CN107835566B - Printed electronic device board integrated member and circuit manufacturing method - Google Patents
Printed electronic device board integrated member and circuit manufacturing method Download PDFInfo
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- CN107835566B CN107835566B CN201711031471.9A CN201711031471A CN107835566B CN 107835566 B CN107835566 B CN 107835566B CN 201711031471 A CN201711031471 A CN 201711031471A CN 107835566 B CN107835566 B CN 107835566B
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- flexible printed
- electronic device
- printed electronic
- boards
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Abstract
A printed electronic device board integrated and a circuit manufacturing method are disclosed, which enable a flexible printed electronic device board to be fixed to a target object or connected to each other by providing a mechanical connection member, whereby the flexible electronic device board can be conveniently moved and taken out in production, and on the other hand, the mounting of the flexible electronic device can be conveniently performed.
Description
Technical Field
The invention relates to three-dimensional printing and printed electronics technology, in particular to a printed electronic device board integrated piece and a circuit manufacturing method.
Background
Printed electronics is an electronic manufacturing technology based on the printing principle. Silicon-based semiconductor microelectronics have dominated electronics for the past 50 years. Silicon-based integrated circuit fabrication techniques are becoming increasingly complex and capital intensive. With the development of organic and inorganic semiconducting materials in solution over the last 10 years, research and development has been promoted for the fabrication of various electronic devices using conventional printing techniques. The biggest characteristic of solubilized organic and inorganic semiconductor materials is that they are independent of the conductive or semiconductive properties of the substrate material and can be deposited in thin film form onto any material. The means of deposition may be evaporation, spin coating or printing. This has led to a new electronic field, Printed electronics (Printed electronics), which is different from silicon-based microelectronics. The biggest characteristics and advantages of printed electronic products are large area, flexibility and low cost. Printed electronics can enable printing on flexible substrates or printing to form printed electronics.
Disclosure of Invention
In view of the above, embodiments of the present invention provide a printed electronic device board integrated component and a circuit manufacturing method, so as to expand the application of the printed electronic device.
In a first aspect, there is provided a printed electronics board assembly comprising
At least one flexible printed electronics board; and
a mechanical connection part for mechanically connecting the flexible printed electronic device boards to each other or fixedly connecting the flexible printed electronic device boards to a target.
Preferably, the mechanical connecting part is an adhesive layer arranged on the back surface of the flexible printed electronic device board.
Preferably, the adhesive layer covers the entire area of the back surface of the flexible printed electronic device board;
the front surface of the flexible printed electronic device board is provided with a protective layer which is easy to separate from the adhesive layer.
Preferably, the adhesive layer covers a partial area of the back surface of the flexible printed electronic device board;
the partial area corresponds to a blank area of the front surface of the flexible printed electronic device board connected with the adhesive layer.
Preferably, the printed electronics board assembly comprises a plurality of flexible printed electronics boards of the same type.
Preferably, the printed electronics board assembly comprises a plurality of different types of flexible printed electronics boards;
the printed electronics board assembly further comprises:
and an electrical connection part for connecting different flexible printed electronic device boards to construct a circuit system having a predetermined function.
Preferably, the electrical connection part is a flexible printed circuit connector.
In a second aspect, a circuit manufacturing method is provided, including:
printing to form a plurality of flexible printed electronic device boards;
interconnecting the plurality of flexible printed electronic device boards by a mechanical connection component;
the different printed electronic boards are connected by electrical connection means to build up a circuit system with predetermined functions.
Preferably, the connecting part is an adhesive layer arranged on the back surface of the flexible printed electronic device board.
The embodiment of the invention enables the flexible printed electronic device board to be fixed to a target object or connected with each other by arranging the mechanical connecting part, thereby being capable of conveniently moving and taking the flexible electronic device in production and conveniently installing the flexible electronic device.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of a flexible printed electronics board integration of an embodiment of the present invention;
FIG. 2 is a schematic view of a flexible printed electronics board integration of another embodiment of the present invention;
fig. 3 is a top view of the flexible printed electronics board manifold shown in the above embodiment;
FIG. 4 is a schematic view of a flexible printed electronics board integration of yet another embodiment of the present invention;
FIG. 5 is a schematic view of a flexible printed electronic device board substrate manifold in accordance with yet another embodiment of the present invention;
fig. 6 is a flow chart of a method of manufacturing a circuit according to an embodiment of the invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Meanwhile, it should be understood that, in the following description, a "circuit" refers to a conductive loop constituted by at least one element or sub-circuit through electrical or electromagnetic connection. When an element or circuit is referred to as being "connected to" another element or element/circuit is referred to as being "connected between" two nodes, it may be directly coupled or connected to the other element or intervening elements may be present, and the connection between the elements may be physical, logical, or a combination thereof. In contrast, when an element is referred to as being "directly coupled" or "directly connected" to another element, it is intended that there are no intervening elements present.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
It will be understood that when a layer or region is referred to as being "on" or "over" another layer or region in describing the structure of the device, it can be directly on the other layer or region or intervening layers or regions may also be present. And, if the device is turned over, that layer, region, or regions would be "under" or "beneath" another layer, region, or regions.
If for the purpose of describing the situation directly on another layer, another area, the expression "directly on … …" or "on … … and adjacent thereto" will be used herein.
In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Fig. 1 is a schematic view of a flexible printed electronics board integration of an embodiment of the present invention. As shown in fig. 1, the printed electronic device board assembly of the present embodiment may be integrated from a plurality of manufactured flexible printed electronic device boards. Specifically, the flexible printed electronic board assembly includes a plurality of flexible printed electronic boards 1 and a mechanical connection member 2. The flexible printed electronic device board 1 is a plurality of electronic devices formed by printing or printing organic or inorganic electronic materials on a flexible substrate, and connecting leads. Organic, inorganic, or composite materials that form circuits or electronic components may be printed by printing or printing to produce devices such as transistors, displays, sensors, phototubes, batteries, lighting devices, conductors, and semiconductors, and interconnecting circuitry. Printed electronics boards are distinct from printed circuit boards. Printed circuit boards can only form metal conductors for connecting different electronic devices. The printed electronic device board is formed by printing electronic technology on a substrate to form an electronic device 11, such as an organic light emitting diode device (OLED), a photovoltaic device, a photosensor device, and the like, and if necessary, a wire 12 for connecting the electronic device. Wherein the electronic device may be obtained by printing a plurality of different material layers in a stacked manner. That is, the electronic devices and the conductive lines on the printed electronic device board according to the embodiment of the present invention are printed or formed by printed electronics.
The mechanical connection part 2 is used for mechanically connecting the flexible printed electronic device boards to each other or fixedly connecting the flexible printed electronic device boards 1 to an object. The mechanical connection means 2 may be any of various means suitable for interconnecting flexible substrates, for example an adhesive layer.
In this embodiment, the mechanical connection member 2 is an adhesive layer disposed on the back surface of the flexible printed electronic device board. And adopting an adhesive layer to adhere the back surface of the flexible printed electronic device board and the blank area of the front surface of the next flexible printed electronic device board together. The adhesive layer covers a partial area of the back surface of each flexible printed electronic device board. This area corresponds to a blank area of the front side of the next fpc board. Therefore, a plurality of flexible printed electronic device boards can be connected into a whole through the viscose layer, and the electrical functionality of the flexible printed electronic device boards connected with the flexible printed electronic device boards cannot be influenced. In this embodiment, all the flexible printed electronic boards are connected together at one side edge by an adhesive layer covering a narrow area, as shown in fig. 1. Meanwhile, all the flexible printed electronic boards 1 are the same type of electronic board. Thus, the fpc board assembly may form a fpc book in which each page is a separate sheet with printed electronics.
In an alternative implementation, the adhesive layer is selected from a material that is separable from the flexible printed electronics board. That is, each of the flexible printed electronic device boards may be separated from the other flexible printed electronic device boards, which may be achieved by setting the adhesive layer material as a non-setting adhesive. The printed electronic device board integrated piece of the implementation mode can be applied to the manufacturing process, and when the flexible printed electronic device board needs to be used, one page can be directly torn from the flexible printed electronic device board book. This can simplify the manufacturing process and avoid errors. And meanwhile, the manufactured flexible printed electronic device board is convenient to carry and transport.
Instead of an adhesive layer, other forms of mechanical connection 2 may be used to connect different printed electronics boards. For example, holes may be punched in one side of each of the flexible printed electronic device boards to form connection holes, and different flexible printed electronic device boards may be connected in a book by means of eyelets or other members suitable for punching connection. For another example, a plurality of flexible electric device boards may be bound into one book directly by a stapler. Furthermore, an easy-to-tear opening or an easy-to-tear line can be arranged on the flexible substrate, and the flexible printed electronic device board is convenient to tear and use.
Through the mechanical connecting part, the flexible printed electronic device board can be fixed to a target object or connected with the target object, so that the flexible printed electronic device board can be conveniently moved and taken in production, the production efficiency is improved, the production cost is reduced, and the error probability in production is reduced.
Fig. 2 is a schematic view of a flexible printed electronics board integration of another embodiment of the present invention. The flexible printed electronic device board assembly of the present embodiment includes one or more flexible printed electronic device boards 1 and an adhesive layer 3 disposed on the back surface thereof. The adhesive layer 3 covers the back of the entire flexible printed electronic device board 1. This allows the flexible printed electronic device board 1 to be attached to a target object in a planar or curved manner through the adhesive layer 3. For example, when the flexible printed electronic device board 1 is an Organic Light-Emitting Diode (OLED) array board, it may be attached to a side surface of a pillar through the adhesive layer 3 to perform mounting of a Light source.
The flexible printed electronic device board of the present embodiment may be attached to another flexible substrate (e.g., paper) that is easily separated from the adhesive layer, or may be attached to the front surface of the flexible printed electronic device board located therebelow. When the flexible printed electronic device boards are adhered to each other, a protective layer 13 which is easily separated from the adhesive layer needs to be additionally formed on the front surface of the flexible electronic device board 1 to protect the electronic devices and the wires printed on the front surface of the flexible electronic device board.
The embodiment can make the flexible electronic device board integrated parts connected with each other more compactly, and is easy to fix on a target object and convenient to use.
Fig. 3 is a top view of the flexible electronics board manifold shown in fig. 1 and 2. In fig. 3, the flexible electronic device board 1 has a main body portion formed in an approximately rectangular shape, on which electronic devices and circuits (not shown in the figure) are printed and formed. While the flexible electronic device board 1 may have the connection portions 14 protruding from the main body portion to different defensive lines. The connecting part is printed with a lead interface suitable for being connected with other circuits.
Fig. 4 is a schematic view of a flexible printed electronics board integration of yet another embodiment of the present invention. In the present embodiment, the flexible printed electronic boards 1 connected to each other by the adhesive layer 2 or other mechanical connecting means are of different types, that is, each flexible printed electronic board is provided with different electric devices and formed with different circuits. The flexible printed electronic board assembly of the present embodiment further includes an electrical connection member 4 for connecting different printed electronic boards to construct a circuit having a predetermined function. Preferably, the different printed electronics boards are connected as electrical connection means by means of a flexible printed circuit connector. The flexible printed circuit connector may have a plurality of parallel conductive traces printed thereon, which may be connected to electrical interfaces of different printed electronics boards by conductive adhesive. Therefore, a plurality of printed electric device boards with different functions can be connected with each other, and an electric system based on the printed electric devices can be built in a compact mode.
In the embodiment, the different types of flexible printed electronic device boards are connected in a layered manner through the mechanical connecting part, and then the different types of flexible printed electronic device boards are respectively connected with each other through the electrical connecting part, so that the electrical system based on the printed electronic devices is constructed in a compact manner.
Further, the flexible printed electronic device board positioned at the lowermost layer can also be provided with an adhesive layer on the back surface, so that the whole electrical system can be fixedly connected to a target object, and the installation of the circuit system is convenient.
Fig. 5 is a schematic view of a flexible printed electronics board integration of yet another embodiment of the present invention. In the present embodiment, the different flexible printed electronic device boards 1 are of different types, that is, each flexible printed electronic device board is provided with different electronic devices and formed with different circuits. The present embodiment still interconnects the electrical interfaces of the different flexible hard brush electronics boards 1 by means of the electrical connection means 4. Meanwhile, 3 flexible printed electronic boards may be fixedly attached to a target object, such as a piece of paper, by mechanical attachment means provided on the flexible printed electronic boards. Thus, an electronic system based on printed electronics can be conveniently built.
Fig. 6 is a flow chart of a method of manufacturing a circuit according to an embodiment of the invention. As shown in fig. 6, the method of the present embodiment includes:
and S100, printing on the flexible substrate to form a plurality of flexible printed electronic device boards.
And S200, connecting or fixing the plurality of flexible printed electronic device boards to the target object through the mechanical connecting part.
Preferably, the connecting part is an adhesive layer arranged on the back surface of the flexible printed electronic device board. The adhesive layer covers part or all of the area of the back face of the flexible printed electronic device board.
Step S300, connecting different printed electronic boards through electrical connection members to construct a circuit system having a predetermined function.
Preferably, the electrical connection part is a flexible printed circuit connector.
It should be understood that steps S200 and S300 may be performed alternately layer by layer.
Therefore, the flexible printed electronic device boards of different types are connected in a layered mode through the mechanical connecting component, and then the flexible printed electronic device boards of different types are respectively connected with each other through the electrical connecting component, so that the electrical system based on the printed electronic devices is constructed in a compact mode.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A printed electronics board assembly, comprising:
the flexible printed electronic device board comprises a main body part and connecting parts extending out of the main body part in different directions, wherein the connecting parts are provided with wire interfaces; and
a mechanical connection member for mechanically connecting the flexible printed electronic device boards to each other;
wherein the printed electronics board assembly comprises a plurality of different types of flexible printed electronics boards; the printed electronics board assembly further comprises:
an electrical connection part for connecting different flexible printed electronic device boards to construct a circuit system having a predetermined function;
the mechanical connecting part is an adhesive layer arranged on the back surface of the flexible printed electronic device board; alternatively, the first and second electrodes may be,
the flexible printed electronic device board has a hole, and the mechanical connecting part is a perforated connecting part; alternatively, the first and second electrodes may be,
the mechanical connecting part is a staple.
2. The printed electronics board assembly of claim 1, wherein the adhesive layer covers the entire area of the back side of the flexible printed electronics board;
the front surface of the flexible printed electronic device board is provided with a protective layer which is easy to separate from the adhesive layer.
3. The printed electronics board assembly of claim 1, wherein the adhesive layer covers a partial area of the back side of the flexible printed electronics board;
the partial area corresponds to a blank area of the front surface of the flexible printed electronic device board connected with the adhesive layer.
4. The printed electronics board assembly of claim 1, wherein the printed electronics board assembly comprises a plurality of flexible printed electronics boards of the same type.
5. Printed electronics board assembly according to claim 2 or 3, characterized in that the adhesive layer is detachably connected with the flexible printed electronics board.
6. A printed electronic board assembly as in claim 1, wherein the electrical connection component is a flexible printed circuit connector (FPC).
7. A method of manufacturing a circuit, comprising:
printing to form a plurality of flexible printed electronic device boards;
interconnecting the plurality of flexible printed electronic device boards by a mechanical connection component;
connecting different printed electronic boards by means of electrical connection members to build up a circuit system having a predetermined function;
the mechanical connecting part is an adhesive layer arranged on the back surface of the flexible printed electronic device board; alternatively, the first and second electrodes may be,
the flexible printed electronic device board has a hole, and the mechanical connecting part is a perforated connecting part; alternatively, the first and second electrodes may be,
the mechanical connecting part is a staple.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2553462Y (en) * | 2002-07-05 | 2003-05-28 | 中国科学技术馆 | Book type demonstration device for electronic technology application |
CN102653663A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Tackiness adhesive sheet for thin-film substrate fixing |
CN104766517A (en) * | 2015-04-16 | 2015-07-08 | 于宝海 | Electronic technique and real component circuit book |
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EP2262352A1 (en) * | 2008-03-25 | 2010-12-15 | Sumitomo Bakelite Co., Ltd. | Method for producing rigid-flex circuit board, and rigid-flex circuit board |
CN103296489B (en) * | 2012-04-13 | 2015-08-26 | 上海天马微电子有限公司 | Jockey, board device, imageing sensor, display and touch apparatus |
KR102323947B1 (en) * | 2013-11-19 | 2021-11-09 | 닛토덴코 가부시키가이샤 | Resin sheet |
GB2525605B (en) * | 2014-04-28 | 2018-10-24 | Flexenable Ltd | Method of bonding flexible printed circuits |
CN204031592U (en) * | 2014-07-09 | 2014-12-17 | 昆山圆裕电子科技有限公司 | Explosion-proof flexible board |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN2553462Y (en) * | 2002-07-05 | 2003-05-28 | 中国科学技术馆 | Book type demonstration device for electronic technology application |
CN102653663A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Tackiness adhesive sheet for thin-film substrate fixing |
CN104766517A (en) * | 2015-04-16 | 2015-07-08 | 于宝海 | Electronic technique and real component circuit book |
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