CN108231709B - 具有双面冷却的功率模块 - Google Patents
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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Abstract
一种具有双面冷却的功率模块,在功率模块的上板与下板之间设置有半导体芯片。具体地,上板包括:由介电材料制成的第一接合层;和由铜材料制成并设置在第一接合层的第一表面上的第一电极,第一电极连接至半导体芯片。下板包括:由介电材料制成的第二接合层;和由铜材料制成并设置在第二接合层的第一表面上的第二电极,第二电极连接至半导体芯片。更具体地,第一电极的厚度是第一接合层的厚度的三倍或更大,并且第二电极的厚度是第二接合层的厚度的三倍或更大。
Description
技术领域
本发明总体涉及具有双面冷却的功率模块。
背景技术
本节中的说明仅提供与本发明相关的背景信息,并且可能不构成现有技术。
通常,为了操作例如混合动力车或电动车的绿色汽车的驱动电动机,需要将从高压电池供应的电流适当地传输至驱动电动机的功率模块。
这样的功率模块由于快速切换操作而产生相当大的热量。因为这种发热导致功率模块的效率降低,所以配置用于冷却功率模块的冷却器。
在具有双面冷却的功率模块中,将板分别安装在功率模块的半导体芯片(即IGBT或MOSFET)的两个表面上,并且冷却器安装在板的外侧,由此同时冷却板的两面。
特别地,使用两个半导体芯片并具有双面冷却的2合1型功率模块体积小并且散热性能优异,因此其应用范围广。
图1示出常规的具有双面冷却的2合1型功率模块。
如图1中所示,常规的功率模块配置为使得上板10和下板20设置在第一半导体芯片31和第二半导体芯片32的两面的方向上,并且例如连接至半导体芯片31、32的第一输出端子11、第二输出端子12、第三输出端子23、正端子22和负端子21的电极设置在板10、20上。正端子22连接至电池(未示出)的阳极,负端子21连接至电池的阴极,并且第一、第二和第三输出端子11、12和23连接至驱动电动机(未示出)。可设置由铜材料制成的间隔件41、42、43和44,用以连接在上板10与下板20之间并且确保用于安装引线(未示出)的空间。
上板10和下板20的电极分别设置在绝缘层14、25上,并且绝缘层14、25由例如氧化铝(Al2O3)的陶瓷材料制成。此外,散热板13、24设置在绝缘层14、25的外侧,用以将热量传递至冷却器51、52。
同时,如图3中所示,半导体芯片30中产生的热量在传递至铜层C的同时,不仅在长度方向而且在宽度方向扩散。热量在具有高导热性的铜层C中以约45°的角度扩散,并且在具有较低导热性的绝缘层I中在垂直方向上扩散。
为了通过增加散热面积来提高冷却效率,需要增加铜层C的厚度以形成热量在宽度方向扩散的空间。然而,在由铜和陶瓷材料构成的常规板中,因为铜材料和陶瓷材料之间的热膨胀系数的差异,所以存在铜层C不能形成至一定厚度以上的问题。当铜层过厚时,难以进行通过等于或大于1065℃的温度下的共晶反应将铜层和陶瓷层彼此接合的工艺,并且由于内部残余应力而容易导致破损。
作为对此的解决方案,如图2中所示,提出了一种从板上去除铜-陶瓷接合层,并且在电极91、92、93、94与冷却器51、52之间分别设置由氮化硅(Si3N4)构成的绝缘层96的结构。
然而,我们已经发现,由于氮化硅(Si3N4)比较昂贵并且露出密封构件80的外部,所以易于因外部冲击而破损。
另外,难以利用导热脂60将绝缘层96与电极91、92、93、94接合,并且当未均匀涂敷导热脂60时,热特性迅速恶化。
前述内容仅旨在帮助理解本发明的背景,并不旨在意味着本发明落入本领域技术人员已知的现有技术的范围内。
发明内容
本发明提供一种具有双面冷却的功率模块,该模块应用介电材料,从而能够扩大散热面积。
在本发明的一种实施方式中,具有双面冷却的功率模块在上板与下板之间设置有半导体芯片。功率模块包括:上板,包括由介电材料制成的第一接合层和由铜材料制成并设置在第一接合层的第一表面上的第一电极,第一电极连接至半导体芯片;以及下板,包括由介电材料制成的第二接合层和由铜材料制成并设置在第二接合层的第一表面上的第二电极,第二电极连接至半导体芯片。特别地,第一电极的厚度可为第一接合层的厚度的三倍或更大,并且第二电极的厚度可为第二接合层的厚度的三倍或更大。
第一电极可包括:第一输出端子,设置在第一接合层的第一表面上;以及第二输出端子,设置在第一接合层的第一表面上并与第一输出端子间隔开。第二电极可包括:正端子,设置在第二接合层的第一表面上;第三输出端子,设置在第二接合层的第一表面上并与正端子间隔开;以及负端子,设置在第二接合层的第一表面上并与正端子和第三输出端子两者间隔开。
半导体芯片可包括:第一半导体芯片,设置在第一输出端子与正端子之间;以及第二半导体芯片,设置在第二输出端子与第三输出端子之间。
第一间隔件可设置在第一输出端子与第一半导体芯片之间,并且第二间隔件可设置在第二输出端子与第二半导体芯片之间。
第一间隔件可构造为使得第一间隔件的截面积在从第一半导体芯片向第一输出端子的方向上增加,并且第二间隔件可构造为使得第二间隔件的截面积在从第二半导体芯片向第二输出端子的方向上增加。
正端子与第一半导体芯片、第一半导体芯片与第一间隔件、第一间隔件与第一输出端子、第三输出端子与第二半导体芯片、第二半导体芯片与第二间隔件以及第二间隔件与第二输出端子可分别通过使用焊接材料焊接在一起。
第一桥可由铜材料制成并可将第一输出端子与第三输出端子彼此连接,并且第二桥可由铜材料制成并可将第二输出端子与负端子彼此连接,其中,可通过使用焊接材料将第一桥焊接至第一输出端子和第三输出端子,并可通过使用焊接材料将第二桥焊接至第二输出端子和负端子。
上板还可包括:第一散热板,设置在第一接合层的第二表面上并与第一冷却器接触,并且下板还可包括:第二散热板,设置在第二接合层的第二表面上并与第二冷却器接触。
导热脂可设置在第一散热板与第一冷却器之间以及第二散热板与第二冷却器之间。
第一接合层和第二接合层中的每一者可包含3~40重量%的环氧化合物和50~95重量%的陶瓷。
根据本发明的具有双面冷却的功率模块具有以下效果。
首先,可增加铜层的厚度,因此能够扩大散热面积。
第二,可扩大散热面积,因此能够实现功率模块的改善的冷却性能。
第三,可应用具有比陶瓷更高的刚性的介电材料,因此能够防止破损。
根据本文提供的描述,其它应用领域将变得显而易见。应当理解,描述和具体示例仅旨在说明的目的,而并非旨在限制本发明的范围。
附图说明
为了可以很好地理解本发明,现在将参考附图说明以示例的方式给出的本发明的各种实施方式,其中:
图1是示出常规的具有双面冷却的功率模块的一种实施方式的截面图;
图2是示出常规的具有双面冷却的功率模块的另一实施方式的截面图;
图3是示出铜材料和介电材料中的热扩散方向的示意图;并且
图4是示出本发明的一种实施方式的具有双面冷却的功率模块的截面图。
本文所述的附图仅用于说明的目的,并不意图以任何方式限制本发明的范围。
具体实施方式
以下说明本质上仅是示例性的,并不意图限制本发明、应用或用途。应当理解,在整个附图中,相应的附图标记表示相似或相应的部件和特征。
本文使用的专业术语仅用于说明特定实施方式的目的,并不意图限制本发明。如本文所使用的,单数形式“一个”、“一种”和“所述”意在也包括复数形式,除非上下文另有明确指明。将进一步理解的是,当在本说明书中使用时,术语“包括”、“包含”、“具有”等指定所述特征、整数、步骤、操作、要素、成分和/或其组合的存在,但不排除一个或多个其它特征、整数、步骤、操作、要素、成分和/或其组合的存在或添加。
除非另有定义,否则本文所使用的包括技术和科学术语的所有术语具有与本发明所属领域的普通技术人员通常理解的含义相同的含义。将进一步理解的是,本文所使用的术语应被解释为具有与本说明书的上下文和相关领域中的含义一致的含义,而不以理想化或过度正式的方式解释,除非本文明确限定。
在下文中,将参考附图说明本发明的一种实施方式的具有双面冷却的功率模块。
本发明的一种实施方式的具有双面冷却的功率模块在上板与下板之间设置有半导体芯片,并且包括:上板100,包括由介电材料制成的第一接合层110、由铜材料制成的第一电极101和由铜材料制成的第一散热板140;以及下板200,包括由介电材料制成的第二接合层210、由铜材料制成的第二电极201和由铜材料制成的第二散热板250。
这里,第一电极101中的每一者的厚度为第一接合层110的厚度的三倍或更大,并且第二电极220、230、240中的每一者的厚度为第二接合层210的厚度的三倍或更大。
常规地,由于将铜电极接合至由陶瓷(即,氧化铝材料)制成的基层上,所以为了保持接合强度,不能将铜电极的厚度确定为高于一定水平。结果,存在热扩散面积减小因此散热面积减小的问题。
然而,根据本发明,能够通过以介电材料形成接合层而大大增加铜电极的厚度,该介电材料具有韧性,使得即使当形成有小的厚度时也能保持接合强度,并且当发生一定程度的变形时也能抵御破损。
第一接合层110和第二接合层210由包含3~40重量%的环氧树脂和50~95重量%的陶瓷的介电材料制成。这里,可使用氮化硼等作为陶瓷。
在约180℃的低温下压接的具有这种组分的介电材料导致小的热应力,并且具有优异的弹性和韧性,从而防止由于热膨胀率的差异而导致的破损。
此外,第一接合层110和第二接合层210中的每一者可具有在0.04mm~0.2mm范围内的厚度。需要至少0.04mm的厚度来保持作为介电材料的接合强度和耐久性,并且厚度可等于或小于0.2mm以增强导热性并使尺寸最小化。
此外,第一电极101和第二电极201中的每一者可具有为第一接合层110和第二接合层210中的每一者的厚度的三倍或更大的厚度,并可具有等于或大于0.6mm的厚度。通过以这样厚的厚度形成各电极,能够提供使半导体芯片31、32中产生的热量在宽度方向扩散的空间D。
常规地,由陶瓷制成的基层在等于或大于1065℃的温度下通过共晶反应与铜电极发生反应,从而制造板。然而,在本发明中,由于介电材料在低至约180℃的温度下固化的同时与铜电极接合,所以残余应力降低。此外,在制造完成后,接合层110和210的弹性优异,因此能够降低或防止裂缝的发生。
第一电极101包括第一输出端子120和第二输出端子130,并且第二电极220、230、240包括负端子220、正端子230和第三输出端子240。
第一输出端子120、第二输出端子130和第三输出端子240连接至驱动电动机(未示出)从而供电。正端子230连接至电池(未示出)的阳极,并且负端子220连接至电池的阴极,由此被供电。
第一半导体芯片31设置在第一输出端子120与正端子230之间,并且第二半导体芯片32设置在第二输出端子130与第三输出端子240之间。
另外,第一桥42将第一输出端子120与第三输出端子240彼此连接,并且第二桥44将第二输出端子130与负端子220彼此连接,从而形成功率模块的电源结构。
虽然附图中未示出,但是第一间隔件41和第二间隔件43分别设置在第一输出端子120与第一半导体芯片31之间以及第二输出端子130与第二半导体芯片32之间,以便确保安装用于与第一和第二半导体芯片31、32发送/接收操作信号的引线的空间。这些间隔件由铜材料制成,从而具有高导热性、导电性和刚性。
第一和第二间隔件41、43可形成为具有恒定截面积的柱形,并可形成为具有梯形侧表面的四角锥形。
换言之,第一间隔件41具有截面积从第一半导体芯片31向第一输出端子120增加的四角锥形,并且第二间隔件43具有截面积从第二半导体芯片32向第二输出端子130增加的四角锥形。
如上所述,由于铜材料中的热扩散方向为约45°的角度,因此能够通过与热扩散方向类似地形成间隔件的形状来减少不必要的材料使用,从而降低成本和热应力。
第一接合层110与第一电极101以及第二接合层210与第二电极201可通过使用介电材料彼此直接接合,但是其它界面通过使用焊接材料70接合。例如,正端子230与第一半导体芯片31、第一半导体芯片31与第一间隔件41、第一间隔件41与第一输出端子120、第三输出端子240与第二半导体芯片32、第二半导体芯片32与第二间隔件43以及第二间隔件43与第二输出端子130分别通过使用焊接材料70彼此焊接。
另外,第一桥42、第一输出端子120和第三输出端子240以及第二桥44、第二输出端子130和负端子220分别通过使用焊接材料70彼此焊接。
第一散热板140安装在上板100的外表面上,即,与第一接合层110和第一电极101彼此接合的表面相反的表面。第一电极101和第一散热板140可同时接合至第一接合层110,或者第一电极101和第一散热板140中的一者可首先接合至第一接合层110,然后剩余一者可接合至该第一接合层。
类似于第一散热板140,第二散热板250安装在下板200的外表面上,即,与第二电极201接合至第二接合层210的表面相反的表面。
第一冷却器51安装在第一散热板140中,并且去除在第一和第二半导体芯片31、32中产生并在上板100的方向上扩散的热量。第二冷却器52安装在第二散热板250中,并且去除在第一和第二半导体芯片31、32中产生并在下板200的方向上扩散的热量。
可在第一散热板140与第一冷却器51之间以及第二散热板250与第二冷却器52之间设置导热脂60以填充其间的间隙。因此,能够更可靠地将第一和第二半导体芯片31、32中产生的热量传递至第一和第二冷却器51、52。
虽然为了说明的目的已描述了本发明的实施方式,但是本领域技术人员将理解,在不脱离本发明的范围和思想的情况下,各种变型、添加和替换都是可能的。
因此,已为了说明的目的描述了本发明的实施方式,但是其不应被解释为是限制性的。此外,本发明旨在不仅涵盖示例性实施方式,而且涵盖可包括在本发明的思想和范围内的各种替代形式、变型、等同形式和其它实施方式。
Claims (8)
1.一种在上板与下板之间设置有半导体芯片的具有双面冷却的功率模块,所述功率模块包括:
所述上板,包括由介电材料制成的第一接合层;由铜材料制成并设置在所述第一接合层的第一表面上的第一电极,所述第一电极连接至所述半导体芯片;和设置在所述第一接合层的第二表面上并与第一冷却器接触的第一散热板;以及
所述下板,包括由介电材料制成的第二接合层;由铜材料制成并设置在所述第二接合层的第一表面上的第二电极,所述第二电极连接至所述半导体芯片;和设置在所述第二接合层的第二表面上并与第二冷却器接触的第二散热板,
其中,所述第一电极的厚度是所述第一接合层的厚度的三倍或更大,并且所述第二电极的厚度是所述第二接合层的厚度的三倍或更大,并且
其中,所述第一接合层和所述第二接合层中的每一者包含3~40重量%的环氧化合物和50~95重量%的陶瓷。
2.根据权利要求1所述的功率模块,其中,所述第一电极包括:第一输出端子,设置在所述第一接合层的第一表面上;和第二输出端子,设置在所述第一接合层的第一表面上并与所述第一输出端子间隔开,并且
所述第二电极包括:正端子,设置在所述第二接合层的第一表面上;第三输出端子,设置在所述第二接合层的第一表面上并与所述正端子间隔开;和负端子,设置在所述第二接合层的第一表面上并与所述正端子和所述第三输出端子两者间隔开。
3.根据权利要求2所述的功率模块,其中,所述半导体芯片包括:第一半导体芯片,设置在所述第一输出端子与所述正端子之间;和第二半导体芯片,设置在所述第二输出端子与所述第三输出端子之间。
4.根据权利要求3所述的功率模块,还包括:
第一间隔件,设置在所述第一输出端子与所述第一半导体芯片之间;和
第二间隔件,设置在所述第二输出端子与所述第二半导体芯片之间。
5.根据权利要求4所述的功率模块,其中,所述第一间隔件构造为使得所述第一间隔件的截面积在从所述第一半导体芯片向所述第一输出端子的方向上增加,并且
所述第二间隔件构造为使得所述第二间隔件的截面积在从所述第二半导体芯片向所述第二输出端子的方向上增加。
6.根据权利要求5所述的功率模块,其中,所述正端子与所述第一半导体芯片、所述第一半导体芯片与所述第一间隔件、所述第一间隔件与所述第一输出端子、所述第三输出端子与所述第二半导体芯片、所述第二半导体芯片与所述第二间隔件以及所述第二间隔件与所述第二输出端子分别通过使用焊接材料焊接在一起。
7.根据权利要求6所述的功率模块,还包括:
第一桥,由铜材料制成,并且构造为将所述第一输出端子与所述第三输出端子彼此连接;和
第二桥,由铜材料制成,并且构造为将所述第二输出端子与所述负端子彼此连接,
其中,通过使用所述焊接材料将所述第一桥焊接至所述第一输出端子和所述第三输出端子,并且
通过使用所述焊接材料将所述第二桥焊接至所述第二输出端子和所述负端子。
8.根据权利要求1所述的功率模块,还包括:导热脂,设置在所述第一散热板与所述第一冷却器之间以及所述第二散热板与所述第二冷却器之间。
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DE102017213053A1 (de) | 2018-06-21 |
US20180174945A1 (en) | 2018-06-21 |
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