CN107968130A - Silicon chip cleaning and texturing technique - Google Patents
Silicon chip cleaning and texturing technique Download PDFInfo
- Publication number
- CN107968130A CN107968130A CN201711204169.9A CN201711204169A CN107968130A CN 107968130 A CN107968130 A CN 107968130A CN 201711204169 A CN201711204169 A CN 201711204169A CN 107968130 A CN107968130 A CN 107968130A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- cleaning
- making herbs
- groove body
- wool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 145
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 145
- 239000010703 silicon Substances 0.000 title claims abstract description 145
- 238000004140 cleaning Methods 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 39
- 210000002268 wool Anatomy 0.000 claims abstract description 57
- 235000008216 herbs Nutrition 0.000 claims abstract description 54
- 238000005530 etching Methods 0.000 claims abstract description 32
- 238000012546 transfer Methods 0.000 claims abstract description 28
- 239000007921 spray Substances 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 44
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 27
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000004321 preservation Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 4
- 230000036632 reaction speed Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 68
- 239000002585 base Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002459 sustained effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- -1 nozzle opens Dynamic Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000013268 sustained release Methods 0.000 description 1
- 239000012730 sustained-release form Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses one kind can protect easy to making herbs into wool temperature control, while ensure that silicon chip silicon chip during Wafer Cleaning, making herbs into wool is carried out is in the silicon chip cleaning and texturing technique of moisture state all the time.The silicon chip cleaning and texturing technique, realizes, the silicon chip cleaning and texturing device includes silicon chip texture etching slot, silicon chip transfer device and silicon wafer stripping cleaning device using silicon chip cleaning and texturing device；The silicon chip transfer device is arranged between silicon chip texture etching slot and silicon wafer stripping cleaning device；Silicon chip cleaning and texturing technique includes processing step cleaning and making herbs into wool；High using the silicon chip cleaning and texturing technique making herbs into wool temperature control precision, chemical stable reaction, controllable in whole technology groove, the reaction speed and volatile quantity of solution can be achieved effective control, easy to technique adjustment；Silicon chip can ensure that silicon chip remains moisture state in operation process in transport process by spray at the same time, so as to effectively avoid the occurrence of the situation of " edge flower piece ", improve the quality of product.
Description
Technical field
The present invention relates to the making herbs into wool of silicon chip, especially a kind of silicon chip cleaning and texturing technique.
Background technology
It is well-known：Silicon chip needs to be cleaned after by a series of processing program, and the purpose of cleaning is will
Each pollutant of the absorption in silicon chip surface is eliminated, and makes the suede structure that can reduce surface sun light reflection, and is cleaned
Clean level directly affect the yield rate and reliability of cell piece.Making herbs into wool is to manufacture first of technique of crystal silicon battery, again
Claim " surface-texturing ".Effective suede structure causes incident light in silicon chip surface multiple reflections and refraction, to add the suction of light
Receive, reduce reflectivity, help to improve the performance of battery.
Important function in view of process for etching section to the entire production line, for the factor for influencing making herbs into wool reaction, to equipment
The design of process section carries out finer adjustment：
Making herbs into wool is considered as the condition reacted, the i.e. temperature of chemical liquids and the concentration of each component etc. first as chemical reaction.
Present industrial production proposes process for etching temperature control higher requirement, in order to ensure the uniformity of reaction condition, temperature
Controlling precision will be in ± 1 DEG C, and chemical reaction could be more stable and controllable in whole technology groove, achieves effective control the reaction of solution
Speed and volatile quantity, easy to technique adjustment.Control of the existing texturing slot to solution temperature is not sufficiently stable, and can not ensure making herbs into wool pair
The requirement of solution temperature.
At the same time in the prior art, Wafer Cleaning and the device that making herbs into wool is carried out continuously are realized although having, in silicon chip by clear
During dilution is transported to texturing slot, there is in atmosphere therefore easily water wave print due to exposure in silicon chip, so that silicon
Tablet quality is affected.
The content of the invention
The technical problems to be solved by the invention, which are to provide one kind, can protect easy to making herbs into wool temperature control, while ensure silicon chip
Silicon chip is in the silicon chip cleaning and texturing technique of moisture state all the time during Wafer Cleaning, making herbs into wool is carried out.
The technical solution adopted by the present invention to solve the technical problems is：Silicon chip cleaning and texturing technique, using Wafer Cleaning
Fluff making device, the silicon chip cleaning and texturing device include silicon chip texture etching slot, silicon chip transfer device and silicon chip cleaning device；It is described
Silicon chip transfer device is arranged between silicon chip texture etching slot and silicon chip cleaning device；
The silicon chip texture etching slot includes groove body, heating controller；One end of the groove body is provided with to be set into sink, the other end
It is equipped with effluent trough；
It is described enter sink one end connected by the first even flow plate with groove body, be provided with above the other end and connected with entering sink
Enter water tank；It is described enter water tank there is water inlet, it is described enter sink in from the one end for entering sink be disposed with horizontal stroke to the other end
To adding thermal resistance, vertical adding thermal resistance and agitating device；The Transverse Heated resistance is located at the lower section into water tank；And vertical
It is uniformly distributed on direction；The vertical adding thermal resistance in the horizontal direction on be uniformly distributed；The agitating device is located at the first uniform flow
The side of plate；
One end of the effluent trough is connected by the second even flow plate with groove body, and the other end is provided with water outlet；The groove body
Bottom be provided with Heat preservation resistance, be provided with temperature sensor in the groove body, the temperature sensor, Transverse Heated electricity
Resistance, vertical adding thermal resistance and Heat preservation resistance are electrically connected with heating controller；
The silicon chip transfer device includes mounting base, and turntable is provided with the mounting base, is provided with the turntable perpendicular
To traveller, slide unit is provided with the vertical traveller, the first telescopic device, first telescopic device are provided with the slide unit
One end is fixedly connected with slide unit, and the other end is provided with support arm, and described support arm one end is connected with telescopic device by cradle head
Connect；The second turntable is provided with below the other end of the support arm, the second telescopic device, institute are provided with second turntable
The lower end for stating the second telescopic device is provided with clamping jaw；
The clamping jaw includes fixed plate, stationary jaw and dynamic clamping jaw, and the stationary jaw is fixedly mounted in fixed plate, institute
Clamping jaw is stated to be slidably mounted in fixed plate along the length direction of fixed plate；The dynamic clamping jaw of driving is provided with the fixed plate along admittedly
The sliding driving device that the length direction of fixed board slides；Formed between the stationary jaw and dynamic clamping jaw between grabbing clip area, it is described solid
Fixed board lower surface is provided with nozzle, and booster pump is provided with the support arm；The nozzle is connected with booster pump, the nozzle position
It is interior in grabbing clip area；
The silicon chip cleaning and texturing technique comprises the following steps：
1 silicon chip first is cleaned by cleaning device, in the sink of cleaning device, configures cleaning solution cleaning solution bag
Include HCl, H202, DI water, wherein HCl：H202：DI water is 1:1:6~1:2:8；
2) it is 70 DEG C to 85 DEG C to ensure cleaning solution temperature in sink, and silicon chip then is soaked 25 to 30min；
3 are transported to silicon chip in silicon chip texture etching slot by silicon chip transfer device；By on transfer device in transport process
Nozzle sprays vaporific DI water to the gaily decorated basket for loading silicon chip always；
4 in silicon chip texture etching slot, configures making herbs into wool solution first, the making herbs into wool solution is the hydroxide that concentration is 1%-2%
Sodium solution, and add isopropanol into making herbs into wool solution；Wherein mass percent sodium hydroxide：Isopropanol is 1:50 to 1:80；
Then making herbs into wool solution is sent into by entering water tank 14, making herbs into wool solution is successively by Transverse Heated resistance, vertical heating electricity
Resistance, agitating device processing after so that making herbs into wool solution temperature be 80 DEG C ± 5 DEG C, then making herbs into wool solution by the first even flow plate 17 into
Enter in groove body；
5 monitor the temperature of the making herbs into wool solution in groove body in real time by temperature sensor in groove body, then pass through
Temperature controller control Heat preservation resistance groove body is heated, ensure groove body in making herbs into wool solution temperature fluctuation range ±
Within 0.3 DEG C；
6 silicon chips soak 15 to 20min in making herbs into wool solution.
Further, ensure that cleaning solution temperature is 75 DEG C to 80 DEG C in sink in step 2).
Further, the mass percent of sodium hydroxide and isopropanol is 1 in step 4):60 to 1:70.
Further, it is provided with heat insulation and heating equipment on the upper end for the otch that the groove body has.
Further, the vertical adding thermal resistance end is extended in groove body, and the other end is provided with fixed mounting plate, described perpendicular
To adding thermal resistance through fixed mounting plate and with fixed mounting plate thread fitting.
Further, the agitating device includes driving motor, agitating shaft；The agitating shaft is inserted vertically into groove body,
Agitating vane is provided with the agitating shaft, the agitating shaft is by driving motor-driven rotation.
Further, the agitating vane is uniformly distributed in the axial direction on agitating shaft, and along the circumference side of agitating shaft
To being uniformly distributed.
Further, the agitating vane of sustained height is agitating vane group on the axis direction of the agitating shaft；Every group is stirred
Mix blade group and include at least three pieces agitating vane.
Further, at least there are three groups of agitating vane groups on agitating shaft.
Further, first telescopic device and the second telescopic device use hydraulic cylinder.
Further, the nozzle of embedded inner wall is provided with the inner wall of the stationary jaw.
Further, the cradle head includes the first adapter and the second adapter, is set in first adapter
There is rotational drive motor, annular convex platform is provided with second adapter, be provided with first adapter and convex annular
The matched groove of platform；Bearing is provided between the inner ring and groove of the annular convex platform；What the rotational drive motor had turns
Moving axis is connected with the second adapter, and first adapter is connected with the first telescopic device, second adapter and support arm
Connection.
The beneficial effects of the invention are as follows：Silicon chip cleaning and texturing technique of the present invention using silicon chip cleaning and texturing due to being filled
Put, the cleaning and texturing device includes silicon chip texture etching slot and silicon chip transfer device, the silicon chip texture etching slot in technology groove one
End is provided with into sink, and is entering the vertical equally distributed Transverse Heated resistance of setting in sink, is uniformly divided laterally setting
The vertical adding thermal resistance of cloth, and by agitating device to being stirred after the heating of the solution of circulation, then by even flow plate into
Enter into groove body, so as to ensure that the heating-up temperature of circulation solution is uniform, ensure that the temperature of making herbs into wool.The silicon chip transhipment dress
Put, the nozzle that can be set according to technological requirement is mounted with clamping jaw, after clamping jaw will expect that basket is proposed from solution, nozzle opens
Dynamic, water sprays in an atomized manner, ensure that silicon chip all angles can spray, the portion that especially silicon chip is contacted with material basket
Point.
Therefore, silicon chip cleaning and texturing technique of the present invention has the following advantages：
1st, temperature control precision is high, and chemical stable reaction, controllable in whole technology groove, can achieve effective control the anti-of solution
Speed and volatile quantity are answered, easy to technique adjustment.
2nd, silicon chip can ensure that silicon chip remains moisture state in operation process in transport process by spray, from
And the situation of " edge flower piece " is effectively avoided the occurrence of, ensure the quality of product.
Brief description of the drawings
Fig. 1 is the structure diagram of silicon chip cleaning and texturing device in the embodiment of the present invention；
Fig. 2 is the stereogram of silicon chip texture etching slot in the embodiment of the present invention；
Fig. 3 is the top view of silicon chip texture etching slot in the embodiment of the present invention；
Fig. 4 is the side view of silicon chip texture etching slot in the embodiment of the present invention；
Fig. 5 is A-A sectional views in Fig. 3
Fig. 6 is the B-B sectional views in Fig. 3；
Fig. 7 is the C-C sectional views in Fig. 3；
Fig. 8 is the stereogram of silicon wafer wool making transfer device in the embodiment of the present invention；
Fig. 9 is the diarthrodial structure diagram of transfer of the embodiment of the present invention；
Indicated in figure：1- silicon chip texture etching slots, 11- groove bodies, 12- enter sink, 13- effluent troughs, and 14- enters water tank, and 15- vertically adds
Thermal resistance, 16- agitating devices, the first even flow plates of 17-, the second even flow plates of 18-, 19- Transverse Heated resistance, 110- Heat preservations electricity
Resistance, 111- heat insulation and heating equipments, 2- silicon chip transfer devices, 21- mounting bases, 22- slide units, the first telescopic devices of 23-, 24- are rotated
Joint, 25- support arms, the second turntables of 26-, the second telescopic devices of 27-, 28- clamping jaws, 29- nozzles, 210- booster pumps, 3- silicon chips
Cleaning device.
Embodiment
The present invention is further described with reference to the accompanying drawings and examples.
As shown in Figures 1 to 6, silicon chip cleaning and texturing technique of the present invention, it is described using silicon chip cleaning and texturing device
Silicon wafer wool making device includes silicon chip texture etching slot 1, silicon chip transfer device 2 and silicon chip cleaning device 3；The silicon chip transfer device 2
It is arranged between silicon chip texture etching slot 1 and silicon chip cleaning device 3；
The silicon chip texture etching slot 1 includes groove body 11, heating controller 19；One end of the groove body 11 is provided with into sink
12, the other end is provided with effluent trough 13；
It is described enter 12 one end of sink connected by the first even flow plate 17 with groove body 11, be provided with above the other end and enter water
What groove 12 connected enters water tank 14；It is described enter water tank 14 there is water inlet 141, it is described enter sink 12 in from enter one end of sink 12 to
The other end is disposed with Transverse Heated resistance 19, vertical adding thermal resistance 15 and agitating device 16；The Transverse Heated resistance
19 are located at the lower section into water tank 14；And in the vertical direction is uniformly distributed；The vertical adding thermal resistance 15 is upper equal in the horizontal direction
Even distribution；The agitating device 16 is located at the side of the first even flow plate 17；
One end of the effluent trough 13 is connected by the second even flow plate 18 with groove body 11, and the other end is provided with water outlet 131；
The bottom of the groove body 11 is provided with Heat preservation resistance 110, and temperature sensor is provided with the groove body 11, and the temperature passes
Sensor, Transverse Heated resistance 19, vertical adding thermal resistance 15 and Heat preservation resistance 110 are electrically connected with heating controller 19；
The silicon chip transfer device 2 includes mounting base 211, is provided with turntable in the mounting base 211, pacifies on the turntable
Equipped with vertical traveller 21, slide unit 22 is provided with the vertical traveller 21, the first telescopic device 23 is provided with the slide unit 22,
Described first telescopic device, 23 one end is fixedly connected with slide unit 22, and the other end is provided with support arm 25, described 25 one end of support arm
It is connected with telescopic device 23 by cradle head 24；The second turntable 26, institute are provided with below the other end of the support arm 25
State and the second telescopic device 27 is provided with the second turntable 26, the lower end of second telescopic device 27 is provided with clamping jaw 28；
The clamping jaw 28 includes fixed plate, stationary jaw 281 and dynamic clamping jaw 282, and the stationary jaw 281 is fixedly mounted on
In fixed plate, the dynamic clamping jaw 282 is slidably mounted in fixed plate along the length direction of fixed plate；It is provided with the fixed plate
The sliding driving device that the length direction of driving dynamic clamping jaw 282 along fixed plate slides；The stationary jaw 281 and dynamic clamping jaw 282
Between formed grab clip area between, the fixed plate lower surface is provided with nozzle 9, and booster pump 210 is provided with the support arm 5；Institute
State nozzle 29 to connect with booster pump 210, the nozzle 29 is interior positioned at clip area is grabbed；
The silicon chip cleaning and texturing technique comprises the following steps：
1 silicon chip first is cleaned by cleaning device 3, in the sink of cleaning device 3, configures cleaning solution, cleaning
Liquid includes HCl, H202, DI water, wherein HCl：H202：DI water is 1:1:6~1:2:8；
2) it is 70 DEG C to 85 DEG C to ensure cleaning solution temperature in sink, and silicon chip then is soaked 25 to 30min；
3 are transported to silicon chip in silicon chip texture etching slot 1 by silicon chip transfer device 2；By on transfer device 2 in transport process
Nozzle 9 spray vaporific DI water to the gaily decorated basket for loading silicon chip always；
4 in silicon chip texture etching slot, configures making herbs into wool solution first, the making herbs into wool solution is the hydroxide that concentration is 1%-2%
Sodium solution, and add isopropanol into making herbs into wool solution；Wherein mass percent sodium hydroxide：Isopropanol is 1:50 to 1:80；
Then making herbs into wool solution is sent into by entering water tank 14, making herbs into wool solution is successively by Transverse Heated resistance 19, vertical heating
After resistance 15, the processing of agitating device 16 so that making herbs into wool solution temperature is 80 DEG C ± 5 DEG C, and then making herbs into wool solution passes through the first uniform flow
Plate 17 enters in groove body 11；
5 monitor the temperature of the making herbs into wool solution in groove body 11 in real time by temperature sensor in groove body 11, then
Control Heat preservation resistance 110 to heat groove body by temperature controller 19, ensure the making herbs into wool solution temperature in groove body 11
Fluctuation range is within ± 0.3 DEG C；
6 silicon chips soak 15 to 20min in making herbs into wool solution.
Silicon chip is cleaned by cleaning device 3 first in step 1 and step 2, in the sink of cleaning device 3,
Cleaning solution is configured, cleaning solution includes HCl, H202, DI water, wherein HCl：H202：DI water is 1:1:6~1:2:8；Ensure in sink
Cleaning solution temperature is 70 DEG C to 85 DEG C, and silicon chip then is soaked 25 to 30min；
So as to by the configuration cleaning solution of cleaning solution, pass through the metal impurities of cleaning solution taking-up silicon chip surface, especially alkali
Metal ion.
Then silicon chip is transported in silicon chip texture etching slot 1 by silicon chip transfer device 2 in step 3；Lead in transport process
The nozzle 9 crossed on transfer device 2 sprays vaporific DI water to the gaily decorated basket for loading silicon chip always；So as to ensure to protect in silicon chip transport process
Moistening is held, avoids the occurrence of water wave print.
Then in step 4 to step 6 in silicon chip texture etching slot 1, by configuring making herbs into wool solution, the making herbs into wool solution is dense
The sodium hydroxide solution for 1%-2% is spent, and isopropanol is added into making herbs into wool solution；Wherein mass percent sodium hydroxide：
Isopropanol is 1:50 to 1:80；And realization passes through Transverse Heated resistance successively to the temperature control of making herbs into wool solution, making herbs into wool solution
19th, after vertical adding thermal resistance 15, the processing of agitating device 16 so that making herbs into wool solution temperature is 80 DEG C ± 5 DEG C；So as to fulfill silicon chip
Making herbs into wool, ensures the quality of silicon wafer wool making.
Wherein, during silicon chip transfer device 2 is transported through silicon chip：
After silicon chip carries out degumming cleaning by silicon chip cleaning device 3 first, enter in the sink of silicon chip cleaning device 3,
Then silicon chip is transported in silicon chip texture etching slot 3 from sink by silicon chip transfer device 2.It is logical first during transhipment
Cross the length of the telescopic adjustment support arm 25 of the first telescopic device 23, by slide unit 22 slide up and down and the second telescopic device
The height of 27 telescopic adjustment clamping jaw 28, passes through the rotation of cradle head 24 and the rotation of turntable 26, the angle of adjusting clamping jaw 28
Degree；So that clamping jaw clamps the gaily decorated basket from solution, then the gaily decorated basket is lifted from solution, starts booster pump 10, supercharging at this time
Pump 210 delivers water into nozzle 29, sprays water mist to the gaily decorated basket by nozzle 29；So as to ensure to remain in silicon chip transport process
Moistening.
Wherein, temperature control principle of the making herbs into wool solution in silicon chip texture etching slot 1 is：
After by silicon chip transfer device 2, silicon chip is transported in silicon chip texture etching slot 3, solution is by entering water tank in groove body 11
14 enter in sink 12, are heated in the lower section for entering water tank 14 into Transverse Heated resistance 19 is crossed, then again by vertical
The heating of adding thermal resistance 15, since the Transverse Heated resistance 19 is located at the lower section into water tank 14；And in the vertical direction is uniform
Distribution；The vertical adding thermal resistance 15 in the horizontal direction on be uniformly distributed；Therefore it ensure that the uniformity to solution heating, ensure
The temperature at each position of solution is always；Temperature at the same time by each position inside the stirring solution of agitating device is consistent；
Then making herbs into wool of the realization to silicon chip in groove body 11 in groove body 11 is entered by even flow plate 17.And set in the bottom of groove body 11
Equally distributed Heat preservation resistance 110 is equipped with, solution temperature in groove body 11 can be avoided relatively low, packs solution in 11 in groove
Temperature.Temperature sensor is provided with groove body 11, monitors the temperature in groove body 11, Ran Houtong in real time by temperature sensor
Cross heating controller 19 to be controlled vertical adding thermal resistance 15, Transverse Heated resistance 19 and Heat preservation resistance 110, pack
The temperature of solution meets technological requirement in groove body.
In conclusion silicon chip cleaning and texturing technique of the present invention is due to using silicon chip cleaning and texturing device, the silicon
Piece cleaning and texturing device, including silicon chip texture etching slot and silicon chip transfer device, the silicon chip texture etching slot are set in one end of technology groove
It is equipped with into sink, and vertical equally distributed Transverse Heated resistance is set in sink entering, it is equally distributed laterally setting
Vertical adding thermal resistance, and then entered by agitating device to being stirred after the solution heating of circulation by even flow plate
In groove body, so as to ensure that the heating-up temperature of circulation solution is uniform, the temperature of making herbs into wool ensure that.The silicon chip transfer device,
Be mounted with clamping jaw can according to technological requirement set nozzle, when clamping jaw will expect basket is proposed from solution after, nozzle startup, water with
Atomized manner sprays, and ensure that silicon chip all angles can spray, the part that especially silicon chip is contacted with material basket.
Therefore, silicon chip cleaning and texturing technique of the present invention has the following advantages：
1st, temperature control precision is high, and chemical stable reaction, controllable in whole technology groove, can achieve effective control the anti-of solution
Speed and volatile quantity are answered, easy to technique adjustment.
2nd, silicon chip can ensure that silicon chip remains moisture state in operation process in transport process by spray, from
And the situation of " edge flower piece " is effectively avoided the occurrence of, ensure the quality of product.
In order to improve cleaning performance, further, ensure that cleaning solution temperature is 75 DEG C to 80 DEG C in sink in step 2).
In order to improve the sustained release during making herbs into wool and the effect of complexing；Further, in step 4) sodium hydroxide with
The mass percent of isopropanol is 1:60 to 1:70.
In order to ensure that the temperature in groove body 11 keeps stablizing, further, the upper end for the otch that the groove body 11 has
On be provided with heat insulation and heating equipment 111.Specifically, heat insulation and heating equipment 111 can use adding thermal resistance, and it is embedded into groove body 1
Inner wall in；Since the otch of temperature from the groove body 11 of solution in groove body 11 distributes, the otch that groove body 11 has
Heat insulation and heating equipment 111 is provided with upper end so as to supplement the heat lost, packs the temperature of solution in groove body 11.
For the ease of the maintenance and replacement of vertical adding thermal resistance 15, further, vertical 15 end of the adding thermal resistance extension
Into groove body 11, the other end is provided with fixed mounting plate, and the vertical adding thermal resistance 15 is pacified through fixed mounting plate and with fixed
Loading board thread fitting.
Specifically, the agitating device 16 includes driving motor, agitating shaft；The agitating shaft is inserted vertically into groove body 11
It is interior, agitating vane is provided with the agitating shaft, the agitating shaft is by driving motor-driven rotation.
In order to make it that the solution after heating is fully stirred, the uniformity of packaging solution internal temperature, into one
Step, the agitating vane is uniformly distributed in the axial direction on agitating shaft, and is uniformly distributed along the circumferencial direction of agitating shaft.More
Further, the agitating vane of sustained height is agitating vane group on the axis direction of the agitating shaft；Every group of agitating vane group
Including at least three pieces agitating vane.Further, at least there are three groups of agitating vane groups on agitating shaft.
For the ease of control, it is preferred that 23 and second telescopic device 27 of the first telescopic device uses hydraulic cylinder.
In order to avoid silicon chip all in the gaily decorated basket equipped with silicon chip can sufficiently be sprayed by water；Further, it is described solid
The nozzle of embedded inner wall is provided with the inner wall of clamp pawl 281.
In order to simplify structure, while easy to control, specifically, the cradle head 24 includes the first adapter and second turn
Connector 242, is provided with rotational drive motor 243 in first adapter 241, ring is provided with second adapter 242
Shape boss 245, is provided with and 242 matched groove of annular convex platform on first adapter 241；The annular convex platform 242
Bearing 246 is provided between inner ring and groove；244 and second adapter 242 of rotation axis that the rotational drive motor 243 has
Connection, first adapter 241 are connected with the first telescopic device 23, and second adapter 242 is connected with support arm 25.
In order to ensure the stability of structure, it is preferred that the bearing 246 uses roller bearing.
For the ease of installing and dismounting and maintenance, further, first adapter 241 passes through flange and the first flexible dress
23 connections are put, second adapter 242 is connected by flange with support arm 25.
Claims (3)
1. silicon chip cleaning and texturing technique, it is characterised in that：Using silicon chip cleaning and texturing device, the silicon chip cleaning and texturing device bag
Include silicon chip texture etching slot (1), silicon chip transfer device (2) and silicon chip cleaning device (3)；The silicon chip transfer device (2) is arranged on
Between silicon chip texture etching slot (1) and silicon chip cleaning device (3)；
The silicon chip texture etching slot (1) includes groove body (11), heating controller (19)；One end of the groove body (11) is provided with into water
Groove (12), the other end are provided with effluent trough (13)；
It is described enter sink (12) one end connected by the first even flow plate (17) with groove body (11), be provided with and enter above the other end
Sink (12) connection enters water tank (14)；It is described enter water tank (14) there is water inlet (141), it is described enter sink (12) in by entering water
One end of groove (12) is disposed with Transverse Heated resistance (19), vertical adding thermal resistance (15) and agitating device to the other end
(16)；The Transverse Heated resistance (19) is located at the lower section into water tank (14)；And in the vertical direction is uniformly distributed；It is described vertical
Adding thermal resistance (15) in the horizontal direction on be uniformly distributed；The agitating device (16) is located at the side of the first even flow plate (17)；
One end of the effluent trough (13) is connected by the second even flow plate (18) with groove body (11), and the other end is provided with water outlet
(131)；The bottom of the groove body (11) is provided with Heat preservation resistance (110), and temperature sensing is provided with the groove body (11)
Device, the temperature sensor, Transverse Heated resistance (19), vertical adding thermal resistance (15) and Heat preservation resistance (110) with
Heating controller (19) is electrically connected；
The silicon chip transfer device (2) includes mounting base (211), is provided with turntable on the mounting base (211), on the turntable
Vertical traveller (21) is installed, slide unit (22) is provided with the vertical traveller (21), first is provided with the slide unit (22)
Telescopic device (23), described first telescopic device (23) one end are fixedly connected with slide unit (22), and the other end is provided with support arm
(25), described support arm (25) one end is connected with telescopic device (23) by cradle head (24)；The support arm (25) it is another
The second turntable (26) is provided with below one end, is provided with the second telescopic device (27) on second turntable (26), described
The lower end of two telescopic devices (27) is provided with clamping jaw (28)；
The clamping jaw (28) includes fixed plate, stationary jaw (281) and dynamic clamping jaw (282), the fixed peace of the stationary jaw (281)
In fixed plate, the dynamic clamping jaw (282) is slidably mounted in fixed plate along the length direction of fixed plate；In the fixed plate
It is provided with the sliding driving device that the length direction of driving dynamic clamping jaw (282) along fixed plate slides；The stationary jaw (281) and
Formed between dynamic clamping jaw (282) between grabbing clip area, the fixed plate lower surface is provided with nozzle (9), is set on the support arm (5)
There is booster pump (210)；The nozzle (29) connects with booster pump (210), and the nozzle (29) is interior positioned at clip area is grabbed；
It is further comprising the steps of：
1) silicon chip is cleaned by cleaning device (3) first, in the sink of cleaning device (3), configuration cleaning solution cleaning
Liquid includes HCl, H202, DI water, wherein HCl：H202：DI water is 1:1:6~1:2:8；
2) it is 70 DEG C to 85 DEG C to ensure cleaning solution temperature in sink, and silicon chip then is soaked 25 to 30min；
3) silicon chip is transported in silicon chip texture etching slot (1) by silicon chip transfer device (2)；Pass through transfer device in transport process
(2) nozzle (9) on sprays vaporific DI water to the gaily decorated basket for loading silicon chip always；
4) in silicon chip texture etching slot, making herbs into wool solution is configured first, the making herbs into wool solution is that the sodium hydroxide that concentration is 1%-2% is molten
Liquid, and add isopropanol into making herbs into wool solution；Wherein mass percent sodium hydroxide：Isopropanol is 1:50 to 1:80；
Then making herbs into wool solution is sent into by entering water tank 14, making herbs into wool solution is successively by Transverse Heated resistance (19), vertical heating electricity
After hindering (15), agitating device (16) processing so that making herbs into wool solution temperature is 80 DEG C ± 5 DEG C, and then making herbs into wool solution is even by first
Flowing plate 17 enters in groove body (11)；
5) temperature of the making herbs into wool solution in groove body (11) is monitored in real time by temperature sensor in groove body (11), then
Control Heat preservation resistance (110) to heat groove body by temperature controller (19), ensure that the making herbs into wool in groove body (11) is molten
Liquid temperature fluctuation range is within ± 0.3 DEG C；
6) silicon chip soaks 15 to 20min in making herbs into wool solution.
2. silicon chip cleaning and texturing technique as claimed in claim 1, it is characterised in that：Ensure cleaning solution in sink in step 2)
Temperature is 75 DEG C to 80 DEG C.
3. silicon chip cleaning and texturing technique as claimed in claim 1, it is characterised in that：Sodium hydroxide and isopropanol in step 4)
Mass percent be 1:60 to 1:70.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204169.9A CN107968130B (en) | 2017-11-27 | 2017-11-27 | Silicon chip cleaning and texturing technique |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711204169.9A CN107968130B (en) | 2017-11-27 | 2017-11-27 | Silicon chip cleaning and texturing technique |
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| CN107968130A true CN107968130A (en) | 2018-04-27 |
| CN107968130B CN107968130B (en) | 2019-05-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109317836A (en) * | 2018-12-17 | 2019-02-12 | 苏州比雷艾斯电子科技有限公司 | It is a kind of to collect part precise laser cutting device systems automatically |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014053484A1 (en) * | 2012-10-01 | 2014-04-10 | Ultra High Vacuum Solutions Ltd. T/A Nines Engineering | Combined etch and passivation of silicon solar cells |
| CN104157735A (en) * | 2014-08-14 | 2014-11-19 | 山西潞安太阳能科技有限责任公司 | Solar cell texturing process |
| CN105470170A (en) * | 2015-11-23 | 2016-04-06 | 百力达太阳能股份有限公司 | System of making uniform texturing-groove chemical groove liquid temperature |
| CN206312916U (en) * | 2017-01-05 | 2017-07-07 | 浙江晶能光电有限公司 | The fluff making device of solar battery sheet |
| CN206441756U (en) * | 2017-02-16 | 2017-08-25 | 温州隆润科技有限公司 | A kind of solar silicon wafers cleaning and texturing device |
-
2017
- 2017-11-27 CN CN201711204169.9A patent/CN107968130B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014053484A1 (en) * | 2012-10-01 | 2014-04-10 | Ultra High Vacuum Solutions Ltd. T/A Nines Engineering | Combined etch and passivation of silicon solar cells |
| CN104157735A (en) * | 2014-08-14 | 2014-11-19 | 山西潞安太阳能科技有限责任公司 | Solar cell texturing process |
| CN105470170A (en) * | 2015-11-23 | 2016-04-06 | 百力达太阳能股份有限公司 | System of making uniform texturing-groove chemical groove liquid temperature |
| CN206312916U (en) * | 2017-01-05 | 2017-07-07 | 浙江晶能光电有限公司 | The fluff making device of solar battery sheet |
| CN206441756U (en) * | 2017-02-16 | 2017-08-25 | 温州隆润科技有限公司 | A kind of solar silicon wafers cleaning and texturing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109317836A (en) * | 2018-12-17 | 2019-02-12 | 苏州比雷艾斯电子科技有限公司 | It is a kind of to collect part precise laser cutting device systems automatically |
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| Publication number | Publication date |
|---|---|
| CN107968130B (en) | 2019-05-10 |
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