CN108376720A - A kind of photovoltaic cell component and preparation method thereof - Google Patents
A kind of photovoltaic cell component and preparation method thereof Download PDFInfo
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- CN108376720A CN108376720A CN201810368681.5A CN201810368681A CN108376720A CN 108376720 A CN108376720 A CN 108376720A CN 201810368681 A CN201810368681 A CN 201810368681A CN 108376720 A CN108376720 A CN 108376720A
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- 210000003850 cellular structure Anatomy 0.000 title claims abstract description 74
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 155
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 88
- 238000005452 bending Methods 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 30
- 210000004027 cell Anatomy 0.000 claims description 26
- 239000012528 membrane Substances 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- -1 polytetrafluoroethylene Polymers 0.000 claims description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 2
- 230000002742 anti-folding effect Effects 0.000 claims 1
- 239000002346 layers by function Substances 0.000 claims 1
- 238000013082 photovoltaic technology Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 17
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
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- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
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- 239000004926 polymethyl methacrylate Substances 0.000 description 2
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- 239000011241 protective layer Substances 0.000 description 2
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- 206010023126 Jaundice Diseases 0.000 description 1
- ACOGMWBDRJJKNB-UHFFFAOYSA-N acetic acid;ethene Chemical group C=C.CC(O)=O ACOGMWBDRJJKNB-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- 230000000717 retained effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The present invention discloses a kind of photovoltaic cell component and preparation method thereof, is related to photovoltaic technology field, mitigates the weight of photovoltaic cell component on the basis of ensureing photovoltaic cell component sealing performance for photovoltaic generation, to extend the application range of photovoltaic cell component.The photovoltaic cell component includes solar battery chip and backboard, and solar battery chip and backboard are linked together by sealing framework, and the outer surface of the envelope framework is equipped with hydrophobic encapsulated layer.The production method of the photovoltaic cell component is for making above-mentioned photovoltaic cell component.
Description
Technical field
The present invention relates to photovoltaic technology field more particularly to a kind of photovoltaic cell component and preparation method thereof.
Background technology
Solar cell module is otherwise known as photovoltaic cell component, is a kind of dress that the sunlight of absorption is converted into electric energy
It sets.Photovoltaic cell component usually has 25 years or more service life in outdoor environment；If photovoltaic cell component local environment
Humidity it is larger, then local environment steam be easy corrode photovoltaic cell component, lead to the solar-electricity in photovoltaic cell component
Chamber chip lower power production.Therefore, photovoltaic cell component is required for carrying out moisture seal processing, to adapt to the larger environment of humidity
It is required that.
Existing photovoltaic cell component includes transparent substrates and backboard, and the sun being formed between transparent substrates and backboard
It can battery layers；Pass through EVA (ethylene-between transparent substrates and solar cell layer and between backboard and solar cell layer
Acetate ethylene copolymer, full name in English are Ethylene-vinyl Acetate Copolymer, are abbreviated as EVA) glued membrane or PVB
(polyvinyl butyral, full name in English are Poly Vinyl Butyral, are abbreviated as PVB) glued membrane is bonded together, will too
Positive energy battery layers doubling sealing.However since the water resistance of PVB materials is bad, long-term moisture soak is easy to fall off to come unglued, and EVA is easy
It seeps water and is easy jaundice, so, between the edge of transparent substrates and the edge of solar cell layer and the edge of backboard
Butyl hot-melt glue is coated between the edge of solar cell layer, with the purpose of the realization waterproof sealing of maximum possible.But
It is that this sealing means are but also the weight of photovoltaic cell component increases so that photovoltaic cell component, which is difficult to use in, wants weight
The application environment that comparison is stringent is sought, causes the application range of photovoltaic cell component limited.
Invention content
The purpose of the present invention is to provide a kind of photovoltaic cell components and preparation method thereof, to ensure photovoltaic cell component
On the basis of sealing performance, mitigate the weight of photovoltaic cell component, to extend the application range of photovoltaic cell component.
To achieve the goals above, the present invention provides the following technical solutions：
A kind of photovoltaic cell component, the photovoltaic cell component include solar battery chip and backboard, the solar-electricity
Chamber chip and the backboard are linked together by sealing framework, and the outer surface of the envelope framework is equipped with hydrophobic encapsulated layer.
Compared with prior art, in photovoltaic cell component provided by the invention, the outer surface for sealing framework is equipped with hydrophobic encapsulation
Layer so that envelope framework has good hydrophobic ability；When photovoltaic cell component environment higher applied to humidity, contain in air
Some steam can only be agglomerated to the surface of hydrophobic encapsulated layer in the form of droplet, and envelope framework can not be passed through to corrode solar cell
Chip, this makes it possible to the water vapor permeability energy for ensureing photovoltaic cell component；In addition, since the outer surface of envelope framework is equipped with hydrophobic envelope
Fill layer so that hydrophobic encapsulated layer is equivalent to the protective layer of envelope framework, to avoid water oxygen from invading envelope framework using hydrophobic encapsulated layer
Erosion ensures that the envelope frame consistency of performance of envelope framework plays；Moreover, in photovoltaic cell component provided by the invention, only in envelope framework
Outer surface be equipped with hydrophobic encapsulated layer, it will be able to ensure the water vapor permeability energy of photovoltaic cell component, it is therefore not necessary to opposite in backboard
The surface of solar battery chip forms waterproof sealing structure, compared with the existing technology, photovoltaic cell component provided by the invention
Lighter in weight so that the application range of photovoltaic cell component is widened.
The present invention also provides a kind of production method of photovoltaic cell component, the production method packets of the photovoltaic cell component
It includes：
Solar battery chip, backboard and envelope framework are provided；
The solar battery chip and the backboard are linked together using envelope framework, the outer surface of the envelope framework
Equipped with hydrophobic encapsulated layer.
Compared with prior art, the advantageous effect of the production method of photovoltaic cell component provided by the invention and above-mentioned technology
The advantageous effect for the photovoltaic cell component that scheme provides is identical, and this will not be repeated here.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and constitutes the part of the present invention, this hair
Bright illustrative embodiments and their description are not constituted improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the structural schematic diagram of photovoltaic cell component provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of solar battery chip in the embodiment of the present invention；
Fig. 3 is the production method flow chart of photovoltaic cell component provided in an embodiment of the present invention；
Fig. 4 is the flow that solar battery chip and backboard are linked together using envelope framework in the embodiment of the present invention
Figure.
Reference numeral：
1- solar battery chips, 10- transparent substrates；
11- solar battery cells, 111- first electrode layers；
112- the second electrode lays, 112a-AZO electrode layers；
112b-Ag/NiCr/Al electrode layers, 113- battery functi on layers；
113a- the first PIN structural battery functi on layers, 113b- the second PIN structural battery functi on layers；
2- backboards, 3- seal framework；
The hydrophobic encapsulated layers of 4-, the sides 40- hydrophobic portion；
The first bending parts of 401-, the second bending parts of 402-；
The first hydrophobic contacts of 41- portion, the second hydrophobic contacts of 42- portion；
The first SGP glued membranes of 51-, the 2nd SGP glued membranes of 52-.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
For in the prior art since wet steam is heavier, moisture attacks can corrode photovoltaic electric after entering photovoltaic cell component inside
Solar battery chip included by the component of pond so that the carrier concentration inside photovoltaic cell component reduces, conductivity is serious
Decline causes open-circuit voltage Voc and fill factor FF in battery chip performance parameter to decline apparent, eventually leads to generated energy
Reduction.It please refers to Fig.1 and Fig. 2, photovoltaic cell component provided in an embodiment of the present invention includes solar battery chip 1 and backboard
2, solar battery chip 1 and backboard 2 are linked together by sealing framework 3, and the outer surface of envelope framework 3 is equipped with hydrophobic encapsulated layer 4.
The manufacturing process of photovoltaic cell component provided in an embodiment of the present invention is carried out specifically with reference to Fig. 1~Fig. 3
It is bright.
The first step：Solar battery chip 1, backboard 2 and envelope framework 3 are provided；
Second step：Solar battery chip 1 and the backboard 2 are linked together using envelope framework 3, outside envelope framework 3
Surface is equipped with hydrophobic encapsulated layer 4.
In photovoltaic cell component based on the embodiment of the present invention, the outer surface of envelope framework 3 is equipped with hydrophobic encapsulated layer 4,
So that envelope framework 3 has good hydrophobic ability；When photovoltaic cell component environment higher applied to humidity, contain in air
Steam the surface of hydrophobic encapsulated layer 4 can be only agglomerated in the form of droplet, and envelope framework 3 can not be passed through to corrode solar cell
Chip 1, such as：When photovoltaic plant is runed for a long time, the droplet of photovoltaic cell component edge condensation can be air cured, even if continuous overcast and rainy
Weather, in photovoltaic plant operation maintenance, maintenance personnel need to only wipe the droplet condensed in every block assembly edge hydrophobic membrane,
To improve photovoltaic module service life, this makes it possible to the water vapor permeability energy for ensureing photovoltaic cell component.
In addition, since the outer surface of envelope framework 3 is equipped with hydrophobic encapsulated layer 4 so that hydrophobic encapsulated layer 4 is equivalent to envelope framework 3
Protective layer, with using hydrophobic encapsulated layer 4 avoid water oxygen to seal framework 3 erosion, ensure envelope framework 3 envelope frame consistency of performance hair
It waves；Moreover, in photovoltaic cell component provided in an embodiment of the present invention, only hydrophobic encapsulated layer is equipped in the outer surface of envelope framework 3
4, it will be able to ensure the water vapor permeability energy of photovoltaic cell component, it is therefore not necessary in table of the backboard 2 with respect to solar battery chip 1
Face forms waterproof sealing structure, and compared with the existing technology, the lighter in weight of photovoltaic cell component provided in an embodiment of the present invention makes
The application range for obtaining photovoltaic cell component is widened.
It should be noted that dorsulum of the embodiment of the present invention 2 can be transparent, and it can not also be transparent, when backboard 2 is the transparent back of the body
When plate, the Carriers Absorption amount of solar battery chip 1 can be increased, to increase its generated energy.
Extraneous side is contacted in view of sealing framework 3 in the prior art to be easiest to touch steam, is based on this, such as Fig. 1 and
Shown in Fig. 2, hydrophobic encapsulated layer 4 includes at least side hydrophobic portion 40 in the embodiment of the present invention, and side hydrophobic portion 40 is located at envelope framework 3
Side (i.e. the alien invasion of side hydrophobic portion 40) far from solar battery chip 1, to carry out waterproof to the alien invasion for sealing framework 3
Oxygen protection, to reduce corrosion of the steam for envelope framework 3.
Specifically, as depicted in figs. 1 and 2, hydrophobic encapsulated layer 4 further includes the first hydrophobic contact portion 41 in the embodiment of the present invention
The second hydrophobic contact portion 42 and/or；First hydrophobic contact portion 41 is located at surface of the solar battery chip 1 with respect to backboard 2 and envelope
Between framework 3, the second hydrophobic contact portion 42 is located between backboard 2 and envelope framework 3, this is equivalent in 1 phase of solar battery chip
It is additionally arranged the first hydrophobic contact portion 41 in gap between surface to backboard 2 and envelope framework 3, to utilize the first hydrophobic contact portion
41 prevent steam from entering the gap between surface of the solar battery chip 1 with respect to backboard 2 and envelope framework 3, to further
Increase the anti-steam ability of hydrophobic encapsulated layer 4 and the protective effect to sealing framework 3；Similarly, the second hydrophobic contact portion 42 can prevent
Steam enters backboard 2 and seals the gap between framework 3, to further increase the anti-steam ability of hydrophobic encapsulated layer 4 and to sealing
The protective effect of framework 3.
For convenience of manufacture, as depicted in figs. 1 and 2, side hydrophobic portion 40 and the first hydrophobic contact in the embodiment of the present invention
Portion 41 and/or the connection of the second hydrophobic contact portion 42, and using integral structure as best connection mode.And consider side hydrophobic portion
40 are located at the envelope framework 3 close to extraneous side, and the first hydrophobic contact portion 41 is located at solar battery chip 1 with respect to backboard 2
Surface and envelope framework 3 between, the second hydrophobic contact portion 42 be located at backboard 2 and seal framework 3 between so that the first hydrophobic contact portion
41, when the second hydrophobic contact portion 42 and side hydrophobic portion 40 are an integral structure, the first hydrophobic contact portion 41 and side hydrophobic portion
Bending part connection is needed between 40, the second hydrophobic contact portion 42 needs bending part with side hydrophobic portion 40 and connect.Based on this,
First hydrophobic contact portion 41 is connect with side hydrophobic portion 40 by the first bending part 401, other portions of relative hydrophobic encapsulated layer 4
Point, the stress suffered by the first bending part 401 is bigger, passes through second between the second hydrophobic contact portion 42 and side hydrophobic portion 40
Bending part 402 connects, the other parts of relative hydrophobic encapsulated layer 4, and the stress being subject to described in the second bending part 402 is bigger；Base
In this, the warping resistance performance of the first bending part 401 hydrophobic connects at least more than the warping resistance performance in the first hydrophobic contact portion 41, second
The warping resistance performance of contact portion 42 and the warping resistance performance of side hydrophobic portion 40, the warping resistance performance of the second bending part 402 are at least big
In the anti-of the warping resistance performance in the first hydrophobic contact portion 41, the warping resistance performance in the second hydrophobic contact portion 42 and side hydrophobic portion 40
Buckling performance.Specifically, the first bending part 401 and the second bending part 402 are the bending part handled by plasma bombardment, pass through
The bending part structural strength of plasma bombardment processing increases, therefore, as the first hydrophobic contact portion 41,42 and of the second hydrophobic contact portion
When side hydrophobic portion 40 is an integral structure, it is only necessary to finally to the first bending part 401 and the second bending part 402 carry out etc. from
Sub- bombardment processing is prevented with improving the intensity of the first bending part 401 and the second bending part 402 because being answered for a long time by excessive
The problem of the first bending part 401 and the second bending part 402 caused by power are broken, to increase the use longevity of hydrophobic encapsulated layer 4
Life.
It is understood that hydrophobic encapsulated layer 4 is the hydrophobic encapsulated layer 4 that contact angle is more than 90 ° in the embodiment of the present invention.Into
One step, hydrophobic encapsulated layer 4 are the hydrophobic encapsulated layer that contact angle is 120 °~160 °, and hydrophobic encapsulated layer 4 can preferably be sent out at this time
Wave its hydrophobic ability so that can maximumlly condense in hydrophobic encapsulated layer 4 close to the steam contained by 4 air of hydrophobic encapsulated layer
Surface.
Optionally, hydrophobic encapsulated layer 4 can be organic hydrophobic film in the embodiment of the present invention, or inorganic hydrophobic is thin
Film.Wherein, organic hydrophobic film is polyamide hydrophobic film, PMMA-SiO2Composite hydrophobic film or polytetrafluoroethylene film, but
It is not limited only to this；Inorganic hydrophobic film is silica membrane, aluminum oxide film or insulating ceramics film, but is not limited only to
This.
Such as：PMMA-SiO2Composite hydrophobic film is with hydrophilic engineering plastics polymethyl methacrylate (PMMA)
With epoxy resin as matrix, by introducing hydrophobicity SiO2Nano particle prepares PMMA-SiO2Compound based superhydrophobic thin films, should
PMMA-SiO2Compound based superhydrophobic thin films surface is even more than 150 ° with water contact angle, has very strong hydrophobic performance.
In view of operation ease, envelope framework 3 is that hot melt seals frame layer in the embodiment of the present invention, and hydrophobic encapsulated layer 4 is to have
Machine hydrophobic film, it is in this case, cold since hot melt envelope frame layer and organic hydrophobic film can melt in a heated condition
But it solidifies afterwards, is based on this feature, can first be formed as hydrophobic encapsulated layer 4 with respect to the surface of backboard 2 in solar battery chip 1
Hydrophobic substrates, then hydrophobic substrates away from solar battery chip 1 surface formed envelope framework 3, then will envelope framework 3 wrap
It wraps up in, and it is opposite that backboard 2 and solar battery chip 1 formed the envelope surface of framework 3, finally heat lamination solar cell core repeatedly
Piece 1 and backboard 2 so that backboard 2 is closely linked with solar battery chip 1.
It should be noted that the envelope framework 3 in the embodiment of the present invention can be butyl rubber or other can realize the glue for sealing frame
Body or resin are not enumerating herein.
Optionally, as depicted in figs. 1 and 2, solar battery chip 1 divides for frame region and photosensitive in the embodiment of the present invention
Region, the solar battery chip 1 include transparent substrates, and the surface that transparent substrates correspond to photosensitive region is equipped with solar cell list
Member 11, envelope framework 3 are located at the part that transparent substrate 10 corresponds to frame region.
Further, as depicted in figs. 1 and 2, solar battery cell 11 includes being sequentially stacked saturating in the embodiment of the present invention
First electrode layer 111, battery functi on layer 113 and the second electrode lay 112 of photopolymer substrate, first electrode layer 111 and transparent substrates
Photosensitive region surface is opposite, and the second electrode lay 112 is opposite with backboard 2 away from the surface of battery functi on layer 113.
It is specific when making solar battery chip 1, using film-forming process the of stacking is formed on the surface of transparent substrate 10
One electrode layer 111, battery functi on layer 113 and the second electrode lay 112, film-forming process are chemical vapor deposition method or magnetron sputtering
Technique etc.；Then it uses laser (wavelength 1064nm) to remove the part film layer at 10 edge of transparent substrate, allows for so made
The solar battery chip 1 of work divides for frame region and photosensitive region, and the film layer of frame region is by laser ablation, and photosensitive region
Film layer retain, the film layer that photosensitive region is retained is known as solar battery cell 11, and frame region is electric insulated region,
Its width is 7mm-10mm, and the width of electric insulated region refers to herein：From the side of solar battery cell 11 to transparent substrate
The shortest distance d of 10 side.
Illustratively, as shown in Fig. 2, first electrode layer 111 is TCO electrode layers, the second electrode lay 112 is to stack together
AZO electrode layer 112A and Ag/NiCr/Al electrode layer 112b, AZO electrode layers 112A be located at Ag/NiCr/Al electrode layers 112b and
Between battery functi on layer 113, battery functi on layer 113 is the PIN structural battery functi on layer of bilayer, specifically includes the first PIN structural
Battery functi on layer 113a and the second PIN structural battery functi on layer 113b, and the first PIN structural battery functi on layer 113a is located at first
Between electrode layer 111 and the second PIN structural battery functi on layer 113b.
For EVA adhesive film in the prior art or the defect of PVB glued membranes, in the embodiment of the present invention by original EVA adhesive film or
PVB glued membranes replace with SGP glued membranes, to increase adhesive property.Specifically, as depicted in figs. 1 and 2, dorsulum of the embodiment of the present invention 2
The surface of opposite solar battery cell 11 is formed with the first SGP glued membranes for bonding backboard 2 and solar battery cell 11
51, contact aside of the envelope framework 3 also with the first SGP glued membranes 51；And/or shape between transparent substrates and solar battery cell 11
At being useful for bonding the 2nd SGP glued membranes 52 of the transparent substrates and solar battery cell 11, envelope framework 3 is also with described second
The contact aside of SGP glued membranes 52.Since the hygroscopicity of SGP glued membranes is smaller, and there is preferable gluing performance, therefore, this hair
In the photovoltaic electrification component that bright embodiment provides, although passing through the first SGP glued membranes between backboard 2 and solar battery cell 11
51 bondings, and/or bonded by the 2nd SGP glued membranes 52 between transparent substrates and solar battery cell 11, but pass through test
It was found that used backboard 2 and/or transparent substrate 10 can be mitigated using the first SGP glued membranes 51 and/or the 2nd SGP glued membranes 52
Thickness so that the weight of photovoltaic electrification component reduces.
Specifically, when backboard 2 be simple glass or tempered glass, Fig. 1 and Fig. 2 shows structure in, pass through apply SGP glue
Film so that the backboard 2 of 3.2mm and the thickness of transparent substrate 10 are decreased to 2.5mm, the thickness of the backboard 2 and transparent substrate 10 of 4mm
It is decreased to 2mm.Meanwhile BIPV (the photovoltaics of the photovoltaic green-house made of photovoltaic cell component provided in an embodiment of the present invention
Architecture-integral, full name in English are Building Integrated PV, are abbreviated as BIPV) weight of component reduces from 14.4kg
To 9kg, to reduce the load-bearing requirements of photovoltaic green-house building.
As it can be seen that the results showed when backboard 2 and/or transparent substrates are transparent glass, light transmission glass in the embodiment of the present invention
The thickness of glass is respectively less than 3mm, can greatly reduce the weight of photovoltaic cell component.
As shown in FIG. 1 to 3, an embodiment of the present invention provides a kind of production method of photovoltaic cell component, the photovoltaic electrics
The production method of pond component includes：
Step S100：The first step：Solar battery chip 1, backboard 2 and envelope framework 3 are provided；
Step S300：Solar battery chip 1 and backboard 2 are linked together using envelope framework 3, seal the appearance of framework 3
Face is equipped with hydrophobic encapsulated layer 4.
Compared with prior art, the advantageous effect of the production method of photovoltaic cell component provided in an embodiment of the present invention with it is upper
The advantageous effect for stating the photovoltaic cell component of embodiment offer is identical, and this will not be repeated here.
It, as shown in Figure 1, Figure 2 and Figure 4, will using envelope framework 3 in the embodiment of the present invention as a kind of achievable embodiment
Solar battery chip 1 and backboard 2 link together including：
Step S310：The first hydrophobic contact portion 41, the first hydrophobic contact portion 41 are formed on the surface of solar battery chip 1
It is connect with the second hydrophobic contact portion 42 by side hydrophobic portion 40；
Step S320：In the first hydrophobic contact portion 41 envelope framework 3 is formed away from the surface of solar battery chip 1；
Step S330：Side hydrophobic portion 40 is connect with the side of envelope framework 3, by the second hydrophobic contact portion 42 and envelope framework
3 connect away from the surface in the first hydrophobic contact portion 41.When specific operation, by side hydrophobic portion 40 and envelope frame by the way of bending
The overturning of second hydrophobic contact portion 42 is deviated from the first hydrophobic contact portion by the side contact (realize connection) of part 3 to envelope framework 3
41 surface, so that the second hydrophobic contact portion 42 is contacted away from the surface in the first hydrophobic contact portion 41 (to realize with envelope framework 3
Connection).
Step S340：The surface that solar battery chip 1 is formed to the first hydrophobic contact portion 41 is opposite with backboard 2；
Step S350：Solar battery chip 1 and backboard 2 described in heat lamination repeatedly so that seal framework 3 by solar cell
Chip 1 and backboard 2 link together；The side for sealing the connection side hydrophobic portion 40 of framework 3 is located at envelope framework 3 far from solar cell
The side of chip 1.
Further, as shown in FIG. 1 to 3, before the surface of solar battery chip 1 forms the first hydrophobic contact portion 41,
Solar battery chip 1 and backboard 2 are linked together and further include using envelope framework 3：
Step S200：Solar battery chip 1 is divided into photosensitive region and is located at the non-photo-sensing of photosensitive region circumferential direction
Region；The non-photo-sensing region functional film layer that is included of removal solar battery chip 1 so that solar battery chip 1 it is non-
Photosensitive region forms the frame region of insulation；
Step S310 is specifically included：Forming the first hydrophobic contact portion 41 on the surface of solar battery chip 1 includes：On side
Frame region forms the first hydrophobic contact portion 41.
As shown in Figure 1, Figure 2 and Figure 4, if the first hydrophobic contact portion 41 passes through the first bending part with side hydrophobic portion 40
401 connections, are connected between the second hydrophobic contact portion 42 and side hydrophobic portion 40 by the second bending part 402；It is above-mentioned to utilize envelope frame
After part 3 links together solar battery chip 1 and backboard 2, the making of photovoltaic cell component provided in an embodiment of the present invention
Method further includes：
Step S400：Using plasma bombardment technique respectively to the first bending part 401 and the second bending part 402 at
Reason so that the warping resistance performance of the first bending part 401 is at least more than the warping resistance performance in the first hydrophobic contact portion 41, second hydrophobic
The warping resistance performance of contact site 42 and the warping resistance performance of side hydrophobic portion 40, the warping resistance performance of the second bending part 402 is at least
It is anti-more than the warping resistance performance in the first hydrophobic contact portion 41, the warping resistance performance in the second hydrophobic contact portion 42 and side hydrophobic portion
Buckling performance.
In the description of the above embodiment, particular features, structures, materials, or characteristics can be at any one or more
It can be combined in any suitable manner in a embodiment or example.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (16)
1. a kind of photovoltaic cell component, including solar battery chip and backboard, the solar battery chip and the backboard
It is linked together by sealing framework, which is characterized in that the outer surface of the envelope framework is equipped with hydrophobic encapsulated layer.
2. photovoltaic cell component according to claim 1, which is characterized in that the hydrophobic encapsulated layer is dredged including at least side
Water portion, the side hydrophobic portion are located at the side of the envelope framework far from the solar battery chip.
3. photovoltaic cell component according to claim 2, which is characterized in that the hydrophobic encapsulated layer further includes first hydrophobic
Contact site and/or the second hydrophobic contact portion；
First hydrophobic contact portion is located at the solar battery chip with respect between the surface of backboard and the envelope framework, institute
The second hydrophobic contact portion is stated between the backboard and the envelope framework.
4. photovoltaic cell component according to claim 3, which is characterized in that first hydrophobic contact portion and the side
Hydrophobic portion is connected by the first bending part, passes through the second bending part between second hydrophobic contact portion and the side hydrophobic portion
Connection；The warping resistance performance of first bending part at least more than first hydrophobic contact portion warping resistance performance, second dredge
The warping resistance performance of water contact site and the warping resistance performance of side hydrophobic portion, the warping resistance performance of second bending part are at least big
Warping resistance performance, the warping resistance performance in the second hydrophobic contact portion and the anti-folding of side hydrophobic portion in first hydrophobic contact portion
Curved performance.
5. photovoltaic cell component according to claim 1, which is characterized in that the solar battery chip is divided into rim area
Domain and photosensitive region, the solar battery chip include transparent substrates, and the surface that the transparent substrates correspond to photosensitive region is set
There are solar battery cell, the envelope framework to be located at the surface that the transparent substrate corresponds to frame region.
6. photovoltaic cell component according to claim 5, which is characterized in that the solar battery cell includes folding successively
Set the first electrode layer in transparent substrates, battery functi on layer and the second electrode lay, the first electrode layer and the transparent substrates
Photosensitive region surface it is opposite, the second electrode lay away from battery functi on layer surface it is opposite with the backboard, the battery
Functional layer is the PIN structural battery functi on layer of bilayer.
7. photovoltaic cell component according to claim 5, which is characterized in that the backboard is with respect to solar battery cell
Surface is formed with the first SGP glued membranes for bonding the backboard and solar battery cell, and the envelope framework is also with described
The contact aside of one SGP glued membranes；And/or
It is formed between the transparent substrates and the solar battery cell for bonding the transparent substrates and the sun
2nd SGP glued membranes of energy battery unit, contact aside of the envelope framework also with the 2nd SGP glued membranes.
8. photovoltaic cell component according to claim 7, which is characterized in that the backboard and/or the transparent substrates are equal
Thickness for transparent glass, the transparent glass is respectively less than 3mm.
9. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the hydrophobic encapsulated layer is to connect
The hydrophobic encapsulated layer that feeler is 120 °~160 °.
10. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the hydrophobic encapsulated layer is to have
Machine hydrophobic film or inorganic hydrophobic film.
11. photovoltaic cell component according to claim 10, which is characterized in that organic hydrophobic film is dredged for polyamide
Water film, PMMA-SiO2Composite hydrophobic film or polytetrafluoroethylene film；The inorganic hydrophobic film be silica membrane,
Aluminum oxide film or insulating ceramics film.
12. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the envelope framework is hot melt
Seal frame layer.
13. a kind of production method of photovoltaic cell component, which is characterized in that including：
Solar battery chip, backboard and envelope framework are provided；
The solar battery chip and the backboard are linked together using the envelope framework, the outer surface of the envelope framework
Equipped with hydrophobic encapsulated layer.
14. the production method of photovoltaic cell component according to claim 13, which is characterized in that described to utilize envelope framework
The solar battery chip and the backboard link together including：
The first hydrophobic contact portion is formed on the surface of the solar battery chip, first hydrophobic contact portion is dredged by side
Water portion is connect with the second hydrophobic contact portion；
In first hydrophobic contact portion envelope framework is formed away from the surface of solar battery chip；
The side hydrophobic portion connect with the side of envelope framework, second hydrophobic contact portion and the envelope framework are deviated from the
The surface in one hydrophobic contact portion connects；
The surface that the solar battery chip is formed to the first hydrophobic contact portion is opposite with backboard；
Solar battery chip described in heat lamination and the backboard repeatedly so that the envelope framework is by the solar battery chip
It links together with the backboard；The side of the envelope framework connection side hydrophobic portion is located at the envelope framework far from the sun
The side of energy battery chip.
15. the production method of photovoltaic cell component according to claim 14, which is characterized in that described to utilize envelope framework
After the solar battery chip and the backboard link together, the production method of the photovoltaic cell component further includes：It adopts
First bending part and second bending part are handled respectively with plasma bombardment technique.
16. according to the production method of claim 13~15 any one of them photovoltaic cell component, which is characterized in that described
Before the surface of solar battery chip forms the first hydrophobic contact portion, it is described using envelope framework by the solar battery chip and
The backboard, which links together, further includes：
The solar battery chip is divided into photosensitive region and is located at the non-photo-sensing region of photosensitive region circumferential direction；
Remove the functional film layer that the non-photo-sensing region of the solar battery chip is included so that the solar battery chip
Non-photo-sensing region formed insulation frame region.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810368681.5A CN108376720A (en) | 2018-04-23 | 2018-04-23 | A kind of photovoltaic cell component and preparation method thereof |
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| CN201810368681.5A CN108376720A (en) | 2018-04-23 | 2018-04-23 | A kind of photovoltaic cell component and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111628023A (en) * | 2019-02-28 | 2020-09-04 | 北京汉能光伏技术有限公司 | Thin film solar chip assembly and processing method thereof |
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