CN107768975A - A kind of cooling system - Google Patents

A kind of cooling system Download PDF

Info

Publication number
CN107768975A
CN107768975A CN201710886724.4A CN201710886724A CN107768975A CN 107768975 A CN107768975 A CN 107768975A CN 201710886724 A CN201710886724 A CN 201710886724A CN 107768975 A CN107768975 A CN 107768975A
Authority
CN
China
Prior art keywords
heat
cooling
cold
radiator
hot
Prior art date
Application number
CN201710886724.4A
Other languages
Chinese (zh)
Inventor
刘卫华
刘治
Original Assignee
杭州中科极光科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杭州中科极光科技有限公司 filed Critical 杭州中科极光科技有限公司
Priority to CN201710886724.4A priority Critical patent/CN107768975A/en
Publication of CN107768975A publication Critical patent/CN107768975A/en

Links

Abstract

The invention discloses a kind of cooling system, including:Active cooling systems, hot well and heat load cooling system;The active cooling systems include:Cold end radiator and hot-side heat dissipation device;The heat load cooling system includes:Heat-pipe radiator, with the cold drawing connected therewith with heat pipe;The cold end radiator is provided with fan, positioned at the air inlet of cooling system, extraneous air is introduced into system and carries out refrigeration cool-down to it, the cold air after cooling enters the heat load cooling system;The hot well is arranged at below the cold end radiator, is cooled the condensed water to be formed for collecting air cooling;Heating working cell LD is arranged on cold drawing, and thermal load caused by its work is transferred into heat-pipe radiator in cold drawing, and by heat pipe;Cold air takes away the heat transmitted so far by heat-pipe radiator, into hot-side heat dissipation device;Hot-side heat dissipation device is provided with fan, positioned at the air outlet of cooling system, by the final discharge system of the air of entrance.

Description

A kind of cooling system

Technical field

The present invention relates to technical field of heat dissipation, and in particular to a kind of cooling system.

Background technology

With the continuous progress and development of laser display technology, shown with RGB three primary colours LD as light source as current laser Show the developing direction of technology.LD semiconductor lasers are one kind of solid state laser, and it has the high light source coherence of luminous efficiency The features such as strong.Laser is higher to residing operating environment requirements, and the beam quality that the rise of temperature exports to laser has very Big negative effect, high temperature not only can deform upon working-laser material and cleavage surface, and can suppress inverted population Increase, i.e., can make laser beam occur red shift, influenceing the coherence of light substantially reduces the beam quality of output, simultaneously because Fuel factor can be such that the stability of output light also reduces.A key factor for restricting technology development at present is exactly LD radiating Problem.Because LD needs to work at a lower temperature, so majority of case LD temperature is less than room temperature.But this occurs separately An outer problem, i.e., in the case where ambient humidity is higher, LD modules condensation is serious, seriously reduces LD reliability.Therefore, Need a kind of cooling system that LD modules can be avoided to condense badly.

The content of the invention

To solve the problems, such as that LD modules work condensation at low temperature, the present invention proposes a kind of new multistage radiating knot Structure.While can realizing that LD works at low temperature, the phenomenon that does not condense, and it is simple in construction, cost is low, is adapted to extensive raw Production.

To achieve the above object, the present invention uses following technical scheme:

A kind of cooling system, the system include:Active cooling systems, hot well and heat load cooling system;

The active cooling systems include:Cold end radiator and hot-side heat dissipation device;

The heat load cooling system includes:Heat-pipe radiator, with the cold drawing connected therewith with heat pipe;

The cold end radiator is provided with fan, and positioned at the air inlet of cooling system, extraneous air is introduced into system and right It carries out refrigeration cool-down, and the cold air after cooling enters the heat load cooling system;

The hot well is arranged at below the cold end radiator, for collect air cooling cool to be formed it is cold Condensate;

Heating working cell is arranged on the cold drawing, by thermal load caused by its work in the cold drawing, and is passed through The heat pipe is transferred to the heat-pipe radiator;Cold air takes away the heat transmitted so far by the heat-pipe radiator, enters The hot-side heat dissipation device;

The hot-side heat dissipation device is provided with fan, positioned at the air outlet of cooling system, the air of entrance is finally discharged is System.

In the present invention, described heating working cell is LD.

Preferably, heat-pipe radiator is provided with fan, strengthens ventilation effect.

Preferably, the hot well lower end is provided with pipeline, for discharging condensed water.

The present invention provides a kind of preferred scheme of active cooling systems, and the refrigeration system is to include the refrigeration system of compressor System, including:Compressor, hot-side heat dissipation device, choke valve, cold end radiator, temperature sensor and controller;Wherein hot-side heat dissipation device For condenser, cold end radiator is evaporator.

The outlet of compressor is connected with the entrance of condenser, and the outlet of condenser passes through choke valve and the entrance of evaporator It is connected, the outlet of evaporator is connected with the entrance of compressor;Temperature sensor is placed on evaporator air outlet, and temperature is believed Controller number is fed back to, controller controls the temperature of evaporator.

Preferably, described evaporator is microchannel heat sink.

The present invention also provides the preferred scheme of another active cooling systems, and the refrigeration system is to include semiconductor refrigerating core The refrigeration system of piece, including:Cold end radiator, cold end heat-conducting plate, semiconductor refrigeration chip TEC, hot junction heat-conducting plate, hot-side heat dissipation Device, temperature sensor and controller;

Wherein TEC huyashi-chuuka (cold chinese-style noodles) is connected with cold end heat-conducting plate, and cold end heat-conducting plate is connected by heat pipe with cold end radiator, TEC hot face is connected with hot junction heat-conducting plate, and hot junction heat-conducting plate is connected by heat pipe with hot-side heat dissipation device, and temperature sensor is placed Controller is fed back in cold end radiator air outlet, and by temperature signal, controller radiates by adjusting TEC power adjustings cold end The leaving air temp of device.

In addition, the active cooling systems of the present invention can also be water cooling refrigeration system.The heat load cooling system of the present invention Can be water-cooling heat radiating system or fin cooling system.

Beneficial effects of the present invention

LD provided by the invention cooling system, because the wind Jing Guo the system is by the radiating of active cooling systems cold end After device cooling, turn into the dry, wind of low temperature, and the miscellaneous part passed through is the device higher than the air temperature, so will not Condensation.Cooling system provided by the invention, it is advantageous that the cooling system can work in the case where maintaining component low temperature environment While effectively avoid component from condensing.

Brief description of the drawings

Fig. 1 is this cooling system structure schematic diagram

Fig. 2 is the active cooling systems structural representation comprising compressor

Fig. 3 is the active cooling systems structural representation comprising semiconductor refrigeration chip

Description of reference numerals:101- cold end radiators, 102- compressors, 103- choke valves, 104- hot-side heat dissipation devices, 105- Temperature sensor, 106- controllers, 201- heat-pipe radiators, 202- cold drawings, 301- hot wells, 401- cold end heat conduction Plate, 402- semiconductor refrigeration chips TEC, 403- hot junctions heat-conducting plate,

Embodiment

The present invention is specifically described below by embodiment, it is necessary to it is pointed out here that be that the present embodiment is served only for pair The present invention is further described, it is impossible to is interpreted as limiting the scope of the invention, the person skilled in the art in the field can Some nonessential modifications and adaptations are made with the content of the invention more than.In the case where not conflicting, the reality in the present invention Applying the feature in example and embodiment can be mutually combined.

In addition, some nouns of locality being previously mentioned in embodiment in the present invention, such as "left", "right", " on ", " under " Deng the implication of these nouns of locality is relevant with the installation situation of heat abstractor, should not be construed as limiting the scope of the invention.

As shown in figure 1, a kind of cooling system, the system includes:Active cooling systems, hot well 301 and heat are born Carry cooling system;

The active cooling systems include:Cold end radiator 101 and hot-side heat dissipation device 104;The hot-side heat dissipation device 104 is set Fan is equipped with, positioned at the air outlet of cooling system, by the final discharge system of the air of entrance.

The heat load cooling system includes:Heat-pipe radiator 201, with the cold drawing 202 connected therewith with heat pipe;The present invention In the preferred scheme of offer, heat-pipe radiator 201 is provided with fan, strengthens ventilation effect.

The cold end radiator 101 is provided with fan, and positioned at the air inlet of cooling system, extraneous air is introduced into system simultaneously Refrigeration cool-down is carried out to it, the cold air after cooling enters the heat load cooling system;

The hot well 301 is arranged at the lower section of cold end radiator 101, for collecting air cooling cooling shape Into condensed water;

Heating working cell is arranged on the cold drawing 202, by thermal load caused by its work in cold drawing 202, and is led to Superheater tube is transferred to heat-pipe radiator 201;Cold air takes away the heat transmitted so far by heat-pipe radiator 201, into hot junction Radiator 104;

Heating working cell described in this preferred embodiment is LD, can also be applied to the cooling system of the present invention other Work when the device that can generate heat to needing to cool in.It is possible to prevente effectively from form condensation while cooling and influence work Make.

In a particular application, it is provided with order to facilitate the collection and discharge of condensed water, the lower end of hot well 301 Pipeline, for discharging condensed water.Preferably, the hot well 301 can be a deep-slotted chip breaker, can also specifically set For other shapes.

Because the wind by the system is after the cooling of active cooling systems cold end radiator 101, turn into dry, low temperature Wind, and the miscellaneous part passed through is the device higher than the air temperature, so will not condense.Radiating system provided by the invention System, it is advantageous that the cooling system effectively avoids component knot while being worked in the case where maintaining component low temperature environment Dew.

Such as 35 DEG C of environment temperature, humidity 90%, the temperature of cold end radiator 101 of active cooling systems is 10 DEG C, and cold end dissipates Extraneous air is introduced system by hot device 101 by fan, and it is 20 DEG C cold to be changed into temperature after the cooling of cold end radiator 101 Air, thermal load caused by now LD work are transferred to heat-pipe radiator 201 in cold drawing 202, and by heat pipe, and temperature maintains At 25 DEG C, the temperature of cold drawing 202 is 28 DEG C, and cold air is after heat-pipe radiator 201, and temperature is 27 DEG C, by active refrigeration system System hot-side heat dissipation device 104 is discharged, and in the process, only air during active cooling systems cold end radiator 101 by that can send out Raw dew condensation phenomenon, institute's dew is collected in hot well 301, or the pipeline by the lower end of hot well 301 Discharge.

As shown in Fig. 2 the present invention provides a kind of preferred scheme of active cooling systems, the refrigeration system includes:Compressor 102nd, hot-side heat dissipation device 104, choke valve 103, cold end radiator 101, temperature sensor 105 and controller 106;Wherein hot junction dissipates Hot device 104 is condenser, and cold end radiator 101 is evaporator.

The outlet of compressor 102 is connected with the entrance of condenser, and the outlet of condenser passes through choke valve 103 and evaporator Entrance be connected, the outlet of evaporator is connected with the entrance of compressor 102;Temperature sensor 105 is placed on evaporator and gone out Air port, temperature signal is fed back into controller 106, controller 106 controls the temperature of evaporator.

Specifically, the evaporator can be microchannel heat sink.

As shown in figure 3, the present invention also provides the preferred scheme of another active cooling systems, the refrigeration system includes:It is cold Hold radiator 101, cold end heat-conducting plate 401, semiconductor refrigeration chip TEC 402, hot junction heat-conducting plate 403, hot-side heat dissipation device 104, Temperature sensor 105 and controller 106;

Wherein TEC402 huyashi-chuuka (cold chinese-style noodles) is connected with cold end heat-conducting plate 401, and cold end heat-conducting plate 401 is radiated by heat pipe and cold end Device 101 connects, and TEC 402 hot face is connected with hot junction heat-conducting plate 403, and hot junction heat-conducting plate 403 passes through heat pipe and hot-side heat dissipation Device 104 connects, and temperature sensor 105 is placed on the air outlet of cold end radiator 101, and temperature signal is fed back into controller 106, Controller 106 is by adjusting the leaving air temps of the power adjusting cold end radiators 101 of TEC 402.

In addition, the active cooling systems of the present invention can also be water cooling refrigeration system;Heat load cooling system can be water Cold cooling system or fin cooling system.

Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based on this Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made Example is applied, belongs to the scope of the present invention.

Claims (10)

1. a kind of cooling system, it is characterised in that the system includes:Active cooling systems, hot well (301) and heat are born Carry cooling system;
The active cooling systems include:Cold end radiator (101) and hot-side heat dissipation device (104);
The heat load cooling system includes:Heat-pipe radiator (201), with the cold drawing (202) connected therewith with heat pipe;
The cold end radiator (101) is provided with fan, and positioned at the air inlet of cooling system, extraneous air is introduced into system and right It carries out refrigeration cool-down, and the cold air after cooling enters the heat load cooling system;
The hot well (301) is arranged at below the cold end radiator (101), for collecting air cooling cooling shape Into condensed water;
Heating working cell is arranged on the cold drawing (202), by thermal load caused by its work in the cold drawing (202), And the heat-pipe radiator (201) is transferred to by the heat pipe;Cold air takes away transmission by the heat-pipe radiator (201) So far heat, into the hot-side heat dissipation device (104);
The hot-side heat dissipation device (104) is provided with fan, positioned at the air outlet of cooling system, the air of entrance is finally discharged is System.
2. cooling system according to claim 1, it is characterised in that the heating working cell is LD.
3. cooling system according to claim 1, it is characterised in that the heat-pipe radiator (201) is provided with fan.
4. cooling system according to claim 1, it is characterised in that hot well (301) lower end is provided with Pipeline, for discharging condensed water.
5. any described cooling systems of 1-4 are asked according to claim, it is characterised in that the active cooling systems are to include The refrigeration system of compressor, in addition to:Compressor (102), choke valve (103), temperature sensor (105) and controller (106);
The hot-side heat dissipation device (104) is condenser, and cold end radiator (101) is evaporator;
The outlet of compressor (102) is connected with the entrance of condenser, and the outlet of condenser passes through choke valve (103) and evaporator Entrance be connected, the outlet of evaporator is connected with the entrance of compressor (102);Temperature sensor (105) is placed on evaporation Device exports, and temperature signal is fed back into controller (106), controller (106) controls the temperature of evaporator.
6. cooling system according to claim 5, it is characterised in that the evaporator is microchannel heat sink.
7. according to any described cooling systems of claim 1-4, it is characterised in that the active cooling systems are comprising partly leading The refrigeration system of body refrigerating chip, in addition to:Cold end heat-conducting plate (401), semiconductor refrigeration chip (402), hot junction heat-conducting plate (403), temperature sensor (105) and controller (106);
Wherein the huyashi-chuuka (cold chinese-style noodles) of semiconductor refrigeration chip (402) is connected with cold end heat-conducting plate (401), and cold end heat-conducting plate (401) passes through Heat pipe is connected with cold end radiator (101), and the hot face of semiconductor refrigeration chip (402) is connected with hot junction heat-conducting plate (403), heat End heat-conducting plate (403) is connected by heat pipe with hot-side heat dissipation device (104), and temperature sensor (105) is placed on cold end radiator (101) air outlet, and temperature signal is fed back into controller (106), controller (106) is by adjusting semiconductor refrigeration chip (402) leaving air temp of power adjusting cold end radiator (101).
8. according to any described cooling systems of claim 1-3, it is characterised in that the active cooling systems freeze for water cooling System.
9. according to any described cooling systems of claim 1-3, it is characterised in that the heat load cooling system dissipates for water cooling Hot systems.
10. according to any described cooling systems of claim 1-3, it is characterised in that the heat load cooling system is fin Cooling system.
CN201710886724.4A 2017-09-26 2017-09-26 A kind of cooling system CN107768975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710886724.4A CN107768975A (en) 2017-09-26 2017-09-26 A kind of cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710886724.4A CN107768975A (en) 2017-09-26 2017-09-26 A kind of cooling system

Publications (1)

Publication Number Publication Date
CN107768975A true CN107768975A (en) 2018-03-06

Family

ID=61267394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710886724.4A CN107768975A (en) 2017-09-26 2017-09-26 A kind of cooling system

Country Status (1)

Country Link
CN (1) CN107768975A (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204263A (en) * 1995-01-31 1996-08-09 Matsushita Electric Ind Co Ltd Semiconductor laser-excited laser oscillator
CN2443510Y (en) * 2000-08-31 2001-08-15 武汉楚天激光(集团)股份有限公司 Cooler for solid laser
CN201213196Y (en) * 2008-05-30 2009-03-25 深圳市大族激光科技股份有限公司 Cooling mechanism for semiconductor laser device
CN101702485A (en) * 2009-10-14 2010-05-05 瑞安市博业激光应用技术有限公司 Laser generating device of laser marking machine
CN102055132A (en) * 2010-11-26 2011-05-11 中国科学院物理研究所 Semiconductor laser device capable of deep cooling and sealing device thereof
CN102315585A (en) * 2011-07-26 2012-01-11 中国科学院长春光学精密机械与物理研究所 Air-cooling and heat-radiating device for high-power semiconductor laser module
CN203787762U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Laser light source cooling device
US20160141825A1 (en) * 2014-11-19 2016-05-19 The Boeing Company Air cooled laser systems using oscillating heat pipes
CN105870765A (en) * 2015-02-10 2016-08-17 发那科株式会社 Laser oscillator including fans which cool resonator unit
CN105932538A (en) * 2015-02-26 2016-09-07 发那科株式会社 Air-cooled Laser Device Having L-shaped Heat-transfer Member With Radiating Fins
CN106461274A (en) * 2014-06-06 2017-02-22 三菱电机株式会社 Cooling device, light source device provided with cooling device, and projection-type image display device provided with light source device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08204263A (en) * 1995-01-31 1996-08-09 Matsushita Electric Ind Co Ltd Semiconductor laser-excited laser oscillator
CN2443510Y (en) * 2000-08-31 2001-08-15 武汉楚天激光(集团)股份有限公司 Cooler for solid laser
CN201213196Y (en) * 2008-05-30 2009-03-25 深圳市大族激光科技股份有限公司 Cooling mechanism for semiconductor laser device
CN101702485A (en) * 2009-10-14 2010-05-05 瑞安市博业激光应用技术有限公司 Laser generating device of laser marking machine
CN102055132A (en) * 2010-11-26 2011-05-11 中国科学院物理研究所 Semiconductor laser device capable of deep cooling and sealing device thereof
CN102315585A (en) * 2011-07-26 2012-01-11 中国科学院长春光学精密机械与物理研究所 Air-cooling and heat-radiating device for high-power semiconductor laser module
CN203787762U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Laser light source cooling device
CN106461274A (en) * 2014-06-06 2017-02-22 三菱电机株式会社 Cooling device, light source device provided with cooling device, and projection-type image display device provided with light source device
US20160141825A1 (en) * 2014-11-19 2016-05-19 The Boeing Company Air cooled laser systems using oscillating heat pipes
CN105870765A (en) * 2015-02-10 2016-08-17 发那科株式会社 Laser oscillator including fans which cool resonator unit
CN105932538A (en) * 2015-02-26 2016-09-07 发那科株式会社 Air-cooled Laser Device Having L-shaped Heat-transfer Member With Radiating Fins

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
刘春晖等: "《全程图解汽车空调维修》", 31 January 2017, 机械工业出版社 *
叶伏秋等: "《新编大学物理实验》", 30 June 2011 *
徐德胜: "《半导体制冷与应用技术》", 30 November 1992, 上海交通大学出版社 *

Similar Documents

Publication Publication Date Title
JP6271026B2 (en) Power electronic element cooling system and distributed power generation system
CN202083049U (en) Air conditioner and heat radiation device thereof
WO2016155081A1 (en) Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device
CN104320953B (en) Secondary water-loop server cabinet cooling system
CN100575781C (en) A kind of LED lighting device of realizing heat recovery
CN105737439B (en) A kind of air-conditioning system using solar energy and thermoelectricity supercooling apparatus
KR200487943Y1 (en) Semiconductor-based air conditioning device
JO2898B1 (en) Cooling system
CN104251529B (en) A kind of combined type refrigerant multi-gang air conditioner
CN103162475B (en) Heat dissipation circulating system of air conditioner
US9587886B2 (en) Outdoor unit and refrigeration cycle device
CN102057243A (en) Evaporative cooling tower enhancement through cooling recovery
CN1302544C (en) Mini refrigeration system for computer chip heat radiating
WO2016123994A1 (en) Heat exchange apparatus and semi-conductor cooling refrigerator provided with same
GB2415768A (en) Improvement system of energy efficiency for refrigeration cycle
CN101619879A (en) Heat radiator with air pump separate type thermosiphon for machine room or machine cabinet
CN104154692B (en) A kind of novel Gas-supplying enthalpy-increasing system and control method thereof
CN104640421A (en) Air conditioning unit
CN101949613B (en) Refrigerating-heat pump combined operation system for computer room
CN207652877U (en) The cooling system of liquid cooling server
Monné et al. Stationary analysis of a solar LiBr–H2O absorption refrigeration system
CN101463984A (en) Illuminating apparatus
CN102628577A (en) High-efficiency automobile light-emitting diode (LED) fog-proof lamp
CN100580363C (en) Four-element heat radiator
Liu et al. Energy savings of hybrid dew-point evaporative cooler and micro-channel separated heat pipe cooling systems for computer data centers

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20180306