CN108017825A - 一种超薄高倍收缩热缩套管及其制备方法 - Google Patents
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Abstract
本发明提供了一种超薄高倍收缩热缩套管及其制备方法,热缩材料按照重量份数计为:聚合物基体100份,弹性体10‑30份,相容剂0.5‑2份,阻燃剂10‑40份,润滑剂0.5‑2份,抗氧剂0.5‑2份,分散剂0.1‑2份。方法为:步骤1准备热缩材料的制备组份;步骤2将所述制备组分进行混炼后,经过双螺杆处理成改性母料;步骤3将所述改性母粒放入挤出成型机,挤出成型得到管材半成品;步骤4将所述管材半成品通过电子加速器进行辐照;步骤5对辐照后的所述管材进行扩张。本发明制备得到的热缩套管具有收缩强度高,且具有超薄壁厚的特点,可以运用在微型电子设备上。
Description
技术领域
本发明涉及热缩套管领域,尤指一种超薄高倍收缩热缩套管及其制备方法。
背景技术
热缩套管又名热收缩保护套管,具有高温收缩、柔软阻燃、绝缘防蚀等优点,被广泛应用于电子电器行业。热缩套管收缩包覆于电子电器线束上,对电子电器线束起到绝缘和保护作用。
近年来,电子电器设备微型化,轻量化逐渐成为行业发展趋势,这对热缩套管产品壁厚和收缩倍率提出了更加苛刻的要求。一般来说,要求产品壁厚≤0.13mm,收缩倍率≥2.5,但是市面上的很多热缩套管都达不到这个要求。有的生产商在制备热缩套管时,采用挤出成型专用工艺加工得到一种热缩套管,虽然该套管收缩强度较高,但不具备超薄壁厚特性,达不到微型化的要求。
因此,本领域亟需一种收缩强度高,且具有超薄壁厚的热缩套管。
发明内容
本发明针对上述现有技术的不足,提供了一种超薄高倍收缩热缩套管及其制备方法,制备得到的热缩套管具有收缩强度高,且具有超薄壁厚的特点,可以运用在微型电子设备上。
本发明提供的技术方案如下:
本发明提供了一种超薄壁厚高倍收缩热缩套管,热缩材料按照重量份数计为:聚合物基体100份,弹性体10-30份,相容剂0.5-2份,阻燃剂10-40 份,润滑剂0.5-2份,抗氧剂0.5-2份,分散剂0.1-2份。
优选的,所述聚合物基体为:低密度聚乙烯、乙烯-醋酸乙烯酯共聚物,乙烯-丙烯酸乙酯共聚物中的一种或几种。
优选的,所述弹性体为:三元乙丙橡胶、聚烯烃弹性体、硅橡胶和苯乙烯-丁二烯-苯乙烯共聚物一种或几种。
优选的,所述相容剂为:马来酸酐接枝共聚物或丙烯酸酯类共聚物。
优选的,所述阻燃剂为:十溴联苯醚、溴代聚苯乙烯、氢氧化镁和三氧化二锑等复合物。
优选的,所述润滑剂为:聚乙烯蜡或有机硅系润滑物。
优选的,所述抗氧剂为:多元受阻酚与硫代酯类复合物。
优选的,所述分散剂为:硅氧烷偶联剂、钛酸酯偶联剂或铝酸酯偶联剂。
本发明还提供了一种超薄壁厚高倍收缩热缩套管的制备方法,包括步骤:步骤1按照重量份数计,制备组分为:聚合物基体100份,弹性体10-30份,相容剂0.5-2份,阻燃剂10-40份,润滑剂0.5-2份,抗氧剂0.5-2份,分散剂 0.1-2份;步骤2将所述制备组分进行混炼后,经过双螺杆处理成改性母粒;步骤3将所述改性母粒放入挤出成型机,挤出成型得到管材;步骤4将所述管材通过电子加速器进行辐照;步骤5对辐照后的所述管材进行扩张。
优选的,步骤3中所述挤出成型机的加工温度为90-150℃;步骤4中所述电子加速器的参数为2.5MeV,30mA,辐照剂量为60-200kGy,辐照速度 60-300m/min;步骤5中进行扩张的加热软化温度为110-180℃,压力为 0.1Mpa-1.0Mpa,内径扩张倍率在2.5倍以上。
通过本发明提供的一种超薄高倍收缩热缩套管及其制备方法,能够带来以下至少一种有益效果:
1、本发明的超薄壁套管通过添加的弹性体粒子分散在聚合物网状结构中,提高了材料的断裂伸长率,更有助于材料拉薄延展,使材料在薄壁状态下具有更好的力学性能;
2、通过添加分散剂对材料的表面改性处理,使阻燃等无极填料均匀分散,防止其他填料二次团聚形成大颗粒,导致做成薄壁产品时出现缺陷,使有机无机结合界面的最薄化,确保了材料加工性能和综合性能最优化。
3、由于当前电子元器件产品的轻薄化,原有厚度的热缩管无法满足后续外部嵌套元器件的装配,本发明的超薄壁厚套管成品壁厚小于等于0.13mm,收缩倍率大于等于2.5倍,能够满足电子元器件小型化,轻量化的配套使用。
4、本发明的超薄壁厚套管加工工艺简单,易操作,成品率高,具有很高的工业生产应用性。
具体实施方式
实施例1
超薄壁厚高倍收缩热缩套管的原料按照重量份数计:
聚合物基体100份,聚烯烃弹性体10份,马来酸酐接枝共聚物0.5份,十溴联苯醚6份,氢氧化镁3份,三氧化二锑1份,聚乙烯蜡0.5份,多元受阻酚0.5 份,硅氧烷偶联剂0.1份。如表格1所示:
表格1:
将上述原料加入到密炼机中混合处理,制备得到超薄壁厚套管的改性母料,加工温度100℃,密炼机混炼时间20分钟。
将上述的制备得到的改性母料经挤出成型为管材半成品,挤出成型加工温度为90℃
通过电子加速器对管材进行辐照交联,保持合适的交联度。所述的电子加速器参数为2.5MeV,30mA,辐照剂量为60kGy,辐照速度60m/min。
将辐照半成品进行扩张加工,加热软化温度为110℃,压力为0.1Mpa,内径收缩倍率为2.5倍,制得超薄壁厚高倍收缩热缩套管。
制得的超薄壁厚高倍收缩热缩套管壁厚为:0.10mm,收缩倍率为:2.5 倍。
实施例2
超薄壁厚高倍收缩热缩套管的原料按照重量份数计:
聚合物基体100份,三元乙丙橡胶15份,硅橡胶15份,丙烯酸酯类共聚物 2份,十溴联苯醚20份,氢氧化镁13份,三氧化二锑7份,聚乙烯蜡2份,抗氧剂2份,硅氧烷偶联剂2份。如表格2所示:
表格2:
将上述原料加入到密炼机中混合处理,制备得到超薄壁厚套管的改性母料,加工温度110℃,密炼机混炼时间20分钟。
将上述的制备得到的改性母料经挤出成型为管材半成品,挤出成型加工温度为150℃
通过电子加速器对管材进行辐照交联,保持合适的交联度。所述的电子加速器参数为2.5MeV,30mA,辐照剂量为200kGy,辐照速度300m/min。
将辐照半成品进行扩张加工,加热软化温度为180℃,压力为0.1Mpa,内径收缩倍率为3.5倍,制得超薄壁厚高倍收缩热缩套管。
制得的超薄壁厚高倍收缩热缩套管壁厚为:0.10mm,收缩倍率为:2.5 倍。
实施例3
超薄壁厚高倍收缩热缩套管的原料按照重量份数计:
聚合物基体100份,聚烯烃弹性体10份,苯乙烯-丁二烯-苯乙烯共聚物 5份,丙烯酸酯类共聚物1份,溴代聚苯乙烯15份,氢氧化镁8份,三氧化二锑4份,聚乙烯蜡0.6份,硫代酯类复合物1.5份,硅氧烷偶联剂0.5份。
如表格3所示:
表格3:
将上述原料加入到密炼机中混合处理,制备得到超薄壁厚套管的改性母料,加工温度130℃,密炼机混炼时间20分钟。
将上述的制备得到的改性母料经挤出成型为管材半成品,挤出成型加工温度为130℃
通过电子加速器对管材进行辐照交联,保持合适的交联度。所述的电子加速器参数为2.5MeV,30mA,辐照剂量为120kGy,辐照速度100m/min。
将辐照半成品进行扩张加工,加热软化温度为140℃,压力为0.2Mpa,内径收缩倍率为3倍,制得超薄壁厚高倍收缩热缩套管。
制得的超薄壁厚高倍收缩热缩套管壁厚为:0.10mm,收缩倍率为:2.5 倍。
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。
Claims (10)
1.一种超薄壁厚高倍收缩热缩套管,其特征在于,热缩材料按照重量份数计为:
聚合物基体100份,弹性体10-30份,相容剂0.5-2份,阻燃剂10-40份,润滑剂0.5-2份,抗氧剂0.5-2份,分散剂0.1-2份。
2.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述聚合物基体为:低密度聚乙烯、乙烯-醋酸乙烯酯共聚物,乙烯-丙烯酸乙酯共聚物中的一种或多种。
3.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述弹性体为:三元乙丙橡胶、聚烯烃弹性体、硅橡胶和苯乙烯-丁二烯-苯乙烯共聚物的一种或多种。
4.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述相容剂为:马来酸酐接枝共聚物或丙烯酸酯类共聚物。
5.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述阻燃剂为:十溴联苯醚、溴代聚苯乙烯、氢氧化镁和三氧化二锑的一种或多种。
6.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述润滑剂为:聚乙烯蜡或有机硅系润滑物。
7.根据权利要求1所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述抗氧剂为:多元受阻酚或硫代酯类复合物。
8.根据权利要求1~7中任一项所述的一种超薄壁厚高倍收缩热缩套管,其特征在于:
所述分散剂为:硅氧烷偶联剂、钛酸酯偶联剂或铝酸酯偶联剂。
9.一种根据权利要求1~8中任一项所述的一种超薄壁厚高倍收缩热缩套管的制备方法,其特征在于,包括步骤:
步骤1按照重量份数计,制备组分为:聚合物基体100份,弹性体10-30份,相容剂0.5-2份,阻燃剂10-40份,润滑剂0.5-2份,抗氧剂0.5-2份,分散剂0.1-2份;
步骤2将所述制备组分进行混炼后,经过双螺杆处理成改性母粒;
步骤3将所述改性母粒放入挤出成型机,挤出成型得到管材半成品;
步骤4将所述管材半成品通过电子加速器进行辐照;
步骤5对辐照后的所述管材进行扩张。
10.根据权利要求9所述的一种超薄壁厚高倍收缩热缩套管的制备方法,其特征在于:
步骤3中所述挤出成型机的加工温度为90-150℃;
步骤4中所述电子加速器的参数为2.5MeV,30mA,辐照剂量为60-200kGy,辐照速度60-300m/min;
步骤5中进行扩张的加热软化温度为110-180℃,压力为0.1Mpa-1.0Mpa,内径扩张倍率在2.5倍以上。
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