CN107820361A - A kind of preparation method of ceramic base circuit board - Google Patents

A kind of preparation method of ceramic base circuit board Download PDF

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Publication number
CN107820361A
CN107820361A CN201710939322.6A CN201710939322A CN107820361A CN 107820361 A CN107820361 A CN 107820361A CN 201710939322 A CN201710939322 A CN 201710939322A CN 107820361 A CN107820361 A CN 107820361A
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CN
China
Prior art keywords
hole
ceramic substrate
processing
bistrique
circuit board
Prior art date
Application number
CN201710939322.6A
Other languages
Chinese (zh)
Inventor
林静霞
林心品
Original Assignee
肇庆高新区国专科技有限公司
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Priority to CN201710939322.6A priority Critical patent/CN107820361A/en
Publication of CN107820361A publication Critical patent/CN107820361A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling

Abstract

The present invention provides a kind of preparation method of ceramic base circuit board, comprises the following steps:S1, the film make;S2, ceramic substrate drilling:Wiring board is fixed on to the work top of electrical grinding machine, is drilled, concretely comprised the following steps using the bistrique of electrical grinding machine:The bistrique of electrical grinding machine is rotated forward, and ceramic substrate is drilled vertically downward, and hole depth is the 6/1 1/5 of ceramic substrate thickness, forms primary processing hole, and bistrique rises, and leaves ceramic substrate;Bistrique is inverted, and primary processing hole is drilled vertically downward, and hole depth is ceramic substrate thickness 1/3 2/3, forms secondary processing hole, and bistrique rises, and leaves ceramic substrate;Bistrique rotates forward, and vertically downward to stimulating processing hole to drill, runs through ceramic substrate to bistrique, forms through hole;S3, ceramic substrate through-hole wall copper facing;S4, make picture on surface;S5:Plating, the making of etching;The preparation method machining accuracy of the ceramic base circuit board of the present invention is high, and ceramic substrate is non-breakable, and cost is low.

Description

A kind of preparation method of ceramic base circuit board

Technical field

The present invention relates to PCB fields, more particularly, to a kind of preparation method of ceramic base circuit board.

Background technology

A branch of the ceramic base circuit board as printed circuit board (PCB), the printed circuit on ceramic substrate, ceramics have more High thermal conductivity and the coefficient of thermal expansion more matched with copper, synchronism is good during use, can carry out High Density Packaging, layers of copper is not oxygen-containing Change layer, can be used for a long time in reducing atmosphere, it is non-aging without organic layer, it is usually used in the scene higher to printed circuit board (PCB), Such as space industry.

Because ceramics itself are hard and crisp, it is difficult to ceramics are drilled with milling cutter, prior art uses the side of laser boring Formula, but this unfolding mode is higher to device requirement, production cost is high.

Therefore, need that a kind of cost is cheap badly, the preparation method of the non-breakable ceramic base circuit board of ceramic substrate.

The content of the invention

In view of this, the present invention provides a kind of preparation method of ceramic base circuit board.

The object of the invention is achieved through the following technical solutions:

A kind of preparation method of ceramic base circuit board, comprises the following steps:

S1, the film make:According to the default circuit production film;

S2, ceramic substrate drilling:Wiring board is fixed on to the work top of electrical grinding machine, bored using the bistrique of electrical grinding machine Hole, concretely comprise the following steps:The bistrique of electrical grinding machine rotates forward, and ceramic substrate is drilled vertically downward, hole depth is ceramic substrate thickness 1/6-1/5, form primary processing hole, bistrique rises, and leaves ceramic substrate;Bistrique inverts, and processes hole to primary vertically downward Drilled, hole depth is ceramic substrate thickness 1/3-2/3, forms secondary processing hole, and bistrique rises, and leaves ceramic substrate;Bistrique Rotate forward, vertically downward to stimulating processing hole to drill, run through ceramic substrate to bistrique, form through hole;

S3, ceramic substrate through-hole wall copper facing:Using electroless copper to step S2The inwall of the through hole of formation is once plated Copper;

S4, make picture on surface:By step S1The obtained film is developed in ceramic base plate surface, and developer solution is using quality point Number is the blended liquid for the potassium carbonate that 0.5% sodium carbonate and mass fraction are 0.5%;

S5, plating, etching making:The picture on surface of step S4 ceramic substrate is carried out successively electro-coppering thicken processing and Tin plating anti-etching processing;The combination plate surface resist ink after processing is stripped again, forms ceramic base circuit board.

Empty, secondary processing hole, through hole three-step process method are processed using primary, with reference to rotating technique, prevent from directly adding Work, ceramic substrate are easily broken off, and substep is processed, and the inwall of through hole is polished for a plurality of times by positive and negative, easily forms smooth curved surface, During following process, the smooth curved surface of rule is non-breakable when local stress is excessive relative to coarse inwall;Using bistrique First leave ceramic substrate and switch rotation direction again, contribute to discharge polish caused by chip, ensure processing precision.

Preferably, step S4The volume ratio of sodium carbonate liquor and solution of potassium carbonate is 3 in middle blended liquid:1.

The volume ratio of sodium carbonate liquor and solution of potassium carbonate is used as 3:1, alkalescence is moderate, and development effect is good.

Preferably, step S2The positive rotary speed in the middle primary processing hole of bistrique processing is 2000r/min;The secondary processing hole of bistrique processing Speed reversal be 3000r/min;The positive rotary speed of bistrique processing through hole is 4200r/min.

Using gradual increased rotating speed, rotating switching, rotating speed is too fast when avoiding processing early stage, and local stress is excessive, pottery Porcelain substrate is broken, and processing forms primary processing hole, and primary processing forms more smooth inwall in hole, gradually increases speed, prevent While ceramic substrate is broken, accelerate drilling efficiency.

Preferably, step S2In, the hole depth in primary processing hole is the 1/6 of ceramic substrate thickness.

The hole depth in primary processing hole is the 1/6 of ceramic substrate thickness, and processing is too deep, and the Integrated Chip in primary processing hole is excessive, Processing is easily influenceed, or even causes ceramic substrate to be broken.

Preferably, it is characterised in that step S2In, the hole depth in secondary processing hole is the 1/3 of ceramic substrate thickness.

The hole depth in secondary processing hole is the 1/3 of ceramic substrate thickness, and processing is too deep, and the Integrated Chip in secondary processing hole is excessive, Processing is easily influenceed, or even causes ceramic substrate to be broken.

Preferably, step S2In, in addition to air gun, when processing primary processing hole, secondary processing hole and through hole, air gun outlet The primary processing hole of purging, secondary processing hole and through hole.

In boring procedure, purged using air gun, chip of going out, avoid talus accumulation in hole, influenceing to process, or even cause Ceramic substrate is broken.

Preferably, step S2In, when air gun purging primary processes hole, secondary processing hole, air gun spout axis adds with primary Angle between work axially bored line, secondary processing axially bored line is 60 °;When air gun purges through hole, air gun spout axis and through hole axle Angle between line is 85 °.

Angle between air gun spout axis and primary processing axially bored line, secondary processing axially bored line is 60 °, now, hole depth compared with It is small, and be blind hole, angle is 60 °, and air easily forms higher gas turbulence in hole, so as to which chip be blown out;Air gun spout Angle between axis and through-bore axis is 85 °, is now through hole on plate, and directly purging allows chip to be discharged from through hole lower end same When, avoid contacting with bistrique, damage bistrique, influence machining accuracy.

Beneficial effects of the present invention:

1. the preparation method of ceramic base circuit board provided by the present invention, using primary processing sky, secondary processing hole, the step of through hole three Processing method, with reference to rotating technique, prevent from directly processing, ceramic substrate is easily broken off, and substep is processed, the inwall warp of through hole Cross it is positive and negative be polished for a plurality of times, easily form smooth curved surface, during following process, the smooth curved surface of rule is relative in coarse Wall, it is non-breakable when local stress is excessive;Ceramic substrate is first left using bistrique and switches rotation direction again, contributes to discharge to polish Caused chip, ensure the precision of processing.

2. the preparation method of ceramic base circuit board provided by the present invention, using gradual increased rotating speed, rotating switches, Rotating speed is too fast when avoiding processing early stage, and local stress is excessive, ceramic substrate fracture, and processing forms primary processing hole, primary processing More smooth inwall is formed in hole, is gradually increased speed, while preventing that ceramic substrate is broken, accelerates drilling efficiency.

3. the preparation method of ceramic base circuit board provided by the present invention, the hole depth in primary processing hole is ceramic substrate thickness 1/6, processing is too deep, and the Integrated Chip in primary processing hole is excessive, easily influences processing, or even causes ceramic substrate to be broken;Secondary adds The hole depth in work hole is the 1/3 of ceramic substrate thickness, and processing is too deep, and the Integrated Chip in secondary processing hole is excessive, easily influences processing, even Ceramic substrate is caused to be broken.

4. the preparation method of ceramic base circuit board provided by the present invention, in boring procedure, purged, gone out broken using air gun Bits, talus accumulation is avoided in hole, influenceing to process, or even cause ceramic substrate to be broken;Air gun spout axis and primary processing hole Angle between axis, secondary processing axially bored line is 60 °, and now, hole depth is smaller, and is blind hole, and angle is 60 °, and air is easy Higher gas turbulence is formed in hole, so as to which chip be blown out;Angle between air gun spout axis and through-bore axis is 85 °, be now through hole on plate, while directly purging allows the chip discharge from through hole lower end, avoids contacting with bistrique, and damage is ground Head, influence machining accuracy.

Specific embodiment

The present embodiment provides a kind of preparation method of ceramic base circuit board, it is characterised in that comprises the following steps:

S1 , the film make:According to the default circuit production film;

S2, ceramic substrate drilling:Wiring board is fixed on to the work top of electrical grinding machine, bored using the bistrique of electrical grinding machine Hole, concretely comprise the following steps:The bistrique of electrical grinding machine rotates forward, and ceramic substrate is drilled vertically downward, hole depth is ceramic substrate thickness 1/6, form primary processing hole, bistrique rises, and leaves ceramic substrate;Bistrique is inverted, and primary processing hole is carried out vertically downward Drilling, hole depth is ceramic substrate thickness 1/3, forms secondary processing hole, and bistrique rises, and leaves ceramic substrate;Bistrique rotates forward, vertically Downwards to stimulating processing hole to drill, run through ceramic substrate to bistrique, form through hole;

S3, ceramic substrate through-hole wall copper facing:Using electroless copper to step S2The inwall of the through hole of formation is once plated Copper;

S4, make picture on surface:By step S1The obtained film is developed in ceramic base plate surface, and developer solution is using quality point Number is the blended liquid for the potassium carbonate that 0.5% sodium carbonate and mass fraction are 0.5%;

S5, plating, etching making:The picture on surface of step S4 ceramic substrate is carried out successively electro-coppering thicken processing and Tin plating anti-etching processing;The combination plate surface resist ink after processing is stripped again, forms ceramic base circuit board.

Empty, secondary processing hole, through hole three-step process method are processed using primary, with reference to rotating technique, prevent from directly adding Work, ceramic substrate are easily broken off, and substep is processed, and the inwall of through hole is polished for a plurality of times by positive and negative, easily forms smooth curved surface, During following process, the smooth curved surface of rule is non-breakable when local stress is excessive relative to coarse inwall;Using bistrique First leave ceramic substrate and switch rotation direction again, contribute to discharge polish caused by chip, ensure processing precision.

As another embodiment of the present invention, step S4The volume ratio of sodium carbonate liquor and solution of potassium carbonate in middle blended liquid For 3:1.

The volume ratio of sodium carbonate liquor and solution of potassium carbonate is used as 3:1, alkalescence is moderate, and development effect is good.

As another embodiment of the present invention, step S2The positive rotary speed in the middle primary processing hole of bistrique processing is 2000r/ min;The speed reversal in the secondary processing hole of bistrique processing is 3000r/min;The positive rotary speed of bistrique processing through hole is 4200r/ min。

Using gradual increased rotating speed, rotating switching, rotating speed is too fast when avoiding processing early stage, and local stress is excessive, pottery Porcelain substrate is broken, and processing forms primary processing hole, and primary processing forms more smooth inwall in hole, gradually increases speed, prevent While ceramic substrate is broken, accelerate drilling efficiency.

The hole depth in primary processing hole is the 1/6 of ceramic substrate thickness, and processing is too deep, and the Integrated Chip in primary processing hole is excessive, Processing is easily influenceed, or even causes ceramic substrate to be broken.

The hole depth in secondary processing hole is the 1/3 of ceramic substrate thickness, and processing is too deep, and the Integrated Chip in secondary processing hole is excessive, Processing is easily influenceed, or even causes ceramic substrate to be broken.

As another embodiment of the present invention, step S2In, in addition to air gun, process primary processing hole, secondary processing hole During with through hole, the primary processing hole of air gun outlet purging, secondary processing hole and through hole.

In boring procedure, purged using air gun, chip of going out, avoid talus accumulation in hole, influenceing to process, or even cause Ceramic substrate is broken.

As another embodiment of the present invention, step S2In, when the primary processing hole of air gun purging, secondary process hole, air gun Angle between spout axis and primary processing axially bored line, secondary processing axially bored line is 60 °;When air gun purges through hole, air gun Angle between spout axis and through-bore axis is 85 °.

Angle between air gun spout axis and primary processing axially bored line, secondary processing axially bored line is 60 °, now, hole It is deep smaller, and be blind hole, angle is 60 °, and air easily forms higher gas turbulence in hole, so as to which chip be blown out;Air gun Angle between spout axis and through-bore axis is 85 °, is now through hole on plate, and directly purging allows chip to be discharged from through hole lower end While, avoid contacting with bistrique, damage bistrique, influence machining accuracy.

It is the wherein specific implementation of the present invention above, its description is more specific and detailed, but can not therefore manage Solve as the limitation to the scope of the claims of the present invention.For the person of ordinary skill of the art, present inventive concept is not being departed from Under the premise of, various modifications and improvements can be made, these obvious alternative forms belong to protection scope of the present invention.

Claims (7)

1. a kind of preparation method of ceramic base circuit board, it is characterised in that comprise the following steps:
S1 , the film make:According to the default circuit production film;
S2, ceramic substrate drilling:Wiring board is fixed on to the work top of electrical grinding machine, drilled using the bistrique of electrical grinding machine, Concretely comprise the following steps:The bistrique of electrical grinding machine is rotated forward, and ceramic substrate is drilled vertically downward, and hole depth is the 1/ of ceramic substrate thickness 6-1/5, primary processing hole is formed, bistrique rises, and leaves ceramic substrate;Bistrique is inverted, and primary processing hole is carried out vertically downward Drilling, hole depth is ceramic substrate thickness 1/3-2/3, forms secondary processing hole, and bistrique rises, and leaves ceramic substrate;Bistrique rotates forward, Vertically downward to stimulating processing hole to drill, run through ceramic substrate to bistrique, form through hole;
S3, ceramic substrate through-hole wall copper facing:Using electroless copper to step S2The inwall of the through hole of formation is once plated Copper;
S4, make picture on surface:By step S1The obtained film is developed in ceramic base plate surface, and developer solution is using quality point Number is the blended liquid for the potassium carbonate that 0.5% sodium carbonate and mass fraction are 0.5%;
S5, plating, etching making:The picture on surface of step S4 ceramic substrate is carried out to electro-coppering successively and thickeies processing and plating The anti-etching processing of tin;The combination plate surface resist ink after processing is stripped again, forms ceramic base circuit board.
2. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S4Carbon in middle blended liquid The volume ratio of acid sodium solution and solution of potassium carbonate is 3:1.
3. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S2Middle bistrique processing is just The positive rotary speed in level processing hole is 2000r/min;The speed reversal in the secondary processing hole of bistrique processing is 3000r/min;Bistrique adds The positive rotary speed of work through hole is 4200r/min.
4. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S2In, primary processing hole Hole depth be ceramic substrate thickness 1/6.
5. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S2In, secondary processing hole Hole depth be ceramic substrate thickness 1/3.
6. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S2In, in addition to gas Rifle, when processing primary processing hole, secondary processing hole and through hole, the primary processing hole of air gun outlet purging, secondary processing hole and through hole.
7. the preparation method of ceramic base circuit board according to claim 1, it is characterised in that step S2In, air gun purging is just When level processing hole, secondary processing hole, the angle between air gun spout axis and primary processing axially bored line, secondary processing axially bored line is equal For 60 °;When air gun purges through hole, the angle between air gun spout axis and through-bore axis is 85 °.
CN201710939322.6A 2017-10-11 2017-10-11 A kind of preparation method of ceramic base circuit board CN107820361A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128491A (en) * 1987-11-12 1989-05-22 Murata Mfg Co Ltd Formation of via hole
US6194785B1 (en) * 1994-06-06 2001-02-27 International Business Machines Corporation Method for circuitizing through-holes by photo-activated seeding
US6227777B1 (en) * 1998-09-22 2001-05-08 Electro Scientific Industries, Inc. High speed drilling spindle with reciprocating shaft and double-gripping centrifugal chuck
CN1547246A (en) * 2003-11-28 2004-11-17 王鸿仁 Manufacturing method of ceramic packaging substrate
CN102170755A (en) * 2011-04-25 2011-08-31 衢州威盛精密电子科技有限公司 Process for producing ceramic mobile phone circuit board
CN102958288A (en) * 2011-08-21 2013-03-06 深南电路有限公司 Printed circuit board drilling method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128491A (en) * 1987-11-12 1989-05-22 Murata Mfg Co Ltd Formation of via hole
US6194785B1 (en) * 1994-06-06 2001-02-27 International Business Machines Corporation Method for circuitizing through-holes by photo-activated seeding
US6227777B1 (en) * 1998-09-22 2001-05-08 Electro Scientific Industries, Inc. High speed drilling spindle with reciprocating shaft and double-gripping centrifugal chuck
CN1547246A (en) * 2003-11-28 2004-11-17 王鸿仁 Manufacturing method of ceramic packaging substrate
CN102170755A (en) * 2011-04-25 2011-08-31 衢州威盛精密电子科技有限公司 Process for producing ceramic mobile phone circuit board
CN102958288A (en) * 2011-08-21 2013-03-06 深南电路有限公司 Printed circuit board drilling method

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