CN108231931A - A kind of compound backboard of high efficiency and heat radiation solar cell and preparation method thereof - Google Patents
A kind of compound backboard of high efficiency and heat radiation solar cell and preparation method thereof Download PDFInfo
- Publication number
- CN108231931A CN108231931A CN201711485146.XA CN201711485146A CN108231931A CN 108231931 A CN108231931 A CN 108231931A CN 201711485146 A CN201711485146 A CN 201711485146A CN 108231931 A CN108231931 A CN 108231931A
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- resin layer
- metal substrate
- polyester resin
- solar cell
- high efficiency
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- 230000005855 radiation Effects 0.000 title claims abstract description 32
- 150000001875 compounds Chemical class 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 claims abstract description 123
- 239000002184 metal Substances 0.000 claims abstract description 123
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 229920002313 fluoropolymer Polymers 0.000 claims abstract description 66
- 239000004811 fluoropolymer Substances 0.000 claims abstract description 66
- 239000004645 polyester resin Substances 0.000 claims abstract description 60
- 229920001225 polyester resin Polymers 0.000 claims abstract description 59
- 239000011230 binding agent Substances 0.000 claims abstract description 21
- 238000007731 hot pressing Methods 0.000 claims abstract description 14
- 230000001680 brushing effect Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000003491 array Methods 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 4
- 150000001336 alkenes Chemical class 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 97
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The present invention provides a kind of compound backboard of high efficiency and heat radiation solar cell and preparation method thereof.The preparation method of the heat radiating type photovoltaic back includes：1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and form annular protrusion around each columnar projections, annular protrusion is formed in the one side of the second metal substrate and third metal substrate, multiple grooves are formed in the another side of the second metal substrate and third metal substrate；2) in the first fluoropolymer resin layer, the first polyester resin layer, the second polyester resin layer and the respective surface of the second fluoropolymer resin layer brushing binding agent, and being dried respectively；3) the first fluoropolymer resin layer, the second metal substrate, the first polyester resin layer, the first metal substrate, the second polyester resin layer, third metal substrate and the second fluoropolymer resin layer are stacked gradually；4) hot pressing processing is carried out.Composite back plate prepared by this method can rapidly and efficiently radiate.
Description
Technical field
The present invention relates to technical field of solar batteries, more particularly to a kind of compound backboard of high efficiency and heat radiation solar cell
And preparation method thereof.
Background technology
Solar cell module mainly by tempered glass transparent panel, ethylene-vinyl acetate copolymer, cell piece, backboard, connect
Wire box and frame composition.Since backboard plays cell piece support protective effect, and backboard is directly contacted with external environment, backboard
Performance directly determines the photoelectric conversion efficiency and service life of corresponding solar cell module.Backboard is typically that a kind of multilayer is answered
Condensation material, generally with three-decker, outer protective layer has good exhausted with good environment resistant erosiveness, middle layer
The glue-line of edge performance, internal layer and solar cell module has good adhesive property.There is heat dissipation in existing back-protective layer
The problems such as property is poor, mechanical strength is low.How to improve the thermal diffusivity of backboard and mechanical strength causes the extensive concern of people.
Invention content
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of compound back of the body of high efficiency and heat radiation solar cell is provided
Plate and preparation method thereof.
To achieve the above object, the preparation method of a kind of compound backboard of high efficiency and heat radiation solar cell proposed by the present invention,
Include the following steps：
1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and in each column
A first annular protrusion is respectively formed around raised, has one between each columnar projections and each first annular protrusion
First gap forms multiple second annular protrusions, in the second Metal Substrate in the one side of the second metal substrate and third metal substrate
The another side of plate and third metal substrate forms multiple grooves, wherein each second annular protrusion can be embedded in first gap
In；
2) the first fluoropolymer resin layer and second fluoropolymer resin layer while brushing binding agent respectively, first
Polyester resin layer and the respective upper and lower surface of the second polyester resin layer brushing binding agent, and place is dried respectively
Reason；
3) first fluoropolymer resin layer is laid in the lower surface of second metal substrate, in second metal substrate
Upper surface be laid with the first polyester resin layer, first metal substrate is then laid on first polyester resin layer, is connect
It and is laid with the second polyester resin layer in the upper surface of first metal substrate, be then laid on second polyester resin layer
The third metal substrate is then laid with second fluoropolymer resin layer in the upper surface of the third metal substrate；
4) hot pressing processing, multiple second annular protrusion difference of second, third metallic substrate surfaces are carried out
It is embedded in multiple first gaps of first metallic substrate surfaces one by one, to obtain the high efficiency and heat radiation solar cell
Composite back plate.
Preferably, in the step 1, multiple columnar projections are arranged in arrays, and multiple grooves are arranged in arrays.
Preferably, the temperature of the drying process in the step 2) is 80-110 DEG C and the time is 30-60 seconds.
Preferably, it in the step 3), is set in first metal substrate, the second metal substrate and third metal substrate
There is alignment to identify, the one of binding agent is painted in first fluoropolymer resin layer facing towards the lower surface of the second metal substrate, institute
It states and the one of binding agent is painted in the second fluoropolymer resin layer facing towards the upper surface of third metal substrate, first metal substrate
Multiple first gaps on surface are divided respectively with multiple second annular protrusions of second, third metallic substrate surfaces
It does not correspond.
Preferably, the concrete technology of the hot pressing processing in the step 4) is：Concrete technology is：With 6-9 DEG C/min liters
Temperature is to 70-90 DEG C, while using Pressure rise rates as increase 2-3Kg/cm per minute2Condition pressure is increased into 20-30Kg/
cm2, kept for 20-40 minutes, then 100-120 DEG C be warming up to 4-5 DEG C/min, using Pressure rise rates as increase 3- per minute
5Kg/cm2Condition pressure is increased into 50-60Kg/cm2, it is kept for 40-60 minutes, is then cooled to 70-90 DEG C with 4-5 DEG C/min,
Using pressure decrease rate as 3-5Kg/cm2Condition pressure is down to 20-30Kg/cm2, kept for 5-10 minutes, then with pressure drop
Low rate is 2-3Kg/cm2Condition pressure is reduced to 0, it is 70-90 DEG C to keep temperature, cures 50-70 hours, is finally cooled to
Room temperature.
Preferably, in the step 4), a part for first fluoropolymer resin layer is embedded in second metal substrate
In multiple grooves, a part for second fluoropolymer resin layer is embedded in multiple grooves of the third metal substrate.
Preferably, first fluoropolymer resin layer, first polyester resin layer, second polyester resin layer and institute
It states in the second fluoropolymer resin layer and contains heat conduction particle.
Preferably, the fluorine resin in first fluoropolymer resin layer and second fluoropolymer resin layer for polyvinyl fluoride,
One or more mixtures in Kynoar, polytetrafluoroethylene (PTFE), first polyester resin layer and second polyester
Polyester resin in resin layer is one or more mixtures in PET, PEN, PBT.
The present invention also provides a kind of compound backboard of high efficiency and heat radiation solar cell, the high efficiency and heat radiation solar cell composites
Backboard is closed to prepare to be formed using the above method.
In the compound backboard of solar cell of the present invention, the surface of the first metal substrate have mutual cooperation columnar projections and
First annular protrusion, has one first gap between each columnar projections and each first annular protrusion, the second metal substrate and
The one side of third metal substrate has the second annular protrusion, multiple second convex annulars of second, third metallic substrate surfaces
Rise respectively one by one be embedded in first metallic substrate surfaces multiple first gaps in, be effectively increased the first metal substrate with
The contact area of second, third metal substrate, so that the compound backboard of the solar cell has excellent heat dissipation performance.The
The another side of two metal substrates and third metal substrate forms multiple grooves, and a part for first, second fluoropolymer resin layer is embedded
In multiple grooves of second, third metal substrate, the adhesive property of fluoropolymer resin layer and metal substrate is effectively improved.Fluorine resin
Contain heat conduction particle in layer, further such that the photovoltaic back has excellent heat dissipation property and weather resistance.In addition, the present invention
Preparation method also has the advantages that compared with prior art：By optimizing hot pressing treatment process, pressure and temperature is equal
It first gradually increases, and carries out interim hot-pressing processing, then continuously decrease pressure and temperature again so that in entire hot pressing process
It is middle to facilitate being accurately positioned, and then facilitate multiple second convex annulars of second, third metallic substrate surfaces between each metal substrate
It rises and is embedded in multiple first gaps of the first metallic substrate surfaces one by one respectively, preparation method of the invention is simple, is easy to industry
Production.
Description of the drawings
Fig. 1 is the structure diagram of the compound backboard of high efficiency and heat radiation solar cell of the present invention.
Fig. 2 is the compound backboard of high efficiency and heat radiation solar cell of the present invention along A-A ' schematic cross-sections.
Fig. 3 is the schematic diagram for having in the second metal substrate of the present invention and third metal substrate groove one side.
Specific embodiment
A kind of preparation method of the compound backboard of high efficiency and heat radiation solar cell, includes the following steps：
1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and in each column
A first annular protrusion is respectively formed around raised, has one between each columnar projections and each first annular protrusion
First gap forms multiple second annular protrusions, in the second Metal Substrate in the one side of the second metal substrate and third metal substrate
The another side of plate and third metal substrate forms multiple grooves, wherein each second annular protrusion can be embedded in first gap
In；
2) the first fluoropolymer resin layer and second fluoropolymer resin layer while brushing binding agent respectively, first
Polyester resin layer and the respective upper and lower surface of the second polyester resin layer brushing binding agent, and place is dried respectively
Reason；
3) first fluoropolymer resin layer is laid in the lower surface of second metal substrate, in second metal substrate
Upper surface be laid with the first polyester resin layer, first metal substrate is then laid on first polyester resin layer, is connect
It and is laid with the second polyester resin layer in the upper surface of first metal substrate, be then laid on second polyester resin layer
The third metal substrate is then laid with second fluoropolymer resin layer in the upper surface of the third metal substrate；
4) hot pressing processing, multiple second annular protrusion difference of second, third metallic substrate surfaces are carried out
It is embedded in multiple first gaps of first metallic substrate surfaces one by one, to obtain the high efficiency and heat radiation solar cell
Composite back plate.
Wherein, in the step 1, multiple columnar projections are arranged in arrays, and multiple grooves are arranged in arrays, institute
The material for stating first, second, third metal substrate is preferably aluminium or copper.The temperature of the drying process in the step 2) is
80-110 DEG C and time are 30-60 seconds.In the step 3), first metal substrate, the second metal substrate and third gold
Belong to and alignment mark is provided in substrate, the one of binding agent is painted in first fluoropolymer resin layer facing towards the second metal substrate
Lower surface, the one of binding agent is painted in second fluoropolymer resin layer facing towards the upper surface of third metal substrate, it is described
Multiple first gaps of first metallic substrate surfaces respectively with second, third metallic substrate surfaces multiple described
Second ring protrusion corresponds respectively.In the step 4) hot pressing processing concrete technology be：Concrete technology is：With 6-9
DEG C/min is warming up to 70-90 DEG C, while using Pressure rise rates as increase 2-3Kg/cm per minute2Condition pressure is increased to
20-30Kg/cm2, kept for 20-40 minutes, then 100-120 DEG C be warming up to 4-5 DEG C/min, using Pressure rise rates as every point
Clock increases 3-5Kg/cm2Condition pressure is increased into 50-60Kg/cm2, kept for 40-60 minutes, be then cooled to 4-5 DEG C/min
70-90 DEG C, using pressure decrease rate as 3-5Kg/cm2Condition pressure is down to 20-30Kg/cm2, holding 5-10 minutes, then
Using pressure decrease rate as 2-3Kg/cm2Condition pressure is reduced to 0, it is 70-90 DEG C to keep temperature, cures 50-70 hours, most
Postcooling is to room temperature.In the step 4), a part for first fluoropolymer resin layer is embedded in the more of second metal substrate
In a groove, a part for second fluoropolymer resin layer is embedded in multiple grooves of the third metal substrate.Described first
Contain in fluoropolymer resin layer, first polyester resin layer, second polyester resin layer and second fluoropolymer resin layer
There is heat conduction particle.Fluorine resin in first fluoropolymer resin layer and second fluoropolymer resin layer is polyvinyl fluoride, gathers partially
One or more mixtures in vinyl fluoride, polytetrafluoroethylene (PTFE), first polyester resin layer and second polyester resin
Polyester resin in layer is one or more mixtures in PET, PEN, PBT.
The present invention also provides a kind of compound backboard of high efficiency and heat radiation solar cell, the high efficiency and heat radiation solar cell composites
Backboard is closed to prepare to be formed using the above method.As shown in Figs. 1-3, the compound backboard of high efficiency and heat radiation solar cell includes
The first fluoropolymer resin layer 4, the second metal substrate 2, the first polyester resin layer 5, the first metal substrate 1, second stacked gradually is poly-
Ester resin layer 6,3 and second fluoropolymer resin layer 7 of third metal substrate, wherein, in the upper surface of first metal substrate 1 and
Lower surface is respectively provided with multiple columnar projections 8, and one first annular raised 9 is respectively provided with around each columnar projections 8, often
There is one first gap, in second metal substrate 2 between a columnar projections 8 and each described first annular raised 9
Multiple second annular protrusions 10 are formed with the one side of the third metal substrate 3, in second metal substrate 2 and the third
The another side of metal substrate 3 forms multiple grooves 11, multiple second rings on second, third 2 and 3 surface of metal substrate
Shape protrusion 10 is embedded in multiple first gaps on 1 surface of the first metal substrate one by one respectively.
Embodiment 1：
A kind of preparation method of the compound backboard of high efficiency and heat radiation solar cell, includes the following steps：
1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and in each column
A first annular protrusion is respectively formed around raised, has one between each columnar projections and each first annular protrusion
First gap forms multiple second annular protrusions, in the second Metal Substrate in the one side of the second metal substrate and third metal substrate
The another side of plate and third metal substrate forms multiple grooves, wherein each second annular protrusion can be embedded in first gap
In, in the step 1, multiple columnar projections are arranged in arrays, and multiple grooves are arranged in arrays, and described first,
2nd, the material of third metal substrate is aluminium；
2) the first fluoropolymer resin layer and second fluoropolymer resin layer while brushing binding agent respectively, first
Polyester resin layer and the respective upper and lower surface of the second polyester resin layer brushing binding agent, and place is dried respectively
It manages, the temperature of the drying process in the step 2) is 90 DEG C and the time is 50 seconds, first fluoropolymer resin layer, institute
It states in the first polyester resin layer, second polyester resin layer and second fluoropolymer resin layer and contains heat conduction particle.Institute
Fluorine resin in the first fluoropolymer resin layer and second fluoropolymer resin layer is stated as polytetrafluoroethylene (PTFE), first polyester resin
Polyester resin in layer and second polyester resin layer is PET；
3) first fluoropolymer resin layer is laid in the lower surface of second metal substrate, in second metal substrate
Upper surface be laid with the first polyester resin layer, first metal substrate is then laid on first polyester resin layer, is connect
It and is laid with the second polyester resin layer in the upper surface of first metal substrate, be then laid on second polyester resin layer
The third metal substrate is then laid with second fluoropolymer resin layer, the step in the upper surface of the third metal substrate
It is rapid 3) in, be provided in first metal substrate, the second metal substrate and third metal substrate alignment mark, described first contains
The one of binding agent is painted in fluororesin layer facing towards the lower surface of the second metal substrate, is brushed in second fluoropolymer resin layer
Have the one of binding agent facing towards the upper surface of third metal substrate, multiple first gaps of first metallic substrate surfaces
It is corresponded respectively with multiple second annular protrusions of second, third metallic substrate surfaces respectively；
4) hot pressing processing is carried out, the concrete technology of hot pressing processing is：Concrete technology is：70 are warming up to 7 DEG C/min
DEG C, while using Pressure rise rates as increase 2Kg/cm per minute2Condition pressure is increased into 20Kg/cm2, kept for 30 minutes, connect
It and is warming up to 110 DEG C with 5 DEG C/min, using Pressure rise rates as increase 5Kg/cm per minute2Condition pressure is increased into 60Kg/
cm2, kept for 50 minutes, then 70 DEG C be cooled to 5 DEG C/min, using pressure decrease rate as 5Kg/cm2Condition pressure is down to
20Kg/cm2, kept for 8 minutes, then using pressure decrease rate as 2Kg/cm2Condition pressure is reduced to 0, it is 70 to keep temperature
DEG C, cure 60 hours, be finally cooled to room temperature, multiple second annular protrusions of second, third metallic substrate surfaces
It is embedded in multiple first gaps of first metallic substrate surfaces one by one respectively, one of first fluoropolymer resin layer
Divide in multiple grooves of embedded second metal substrate, a part for second fluoropolymer resin layer is embedded in the third metal
In multiple grooves of substrate, to obtain the compound backboard of high efficiency and heat radiation solar cell.
The compound backboard of high efficiency and heat radiation solar cell prepared by the above method is tested for the property, the results showed that, with
The peel strength of solar cell module EVA glue-lines is 156N/cm, water vapor transmittance 0.07g/m2*d。
Embodiment 2：
A kind of preparation method of the compound backboard of high efficiency and heat radiation solar cell, includes the following steps：
1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and in each column
A first annular protrusion is respectively formed around raised, has one between each columnar projections and each first annular protrusion
First gap forms multiple second annular protrusions, in the second Metal Substrate in the one side of the second metal substrate and third metal substrate
The another side of plate and third metal substrate forms multiple grooves, wherein each second annular protrusion can be embedded in first gap
In, in the step 1, multiple columnar projections are arranged in arrays, and multiple grooves are arranged in arrays, and described first,
2nd, the material of third metal substrate is copper；
2) the first fluoropolymer resin layer and second fluoropolymer resin layer while brushing binding agent respectively, first
Polyester resin layer and the respective upper and lower surface of the second polyester resin layer brushing binding agent, and place is dried respectively
It manages, the temperature of the drying process in the step 2) is 100 DEG C and the time is 30 seconds, first fluoropolymer resin layer,
Contain heat conduction particle in first polyester resin layer, second polyester resin layer and second fluoropolymer resin layer.
Fluorine resin in first fluoropolymer resin layer and second fluoropolymer resin layer is polyvinyl fluoride, first polyester resin
The mixture that polyester resin in layer and second polyester resin layer is PET and PBT；
3) first fluoropolymer resin layer is laid in the lower surface of second metal substrate, in second metal substrate
Upper surface be laid with the first polyester resin layer, first metal substrate is then laid on first polyester resin layer, is connect
It and is laid with the second polyester resin layer in the upper surface of first metal substrate, be then laid on second polyester resin layer
The third metal substrate is then laid with second fluoropolymer resin layer, the step in the upper surface of the third metal substrate
It is rapid 3) in, be provided in first metal substrate, the second metal substrate and third metal substrate alignment mark, described first contains
The one of binding agent is painted in fluororesin layer facing towards the lower surface of the second metal substrate, is brushed in second fluoropolymer resin layer
Have the one of binding agent facing towards the upper surface of third metal substrate, multiple first gaps of first metallic substrate surfaces
It is corresponded respectively with multiple second annular protrusions of second, third metallic substrate surfaces respectively；
4) hot pressing processing is carried out, the concrete technology of hot pressing processing is：Concrete technology is：80 are warming up to 8 DEG C/min
DEG C, while using Pressure rise rates as increase 3Kg/cm per minute2Condition pressure is increased into 30Kg/cm2, kept for 25 minutes, connect
It and is warming up to 100 DEG C with 4 DEG C/min, using Pressure rise rates as increase 4Kg/cm per minute2Condition pressure is increased into 50Kg/
cm2, kept for 60 minutes, then 80 DEG C be cooled to 4 DEG C/min, using pressure decrease rate as 4Kg/cm2Condition pressure is down to
30Kg/cm2, kept for 5 minutes, then using pressure decrease rate as 3Kg/cm2Condition pressure is reduced to 0, it is 80 to keep temperature
DEG C, cure 50 hours, be finally cooled to room temperature, multiple second annular protrusions of second, third metallic substrate surfaces
It is embedded in multiple first gaps of first metallic substrate surfaces one by one respectively, one of first fluoropolymer resin layer
Divide in multiple grooves of embedded second metal substrate, a part for second fluoropolymer resin layer is embedded in the third metal
In multiple grooves of substrate, to obtain the compound backboard of high efficiency and heat radiation solar cell.
The compound backboard of high efficiency and heat radiation solar cell prepared by the above method is tested for the property, the results showed that, with
The peel strength of solar cell module EVA glue-lines is 149N/cm, water vapor transmittance 0.10g/m2*d。
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (9)
1. a kind of preparation method of the compound backboard of high efficiency and heat radiation solar cell, it is characterised in that：Include the following steps：
1) multiple columnar projections are respectively formed in the upper and lower surface of the first metal substrate, and in each columnar projections
Surrounding is respectively formed a first annular protrusion, has one first between each columnar projections and each first annular protrusion
Gap forms multiple second annular protrusions in the one side of the second metal substrate and third metal substrate, in the second metal substrate and
The another side of third metal substrate forms multiple grooves, wherein each second annular protrusion can be embedded in first gap；
2) the first fluoropolymer resin layer and the second fluoropolymer resin layer while brushing binding agent respectively, in the first polyester
Resin layer and the respective upper and lower surface of the second polyester resin layer brushing binding agent, and being dried respectively；
3) first fluoropolymer resin layer is laid in the lower surface of second metal substrate, in the upper of second metal substrate
Surface is laid with the first polyester resin layer, and first metal substrate is then laid on first polyester resin layer, is then existed
The upper surface of first metal substrate is laid with the second polyester resin layer, then on second polyester resin layer described in laying
Third metal substrate is then laid with second fluoropolymer resin layer in the upper surface of the third metal substrate；
4) hot pressing processing is carried out, multiple second annular protrusions difference of second, third metallic substrate surfaces are one by one
It is compound to obtain the high efficiency and heat radiation solar cell in multiple first gaps of embedded first metallic substrate surfaces
Backboard.
2. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
In step 1, multiple columnar projections are arranged in arrays, and multiple grooves are arranged in arrays.
3. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
The temperature of the drying process in step 2) is 80-110 DEG C and the time is 30-60 seconds.
4. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
In step 3), alignment is provided in first metal substrate, the second metal substrate and third metal substrate and is identified, described first
The one of binding agent is painted in fluoropolymer resin layer facing towards the lower surface of the second metal substrate, is applied in second fluoropolymer resin layer
Brushed with binding agent one facing towards the upper surface of third metal substrate, first metallic substrate surfaces multiple described first between
Gap corresponds respectively with multiple second annular protrusions of second, third metallic substrate surfaces respectively.
5. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
In step 4) hot pressing processing concrete technology be：Concrete technology is：70-90 DEG C is warming up to, while with 6-9 DEG C/min with pressure
Power is advanced the speed as increase 2-3Kg/cm per minute2Condition pressure is increased into 20-30Kg/cm2, holding 20-40 minutes, then
100-120 DEG C is warming up to 4-5 DEG C/min, using Pressure rise rates as increase 3-5Kg/cm per minute2Condition pressure is increased
To 50-60Kg/cm2, kept for 40-60 minutes, then 70-90 DEG C be cooled to 4-5 DEG C/min, using pressure decrease rate as 3-
5Kg/cm2Condition pressure is down to 20-30Kg/cm2, kept for 5-10 minutes, then using pressure decrease rate as 2-3Kg/cm2
Condition pressure is reduced to 0, it is 70-90 DEG C to keep temperature, cures 50-70 hours, is finally cooled to room temperature.
6. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 5, it is characterised in that：It is described
In step 4), a part for first fluoropolymer resin layer is embedded in multiple grooves of second metal substrate, and described second
A part for fluoropolymer resin layer is embedded in multiple grooves of the third metal substrate.
7. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
In first fluoropolymer resin layer, first polyester resin layer, second polyester resin layer and second fluoropolymer resin layer
Contain heat conduction particle.
8. the preparation method of the compound backboard of high efficiency and heat radiation solar cell according to claim 1, it is characterised in that：It is described
Fluorine resin in first fluoropolymer resin layer and second fluoropolymer resin layer is polyvinyl fluoride, Kynoar, polytetrafluoroethyl-ne
One or more mixtures in alkene, the polyester resin in first polyester resin layer and second polyester resin layer are
One or more mixtures in PET, PEN, PBT.
9. a kind of compound backboard of high efficiency and heat radiation solar cell, which is characterized in that using claim 1-8 any one of them sides
Method prepares what is formed.
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| CN201711485146.XA CN108231931B (en) | 2017-12-29 | 2017-12-29 | Compound backboard of a kind of heat dissipation solar battery and preparation method thereof |
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| CN101552300A (en) * | 2008-04-01 | 2009-10-07 | E.I.内穆尔杜邦公司 | Solar panel with improved heat radiation performance |
| JP2010074057A (en) * | 2008-09-22 | 2010-04-02 | Toppan Printing Co Ltd | Solar cell backside sheet and solar cell module using the same |
| JP2012114331A (en) * | 2010-11-26 | 2012-06-14 | Koito Mfg Co Ltd | Solar cell module |
| CN104701401A (en) * | 2013-12-04 | 2015-06-10 | 纳幕尔杜邦公司 | Integrated backboard including aluminum conductive circuit, and back contact type photovoltaic module |
| CN106847972A (en) * | 2017-03-29 | 2017-06-13 | 江苏福克斯新能源科技有限公司 | A kind of solar cell module and preparation method thereof |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101552300A (en) * | 2008-04-01 | 2009-10-07 | E.I.内穆尔杜邦公司 | Solar panel with improved heat radiation performance |
| JP2010074057A (en) * | 2008-09-22 | 2010-04-02 | Toppan Printing Co Ltd | Solar cell backside sheet and solar cell module using the same |
| JP2012114331A (en) * | 2010-11-26 | 2012-06-14 | Koito Mfg Co Ltd | Solar cell module |
| CN104701401A (en) * | 2013-12-04 | 2015-06-10 | 纳幕尔杜邦公司 | Integrated backboard including aluminum conductive circuit, and back contact type photovoltaic module |
| CN106847972A (en) * | 2017-03-29 | 2017-06-13 | 江苏福克斯新能源科技有限公司 | A kind of solar cell module and preparation method thereof |
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| CN108231931B (en) | 2019-06-28 |
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