CN108054271A - A kind of high-power LED bracket - Google Patents

A kind of high-power LED bracket Download PDF

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Publication number
CN108054271A
CN108054271A CN201711477689.7A CN201711477689A CN108054271A CN 108054271 A CN108054271 A CN 108054271A CN 201711477689 A CN201711477689 A CN 201711477689A CN 108054271 A CN108054271 A CN 108054271A
Authority
CN
China
Prior art keywords
supporting plate
led
chip
leg
lateral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711477689.7A
Other languages
Chinese (zh)
Inventor
马达
罗江华
胡海涛
李心舟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Original Assignee
New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City filed Critical New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Priority to CN201711477689.7A priority Critical patent/CN108054271A/en
Publication of CN108054271A publication Critical patent/CN108054271A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention discloses a kind of high-power LED brackets, including supporting plate, conductive seat and rubber pad, it is provided with above the lateral wall left end of the supporting plate and stacks leg, the leg that stacks is fixedly connected with the supporting plate, the lateral wall top of the supporting plate offers location hole, the lateral wall top of the supporting plate is provided with chip set close to the lower end of the location hole, and the chip set is fixedly connected with the supporting plate;Leg is stacked by being provided with, using stack opened up in leg stack slot LED support can be made to carry out multiple-layer stacked packaging during packing encapsulation is carried out, the active force of generation can be stacked with buffering stand plate by rubber pad, supporting plate is avoided when stacking more height by gravity crimp, prevent the damage of LED support positive and negative anodes copper sheet, it ensures the normal use of LED support, and saves substantial amounts of packaging equipment, reduce the cost of enterprise's production and processing.

Description

A kind of high-power LED bracket
Technical field
The invention belongs to LED equipment technical fields, and in particular to a kind of high-power LED bracket.
Background technology
LED support, the bottom susceptor of LED lamp bead before encapsulation on the basis of LED supports, chip fixation are entered, is welded Upper positive and negative electrode, then it is once in package shape with packaging plastic.
In place of original LED support not known also there are some, LED support is easily folded during packing encapsulation is carried out Put it is more high and by gravity crimp, cause the damage of LED support positive and negative anodes copper sheet, cause LED support can not normal use, and And be inconvenient to be transported, and LED support is packaged encapsulation and needs to expend substantial amounts of packaging equipment, adds enterprise's production and processing Cost, LED support needs multigroup welding wire to be welded, and welding difficulty is big, and mortality is high, influences LED support production and processing Efficiency.
The content of the invention
It is mentioned above in the background art original to solve it is an object of the invention to provide a kind of high-power LED bracket LED support also there are some not to know part, LED support during packing encapsulation is carried out, easily stack it is more high and by weight Power crimp causes the damage of LED support positive and negative anodes copper sheet, cause LED support can not normal use, and be inconvenient to carry out Transport, and LED support is packaged encapsulation and needs to expend substantial amounts of packaging equipment, adds the cost of enterprise's production and processing, LED branch Frame needs multigroup welding wire to be welded, and welding difficulty is big, and mortality is high, the problem of influencing the efficiency of LED support production and processing.
To achieve the above object, the present invention provides following technical solution:A kind of high-power LED bracket including supporting plate, is led Electric pedestal and rubber pad, the lateral wall left end top of the supporting plate, which is provided with, stacks leg, described to stack leg and the supporting plate It is fixedly connected, the lateral wall top of the supporting plate offers location hole, and the lateral wall top of the supporting plate is close to described fixed The lower end in position hole is provided with chip set, and the chip set is fixedly connected with the supporting plate, the centre of the chip set Protective case is provided at position, the protective case is fixedly connected with the chip set, and the upper surface of the protective case is provided with LED chip, the LED chip are fixedly connected with the protective case, and the upper end of the protective case is provided with LED support anode copper Piece, the LED support anode copper sheet are fixedly connected with the protective case, and the lower end of the protective case is provided with LED support cathode Copper sheet, the LED support cathode copper sheet are fixedly connected with the protective case, and the conductive seat is mounted on the LED chip Lateral wall bottom, the conductive seat are fixedly connected with the LED chip, and the lateral wall of the LED chip is provided with conducting resinl Layer, the conductive adhesive layer are fixedly connected with the conductive seat, and the lateral wall bottom of the conductive seat is provided with heat-conducting layer, institute It states heat-conducting layer to be fixedly connected with the conductive seat, the lateral wall bottom of the heat-conducting layer is provided with radiating block, the radiating block It is fixedly connected with the heat-conducting layer, the top of the LED chip is provided with close to the left end of the LED support cathode copper sheet leads Silk, the seal wire are fixedly connected with the LED chip and the LED support cathode copper sheet, and the rubber pad is mounted on described folded Leg outer side wall bottom is put, the madial wall for stacking leg, which offers, stacks slot.
Preferably, it is fixedly connected by welding between the seal wire and LED support cathode copper sheet.
Preferably, it is described to stack there are four leg sets altogether, and four stack four turnings that leg is separately mounted to supporting plate Place.
Preferably, the protective case is fixedly connected with chip set by radiating block.
Preferably, the rubber pad is fixedly connected by welding with stacking leg.
Compared with prior art, the beneficial effects of the invention are as follows:A kind of high-power LED bracket of the present invention, passes through setting Stack leg, using stack opened up in leg stack slot LED support can be made to carry out multilayer during packing encapsulation is carried out Superposition packaging, the active force of generation can be stacked by rubber pad with buffering stand plate, avoid supporting plate when stacking more height by Gravity crimp, it is therefore prevented that the damage of LED support positive and negative anodes copper sheet, it is ensured that the normal use of LED support, and save Substantial amounts of packaging equipment reduces the cost of enterprise's production and processing, and by being provided with seal wire, LED support is being connected just by seal wire Cathode copper sheet reduces the quantity of LED support welding wire, reduces welding difficulty, improves and be welded into power, improves LED support The efficiency of production and processing.
Description of the drawings
Fig. 1 is the structural diagram of the present invention;
Fig. 2 is the conductive base schematic cross-sectional view of the present invention;
Fig. 3 is the left view structural representation of the present invention;
In figure:1- supporting plates, 2-LED stent cathode copper sheet, 3- protective cases, 4-LED chips, 5- stack leg, 6-LED stent anodes Copper sheet, 7- location holes, 8- chip sets, 9- conductive adhesive layers, 10- seal wires, 11- heat-conducting layers, 12- conductive seats, 13- radiating blocks, 14- stacks slot, 15- rubber pads.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work Embodiment belongs to the scope of protection of the invention.
- 3 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of high-power LED bracket, including supporting plate 1, conduction Pedestal 12 and rubber pad 15, the lateral wall left end top of supporting plate 1, which is provided with, stacks leg 5, stacks leg 5 and fixes company with supporting plate 1 It connects, the lateral wall top of supporting plate 1 offers location hole 7, and the lateral wall top of supporting plate 1 is set close to the lower end of location hole 7 There is chip set 8, chip set 8 is fixedly connected with supporting plate 1, and the middle position of chip set 8 is provided with protective case 3, is protected Sheath 3 is fixedly connected with chip set 8, and the upper surface of protective case 3 is provided with LED chip 4, and LED chip 4 is fixed with protective case 3 Connection, the upper end of protective case 3 are provided with LED support anode copper sheet 6, and LED support anode copper sheet 6 is fixedly connected with protective case 3, protect The lower end of sheath 3 is provided with LED support cathode copper sheet 2, and LED support cathode copper sheet 2 is fixedly connected with protective case 3, conductive seat 12 are mounted on the lateral wall bottom of LED chip 4, and conductive seat 12 is fixedly connected with LED chip 4, and the lateral wall of LED chip 4 is set Conductive adhesive layer 9 is equipped with, conductive adhesive layer 9 is fixedly connected with conductive seat 12, and the lateral wall bottom of conductive seat 12 is provided with heat conduction Layer 11, heat-conducting layer 11 is fixedly connected with conductive seat 12, and the lateral wall bottom of heat-conducting layer 11 is provided with radiating block 13, radiating block 13 It is fixedly connected with heat-conducting layer 11, the top of LED chip 4 is provided with seal wire 10, seal wire close to the left end of LED support cathode copper sheet 2 10 are fixedly connected with LED chip 4 and LED support cathode copper sheet 2, and rubber pad 15 is mounted on and stacks 5 lateral wall bottom of leg, stacks leg 5 madial wall, which offers, stacks slot 14.
Further, it is fixedly connected by welding between seal wire 10 and LED support cathode copper sheet 2.
In the present embodiment, LED support cathode copper sheet 2 is fixed on close to LED chip 4 by then 10 by welding At position, and the top with the one end of seal wire 10 away from LED support cathode copper sheet 2 to be fixed on to LED chip 4 by welding End, and silver-plated process is carried out, LED support welding wire quantity required is reduced, welding difficulty is reduced, improves and be welded successfully Rate.
Further, stack there are four the common settings of leg 5, and four stack four turnings that leg 5 is separately mounted to supporting plate 1 Place.
In the present embodiment, leg 5 will be stacked and is fixed on four corners of supporting plate 1 by welding, by stacking Leg 5 is put into another and stacks the stacking in slot 14 of leg 5, can be packaged packing at many levels so as to fulfill supporting plate 1, save bag Equipment is filled, reduces the cost of enterprise's production and processing.
Further, protective case 3 is fixedly connected with chip set 8 by radiating block 13.
In the present embodiment, protective case 3 is fixed on chip set 8 by radiating block 13, is improved using radiating block 13 The heat dissipation effect of 3 internal components of protective case, and the stability of reinforcement protection set 3.
Further, rubber pad 15 is fixedly connected by welding with stacking leg 5.
In the present embodiment, rubber pad 15 is fixed on to the lower end for stacking leg 5 by welding, passes through rubber pad 15 The impact force that elastic acting force buffering stand plate 1 stacks the active force of application and when supporting plate 1 stacks generates, avoids LED branch Frame positive and negative anodes copper sheet is collided or squeezes and welding wire is caused to be broken, it is ensured that the normal use of LED support.
The operation principle and process for using of the present invention:After the present invention installs, supporting plate 1 is positioned over work by staff Make on platform, by the guiding of location hole 7, seal wire 10 is weldingly fixed in LED chip 4 by soldering appliance, then passes through plating Silver-colored instrument carries out silver-plated process to LED chip 4, then carries out gluing encapsulation to 4 lateral wall of LED chip, after treating operation, takes Carry out protective film to seal supporting plate 1 up for safekeeping, then be welded successively, silver-plated, gluing and packaging operation, by packaged supporting plate 1 Another slot 14 that stacks for stacking leg 5 is directed at by stacking leg 5 to put down, and passes through rubber pad 15 and buffers the effect of collision of stacking Power when certain unified height is stacked, carries out packing packaging operation, after tested, you can is put into storehouse preservation.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (5)

1. a kind of high-power LED bracket, it is characterised in that:Including supporting plate(1), conductive seat(12)And rubber pad(15), institute State supporting plate(1)Lateral wall left end above be provided with and stack leg(5), it is described to stack leg(5)With the supporting plate(1)It is fixed to connect It connects, the supporting plate(1)Lateral wall top offer location hole(7), the supporting plate(1)Lateral wall top close to described Location hole(7)Lower end be provided with chip set(8), the chip set(8)With the supporting plate(1)It is fixedly connected, it is described Chip set(8)Middle position be provided with protective case(3), the protective case(3)With the chip set(8)It is fixed to connect It connects, the protective case(3)Upper surface be provided with LED chip(4), the LED chip(4)With the protective case(3)It is fixed to connect It connects, the protective case(3)Upper end be provided with LED support anode copper sheet(6), the LED support anode copper sheet(6)With the guarantor Sheath(3)It is fixedly connected, the protective case(3)Lower end be provided with LED support cathode copper sheet(2), the LED support cathode copper Piece(2)With the protective case(3)It is fixedly connected, the conductive seat(12)Mounted on the LED chip(4)Lateral wall bottom End, the conductive seat(12)With the LED chip(4)It is fixedly connected, the LED chip(4)Lateral wall be provided with conduction Glue-line(9), the conductive adhesive layer(9)With the conductive seat(12)It is fixedly connected, the conductive seat(12)Lateral wall bottom End is provided with heat-conducting layer(11), the heat-conducting layer(11)With the conductive seat(12)It is fixedly connected, the heat-conducting layer(11)'s Lateral wall bottom is provided with radiating block(13), the radiating block(13)With the heat-conducting layer(11)It is fixedly connected, the LED chip (4)Top close to the LED support cathode copper sheet(2)Left end be provided with seal wire(10), the seal wire(10)With the LED Chip(4)With the LED support cathode copper sheet(2)It is fixedly connected, the rubber pad(15)Leg is stacked mounted on described(5)Outside Wall bottom, it is described to stack leg(5)Madial wall offer and stack slot(14).
2. a kind of high-power LED bracket according to claim 1, it is characterised in that:The seal wire(10)It is born with LED support Pole copper sheet(2)Between be fixedly connected by welding.
3. a kind of high-power LED bracket according to claim 1, it is characterised in that:It is described to stack leg(5)Four are provided with altogether It is a, and four stack leg(5)It is separately mounted to supporting plate(1)Four corners.
4. a kind of high-power LED bracket according to claim 1, it is characterised in that:The protective case(3)With chip set (8)Pass through radiating block(13)It is fixedly connected.
5. a kind of high-power LED bracket according to claim 1, it is characterised in that:The rubber pad(15)With stacking leg (5)It is fixedly connected by welding.
CN201711477689.7A 2017-12-29 2017-12-29 A kind of high-power LED bracket Pending CN108054271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711477689.7A CN108054271A (en) 2017-12-29 2017-12-29 A kind of high-power LED bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711477689.7A CN108054271A (en) 2017-12-29 2017-12-29 A kind of high-power LED bracket

Publications (1)

Publication Number Publication Date
CN108054271A true CN108054271A (en) 2018-05-18

Family

ID=62128971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711477689.7A Pending CN108054271A (en) 2017-12-29 2017-12-29 A kind of high-power LED bracket

Country Status (1)

Country Link
CN (1) CN108054271A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101171686A (en) * 2005-05-02 2008-04-30 日本先进系统株式会社 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
CN202395031U (en) * 2011-12-08 2012-08-22 郑州汉威光电技术有限公司 High-power LED support structure
CN102842668A (en) * 2012-09-07 2012-12-26 浙江中博光电科技有限公司 Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure
CN103855141A (en) * 2012-11-29 2014-06-11 光宝光电(常州)有限公司 Light-emitting diode element, light-emitting diode module, and manufacturing method of light-emitting diode element
CN204456487U (en) * 2014-12-31 2015-07-08 吴江市纺织科技中心有限公司 A kind of Novel fireproof module device for structural fire protection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101171686A (en) * 2005-05-02 2008-04-30 日本先进系统株式会社 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
CN202395031U (en) * 2011-12-08 2012-08-22 郑州汉威光电技术有限公司 High-power LED support structure
CN102842668A (en) * 2012-09-07 2012-12-26 浙江中博光电科技有限公司 Structure of directly encapsulating chip on uniform temperature plate and manufacturing method of structure
CN103855141A (en) * 2012-11-29 2014-06-11 光宝光电(常州)有限公司 Light-emitting diode element, light-emitting diode module, and manufacturing method of light-emitting diode element
CN204456487U (en) * 2014-12-31 2015-07-08 吴江市纺织科技中心有限公司 A kind of Novel fireproof module device for structural fire protection

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Application publication date: 20180518