CN108109969A - A kind of novel integrated circuit semiconductor apparatus - Google Patents
A kind of novel integrated circuit semiconductor apparatus Download PDFInfo
- Publication number
- CN108109969A CN108109969A CN201711376418.2A CN201711376418A CN108109969A CN 108109969 A CN108109969 A CN 108109969A CN 201711376418 A CN201711376418 A CN 201711376418A CN 108109969 A CN108109969 A CN 108109969A
- Authority
- CN
- China
- Prior art keywords
- chip
- fixed
- plastic body
- pole piece
- heat dissipation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
The invention discloses a kind of novel integrated circuit semiconductor apparatus, its structure includes fixed pin, LOGO marks, plastic body, the first concave block, mounting hole, the second concave block, recessed groove, screw and runs through through hole, housing, heat dissipation pole piece, metal wire, electrode external part, IC chip, plastic body in itself, first concave block is consistent with the second concave block size, the plastic body both sides are fixed with activity the first concave block of installing and the groove of the second concave block, beneficial effects of the present invention：When IC chip inside integrated circuit semiconductor apparatus generates heat, by radiating, pole piece is dispersed into the external world, not only contribute to realize the heat dissipation of integrated circuit semiconductor apparatus internal integrated circuit chip, and production easy to process, without adding insulating trip between screw and heat dissipation pole piece during assembling, insulation effect is good.
Description
Technical field
The present invention is a kind of novel integrated circuit semiconductor apparatus, belongs to integrated circuit semiconductor apparatus field.
Background technology
With the continuous progress of semiconductor fabrication, the processing speed of chip is also promoted therewith with functional requirement, adjoint
And the heat that the problem of arriving is generated when being and how effectively to run chip dissipates, to ensure the reliable of semiconductor device operation
Property, therefore how further to increase the heat dissipation area of semiconductor devices, while ensure that semiconductor devices will not occur when in use
Short circuit becomes the matter of utmost importance to be solved.
But existing cooling fin meeting and the screw for semiconductor devices to be fixed on substrate are in contact, and easily lead
Short circuit is caused, therefore insulating part must also be increased so that heat dissipation pole piece and screw mutually insulated, and semiconductor devices is caused to produce
Cost increases.
The content of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of novel integrated circuit semiconductor apparatus, with
It solves existing cooling fin meeting and the screw for semiconductor devices to be fixed on substrate is in contact, be easy to cause short circuit, because
This must also increase insulating part so that heat dissipation pole piece and screw mutually insulated, and causes what semiconductor devices production cost increased
Problem.
To achieve these goals, the present invention is to realize by the following technical solutions：A kind of new type integrated circuit half
Conductor device, structure include fixed pin, LOGO marks, plastic body, the first concave block, mounting hole, the second concave block, and described the
One concave block is consistent with the second concave block size, and the plastic body both sides are fixed with activity the first concave block of installing and the second concave block
Groove, the fixation pin is equipped with two or more and size is consistent, and the fixation pin upper end is horizontal using welding manner
Plastic body bottom is fixed at, the plastic body is connected with fixed pin using interference fit, and LOGO marks are cut
Face is circular configuration, and LOGO mark rear ends are pasted on plastic body front end, the plastic body using bonding way fixation
Front end is fixed with the groove of activity installing mounting hole, and the mounting hole is gap-matched with plastic body, the plastics
Body is by recessed groove, screw through through hole, housing, heat dissipation pole piece, metal wire, electrode external part, IC chip, plastic body sheet
Body forms, and the housing and plastic body being integrated molding structure in itself, the plastic body is internal in itself to be fixed with collection
Into circuit chip and heat dissipation pole piece, right side is fixed with the groove that heat dissipation pole piece is installed in activity to the plastic body in itself, described
Plastic body in itself with radiate pole piece being integrated molding structure, the IC chip be fixed at heat dissipation pole piece after
Side, the heat dissipation pole piece are connected with IC chip using interference fit, and described heat dissipation pole piece one end extends to housing
Top, the housing with heat dissipation pole piece be gap-matched, described electrode external part one end extend to by metal wire with
Pole piece radiate using electrical connection, the electrode external part other end connects in itself with plastic body, solid above the housing
Surely be equipped with the groove that screw runs through through hole, the screw is fixed with recessed groove above the through hole, the recessed groove with
Housing is connected using gap.
Further, the IC chip by cap body, spacer ring, by hole, pressure sensing, space layer, be electrically connected
Connection device, the first chip, adhesive layer, bonding agent, the second chip, support plate, connecting line composition.
Further, the cap body bottom is fixed with support plate, and the support plate is integrated chemical conversion type with cap body
Structure, cap body middle part is fixed with through hole, described to pass through hole and cap body being integrated molding structure, the branch
Fagging is fixed with arrangements of electric connection.
Further, first chip is fixed above support plate, and sky is fixed with above the support plate
Interbed, is fixed with spacer ring and bonding agent in the space layer, the spacer ring set altogether there are two and horizontal connection in
Space layer left and right ends, spacer ring lower section are pasted on by adhesive layer above the first chip.
Further, second chip is fixed above space layer, and second chip inner top fixation is set
There are pressure sensing, the pressure sensing and the second chip to be connected using interference fit, second chip passes through connecting line
With the first chip using being electrically connected, first chip is used with arrangements of electric connection by connecting line and is electrically connected.
Further, first chip by insulating layer, form chip, homogeneous conductive adhesive layer, o pads and form.
Further, the homogeneous conductive adhesive layer is base, be fixed in the homogeneous conductive adhesive layer two it is defeated
Go out pad, the o pads level is welded in homogeneous conductive adhesive layer left and right ends, and homogeneous conductive adhesive layer top is solid
Fixed be equipped with forms chip and is gap-matched, and insulating layer is fixed with above the composition chip and is connected using interference fit
It connects.
Advantageous effect
A kind of novel integrated circuit semiconductor apparatus of the present invention, the ic core inside integrated circuit semiconductor apparatus
When piece generates heat, by radiating, pole piece is dispersed into the external world, not only contributes to realize that integrated circuit semiconductor apparatus is internally integrated
The heat dissipation of circuit chip, and production easy to process without add insulating trip between screw and heat dissipation pole piece during assembling, are insulated
Effect is good.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon：
Fig. 1 is a kind of structure diagram of novel integrated circuit semiconductor apparatus of the present invention；
Fig. 2 is a kind of plastic body cut-away view of novel integrated circuit semiconductor apparatus of the present invention；
Fig. 3 is the cut-away view of IC chip of the present invention；
Fig. 4 is the cut-away view of the first chip of the invention；
Fig. 5 is the A in Fig. 3.
In figure：It is fixed pin -1, LOGO marks -2, plastic body -3, the first concave block -4, mounting hole -5, the second concave block -6, recessed
Slot -301, screw are fallen into through through hole -302, housing -303, heat dissipation pole piece -304, metal wire -305, electrode external part -306, collection
Into circuit chip -307, plastic body in itself -308, cap body -3071, spacer ring -3072, by hole -3073, pressure sensing -
3074th, space layer -3075, arrangements of electric connection -3076, the first chip -3077, adhesive layer -3078, bonding agent -3079, second
Chip -30710, support plate -30711, connecting line -30712, insulating layer -30771, composition chip -30772, homogeneous conducting resinl
Layer -30773, o pads -30774.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, with reference to
Specific embodiment, the present invention is further explained.
- Fig. 5 is please referred to Fig.1, the present invention provides a kind of novel integrated circuit semiconductor apparatus technical solution：Its structure includes
Fixed pin 1, LOGO marks 2, plastic body 3, the first concave block 4, mounting hole 5, the second concave block 6, first concave block 4 and second
6 size of concave block is consistent, and 3 both sides of plastic body are fixed with the groove of activity the first concave block 4 of installing and the second concave block 6, institute
The fixation pin 1 stated is equipped with two or more and size is consistent, and 1 upper end of fixation pin is set using the horizontal fixation of welding manner
In 3 bottom of plastic body, the plastic body 3 is connected with fixed pin 1 using interference fit, the section of the LOGO marks 2
For circular configuration, LOGO marks 2 rear end is pasted on 3 front end of plastic body, the plastic body 3 using bonding way fixation
Front end is fixed with the groove of activity installing mounting hole 5, and the mounting hole 5 is gap-matched with plastic body 3, the modeling
Expect body 3 by recessed groove 301, screw through through hole 302, housing 303, heat dissipation pole piece 304, metal wire 305, electrode external part 306,
308 composition, the housing 303 308 are integrated chemical conversion type knot in itself with plastic body in itself for IC chip 307, plastic body
Structure, the plastic body are fixed with IC chip 307 and heat dissipation pole piece 304, the plastic body sheet inside 308 in itself
The right side of body 308 is fixed with the groove of activity installing heat dissipation pole piece 304, and the plastic body 308 is with the pole piece 304 that radiates in itself
Integrated molding structure, the IC chip 307 are fixed at 304 rear side of heat dissipation pole piece, the heat dissipation pole piece 304
It is connected with IC chip 307 using interference fit, described 304 one end of heat dissipation pole piece extends to 303 top of housing, described
Housing 303 with heat dissipation pole piece 304 be gap-matched, described 306 one end of electrode external part is extended to through metal wire 305
With heat dissipation pole piece 304 using being electrically connected, 306 other end of electrode external part 308 connects in itself with plastic body, described
303 top of housing is fixed with the groove that screw runs through through hole 302, and the screw is fixed with recessed through 302 top of through hole
Fall into slot 301, the recessed groove 301 and housing 303 use gap are connected, the IC chip 307 by cap body 3071,
Spacer ring 3072 passes through hole 3073, pressure sensing 3074, space layer 3075, arrangements of electric connection 3076, the first chip 3077, viscous
It connects oxidant layer 3078, bonding agent 3079, the second chip 30710, support plate 30711, connecting line 30712 to form, the cap body
3071 bottoms are fixed with support plate 30711, the support plate 30711 and 3071 being integrated molding structure of cap body, described
The middle part of cap body 3071 be fixed with through hole 3073, it is described by hole 3073 and 3071 being integrated molding structure of cap body,
The support plate 30711 is fixed with arrangements of electric connection 3076, and first chip 3077 is fixed at support plate 30711
Top, 30711 top of support plate are fixed with space layer 3075, spacer ring are fixed in the space layer 3075
3072 with bonding agent 3079, the spacer ring 3072 set altogether there are two and horizontal connection in 3075 left and right ends of space layer, institute
3072 lower section of spacer ring stated is pasted on 3077 top of the first chip, second chip 30710 by adhesive layer 3078
3075 top of space layer is fixed at, 30710 inner top of the second chip is fixed with pressure sensing 3074, the pressure
Power sensing 3074 and the second chip 30710 are connected using interference fit, and second chip 30710 passes through connecting line 30712
With the first chip 3077 using being electrically connected, first chip 3077 is adopted by connecting line 30712 and arrangements of electric connection 3076
With electrical connection, first chip 3077 by insulating layer 30771, form chip 30772, homogeneous conductive adhesive layer 30773, output
Pad 30774 forms, and the homogeneous conductive adhesive layer 30773 is base, is fixed in the homogeneous conductive adhesive layer 30773
Two o pads 30774,30774 level of o pads is welded in 30773 left and right ends of homogeneous conductive adhesive layer, described
The top of homogeneous conductive adhesive layer 30773 be fixed with and form chip 30772 and be gap-matched, the composition chip
30772 tops are fixed with insulating layer 30771 and using interference fit connections.
IC chip 307 described in this patent is to include a silicon substrate, at least a circuit, a fixed sealing ring, one connect
Ground ring and at least electronic component of a protective ring.
It is carrying out in use, will be correspondingly provided on the pole piece 304 that radiates big positioned at its diameter of screw through 302 periphery of through hole
Run through the perforate of 302 internal diameter of through hole in screw, to prevent lock-screw from being contacted with heat dissipation pole piece 304, work as IC semiconductor
When device is mounted on substrate, a killinite piece is set between the bottom surface of the integrated circuit semiconductor apparatus and substrate, to prevent
Only heat dissipation pole piece 304 is in contact with substrate and generates short circuit, the IC chip 307 inside integrated circuit semiconductor apparatus
When generating heat, by radiating, pole piece 304 is dispersed into the external world, since the thermal conductivity of copper is good, so heat dissipation pole piece 304 generally uses
Copper sheet is made, and not only contributes to realize the heat dissipation of integrated circuit semiconductor apparatus internal integrated circuit chip 307, and convenient for adding
Work produces, and without add insulating trip between screw and heat dissipation pole piece 304 during assembling, insulation effect is good.
The present invention solves existing cooling fin meeting and the screw for semiconductor devices to be fixed on substrate is in contact, and holds
Short circuit is easily led to, therefore insulating part must also be increased so that heat dissipation pole piece and screw mutually insulated, and causes semiconductor devices
The problem of production cost increases, being combined with each other by above-mentioned component of the invention not only contribute to realize IC semiconductor
The heat dissipation of device inside IC chip, and production easy to process, without adding between screw and heat dissipation pole piece during assembling
Add insulating trip, insulation effect is good.
The basic principles, main features and the advantages of the invention have been shown and described above, for this field skill
For art personnel, it is clear that the invention is not restricted to the details of above-mentioned exemplary embodiment, and without departing substantially from the present invention spirit or
In the case of essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes falling within the meaning and scope of the equivalent requirements of the claims in the present invention
It is interior.Any reference numeral in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
Using specification as an entirety, the technical solutions in each embodiment can also be properly combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (7)
1. a kind of novel integrated circuit semiconductor apparatus, structure include fixed pin (1), LOGO marks (2), plastic body (3),
First concave block (4), mounting hole (5), the second concave block (6), it is characterised in that：
First concave block (4) is consistent with the second concave block (6) size, and described plastic body (3) both sides are fixed with movable dress
If the groove of the first concave block (4) and the second concave block (6), the fixation pin (1) is equipped with two or more and size is consistent, described
Fixation pin (1) upper end plastic body (3) bottom is fixed at using welding manner level, the plastic body (3) with it is fixed
Pin (1) is connected using interference fit, and the LOGO indicates the section of (2) for circular configuration, after LOGO marks (2)
End is pasted on plastic body (3) front end using bonding way fixation, and the plastic body (3) front end is fixed with activity installing and fixes
The groove in hole (5), the mounting hole (5) are gap-matched with plastic body (3)；
The plastic body (3) is by recessed groove (301), screw through through hole (302), housing (303), heat dissipation pole piece (304), gold
Belonging to line (305), electrode external part (306), IC chip (307), plastic body, (308) form in itself；
The housing (303) and plastic body (308) being integrated molding structure in itself, the plastic body is in itself in (308)
Portion is fixed with IC chip (307) and heat dissipation pole piece (304), and (308) right side is fixed with the plastic body in itself
The groove of activity installing heat dissipation pole piece (304), (308) are integrated chemical conversion type to the plastic body with heat dissipation pole piece (304) in itself
Structure, the IC chip (307) are fixed on rear side of heat dissipation pole piece (304), the heat dissipation pole piece (304) and collection
It is connected into circuit chip (307) using interference fit, described heat dissipation pole piece (304) one end is extended at the top of housing (303), institute
The housing (303) stated is gap-matched with heat dissipation pole piece (304), and described electrode external part (306) one end, which extends to, to be passed through
Metal wire (305) is with heat dissipation pole piece (304) using being electrically connected, and electrode external part (306) other end and plastic body are in itself
(308) connect, the groove that screw runs through through hole (302) is fixed with above the housing (303), the screw runs through
Recessed groove (301) is fixed with above through hole (302), the recessed groove (301) is connected with housing (303) using gap.
2. a kind of novel integrated circuit semiconductor apparatus according to claim 1, it is characterised in that：The integrated circuit
Chip (307) by cap body (3071), spacer ring (3072), by hole (3073), pressure sensing (3074), space layer (3075),
Arrangements of electric connection (3076), the first chip (3077), adhesive layer (3078), bonding agent (3079), the second chip (30710),
Support plate (30711), connecting line (30712) composition.
3. a kind of novel integrated circuit semiconductor apparatus according to claim 2, it is characterised in that：The cap body
(3071) bottom is fixed with support plate (30711), and the support plate (30711) is integrated chemical conversion type knot with cap body (3071)
Structure, the cap body (3071) middle part is fixed with through hole (3073), described to be by hole (3073) and cap body (3071)
Integrated molding structure, the support plate (30711) are fixed with arrangements of electric connection (3076).
4. a kind of novel integrated circuit semiconductor apparatus according to claim 2, it is characterised in that：First chip
(3077) it is fixed above support plate (30711), space layer (3075) is fixed with above the support plate (30711),
Spacer ring (3072) and bonding agent (3079) are fixed in the space layer (3075), the spacer ring (3072) is set altogether
There are two and horizontal connection in space layer (3075) left and right ends, pass through adhesive layer below the spacer ring (3072)
(3078) it is pasted on above the first chip (3077).
5. a kind of novel integrated circuit semiconductor apparatus according to claim 2, it is characterised in that：Second chip
(30710) it is fixed above space layer (3075), described the second chip (30710) inner top is fixed with pressure sensing
(3074), the pressure sensing (3074) is connected with the second chip (30710) using interference fit, second chip
(30710) used and be electrically connected with the first chip (3077) by connecting line (30712), first chip (3077) passes through company
Wiring (30712) is used with arrangements of electric connection (3076) and is electrically connected.
6. a kind of novel integrated circuit semiconductor apparatus according to claim 2, it is characterised in that：First chip
(3077) by insulating layer (30771), form chip (30772), homogeneous conductive adhesive layer (30773), o pads (30774) group
Into.
7. a kind of novel integrated circuit semiconductor apparatus according to claim 1, it is characterised in that：The homogeneous is conductive
Glue-line (30773) is base, and two o pads (30774) are fixed in the homogeneous conductive adhesive layer (30773), described
O pads (30774) level be welded in homogeneous conductive adhesive layer (30773) left and right ends, the homogeneous conductive adhesive layer
(30773) top, which is fixed with, forms chip (30772) and is gap-matched, solid above the composition chip (30772)
Surely it is equipped with insulating layer (30771) and using interference fit connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376418.2A CN108109969A (en) | 2017-12-19 | 2017-12-19 | A kind of novel integrated circuit semiconductor apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376418.2A CN108109969A (en) | 2017-12-19 | 2017-12-19 | A kind of novel integrated circuit semiconductor apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108109969A true CN108109969A (en) | 2018-06-01 |
Family
ID=62211211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711376418.2A Pending CN108109969A (en) | 2017-12-19 | 2017-12-19 | A kind of novel integrated circuit semiconductor apparatus |
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| Country | Link |
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| CN (1) | CN108109969A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1957462A (en) * | 2004-03-23 | 2007-05-02 | 德克萨斯仪器股份有限公司 | Vertically stacked semiconductor device |
| CN1993001A (en) * | 2005-12-27 | 2007-07-04 | 雅马哈株式会社 | Semiconductor device |
| CN101404265A (en) * | 2008-11-10 | 2009-04-08 | 福建福顺半导体制造有限公司 | Integrated circuit semiconductor device |
| CN205140944U (en) * | 2015-11-30 | 2016-04-06 | 歌尔声学股份有限公司 | Packaging structure for chip |
-
2017
- 2017-12-19 CN CN201711376418.2A patent/CN108109969A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1957462A (en) * | 2004-03-23 | 2007-05-02 | 德克萨斯仪器股份有限公司 | Vertically stacked semiconductor device |
| CN1993001A (en) * | 2005-12-27 | 2007-07-04 | 雅马哈株式会社 | Semiconductor device |
| CN101404265A (en) * | 2008-11-10 | 2009-04-08 | 福建福顺半导体制造有限公司 | Integrated circuit semiconductor device |
| CN205140944U (en) * | 2015-11-30 | 2016-04-06 | 歌尔声学股份有限公司 | Packaging structure for chip |
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Application publication date: 20180601 |
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