CN107978422A - A kind of magnetic device embedding shell mechanism - Google Patents

Abstract

The invention provides a potting enclosure for magnetic devices, comprising: a side wall, a bottom plate and a hollow heat dissipation part, wherein the bottom of the side wall is connected with the bottom plate to form a space for accommodating the magnetic device, and the side wall is provided with a magnetic The mounting part of the potting case of the device communicates with the heat dissipation part fixed on the bottom plate through the first through hole set in the middle of the bottom plate to form a heat dissipation channel, which increases the heat dissipation surface area and the ventilation channel of the potting case of the magnetic device, and satisfies the requirements of the magnetic field. The heat dissipation performance of the magnetic device is improved on the basis of the device being dust-proof and soil-proof.

Description

A magnetic device potting shell structure

technical field

The invention relates to a potting shell structure of a magnetic device, in particular, it is suitable for the potting shell of a magnetic device requiring heat dissipation.

Background technique

Magnetic devices are often placed inside the cabinet or work outdoors, where there will be dust and water in the working environment. In order to prevent dust accumulation and waterproof, and protect the inside of the magnetic device from damage, the magnetic device is usually placed in a case for glue filling.

However, during the working process of the magnetic device, the internal middle position generates a lot of heat and the temperature is high, and the heat needs to be transferred from the inside to the outside. When the heat generated at the center of the magnetic device is greater than the heat transferred to the outside, the temperature inside the magnetic device will continue to rise. Therefore, when the magnetic device has high heat dissipation requirements, the overall heat dissipation performance of the magnetic device will be greatly reduced after the overall glue is filled.

Contents of the invention

In view of this, the present invention provides a magnetic device potting shell structure, which is suitable for fixing the magnetic device and can obtain better heat dissipation effect.

In order to solve the above problems, the present invention provides a potting housing structure for magnetic devices, including: a side wall, a bottom plate and a hollow heat dissipation part, wherein the bottom of the side wall is connected with the bottom plate to form a space for accommodating the magnetic device , the base plate is provided with a first through hole, one end of the heat dissipation part is fixed on the base plate, and one end of the heat dissipation part communicates with the first through hole to form a heat dissipation channel, and the base plate is also provided with There is a mounting part for fixing the magnetic device potting case.

Optionally, the first through hole is located in the middle of the bottom plate.

Optionally, the cross-sectional shape of the heat dissipation channel is circular, rectangular, elliptical or polygonal.

Optionally, the material of the side wall and the bottom plate is metal.

Optionally, the cross-sectional shape of the side wall is rectangular or circular.

Optionally, the other end of the heat dissipation portion is flush with the top of the side wall.

Optionally, a groove is provided on the side wall, and the position of the groove on the side wall corresponds to the position of the installation part on the bottom plate.

Optionally, the installation portion is a second through hole.

Optionally, the number of the second through holes is four.

The present invention has the following beneficial effects:

The potting case of the magnetic device includes a side wall, a bottom plate and a hollow heat dissipation part, the bottom of the side wall is connected with the bottom plate to form a space for accommodating the magnetic device, the first through hole provided on the bottom plate and the heat dissipation part whose end is fixed on the bottom plate Connected to form a heat dissipation channel, which solves the problem of poor heat dissipation in the middle of the magnetic device. It not only increases the heat dissipation surface area of the magnetic device potting shell, but also increases the ventilation channel, which improves the magnetic device on the basis of dust and soil protection. thermal performance.

Description of drawings

Fig. 1 is the front view of the magnetic device potting shell of the embodiment of the present invention;

Fig. 2 is the left side view of the potting shell of the magnetic device of the embodiment of the present invention;

Fig. 3 is a top view of a magnetic device potting case according to an embodiment of the present invention;

4 is an axonometric view of a magnetic device potting enclosure according to an embodiment of the present invention;

Fig. 5 is an installation top view of the magnetic device potting case of the embodiment of the present invention;

Fig. 6 is a left side view of the installation of the magnetic device potting case according to the embodiment of the present invention;

Fig. 7 is a cross-sectional view of the installation of the magnetic device potting shell according to the embodiment of the present invention;

Fig. 8 is an installation axonometric view of the potting enclosure of the magnetic device according to the embodiment of the present invention;

Detailed ways

In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

Referring to Figures 1 to 4, in this embodiment, the magnetic device potting enclosure includes: a side wall 1, a bottom plate 2 and a hollow heat dissipation part 3, wherein the bottom of the side wall 1 is connected to the bottom plate 2 to form a A space for accommodating magnetic devices, the bottom plate 2 is provided with a first through hole 4, one end of the heat dissipation portion 3 is fixed on the bottom plate 2, and the fixed end of the heat dissipation portion 3 communicates with the first through hole 4 A heat dissipation channel is formed, and the base plate 2 is also provided with a mounting portion 5 for fixing the potting case of the magnetic device.

In this embodiment, the first through hole 4 is arranged in the middle of the bottom plate 2 , the other end of the heat dissipation portion 3 is flush with the top of the side wall 1 , and the first through hole 4 communicates with the heat dissipation portion 3 to form a heat dissipation channel. The cross-sectional shape of the cooling channel can be circular, rectangular, elliptical or polygonal.

On the one hand, the heat dissipation part 3 and the heat dissipation channel increase the overall heat dissipation surface area of the encapsulation housing of the magnetic device; In addition, the heat dissipation channel also reduces the heat transfer distance at the hottest center of the magnetic device, which can effectively improve the heat dissipation performance.

In this embodiment, the cross-sectional shape of the side wall 1 of the potting case of the magnetic device may be rectangular or circular, and the side wall 1 is provided with a groove 6 . The mounting part 5 provided on the bottom plate 2 is a second through hole, for example, in this example, the number of the second through hole is set to four, and the second through hole is arranged on the four corners of the rectangular side wall 1 . The grooves 6 on the side wall 1 correspond to the positions of the installation parts 5 on the bottom plate 2 one by one, and there is no obstruction near the installation parts 5, which is convenient for bolts and other connecting parts to fix the potting casing of the magnetic device. Of course, this embodiment does not limit the specific shapes and positions of the mounting portion and the groove.

In this embodiment, the materials of the sidewall 1 and the bottom plate 2 can be metal materials, such as aluminum or iron, etc. Metal materials generally have better heat conduction effects, and can also improve the heat dissipation performance of the magnetic device encapsulation enclosure.

Referring to Figures 5 to 8, the magnetic device 8 is placed in the accommodation space formed by the side wall 1 and the floor 2 of the magnetic device potting case, and the high thermal conductivity glue 7 is potted inside the magnetic device potting case to complete the potting of the magnetic device 8 Sealing treatment and potting can meet the dustproof and waterproof requirements of the magnetic device 8, wherein the high thermal conductivity glue 7 can be epoxy glue or silica gel. The heat dissipation channel formed by the communication between the first through hole and the heat dissipation part runs through the entire encapsulation casing of the magnetic device.

It should be noted that, in this embodiment, the potting case of the magnetic device includes a side wall, a bottom plate and a hollow heat dissipation part, the side wall and the bottom plate are connected to form a space for accommodating the magnetic device, and the bottom plate is not only provided with The installation part of the potting shell is also provided with a first through hole. The first through hole communicates with the heat dissipation part whose end is fixed on the bottom plate to form a heat dissipation channel, which increases the heat dissipation area of the potting shell of the magnetic device, and also increases the ventilation channel, and improves the magnetic device on the basis of dustproof and soilproof. Excellent heat dissipation performance, which solves the problem of poor heat dissipation in the middle of the magnetic device.

The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be It is regarded as the protection scope of the present invention.

Claims (9)

1. A magnetic device encapsulation housing, characterized in that it comprises: a side wall, a bottom plate and a hollow heat dissipation portion, wherein the bottom of the side wall is connected to the bottom plate to form a space for accommodating the magnetic device, the The bottom plate is provided with a first through hole, one end of the heat dissipation part is fixed on the bottom plate, and one end of the heat dissipation part communicates with the first through hole to form a heat dissipation channel, and the bottom plate is also provided with a The mounting part of the magnetic device potting case. 2 . The magnetic device potting case according to claim 1 , wherein the first through hole is located in the middle of the bottom plate. 3 . 3 . The potting enclosure of the magnetic device according to claim 1 , wherein the cross-sectional shape of the heat dissipation channel is circular, rectangular, elliptical or polygonal. 4 . 4 . The magnetic device potting enclosure according to claim 1 , wherein the material of the side wall and the bottom plate is metal. 5 . The magnetic device potting case according to claim 1 , wherein the cross-sectional shape of the side wall is a rectangle or a circle. 6 . 6 . The magnetic device potting case according to claim 1 , wherein the other end of the heat dissipation portion is flush with the top of the side wall. 7 . 7. The magnetic device potting enclosure according to claim 1, wherein a groove is provided on the side wall, and the position of the groove on the side wall corresponds to the position of the mounting part on the bottom plate . 8 . The magnetic device potting case according to claim 7 , wherein the mounting portion is a second through hole. 9 . The magnetic device potting case according to claim 8 , wherein the number of the second through holes is four.