CN108322995A - A kind of electronic line structure - Google Patents

Abstract

The invention provides an electronic circuit structure, including a circuit board, the circuit board is electrically connected with an antenna structure and/or a transmission line, and it is characterized in that the circuit board has at least one first conductor layer, and the circuit board A second conductor layer is provided on at least one side of the circuit board, and the second conductor layer is electrically connected to the first conductor layer; the antenna structure and/or the transmission line are provided on the side of the circuit board, and are connected to the circuit board The second conductor layer is electrically connected. Compared with the technical solution in the prior art where the antenna structure and the transmission line are arranged on the upper and lower surfaces of the circuit board, the present invention arranges the antenna structure and the transmission line on the side of the circuit board, so that the functions of the transmission line and the antenna can be well realized, and the The horizontal space can be greatly utilized, thereby helping to reduce the requirement for the thickness of electronic products.

Description

An electronic circuit structure

technical field

The invention relates to the technical field of antennas and communications, in particular to an electronic circuit structure.

Background technique

In communication electronic equipment such as mobile phones, a printed circuit board (PCB) is usually installed, with a large number of SMT components on it, and other parts such as transmission lines above and below the PCB.

Conventional PCBs are connected to flat cables, FPCs, and antennas on the front or back of the PCB, and conduction and electronic functions are realized through shrapnel contact or soldering to the PCB. Conventional contact methods will increase the requirements of the equipment in the height direction, and also require space to avoid other components, and have high requirements for height and surrounding environment.

Contents of the invention

In view of the above problems, the present invention provides an electronic circuit structure, at least one of the first conductor layers extends to the side of the circuit board, and is directly connected to the second conductor layer arranged on the side of the circuit board .

Preferably, the second conductor layer is arranged on one side of the circuit board along its length direction, and the transmission line/the antenna structure is arranged along the side of the circuit board and connected to the second conductor layer .

Preferably, the second conductor layer includes a plurality of conductor layer modules, the plurality of conductor layer modules are arranged at intervals along the length direction of the side of the circuit board, the transmission line/the antenna structure and the plurality of the Conductor layer module soldering.

Preferably, each of the conductor layer modules is directly welded to the transmission line/the antenna structure through an SMT metal sheet;

Alternatively, welding pads are respectively provided on the transmission line/antenna structure at positions corresponding to each of the conductor layer modules, and the transmission line is welded to the conductor layer modules through the welding pads.

Preferably, the antenna structure includes an antenna metal radiator, and the antenna metal radiator is arranged on one side of the circuit board and is electrically connected to the second conductor layer.

Preferably, the antenna structure further includes an antenna carrier, the antenna metal radiator is arranged on the antenna carrier, and the antenna carrier is arranged on one side of the circuit board.

Compared with the prior art, the present invention has the following advantages and positive effects due to the adoption of the above technical solutions:

In the present invention, the antenna structure and the transmission line are arranged on the side of the circuit board, and realize the connection with the first conductor layer through the second conductor layer on the side of the circuit board (to realize grounding or realize signal connection); The antenna structure and the transmission line are arranged on the upper and lower surfaces of the circuit board. In the present invention, the antenna structure and the transmission line are arranged on the side of the circuit board, so that the functions of the transmission line and the antenna can be well realized, and the horizontal space can also be greatly utilized. , thus helping to reduce the requirements for the thickness of electronic products.

Description of drawings

The above and other features and advantages of the present invention can be more clearly understood through the following detailed description in conjunction with the accompanying drawings, wherein:

Fig. 1 is the structural representation of circuit board in embodiment 1;

Fig. 2 is the structural representation of transmission line in embodiment 1;

Fig. 3 is the three-dimensional structure schematic diagram that the transmission line is installed on the circuit board in embodiment 1;

Fig. 4 is the front view that the transmission line is installed on the circuit board in embodiment 1;

Fig. 5 is the structural representation of circuit board in embodiment 2;

Fig. 6 is the front view that transmission line is installed on the circuit board in embodiment 2;

FIG. 7 is a schematic structural diagram of the antenna structure in Embodiment 3;

Fig. 8 is a three-dimensional schematic diagram of the antenna structure installed on the circuit board in Embodiment 3;

9 is a front view of the antenna structure installed on the circuit board in Embodiment 3;

Fig. 10 is a three-dimensional schematic diagram of the antenna structure installed on the circuit board in Embodiment 4;

Fig. 11 is a front view of the antenna structure installed on the circuit board in Embodiment 4.

Detailed ways

The invention will be described in more detail hereinafter with reference to the accompanying drawings showing embodiments of the invention. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In these drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

The invention provides an electronic circuit structure, comprising a circuit board, an antenna structure and/or a transmission line are electrically connected to the circuit board; the circuit board has at least one first conductor layer, and at least one side of the circuit board is provided with a first Two conductor layers, the second conductor layer is electrically connected to the first conductor layer; the antenna structure and the transmission line are arranged on the side of the circuit board, and are electrically connected to the second conductor layer.

Wherein, the electronic circuit structure provided by the present invention can be used in electronic devices such as mobile phones and tablet computers; the circuit board in the present invention can adopt any circuit board in the prior art, such as a two-layer copper PCB structure; the circuit board can be It is a single-layer board or a multi-layer board. The first conductor layer on the circuit board is used for grounding or realizing signal connection. There is no limitation here. The first conductor layer can be arranged on the front or back or the middle of the circuit board. Do limit.

Among them, only one side of the circuit board can be provided with the second conductor layer, and there can also be multiple sides provided with the second conductor layer, which can be adjusted according to specific needs; only the antenna structure can be arranged on the side of the circuit board on the circuit board, or Only the transmission line can be arranged on the side of the circuit board, and the antenna structure and the transmission line can also be arranged on the side of the circuit board. Further, the antenna structure and the transmission line can be located on the same side of the circuit board, or on different sides of the circuit board. There are no restrictions and can be adjusted according to specific needs.

In the present invention, the antenna structure and the transmission line are arranged on the side of the circuit board, and realize the connection with the first conductor layer (to realize grounding or realize signal connection) through the second conductor layer on the side of the circuit board; The antenna structure and the transmission line are arranged on the upper and lower surfaces of the circuit board. In the present invention, the antenna structure and the transmission line are arranged on the side of the circuit board, so that the functions of the transmission line and the antenna can be well realized, and the horizontal space can also be greatly utilized. , thus helping to reduce the requirements for the thickness of electronic products.

Further description will be given below with regard to specific embodiments.

Example 1

1-4, this embodiment provides an electronic circuit structure, including a circuit board and a transmission line 4 arranged on the circuit board.

In this embodiment, the circuit board includes a substrate 1 and a first conductor layer 2 and a first conductor layer 6 arranged on the upper and lower surfaces of the substrate; further, the upper surface of the first conductor layer 2 and the second conductor layer 3 The small surface is covered with protective ink to prevent oxidation.

In this embodiment, one side of the circuit board is provided with the second conductor layer 3, and the side of the first conductor layer 2 and the first conductor layer 6 close to the second conductor layer 3 extends to the edge of the circuit board, thereby directly It is connected with the second conductor layer 3 to realize the electrical connection between the second conductor layer 3 and the first conductor layer, as shown in FIG. 4 .

Of course, in other embodiments, the electrical connection between the first conductor layer and the second conductor layer is not limited to the above, and can also be adjusted according to specific conditions, which is not limited here.

In this embodiment, the transmission line 4 is arranged along the length direction of the side surface of the circuit board, the second conductor layer 3 is also arranged along the length direction of the side surface of the circuit board, and the transmission line 4 and the second conductor layer 3 are bonded and connected together.

Wherein, as shown in Fig. 1, the second conductor layer 3 includes a plurality of conductor layer modules, specifically includes a conductor layer module 31, a conductor layer module 32, and a conductor layer module 33, and of course the specific number of conductor layer modules can also be Adjustment is made according to specific conditions, and there is no limitation here; multiple conductor layer modules are arranged at intervals along the length direction of the side of the circuit board, and the transmission line 4 is welded to the multiple conductor layer modules.

Of course, in other embodiments, the second conductor layer 3 may also be an integral structure extending along the length direction of the side surface of the circuit board, which is not limited here.

In this embodiment, the second conductor layer 3 can be directly formed on the side of the circuit board by electroplating or chemical plating, or by coating various metal conductive pastes (such as solder paste, silver paste, etc.), which is not limited here.

In this embodiment, as shown in FIG. 2 , pads 5 are provided on the transmission line 4 corresponding to the respective conductor layer modules, specifically including pads 51, pads 52 and pads 53; the transmission line 4 passes through The pads 51 , 52 , and 53 are welded to the conductor layer module 31 , the conductor layer module 32 , and the conductor layer module 33 in one-to-one correspondence to realize electrical connection.

Wherein, the welding method between the pad 5 and the second conductor layer can specifically adopt SMT (Surface Mount Technology) welding process, high frequency welding, heat gun welding, soldering iron tip heating welding, etc., which are not limited here.

Of course, in other embodiments, the connection mode between the transmission line 4 and the second conductor layer 3 is not limited to the above, and can be adjusted according to specific conditions.

Example 2

This embodiment is an adjustment made on the basis of Embodiment 1, and compared with Embodiment 1, there are the following differences:

5-6, in this embodiment, the transmission line 4 is provided with pads (not shown in the figure), the structural form of the pads can refer to the description in Embodiment 1; the pads of the transmission line 4 pass through three The metal sheet 7 is directly welded to the three-conductor layer module on the transmission line 4 , that is, the connection between the transmission line 4 and the second conductor layer 3 is realized directly through surface mount technology.

Wherein, the welding method between the pad, the metal sheet 7 and the conductor layer module can refer to the welding method between the pad and the second conductor layer in Embodiment 1, and will not be repeated here.

Example 3

7-9, this embodiment provides an electronic circuit structure, including a circuit board and an antenna structure arranged on the circuit board. Wherein, for the specific structure of the circuit board, reference may be made to the description in Embodiment 1, which will not be repeated here.

In this embodiment, the antenna structure includes an antenna metal radiator 8 and an antenna carrier 9, the antenna metal radiator 8 is arranged on the antenna carrier 9, and specifically, the antenna metal radiator 8 is directly formed on the antenna carrier 9 by means of electroplating or the like, It is an LDS antenna; of course, in other embodiments, the antenna metal radiator 8 may also be an FPC antenna (flexible antenna) attached to the antenna carrier 9 , which is not limited here.

Wherein, the antenna carrier 9 is a strip structure arranged along the length direction of the side of the circuit board and has a rectangular cross-section. The antenna metal radiator 8 is partially arranged on the side of the antenna carrier 9 facing the side of the circuit board, thereby facilitating the antenna metal The radiator 8 is directly soldered to the second conductor layer on the side of the circuit board. Of course, in other embodiments, the specific shape of the antenna carrier 9 can also be adjusted according to factors such as the form of the antenna, which is not limited here.

Wherein, the structural form of the antenna metal radiator 8 is not limited to that shown in FIG. 7 , and can be designed according to specific performance requirements, and there is no limitation here, and can be arranged according to specific needs.

In this embodiment, the connection method between the antenna metal radiator 8 and the second conductor layer 3 on the circuit board can refer to the connection method between the transmission line and the second conductor layer 3 in Embodiment 1 or Embodiment 2, here I won't repeat them here.

Example 4

This embodiment is an adjustment made on the basis of Embodiment 3, and compared with Embodiment 3, there are the following differences:

10-11, in this embodiment, the arrangement of the antenna carrier is omitted, and the antenna structure directly includes an antenna metal radiator 8, and the antenna metal radiator 8 is specifically realized by a metal shrapnel; the antenna metal radiator 8 directly It is welded together with the second conductor layer 3 on the side of the circuit board to realize electrical connection.

Wherein, the welding method between the antenna metal radiator 8 and the second conductor layer 3 refers specifically to the welding method between the pad and the second conductor layer in Embodiment 1, and will not be repeated here.

Compared with the conductor structure in Embodiment 3, the antenna structure in this embodiment is simpler in structure.

Those skilled in the art will appreciate that the present invention may be embodied in many other specific forms without departing from its own spirit or scope. Although examples of the present invention have been described, it should be understood that the present invention should not be limited to these examples, and that changes and modifications may be made by those skilled in the art within the spirit and scope of the present invention as defined by the appended claims.

Claims (8)

1. An electronic circuit structure, comprising a circuit board, the circuit board is electrically connected with an antenna structure and/or a transmission line, it is characterized in that the circuit board has at least one first conductor layer, and at least one of the circuit boards A second conductor layer is arranged on one side, and the second conductor layer is electrically connected to the first conductor layer; the antenna structure and/or the transmission line are arranged on the side of the circuit board, and are connected to the The second conductor layer is electrically connected. 2 . The electronic circuit structure according to claim 1 , wherein the first conductor layer is disposed on the upper surface of the circuit board or on the lower surface of the circuit board or in the middle of the circuit board. 3. The electronic circuit structure according to claim 1, wherein at least one of the first conductor layers extends to the side of the circuit board, and directly connects with the second layer disposed on the side of the circuit board. Conductor layer connection. 4. The electronic circuit structure according to claim 1, wherein the second conductor layer is arranged on one side of the circuit board along its length direction, and the transmission line/the antenna structure is arranged along the The side of the circuit board is arranged and connected with the second conductor layer. 5. The electronic circuit structure according to claim 4, wherein the second conductor layer is an integral structure extending along the length direction of the side surface of the circuit board; Alternatively, the second conductor layer includes a plurality of conductor layer modules, and the plurality of conductor layer modules are arranged at intervals along the length direction of the side surface of the circuit board, and the transmission line/the antenna structure and the plurality of conductor layer modules Module welding. 6. The electronic circuit structure according to claim 5, wherein each of the conductor layer modules is directly welded to the transmission line/the antenna structure through an SMT metal sheet; Alternatively, welding pads are respectively provided on the transmission line/antenna structure at positions corresponding to each of the conductor layer modules, and the transmission line is welded to the conductor layer modules through the welding pads. 7. The electronic circuit structure according to claim 1 or 4 or 5 or 6, wherein the antenna structure includes an antenna metal radiator, and the antenna metal radiator is arranged on one side of the circuit board, And electrically connected with the second conductor layer. 8. The electronic circuit structure according to claim 7, wherein the antenna structure further includes an antenna carrier, the antenna metal radiator is arranged on the antenna carrier, and the antenna carrier is arranged on the circuit side of the board.