser assembly.
Alternatively, as shown in fig. 2, the laser assembly 304 may include a first laser 304a and a second laser 304b, the first laser 304a being disposed on a side of the second cutting table 303 remote from the first cutting table 302, the second laser 304a being disposed on a side of the first cutting table 302 remote from the second cutting table 303.
In practical applications, the laser module may also include a laser, that is, the first laser and the second laser are the same laser.
It should be noted that, when the laser assembly performs laser cutting on the protection layer from the side of the second surface, only the protection layer is cut, and the motherboard body cannot be damaged.
And 504, moving the display screen motherboard to a second cutting table through the motherboard moving assembly so that the second face is fixedly arranged on the bearing surface of the second cutting table.
The bearing surface of the second cutting table is opposite to and parallel to the bearing surface of the first cutting table.
Optionally, moving the display screen motherboard to the second cutting table by the motherboard moving assembly may include:
the first cutting table and the second cutting table are moved through the cutting table moving assembly, so that after the cutting table is moved, as shown in fig. 4B, the orthographic projection of the bearing surface of the second cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the first cutting table on the display screen motherboard does not overlap with the display screen motherboard; and moving the display screen mother board to a second cutting table along the direction vertical to the bearing surface by the mother board moving assembly.
And 505, performing laser cutting on the motherboard body from the side of the first surface through the laser assembly.
Optionally, when the laser assembly comprises a laser, the laser is moved from the side of the second cutting table remote from the first cutting table to the side of the first cutting table remote from the second cutting table before the motherboard body is laser cut by the laser assembly from the side of the first face.
It should be noted that, when the laser assembly performs laser cutting on the motherboard body from the side of the first surface, the laser assembly may be over-etched on the protective layer without cutting the protective layer.
And step 506, stripping the protective layer to obtain a plurality of display panels.
Alternatively, the first cutting table and the second cutting table may be arranged as shown in fig. 5, and there is no overlapping portion between the orthographic projection of the bearing surface of the first cutting table on the second cutting table and the bearing surface of the second cutting table, the implementation method of step 502 may include: the motherboard moving assembly is moved along the direction parallel to the bearing surface of the cutting table through the sliding assembly, so that the orthographic projection of the bearing surface of the first cutting table on the display screen motherboard covers the display screen motherboard, and the display screen motherboard is moved to the first cutting table along the direction vertical to the bearing surface through the motherboard moving assembly; the implementation method of step 504 may include: the motherboard moving assembly is moved in the direction parallel to the bearing surface of the cutting table through the sliding assembly, so that the orthographic projection of the bearing surface of the second cutting table on the display screen motherboard covers the display screen motherboard, and the display screen motherboard is moved to the second cutting table in the direction perpendicular to the bearing surface through the motherboard moving assembly.
It should be noted that, the order of the steps of the laser cutting method provided in the embodiment of the present invention may be appropriately adjusted, and the steps may also be increased or decreased according to the circumstances, and any method that can be easily conceived by those skilled in the art within the technical scope of the present invention should be included in the protection scope of the present invention, and therefore, the detailed description is omitted.
In summary, according to the laser cutting method provided by the embodiment of the invention, since the laser cutting device includes the first cutting table and the second cutting table, in which the bearing surfaces are opposite and parallel to each other, when the protection layer is cut, the display screen motherboard is arranged on the first cutting table, when the motherboard body is cut, the display screen motherboard is arranged on the second cutting table, and since one surface of the protection layer, which is far away from the motherboard body, is attached to the bearing surface of the second cutting table when the motherboard body is cut, the protection layer can bear over-etching within a certain range when the motherboard body is cut over-etching, so that grooves do not need to be arranged at corresponding positions of the second cutting table, the laser cutting device provided by the embodiment of the invention can be used for cutting different display products, and has high universality; when the different display screen motherboards of cutting, compare with correlation technique, on the one hand, practiced thrift the cost of manufacture of cutting bed, on the other hand need not to change the cutting bed, has improved cutting efficiency.
The invention is not to be considered as limited to the particular embodiments shown and described, but is to be understood that various modifications, equivalents, improvements and the like can be made without departing from the spirit and scope of the invention.
Claims (7)
1. The utility model provides a laser cutting equipment which characterized in that for cutting display screen mother board, the display screen mother board includes the mother board body and sets up the protective layer of one side of mother board body, the display screen mother board has relative first face and second face, first face is the mother board body is kept away from the one side of protective layer, the second face is the protective layer is kept away from the one side of mother board body, laser cutting equipment includes: the mother board moving assembly comprises a first cutting table, a second cutting table and a laser assembly, wherein the bearing surfaces of the first cutting table and the second cutting table are arranged oppositely and parallelly;
the mother board moving assembly is used for moving the display screen mother board to a first cutting table, the first cutting table is used for attaching and fixing the first surface and a bearing surface of the first cutting table, and the laser assembly is used for carrying out laser cutting on the protective layer from the side where the second surface is located;
the motherboard moving assembly is further used for moving the display screen motherboard to a second cutting table, the second cutting table is used for attaching and fixing a second face of the protective layer to a bearing face of the second cutting table, the laser assembly is used for carrying out laser cutting on the motherboard body from the side where the first face is located, and the protective layer is used for bearing over-etching;
the motherboard moving assembly comprises at least two oppositely arranged moving support frames, each moving support frame is used for fixing the edge of the display screen motherboard so that the display screen motherboard is positioned between the bearing surface of the first cutting table and the bearing surface of the second cutting table, the motherboard moving assembly is configured to move in a direction perpendicular to the bearing surface, and the laser cutting equipment further comprises a cutting table moving assembly;
the cutting table removes the subassembly and is used for removing first cutting table with at least one in the second cutting table to the messenger removes the back at the cutting table, the loading end of first cutting table is in orthographic projection on the display screen motherboard covers the display screen motherboard, the second cutting table is in orthographic projection on the display screen motherboard with coincidence portion does not exist to the display screen motherboard, or, the loading end of second cutting table is in orthographic projection on the display screen motherboard covers the display screen motherboard, first cutting table is in orthographic projection on the display screen motherboard with coincidence portion does not exist to the display screen motherboard.
2. The laser cutting apparatus of claim 1, wherein the laser assembly includes a first laser and a second laser, the first laser being disposed on a side of the second cutting table distal from the first cutting table, the second laser being disposed on a side of the first cutting table distal from the second cutting table;
the first laser is used for carrying out laser cutting on the protective layer from the side of the second face;
the second laser is used for carrying out laser cutting on the motherboard body from the side of the first face.
3. The laser cutting apparatus according to claim 1 or 2, wherein the cutting table moving assembly comprises a first cutting table moving portion and a second cutting table moving portion;
the first cutting table moving part is used for moving the first cutting table;
the second cutting table moving section is for moving the second cutting table.
4. Laser cutting device according to claim 1 or 2,
each movable support frame is a telescopic support frame.
5. The laser cutting apparatus of claim 1 or 2, wherein the first cutting table is staggered from the second cutting table, the laser cutting apparatus further comprising a sliding assembly;
the sliding assembly is used for moving the motherboard moving assembly along a direction parallel to the bearing surface.
6. Laser cutting device according to claim 1,
the display screen mother board cutting device is characterized in that adsorption holes which are uniformly distributed are formed in the bearing surfaces of the first cutting table and the second cutting table and used for adsorbing and fixing the display screen mother board.
7. A laser cutting method, characterized in that the method comprises:
providing a display screen mother board to be cut, wherein the display screen mother board comprises a mother board body and a protective layer arranged on one side of the mother board body, the display screen mother board is provided with a first surface and a second surface which are opposite, the first surface is the surface of the mother board body far away from the protective layer, and the second surface is the surface of the protective layer far away from the mother board body;
moving at least one of a first cutting table and a second cutting table through a cutting table moving assembly, so that after the cutting table is moved, the orthographic projection of the bearing surface of the first cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the second cutting table on the display screen motherboard does not have an overlapped part with the display screen motherboard;
moving the display screen mother board to the first cutting table along a direction perpendicular to the bearing surface through a mother board moving assembly so that the first surface is fixedly arranged on the bearing surface of the first cutting table;
carrying out laser cutting on the protective layer from the side where the second surface is located through a laser assembly;
moving the first cutting table and the second cutting table through the cutting table moving assembly, so that after the cutting table moves, the orthographic projection of the bearing surface of the second cutting table on the display screen motherboard covers the display screen motherboard, and the orthographic projection of the first cutting table on the display screen motherboard does not have an overlapped part with the display screen motherboard;
moving the display screen motherboard to the second cutting table along a direction perpendicular to the bearing surface by the motherboard moving assembly, so that the second surface of the protective layer is fixedly arranged on the bearing surface of the second cutting table, the bearing surface of the second cutting table is opposite to and parallel to the bearing surface of the first cutting table, the motherboard moving assembly comprises at least two moving support frames which are oppositely arranged, each moving support frame is used for fixing the edge of the display screen motherboard, so that the display screen mother board is positioned between the bearing surface of the first cutting table and the bearing surface of the second cutting table, the motherboard moving assembly is configured to move along a direction perpendicular to the bearing surface, the laser cutting equipment further comprises a cutting table moving assembly, the cutting table moving assembly is for moving at least one of the first cutting table and the second cutting table;
and carrying out laser cutting on the motherboard body from the side of the first surface through the laser assembly, wherein the protective layer is used for bearing over-etching.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810170616.1A CN108381045B (en) | 2018-03-01 | 2018-03-01 | Laser cutting method and laser cutting equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810170616.1A CN108381045B (en) | 2018-03-01 | 2018-03-01 | Laser cutting method and laser cutting equipment |
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| CN108381045A CN108381045A (en) | 2018-08-10 |
| CN108381045B true CN108381045B (en) | 2021-01-26 |
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| CN110491908A (en) * | 2019-07-26 | 2019-11-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and its cutting method |
| CN112531135A (en) * | 2020-11-30 | 2021-03-19 | Oppo广东移动通信有限公司 | Manufacturing method of display screen, display screen and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104227570A (en) * | 2013-06-17 | 2014-12-24 | 株式会社太星技研 | Unitary armorplate glass processing system for forming G2-mode touch sensors of cell units |
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| JP2002172479A (en) * | 2000-09-20 | 2002-06-18 | Seiko Epson Corp | Laser parting method, laser parting device, manufacturing method for liquid crystal device, and manufacturing device for liquid crystal |
| JP6022862B2 (en) * | 2012-05-08 | 2016-11-09 | 株式会社不二製作所 | Hard brittle substrate cutting method and cutting device |
| CN202658076U (en) * | 2012-07-20 | 2013-01-09 | 京东方科技集团股份有限公司 | Display panel cutting system |
| KR101703026B1 (en) * | 2014-08-29 | 2017-02-07 | 주식회사 태성기연 | Suction equipment for a display panel |
| CN105108355B (en) * | 2015-09-18 | 2017-10-17 | 京东方科技集团股份有限公司 | Plummer, bogey and laser cutting device |
| KR102467419B1 (en) * | 2016-05-13 | 2022-11-16 | 삼성디스플레이 주식회사 | Method for manufacturing display apparatus |
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| CN104227570A (en) * | 2013-06-17 | 2014-12-24 | 株式会社太星技研 | Unitary armorplate glass processing system for forming G2-mode touch sensors of cell units |
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