CN108215007A - A kind of AMP electronic components mounting base mold - Google Patents
A kind of AMP electronic components mounting base mold Download PDFInfo
- Publication number
- CN108215007A CN108215007A CN201711243773.2A CN201711243773A CN108215007A CN 108215007 A CN108215007 A CN 108215007A CN 201711243773 A CN201711243773 A CN 201711243773A CN 108215007 A CN108215007 A CN 108215007A
- Authority
- CN
- China
- Prior art keywords
- mounting base
- electronic components
- workbench
- base mold
- components mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/0021—Stands, supports or guiding devices for positioning portable tools or for securing them to the work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of AMP electronic components mounting base molds, the AMP electronic components mounting base mold includes workbench, the workbench is equipped with forming tank, it is even away from equipped at least two laterally separated pieces in the forming tank, forming tank is distinguished several identical holding tank molding cavities by these laterally separated piece, the level board being mutually parallel there are two being set in each holding tank molding cavity, a bar-shaped trough is formed between the two level boards, it is even away from equipped with several supporting blocks above each level board, and the supporting block on the two level boards is symmetrical, a card slot is formed between two neighboring supporting block on each level board, at least one demoulding hole is respectively equipped on the side of each holding tank molding cavity both sides, mould emptier is respectively equipped on the upper surface of the workbench both sides.The configuration of the present invention is simple, intensity is high, and radiating efficiency is good, and electronic component mounting base after molding substantially increases space availability ratio, and can orderly fix the electronic component of each shape.
Description
Technical field
The present invention relates to a kind of molds, and in particular to a kind of AMP electronic components mounting base mold.
Background technology
Existing AMP electronic components mounting base mold electronic component mounting base after molding generally comprises a workbench,
Workbench is equipped with several forming tanks, and AMP electronic components can be placed in each forming tank.
It cannot orderly be stacked when AMP electronic components are placed in forming tank, very disorderly, and due to AMP electronic components
Shape it is very much, the waste in many spaces can be caused when the AMP electronic components of each shape are placed in forming tank.
Invention content
The present invention to solve the above-mentioned problems, so as to provide a kind of AMP electronic components mounting base mold.
In order to achieve the above objectives, technical scheme is as follows：
A kind of AMP electronic components mounting base mold, the AMP electronic components mounting base mold include workbench, it is described into
Type platform is equipped with forming tank, and even away from equipped at least two laterally separated pieces in the forming tank, these laterally separated piece will molding
Slot distinguishes several identical holding tank molding cavities, sets that there are two the levels that are mutually parallel in each holding tank molding cavity
Plate, forms a bar-shaped trough between the two level boards, even away from equipped with several supporting blocks above each level board, and the two
Supporting block on level board is symmetrical, and a card slot is formed between the two neighboring supporting block on each level board, each to store
At least one demoulding hole is respectively equipped on the side of Slot shaping cavity both sides, is respectively equipped on the upper surface of the workbench both sides
Mould emptier.
In a preferred embodiment of the invention, the workbench bottom is equipped with heat sink, and the heat sink bottom surface is set
There are several wavy heat dissipation non-slipping blocks.
In a preferred embodiment of the invention, the section of the workbench is isosceles trapezoid.
In a preferred embodiment of the invention, four ends of the workbench are arc-shaped.
In a preferred embodiment of the invention, the holding tank molding cavity is rectangle.
In a preferred embodiment of the invention, four ends in the holding tank molding cavity are respectively equipped with circular arc
The cylinder of shape.
In a preferred embodiment of the invention, several heat emission holes are respectively equipped on the side of the workbench.
The beneficial effects of the invention are as follows：
The configuration of the present invention is simple, intensity is high, and radiating efficiency is good, and electronic component mounting base after molding substantially increases
Space availability ratio, and the electronic component of each shape can orderly be fixed.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural diagram of the present invention.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Conjunction is specifically illustrating, and the present invention is further explained.
Referring to Fig. 1, AMP electronic components mounting base mold provided by the invention, including workbench 100, workbench 100 is cut
Face is isosceles trapezoid shape, substantially increases intensity in this way.
Four ends of workbench 100 are arc-shaped, and can preventing workbench 100 in this way, end damages in collision.
Heat sink 110 is equipped in 100 bottom of workbench, heat sink 110 is used to improve the radiating efficiency of workbench 100 and carry
The support strength of high workbench 100.
Several wavy heat dissipation non-slipping blocks are equipped in 110 bottom surface of heat sink, these heat dissipation non-slipping blocks can be carried further
The radiating efficiency of high workbench 100 and the stability for improving workbench 100.
In addition, being respectively equipped with several heat emission holes 120 on the side of workbench 100, heat emission hole 120 can further improve
The radiating efficiency of workbench 100 so that the heat dissipation effect of workbench 100 reaches highest.
Forming tank is equipped in 100 upper surface of workbench, it is even away from equipped at least two laterally separated pieces 200 in forming tank,
Forming tank is distinguished several identical holding tank molding cavities 300, each holding tank molding cavity by these laterally separated piece 200
300 can form for the holding tank of holding vehicles element.
The level board 310 being mutually parallel there are two being set in each holding tank molding cavity 300, and the two level boards
A bar-shaped trough 311 is formed between 310.
Bar-shaped trough 311 is for forming reinforcement block in electronic component mounting base bottom, can improve electronic component installation in this way
The support strength of seat.
It is even away from equipped with several supporting blocks 320 above each level board 310, and every group of holding tank molding cavity 300
Supporting block 320 on two interior level boards is symmetrical, shape between the two neighboring supporting block 320 on each level board 310
Into a card slot 330.
By setting branch is also correspondingly formed inside 330 electronic component mounting base after molding of supporting block 320 and card slot
Bracer and card slot, large-scale electronic component can be directly placed at the top of supporting block in this way, and small-sized electronic component can embed
It is fixed in card slot.
Pass through the setting of above structure so that by the application electronic component mounting base after molding can by various types and
The electronic component of all size is orderly fixedly secured, substantially increases and places fastness and improve space availability ratio.
A vertical spacing block 400 is additionally provided in the holding tank molding cavity 300 of the leftmost side on workbench 100, is erected
Holding tank molding cavity 300 can be divided into left groove body 510 and right groove body 520 to spacing block 400, left groove body 510 is used to form electricity
The holding tank of subcomponent seat, right groove body 520 can be used to form the groove body of the electronic component of placing element famous brand or card-like.
At least one demoulding hole 600 is respectively equipped on the side of each 300 both sides of holding tank molding cavity, demoulds hole
600 sections are arc, are demoulded in this way convenient for electronic component seat after molding.
In addition, being respectively equipped with mould emptier on the upper surface of 100 both sides of workbench, mould emptier is used for demoulding hole
600 cooperations, can further improve demoulding efficiency, and do not influence the molding of electronic component seat also.
At least two mounting grooves are specifically respectively equipped on the upper surface of 100 both sides of workbench, mould emptier includes support
Column 710 and resilient support block 720.
Support column 710 can be landed and secured in mounting groove, and resilient support block 720 is arranged on support column 710, and can
Upper and lower displacement is carried out on support column 710, also, can after resilient support block 720 is depressed into certain distance on support column 710
It is locked, needing to push again after locking can just shift up.
In addition, the end face at 720 top of resilient support block is identical with the notch of mounting groove, such resilient support block 720 pushes
After being locked to bottom, the top end surface of resilient support block 720 just forms a plane with forming panel 100, does not influence electricity in this way
The molding of subcomponent seat.
The basic principles, main features and the advantages of the invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (7)
1. a kind of AMP electronic components mounting base mold, which is characterized in that the AMP electronic components mounting base mold includes molding
Platform, the workbench are equipped with forming tank, and even away from equipped at least two laterally separated pieces in the forming tank, these are laterally separated
Forming tank is distinguished several identical holding tank molding cavities by block, is set in each holding tank molding cavity there are two being mutually parallel
Level board, form a bar-shaped trough between the two level boards, it is even away from equipped with several supporting blocks above each level board, and
Supporting block on the two level boards is symmetrical, forms a card slot between the two neighboring supporting block on each level board, often
At least one demoulding hole is respectively equipped on the side of a holding tank molding cavity both sides, is divided on the upper surface of the workbench both sides
It She You not mould emptier.
A kind of 2. AMP electronic components mounting base mold according to claim 1, which is characterized in that the workbench bottom
Equipped with heat sink, the heat sink bottom surface is equipped with several wavy heat dissipation non-slipping blocks.
3. a kind of AMP electronic components mounting base mold according to claim 1, which is characterized in that the workbench is cut
Face is isosceles trapezoid.
A kind of 4. AMP electronic components mounting base mold according to claim 3, which is characterized in that the four of the workbench
A end is arc-shaped.
A kind of 5. AMP electronic components mounting base mold according to claim 1, which is characterized in that the storage Slot shaping
Cavity is rectangle.
A kind of 6. AMP electronic components mounting base mold according to claim 5, which is characterized in that the storage Slot shaping
Four ends in cavity are respectively equipped with the cylinder of arc-shaped.
A kind of 7. AMP electronic components mounting base mold according to claim 1, which is characterized in that the side of the workbench
Several heat emission holes are respectively equipped on face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243773.2A CN108215007A (en) | 2017-11-30 | 2017-11-30 | A kind of AMP electronic components mounting base mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243773.2A CN108215007A (en) | 2017-11-30 | 2017-11-30 | A kind of AMP electronic components mounting base mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108215007A true CN108215007A (en) | 2018-06-29 |
Family
ID=62653166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711243773.2A Pending CN108215007A (en) | 2017-11-30 | 2017-11-30 | A kind of AMP electronic components mounting base mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108215007A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2130785A1 (en) * | 2008-06-05 | 2009-12-09 | Rehrig Pacific Company | Slip Sheet |
| CN201907760U (en) * | 2010-12-29 | 2011-07-27 | 江苏高阳电子材料有限公司 | Packaging structure for electronic products |
| CN202967073U (en) * | 2012-11-29 | 2013-06-05 | 无锡德润电子有限公司 | Plastic tray for transformer packaging |
| CN203111734U (en) * | 2012-12-14 | 2013-08-07 | 鸿准精密模具（昆山）有限公司 | Packing mechanism |
| CN203957342U (en) * | 2014-05-22 | 2014-11-26 | 咸宁市金宏城吸塑包装有限公司 | A kind of Blister product shaping mould |
-
2017
- 2017-11-30 CN CN201711243773.2A patent/CN108215007A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2130785A1 (en) * | 2008-06-05 | 2009-12-09 | Rehrig Pacific Company | Slip Sheet |
| CN201907760U (en) * | 2010-12-29 | 2011-07-27 | 江苏高阳电子材料有限公司 | Packaging structure for electronic products |
| CN202967073U (en) * | 2012-11-29 | 2013-06-05 | 无锡德润电子有限公司 | Plastic tray for transformer packaging |
| CN203111734U (en) * | 2012-12-14 | 2013-08-07 | 鸿准精密模具（昆山）有限公司 | Packing mechanism |
| CN203957342U (en) * | 2014-05-22 | 2014-11-26 | 咸宁市金宏城吸塑包装有限公司 | A kind of Blister product shaping mould |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |