CN107995789A - A kind of mobile phone radiator used for printed circuit board - Google Patents

A kind of mobile phone radiator used for printed circuit board Download PDF

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Publication number
CN107995789A
CN107995789A CN201711449659.5A CN201711449659A CN107995789A CN 107995789 A CN107995789 A CN 107995789A CN 201711449659 A CN201711449659 A CN 201711449659A CN 107995789 A CN107995789 A CN 107995789A
Authority
CN
China
Prior art keywords
heat dissipation
dissipation ventilation
circuit board
printed circuit
ventilation pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201711449659.5A
Other languages
Chinese (zh)
Inventor
刘娟娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lang Xin Industrial Co Ltd
Original Assignee
Suzhou Lang Xin Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Lang Xin Industrial Co Ltd filed Critical Suzhou Lang Xin Industrial Co Ltd
Priority to CN201711449659.5A priority Critical patent/CN107995789A/en
Publication of CN107995789A publication Critical patent/CN107995789A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

The invention discloses a kind of mobile phone radiator used for printed circuit board, including bottom case, the inside of bottom case is cavity structure;The interior bottom of bottom case is equipped with radiating motor, the end of the main shaft of radiating motor is equipped with radiator shutter, the front portion of radiating motor is equipped with ventilation case, ventilation case is sleeved on the outer circumferential surface of radiator shutter, and the top of ventilation case is equipped with air guide hole, and the top of bottom case is equipped with heat dissipation ventilation pipe, heat dissipation ventilation pipe is arranged vertically, the axial location of heat dissipation ventilation pipe is equipped with heat dissipation ventilation groove, and the upper end of heat dissipation ventilation pipe is free end, and the lower end of heat dissipation ventilation pipe is docked with air guide hole;The outer circumferential surface of heat dissipation ventilation pipe is equipped with fixed seat, and the outside left of fixed seat has installed support base;Fixing pipe is equipped between fixed seat and heat dissipation ventilation pipe, fixing pipe is sleeved on the outer circumferential surface of heat dissipation ventilation pipe.The present invention by heat dissipation ventilation groove will can radiate it is distinguished and admirable be blown on printed circuit board, heat discharging operation is carried out to printed circuit board so as to convenient.

Description

A kind of mobile phone radiator used for printed circuit board
Technical field
The present invention relates to a kind of radiator, and in particular to a kind of mobile phone radiator used for printed circuit board.
Background technology
Printed circuit board, also known as printed circuit board (PCB), are the suppliers of electronic component electrical connection.According to the wiring board number of plies Single sided board, dual platen, four laminates, six laminates and other multilayer circuit boards can be divided into.Since printed circuit board (PCB) is not general eventually Product is held, thus it is slightly chaotic in the definition of title, such as:The motherboard of PC, is known as mainboard, and cannot directly claim Related but cannot both when for circuit board, although there is the presence of circuit board in motherboard, and differing, therefore assessing industry Say identical.
The content of the invention
In view of the deficiencies of the prior art, the present invention provides it is a kind of can conveniently be radiated by radiator shutter it is distinguished and admirable Output, the air guide hole that ventilation case is crossed in heat dissipation wind circulation drain into the heat dissipation ventilation groove location of heat dissipation ventilation pipe;Pass through heat dissipation ventilation Groove will can radiate it is distinguished and admirable be blown on printed circuit board, so as to the convenient mobile phone that heat discharging operation is carried out to printed circuit board Radiator used for printed circuit board.
To achieve these goals, the present invention is to realize by the following technical solutions:
A kind of mobile phone radiator used for printed circuit board, including bottom case, the inside of bottom case is cavity structure;The interior bottom of bottom case Portion is equipped with radiating motor, and the end of the main shaft of radiating motor is equipped with radiator shutter, and the front portion of radiating motor is equipped with ventilation case, wind-guiding Valve jacket is on the outer circumferential surface of radiator shutter, and the top of ventilation case is equipped with air guide hole, and the top of bottom case is equipped with heat dissipation ventilation pipe, dissipates Hot ventilation duct is arranged vertically, and the axial location of heat dissipation ventilation pipe is equipped with heat dissipation ventilation groove, and the upper end of heat dissipation ventilation pipe is freely End, the lower end of heat dissipation ventilation pipe is docked with air guide hole;The outer circumferential surface of heat dissipation ventilation pipe is equipped with fixed seat, the outside left of fixed seat Support base is installed;Fixing pipe is equipped between fixed seat and heat dissipation ventilation pipe, fixing pipe is sleeved on the outer circumferential surface of heat dissipation ventilation pipe On.
Further, the side locations of the bottom case are equipped with fluting.
Further, the bottom of the support base is equipped with fixed plate.
Further, the bottom of the bottom case is equipped with fixinig plate.
Further, the support base is arcuate shape.
Beneficial effects of the present invention:It can be facilitated by bottom case and radiating motor is installed, can be square by ventilation case Just radiator shutter is installed, heat dissipation ventilation pipe is firmly installed by bottom case, support base is by fixed seat to heat dissipation The outer circumferential surface of ventilation duct is firmly supported;The radiator can be placed in the lower section of the Preparation equipment of printed circuit board; Radiating motor can control radiator shutter to realize and rotate, and can conveniently be radiated distinguished and admirable output by radiator shutter, and heat dissipation is distinguished and admirable The heat dissipation ventilation groove location of heat dissipation ventilation pipe is drained into by the air guide hole of ventilation case;Can be by radiation air by heat dissipation ventilation groove Stream is blown on printed circuit board, and heat discharging operation is carried out to printed circuit board so as to convenient.
Brief description of the drawings
Fig. 1 is the structure diagram of mobile phone of the present invention radiator used for printed circuit board.
Embodiment
To make the technical means, the creative features, the aims and the efficiencies achieved by the present invention easy to understand, with reference to Embodiment, the present invention is further explained.
As shown in Figure 1, a kind of mobile phone radiator used for printed circuit board, including bottom case 1, the inside of bottom case 1 is cavity knot Structure;The interior bottom of bottom case 1 is equipped with radiating motor 3, and the end of the main shaft of radiating motor 3 is equipped with radiator shutter 4, radiating motor 3 Front portion is equipped with ventilation case 5, and ventilation case 5 is sleeved on the outer circumferential surface of radiator shutter 4, and the top of ventilation case 5 is equipped with air guide hole 6, bottom The top of shell 1 is equipped with heat dissipation ventilation pipe 7, and heat dissipation ventilation pipe 7 is arranged vertically, and the axial location of heat dissipation ventilation pipe 7 is equipped with heat dissipation Ventilation slot 8, the upper end of heat dissipation ventilation pipe 7 is free end, and the lower end of heat dissipation ventilation pipe 7 is docked with air guide hole 6;Heat dissipation ventilation pipe 7 Outer circumferential surface be equipped with fixed seat 10, the outside left of fixed seat 10 has installed support base 11;Fixed seat 10 and heat dissipation ventilation pipe 7 it Between be equipped with fixing pipe 9, fixing pipe 9 is sleeved on the outer circumferential surface of heat dissipation ventilation pipe 7;The side locations of bottom case 1 are equipped with fluting 2;Branch The bottom of support seat 11 is equipped with fixed plate 12;The bottom of bottom case 1 is equipped with fixinig plate 13;Support base 11 is arcuate shape.
Mobile phone radiator used for printed circuit board of the present invention, can be facilitated by bottom case 1 and radiating motor 3 is installed, It can be facilitated by ventilation case 5 and radiator shutter 4 is installed, heat dissipation ventilation pipe 7 is firmly installed by bottom case 1, propped up Support seat 11 firmly supports the outer circumferential surface of heat dissipation ventilation pipe 7 by fixed seat 10;The radiator can be placed in print The lower section of the Preparation equipment of circuit board processed;Radiating motor 3 can control radiator shutter 4 to realize and rotate, can be with by radiator shutter 4 Convenient distinguished and admirable output of radiating, the air guide hole 6 that ventilation case 5 is crossed in heat dissipation wind circulation drain into the heat dissipation ventilation groove 8 of heat dissipation ventilation pipe 7 Position;By heat dissipation ventilation groove 8 will can radiate it is distinguished and admirable be blown on printed circuit board, so as to convenient to printed circuit board Carry out heat discharging operation.
Wherein, the side locations of bottom case 1 are equipped with fluting 2;The sidepiece of bottom case 1 is carried out so can be facilitated by fluting 2 Drainage.
Wherein, the bottom of support base 11 is equipped with fixed plate 12;So it can be facilitated to support base 11 by fixed plate 12 Installation is fixed in bottom.
Wherein, the bottom of bottom case 1 is equipped with fixinig plate 13;So by fixinig plate 13 can facilitate to the bottom of bottom case 1 into Row is fixedly mounted.
The basic principles, main features and the advantages of the invention have been shown and described above.The technology of the industry Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its Equivalent thereof.

Claims (5)

1. a kind of mobile phone radiator used for printed circuit board, including bottom case, it is characterised in that:The inside of bottom case is cavity structure; The interior bottom of bottom case is equipped with radiating motor, and the end of the main shaft of radiating motor is equipped with radiator shutter, and the front portion of radiating motor is equipped with Ventilation case, ventilation case are sleeved on the outer circumferential surface of radiator shutter, and the top of ventilation case is equipped with air guide hole, and the top of bottom case, which is equipped with, to be dissipated Hot ventilation duct, heat dissipation ventilation pipe are arranged vertically, and the axial location of heat dissipation ventilation pipe is equipped with heat dissipation ventilation groove, heat dissipation ventilation pipe Upper end is free end, and the lower end of heat dissipation ventilation pipe is docked with air guide hole;The outer circumferential surface of heat dissipation ventilation pipe is equipped with fixed seat, fixed seat Outside left installed support base;Fixing pipe is equipped between fixed seat and heat dissipation ventilation pipe, fixing pipe is sleeved on heat dissipation ventilation On the outer circumferential surface of pipe.
2. mobile phone radiator used for printed circuit board according to claim 1, it is characterised in that:The side of bottom case installs There is fluting.
3. mobile phone radiator used for printed circuit board according to claim 1, it is characterised in that:The bottom of support base is equipped with Fixed plate.
4. mobile phone radiator used for printed circuit board according to claim 1, it is characterised in that:The bottom of bottom case is equipped with solid Stator.
5. mobile phone radiator used for printed circuit board according to claim 1, it is characterised in that:Support base is arc shape Shape.
CN201711449659.5A 2017-12-27 2017-12-27 A kind of mobile phone radiator used for printed circuit board Withdrawn CN107995789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711449659.5A CN107995789A (en) 2017-12-27 2017-12-27 A kind of mobile phone radiator used for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711449659.5A CN107995789A (en) 2017-12-27 2017-12-27 A kind of mobile phone radiator used for printed circuit board

Publications (1)

Publication Number Publication Date
CN107995789A true CN107995789A (en) 2018-05-04

Family

ID=62042996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711449659.5A Withdrawn CN107995789A (en) 2017-12-27 2017-12-27 A kind of mobile phone radiator used for printed circuit board

Country Status (1)

Country Link
CN (1) CN107995789A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117336236A (en) * 2023-09-27 2024-01-02 东莞市唯仕达通讯科技有限公司 Router heat dissipation adjusting device and router heat dissipation adjusting method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2443426Y (en) * 2000-07-27 2001-08-15 魏文珍 Computer radiator
CN201438286U (en) * 2009-06-18 2010-04-14 鸿富锦精密工业(深圳)有限公司 Foolproof device of heat radiation system
JP2016057997A (en) * 2014-09-12 2016-04-21 立端科技股▲分▼有限公司 Electric communication computing module capable of housing printed circuit board
CN206287525U (en) * 2016-10-31 2017-06-30 宁波爱博睿智能科技有限公司 A kind of 3D printer shower nozzle shunts wind guide cover device
CN206724289U (en) * 2017-04-20 2017-12-08 呼和浩特市利信机电设备有限公司 A kind of infrared radiation electric heating apparatus heat abstractor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2443426Y (en) * 2000-07-27 2001-08-15 魏文珍 Computer radiator
CN201438286U (en) * 2009-06-18 2010-04-14 鸿富锦精密工业(深圳)有限公司 Foolproof device of heat radiation system
JP2016057997A (en) * 2014-09-12 2016-04-21 立端科技股▲分▼有限公司 Electric communication computing module capable of housing printed circuit board
CN206287525U (en) * 2016-10-31 2017-06-30 宁波爱博睿智能科技有限公司 A kind of 3D printer shower nozzle shunts wind guide cover device
CN206724289U (en) * 2017-04-20 2017-12-08 呼和浩特市利信机电设备有限公司 A kind of infrared radiation electric heating apparatus heat abstractor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117336236A (en) * 2023-09-27 2024-01-02 东莞市唯仕达通讯科技有限公司 Router heat dissipation adjusting device and router heat dissipation adjusting method
CN117336236B (en) * 2023-09-27 2024-05-14 东莞市唯仕达通讯科技有限公司 Router heat dissipation adjusting device and router heat dissipation adjusting method

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Application publication date: 20180504