CN108135087A - A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB - Google Patents

A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB Download PDF

Info

Publication number
CN108135087A
CN108135087A CN201810111613.0A CN201810111613A CN108135087A CN 108135087 A CN108135087 A CN 108135087A CN 201810111613 A CN201810111613 A CN 201810111613A CN 108135087 A CN108135087 A CN 108135087A
Authority
CN
China
Prior art keywords
pcb
scoreboard
big
automatic
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810111613.0A
Other languages
Chinese (zh)
Inventor
何小强
管术春
段绍华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Original Assignee
JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd filed Critical JIANGXI JINGWANG PRECISION CIRCUIT Co Ltd
Priority to CN201810111613.0A priority Critical patent/CN108135087A/en
Publication of CN108135087A publication Critical patent/CN108135087A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing

Abstract

The method of automatic scoreboard after the big plate lamination of a kind of multi-layer PCB disclosed by the invention, it is related to PCB manufacturing technology fields, this method has abandoned many drawbacks of traditional artificial scoreboard method, and with reference to state-of-the-art technology, the big plates of PCB to be divided are caught using two manipulators, the middle seam copper foil on the scoreboard knife cut-out big plates of PCB are then recycled, so as to which the big plates of a PCB are divided into two pieces of PCB platelets, and respectively capture in a manipulator, then the PCB platelets divided are sent to cooling again.This method can not only ensure that the stability of product, also relieve the security risk present in artificial scoreboard without artificial scoreboard.

Description

A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB
Technical field
The present invention relates to technical field of PCB board, the method for referring in particular to automatic scoreboard after a kind of big plate lamination of multi-layer PCB.
Background technology
In multi-layer PCB board production procedure, it is related to a critical process, that is, presses, i.e., press polylith lamina One multi-layer board, and after process for pressing, also relate to the scoreboard problem of PCB.And PCB scoreboards are produced in high-volume Electronic Assemblies The important process of a step in process.In order to improve the yield of printed circuit board (PCB) manufacture and surface installation (SMT) linear speed Degree, printed circuit board are generally designed to one block of big plate, this bulk of pcb board can be described as connecting plate or jigsaw, including crowd More independent PCB platelets, scoreboard are then that one block of big plate of PCB is divided into the PCB platelets of polylith independence.And in traditional work method The inside, scoreboard process, which is substantially, first manually takes away the steel plate on the big plate of multi-layer PCB, then will be connected to PCB platelets manually Between middle seam copper foil tear off the big plates of separated PCB and form polylith PCB platelets, exactly because wherein include manual work, hand The dynamics and angle of work point plate are all difficult to control, and pcb board are broken bad quality hidden danger or breaking board process is slandered so as to exist And the potential problems such as worker's inherently safe, the part so this technical solution still has much room for improvement.
Invention content
The technical problems to be solved by the invention are:In the prior art, after pcb board pressing, using human hand work point plate, exist The problems such as quality hidden danger and security risk.
To solve the above-mentioned problems, the method that this programme discloses automatic scoreboard after a kind of big plate lamination of multi-layer PCB, specifically Include the following steps:
S1, it tears plate open, after lamination, removes steel plate used in lamination;
S2, scoreboard capture on the big plates of PCB the both sides for waiting to hit seam copper foil respectively with two manipulators, then with scoreboard knife Copper foil is stitched in cut-out so as to which a big plate of PCB is divided into two PCB platelets, after stitching copper foil in cut-out, on each manipulator respectively Crawl has a PCB platelet;
S3, cold plate cool down each PCB platelet divided, receive plate and treat lower procedures.
Further, in the S2 scoreboards step, in scoreboard knife cut-out before seam copper foil, two manipulators point The part for stitching copper foil both sides in the big plates of the PCB is not driven to be bent downwardly not simultaneously, copper foil is stitched in being cut off convenient for scoreboard knife.
Further, in the S2 scoreboards step, two manipulators make to stitch copper foil both sides in the big plates of the PCB respectively Portion be bent downwardly 30-45 degree.
Further, in the S2 scoreboards step, in the scoreboard knife cut-out after seam copper foil, by two manipulators point The PCB platelets not captured recall to horizontality, then make PCB platelets in being rotated by 90 ° in horizontal plane, and by each after scoreboard PCB platelets are transported to cooling.
Further, the S1 is torn open in plate step, after lamination, is transported the big plates of the PCB and steel plate together using AGV system It send to Automatic dismounting-plate line, the big plates of PCB is transported to automatic scoreboard in removing steel plate on Automatic dismounting-plate line and reusing AGV system Machine carries out scoreboard.
Further, the S2 scoreboards step is carried out on the automatic board separator, and automatic board separator controls the machinery Hand and scoreboard knife carry out the big plates of the PCB automatic scoreboard, then the PCB platelets divided are sent to cold plate line and are cooled down.
Further, width >=10mm of the middle seam copper foil.
Further, the scoreboard knife is the SK2 knives of HRC45~51 degree.
Further, before scoreboard, the copper foil that the big plates of PCB exceed around is less than 40um.
The method of automatic scoreboard, has abandoned traditional artificial scoreboard after the big plate lamination of a kind of multi-layer PCB disclosed by the invention Many drawbacks of method, and with reference to state-of-the-art technology, the big plates of PCB to be divided are caught using two manipulators, are then recycled Middle seam copper foil on the scoreboard knife cut-out big plates of PCB, so as to which the big plates of a PCB are divided into two pieces of PCB platelets, and respectively capture in a machine In tool hand, then the PCB platelets divided are sent to cooling again.This method can not only ensure that the steady of product without artificial scoreboard It is qualitative, also relieve the security risk of artificial scoreboard.
Description of the drawings
Flow that the invention will now be described in detail with reference to the accompanying drawings
Fig. 1 is the schematic diagram that the big plates of a PCB are divided into PCB platelets.
In figure, copper foil, 4- scoreboards knife, 5-PCB platelets are stitched in the big plates of 1-PCB, 2- manipulators, 3-.
Specific embodiment
For the technology contents that the present invention will be described in detail, feature, the objects and the effects, given in detail below in conjunction with embodiment Explanation.
With reference to Fig. 1, method that automatic scoreboard after a kind of lamination of multi-layer PCB big plate is disclosed in a specific embodiment, specifically Include the following steps:
S1, plate is torn open, after lamination, it is necessary first to steel plate used in lamination is removed, leaves the big plates of PCB, it is subsequent to treat Scoreboard operates;
S2, scoreboard, this process capture on the big plates of PCB the both sides for waiting to hit seam copper foil respectively using two manipulators, then Seam copper foil by a big plate of PCB so that be divided into two PCB platelets in being cut off with scoreboard knife, after stitching copper foil in cut-out, each machinery Crawl has a PCB platelet respectively on hand;
S3, cold plate cool down each PCB platelet divided, receive plate and treat lower procedures.
The scoreboard method, key are to be utilized manipulator combination scoreboard knife instead of traditional handwork, described point Plate knife is preferably the SK2 knives of HRC45~51 degree, and width >=10mm of the middle seam copper foil facilitates scoreboard knife to cut.Using point Plate knife carries out scoreboard, and not only middle seam copper foil notch is neat, while is not easy to the PCB platelets after damage scoreboard.So as to effectively solve Certainly during traditional-handwork scoreboard, breaking board power is not easy to hold and existing security hidden trouble.
In addition, in one embodiment, in the S2 scoreboards step, in scoreboard knife cut-out before seam copper foil, two A manipulator drives the part for stitching copper foil both sides in the big plates of the PCB to be bent downwardly simultaneously respectively, is cut off convenient for scoreboard knife Middle seam copper foil.In traditional-handwork scoreboard, typically two hands hold the part that copper foil both sides are stitched in the big plates of a PCB respectively, then It firmly curves it, and fractures along middle seam copper foil, and form two pieces of PCB platelets.Herein, in order to allow scoreboard knife preferably By middle seam copper foil cut-out, also the part that copper foil both sides are stitched in the big plates of one PCB can be separately down bent first with manipulator.Specifically Reclinate angle can be determined according to the circuit board of actual production, but bending angle is preferably 30-45 degree.Angle mistake The small scoreboard knife that is unfavorable for is cut, and angle is excessive, it is not only possible to be damaged the big plates of PCB, while the also inconvenient cutting of scoreboard knife Middle seam copper foil.
In addition, in the S2 scoreboards step, in the scoreboard knife cut-out after seam copper foil, two manipulators are grabbed respectively The PCB platelets taken recall to horizontality, then make PCB platelets in being rotated by 90 ° in horizontal plane, and each PCB after scoreboard is small Plate is transported to cooling.In automatic scoreboard, cut for the ease of scoreboard knife, so need to by big one angles of plate benging of PCB, and After stitching copper foil in cut-out, automatic for the ease of PCB platelets transports and carries out subsequent flow, then needs to utilize manipulator pair PCB platelets are adjusted.
In addition, for the automation of entire scoreboard scheme, the S1 is torn open in plate step, after lamination, utilizes AGV (abbreviation of Automated Guided Vehicle, implies that " automated guided vehicle ", refers to magnetically or optically wait certainly equipped with electricity Dynamic guiding device, it can be travelled along defined guide path, have the transport vehicle of safeguard protection and various transfer functions) system The big plates of the PCB and steel plate are transported to Automatic dismounting-plate line by system together, in dismounting steel plate on Automatic dismounting-plate line and reuse AGV The big plates of PCB are transported to automatic board separator and carry out scoreboard by system, i.e., the whole automatic fortune that pcb board is all carried out using AGV system It send, without manual intervention.Meanwhile the S2 scoreboards step is carried out on the automatic board separator, described in automatic board separator control Manipulator and scoreboard knife carry out the big plates of the PCB automatic scoreboard, then the PCB platelets divide are sent to the cooling of cold plate line, also without Need manual operation.And before scoreboard, the copper foil that the big plates of PCB exceed around is preferably smaller than 40um, entire automatic to prevent influencing The normal work of various sensors during change scoreboard.
The method of automatic scoreboard after the big plate lamination of a kind of multi-layer PCB disclosed by the invention, for traditional artificial scoreboard side Many drawbacks of method, are such as easily damaged the big plates of PCB, and with reference to state-of-the-art technology, using two manipulators by the big plates of PCB to be divided It catches and adjusts its position and its reclinate angle, then recycle the middle seam copper foil on the scoreboard knife cut-out big plates of PCB, from And the big plates of a PCB are divided into two pieces of PCB platelets, and respectively capture in a manipulator, the angle of PCB platelets is then adjusted again And position, and the PCB platelets most divided at last are sent to cooling.This method whole process can realize the automatic of scoreboard without artificial scoreboard Change, not only ensure that the stability of product, also relieve the security risk of artificial scoreboard.
Herein, up, down, left, right, before and after only represents its relative position and does not indicate that its absolute position.The foregoing is merely The embodiment of the present invention is not intended to limit the scope of the invention, it is every using present specification made etc. Flow transformation is imitated, is directly or indirectly used in other related technical areas, is similarly included in the patent protection of the present invention In the range of.

Claims (9)

1. a kind of method of automatic scoreboard after big plate lamination of multi-layer PCB, which is characterized in that include the following steps:
S1, it tears plate open, after lamination, removes steel plate used in lamination;
S2, scoreboard capture on the big plates of PCB the both sides for waiting to hit seam copper foil, then cut off with scoreboard knife respectively with two manipulators Middle seam copper foil after stitching copper foil in cut-out, captures respectively so as to which a big plate of PCB is divided into two PCB platelets on each manipulator There is a PCB platelet;
S3, cold plate cool down each PCB platelet divided, receive plate and treat lower procedures.
2. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as described in claim 1, which is characterized in that the S2 scoreboards In step, in scoreboard knife cut-out before seam copper foil, two manipulators drive in the big plates of the PCB stitch copper respectively simultaneously The part on foil both sides is bent downwardly, and copper foil is stitched in being cut off convenient for scoreboard knife.
3. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 2, which is characterized in that the S2 scoreboards In step, two manipulators make the part for stitching copper foil both sides in the big plates of the PCB be bent downwardly 30-45 degree respectively.
4. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 3, which is characterized in that the S2 scoreboards In step, in the scoreboard knife cut-out after seam copper foil, the PCB platelets that two manipulators capture respectively are recalled to horizontal State, then make PCB platelets in being rotated by 90 ° in horizontal plane, and each PCB platelet after scoreboard is transported to cooling.
5. such as the method for automatic scoreboard after the big plate lamination of claim 1-3 any one of them multi-layer PCBs, which is characterized in that institute It states S1 to tear open in plate step, after lamination, the big plates of the PCB and steel plate is transported to Automatic dismounting-plate line together using AGV system, in certainly It moves to tear open to remove steel plate on printed line and reuse AGV system and the big plates of PCB is transported to automatic board separator progress scoreboard.
6. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 5, which is characterized in that the S2 scoreboards Step is carried out on the automatic board separator, and automatic board separator controls the manipulator and scoreboard knife to carry out the big plates of the PCB Then the PCB platelets divided are sent to cold plate line and cooled down by automatic scoreboard again.
7. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 5, which is characterized in that the middle seam copper Width >=10mm of foil.
8. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 5, which is characterized in that the scoreboard knife SK2 knives for HRC45~51 degree.
9. the method for automatic scoreboard after the big plate lamination of multi-layer PCB as claimed in claim 5, which is characterized in that described before scoreboard The copper foil that the big plate surroundings of PCB exceed is less than 40um.
CN201810111613.0A 2018-02-05 2018-02-05 A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB Pending CN108135087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810111613.0A CN108135087A (en) 2018-02-05 2018-02-05 A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810111613.0A CN108135087A (en) 2018-02-05 2018-02-05 A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB

Publications (1)

Publication Number Publication Date
CN108135087A true CN108135087A (en) 2018-06-08

Family

ID=62430542

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810111613.0A Pending CN108135087A (en) 2018-02-05 2018-02-05 A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB

Country Status (1)

Country Link
CN (1) CN108135087A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004034319A (en) * 2002-06-28 2004-02-05 Uht Corp Cutting method for laminated sheet and half-cut device used therein
CN104394650A (en) * 2014-08-13 2015-03-04 中国船舶重工集团公司第七0九研究所 Board splitting method for combined printed circuit board finishing component surface mounting
CN107613664A (en) * 2017-10-19 2018-01-19 江苏杰士德精密工业有限公司 Carrier plants panel assembly and its operating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004034319A (en) * 2002-06-28 2004-02-05 Uht Corp Cutting method for laminated sheet and half-cut device used therein
CN104394650A (en) * 2014-08-13 2015-03-04 中国船舶重工集团公司第七0九研究所 Board splitting method for combined printed circuit board finishing component surface mounting
CN107613664A (en) * 2017-10-19 2018-01-19 江苏杰士德精密工业有限公司 Carrier plants panel assembly and its operating method

Similar Documents

Publication Publication Date Title
CN105855627A (en) Board cutting device
JP6427003B2 (en) Electronic component supply apparatus, reel device, and component storage tape replenishment method
CN105834291B (en) Punching press fully-automatic intelligent production system based on remote control
CN106239610A (en) A kind of automatic punch of flexible circuit board
JP5402949B2 (en) Component mounting equipment
CN108135087A (en) A kind of method of automatic scoreboard after big plate lamination of multi-layer PCB
EP2186611B1 (en) Automatically removing waste material using a strip die when cutting a sheet of material according to a predetermined pattern
CN101534974B (en) Method for obtaining workpiece cutouts from a plate-like workpiece
CN104902428B (en) Horn mesh enclosure production system
CN207158292U (en) A kind of automatic adhesive-tape application machine
CN110446585A (en) Mechanical system and control method
CN203536223U (en) Surface mount device (SMD) chip inductor automatic PIN inserter
KR101689119B1 (en) Video punching method and system for sheet type material with seams section
CN108271316B (en) PCB double sided board cutting system
CN207752876U (en) A kind of automation integrated machine equipment of ferrite
JP2006315060A (en) Sheet metal working system and sheet metal working method
CN107938301A (en) A kind of more pieces of cloth glue laminating techniques of needle-and-thread-free
CN205043330U (en) Tool table of spot welding system of robot
CN107497930A (en) A kind of punching press on-line equipment
CN205184249U (en) Automatic equipment system of cutting into slices of evaporimeter
KR100969502B1 (en) Active cutting device and cover lay attach system including the same
KR20150138189A (en) Improved system and method for manufacturing flexible laminated circuit boards
CN206279380U (en) A kind of eyelid film shut-off mechanism
JP3540339B2 (en) Workpiece machining method
CN206967049U (en) A kind of door rail stretch benders

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20180608

RJ01 Rejection of invention patent application after publication