CN107759252A - Suppress surface treatment method and electronic ceramic component that electronic ceramic component climbs plating - Google Patents

Suppress surface treatment method and electronic ceramic component that electronic ceramic component climbs plating Download PDF

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Publication number
CN107759252A
CN107759252A CN201711115205.4A CN201711115205A CN107759252A CN 107759252 A CN107759252 A CN 107759252A CN 201711115205 A CN201711115205 A CN 201711115205A CN 107759252 A CN107759252 A CN 107759252A
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Prior art keywords
ceramic component
electronic ceramic
mixed
treatment
plating
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CN201711115205.4A
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Chinese (zh)
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戴承萍
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戴承萍
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Priority to CN201711115205.4A priority Critical patent/CN107759252A/en
Publication of CN107759252A publication Critical patent/CN107759252A/en

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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81Coating or impregnation
    • C04B41/89Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation

Abstract

The invention discloses the surface treatment method and electronic ceramic component that suppression electronic ceramic component climbs plating, including configuration surface processing solution:Mixed material is well mixed with water, obtains the surface processing solution, the mixed material includes perchloric acid and catalyst, surface treatment:The electronic ceramic component is put into the surface processing solution and soaked, makes the electronic ceramic component Surface Creation sprayed coating, cleaning, drying:The surface residue of the electronic ceramic component after treatment is cleaned up, and the electronic ceramic component is dried, configures spray liniment:It is mixed, is sprayed as raw material from propionic aldehyde, propane, propylene and ethene:Sprayed by thermal spraying.The present invention makes product surface form the diaphragm of a floor height resistivity, increases product surface resistance, so as to climb plating when suppressing the plating of electronic ceramic component product, it is possible to increase the anti-flammability of sprayed coating, can avoid the generation of fire to a certain extent.

Description

Suppress surface treatment method and electronic ceramic component that electronic ceramic component climbs plating

Technical field

The present invention relates to technical field of electronic ceramic, more particularly to suppress the surface treatment side that electronic ceramic component climbs plating Method.

Background technology

At present, electronic ceramics can utilize electricity, the ceramics of magnetic property in the electronics industry.Electronic ceramics is by table The precision in face, crystal boundary and dimensional structure controls and finally obtains the ceramics with New function.In the energy, household electrical appliance, automobile etc. Aspect can be extensively using with the fast development of electronic and information industry, and sheet type electronic ceramics element is widely used, more next More elements realizes chip type, miniaturization.Slice component is generally made up of element substrate, internal electrode and termination electrode, is The weldability of element is improved, last layer nickel dam and one layer of tin layers, but the product table in electroplating process need to be plated on termination electrode surface Face also easily plates nickel dam and tin layers, causes product appearance bad and top layer conducting is short-circuit, so as to cause products application bad, because This, needs a kind of surface treatment method for suppressing electronic ceramic component and climbing plating badly.

The content of the invention

The invention aims to solve shortcoming present in prior art, and the suppression electronic ceramic component proposed is climbed The surface treatment method of plating.

To achieve these goals, present invention employs following technical scheme:

Suppress the surface treatment method that electronic ceramic component climbs plating, comprise the following steps:

S1:Configuration surface processing solution:Mixed material is well mixed with water, obtains the surface processing solution, the mixing Material includes perchloric acid and catalyst;

S2:Surface treatment:The electronic ceramic component is put into the surface processing solution and soaked, makes the ceramic electronic element Part Surface Creation sprayed coating;

S3:Cleaning, drying:The surface residue of the electronic ceramic component by step S2 processing is cleaned up, and to institute Electronic ceramic component is stated to be dried;

S4:Configure spray liniment:Be mixed from propionic aldehyde, propane, propylene and ethene as raw material, its composition and respectively into The concentration divided is propionic aldehyde 10%~20%, propane 10%~30%, propylene 20%~30%, ethene 15%~25%;

S5:Spraying:Sprayed by thermal spraying, cooled after spraying.

Preferably, the time soaked described in configuration step S2 is 5 to 10 minutes, and the temperature of soaking water is 20 ° to 30 ° Between.

Preferably, temperature when being mixed described in step S4 is between 600 ° to 800 °.

Preferably, thermal jet includes described in step S5:The propionic aldehyde, propane, propylene and the mixed solution of ethene are existed Sprayed at once after mixing, then it is placed on ventilation drying, allows it freely to air-dry.

Present invention also offers a kind of electronic ceramic component, manufacture by the following method:

The first step:Prepare raw material, by the use of ZnO be used as main material, then add Al, Fe, Pr, La, Ce, Nd, B, Si and Mn optionally Oxidate powder forms mixed material;

Second step:Drying and processing, the raw material chosen is dried;

3rd step:Weigh, certain material quality is weighed according to the data calculated;

5th step:Vibration, load weighted each raw material is mixed, is ground after mixing;

6th step:Drying screening, the good raw material stoving of mixed grinding, then it is compacted blocking, is then regrind, ground After be dried, dried particle is screened;

7th step:Granulating and forming, powder pressing into sequin and is progressively heated at 600~720 DEG C of insulation dumpings;

8th step:Sintering, heat-agglomerating is carried out to the raw material after dumping, and be cooled to room temperature;

9th step:Test, is tested the element after sintering by instrument, is packaged after test passes.

Preferably:Groove is provided with the side outer wall of the ceramic component body, and groove embeds and is connected to termination electrode, it is described Side of the ceramic component body away from termination electrode is provided with internal electrode, is welded on the both sides inwall of the ceramic component body 1 There is element substrate.

Beneficial effects of the present invention are:

1st, can be chemically reacted by the setting of surface treatment liquid by the surface for the treatment of fluid and electronic ceramic component, and Control time is proper, can be good at making producing uniform protective layer in electronic ceramic component, facilitates the spraying application in later stage.

2nd, can be by making product surface form the diaphragm of a floor height resistivity, increase production by setting for sprayed on material Product sheet resistance, so as to climb plating when suppressing the plating of electronic ceramic component product, and a- cyanoacrylates can improve spray The anti-flammability of coating, the generation of fire can be avoided to a certain extent.

Brief description of the drawings

Fig. 1 is the surface treatment method flow graph construction schematic diagram that suppression electronic ceramic component proposed by the present invention climbs plating;

Fig. 2 is that suppression electronic ceramic component proposed by the present invention climbs the surface treatment method of plating and the electronics pottery of electronic ceramic component The manufacturing process schematic diagram of porcelain element;

Fig. 3 is that suppression electronic ceramic component proposed by the present invention climbs the surface treatment method of plating and the electronics pottery of electronic ceramic component Porcelain component structure schematic diagram.

In figure:1 ceramic component body, 2 internal electrodes, 3 element substrates, 4 termination electrodes.

Embodiment

Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.

Embodiment one:

Reference picture 1, suppress the surface treatment method that electronic ceramic component climbs plating, comprise the following steps:

S1:Configuration surface processing solution:Mixed material is well mixed with water, obtains surface processing solution, mixed material includes Perchloric acid and catalyst;

S2:Surface treatment:Electronic ceramic component is put into surface processing solution and soaked, sprays electronic ceramic component Surface Creation Coating;

S3:Cleaning, drying:The surface residue of electronic ceramic component by step S2 processing is cleaned up, and electronics is made pottery Porcelain element is dried;

S4:Configure spray liniment:Be mixed from propionic aldehyde, propane, propylene and ethene as raw material, its composition and respectively into The concentration divided is propionic aldehyde 10%~20%, propane 10%~30%, propylene 20%~30%, ethene 15%~25%;

S5:Spraying:Sprayed by thermal spraying, cooled after spraying.

Between the time soaked in configuration step S2 is 5 to 10 minutes, and the temperature of soaking water is 20 ° to 30 °, step S4 Temperature during middle mixing is between 600 ° to 800 °, and thermal jet includes in step S5:After propionic aldehyde, propane, propylene and ethene are mixed Solution spray at once upon mixing, then it is placed on ventilation drying, allow it freely to air-dry.

Reference picture 2 and Fig. 3, a kind of electronic ceramic component, are manufactured by the following method:

The first step:Prepare raw material, by the use of ZnO be used as main material, then add Al, Fe, Pr, La, Ce, Nd, B, Si and Mn optionally Oxidate powder forms mixed material;

Second step:Drying and processing, the raw material chosen is dried;

3rd step:Weigh, certain material quality is weighed according to the data calculated;

5th step:Vibration, load weighted each raw material is mixed, is ground after mixing;

6th step:Drying screening, the good raw material stoving of mixed grinding, then it is compacted blocking, is then regrind, ground After be dried, dried particle is screened;

7th step:Granulating and forming, powder pressing into sequin and is progressively heated at 600~720 DEG C of insulation dumpings;

8th step:Sintering, heat-agglomerating is carried out to the raw material after dumping, and be cooled to room temperature;

9th step:Test, is tested the element after sintering by instrument, is packaged after test passes.

Electronic ceramic component includes ceramic component body 1, and groove is provided with the side outer wall of ceramic component body 1, and recessed Groove is embedded to be connected to termination electrode 4, and side of the ceramic component body 1 away from termination electrode 4 is provided with internal electrode 2, ceramic component body 1 Element substrate 3 is welded with the inwall of both sides;

Embodiment two:

S1:Configuration surface processing solution:Mixed material is well mixed with water, obtains surface processing solution, mixed material includes Perchloric acid and catalyst;

S2:Surface treatment:Electronic ceramic component is put into surface processing solution and soaked, sprays electronic ceramic component Surface Creation Coating;

S3:Cleaning, drying:The surface residue of electronic ceramic component by step S2 processing is cleaned up, and electronics is made pottery Porcelain element is dried;

S4:Configure spray liniment:From a- cyanoacrylates, propionic aldehyde, propane, propylene and ethene mixing system is carried out as raw material Into the concentration of its composition and each composition is propionic aldehyde 20%~40%, propane 20%~30%, propylene 5%~10%, ethene 10% ~20%, a- cyanoacrylate 10%~30%;

S5:Spraying:Sprayed by thermal spraying, cooled after spraying.

Between the time soaked in configuration step S2 is 5 to 10 minutes, and the temperature of soaking water is 20 ° to 30 °, step S4 Temperature during middle mixing is between 600 ° to 800 °, and thermal jet includes in step S5:After propionic aldehyde, propane, propylene and ethene are mixed Solution spray at once upon mixing, then it is placed on ventilation drying, allow it freely to air-dry.

Reference picture 2 and Fig. 3, a kind of electronic ceramic component, are manufactured by the following method:

The first step:Prepare raw material, by the use of ZnO be used as main material, then add Al, Fe, Pr, La, Ce, Nd, B, Si and Mn optionally Oxidate powder forms mixed material;

Second step:Drying and processing, the raw material chosen is dried;

3rd step:Weigh, certain material quality is weighed according to the data calculated;

5th step:Vibration, load weighted each raw material is mixed, is ground after mixing;

6th step:Drying screening, the good raw material stoving of mixed grinding, then it is compacted blocking, is then regrind, ground After be dried, dried particle is screened;

7th step:Granulating and forming, powder pressing into sequin and is progressively heated at 600~720 DEG C of insulation dumpings;

8th step:Sintering, heat-agglomerating is carried out to the raw material after dumping, and be cooled to room temperature;

9th step:Test, is tested the element after sintering by instrument, is packaged after test passes.

Nonlinear factor α, α=(lgI2-lgI1)/(lgV2-lgV1)(Formula 1)V1, V2 are corresponded on voltage-sensitive ceramic respectively to be passed through Voltage, generally 0.1mA, 1mA of electric current when being I1, I2 when respectively corresponding voltage calculate α, therefore can obtain:α=1/lg (V2/V1)(Formula 2)V2/V1 in formula 2 is the pressure ratio of voltage-sensitive ceramic, commonly uses the α that K α represent voltage-sensitive ceramic, K α are smaller, and α is bigger. The α of ZnO voltage-sensitive ceramics is 22 ~ 40 or higher.

The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto, Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.

Claims (6)

1. suppress the surface treatment method that electronic ceramic component climbs plating, it is characterised in that comprise the following steps:
S1:Configuration surface processing solution:Mixed material is well mixed with water, obtains the surface processing solution, the mixing Material includes perchloric acid and catalyst;
S2:Surface treatment:The electronic ceramic component is put into the surface processing solution and soaked, makes the ceramic electronic element Part Surface Creation sprayed coating;
S3:Cleaning, drying:The surface residue of the electronic ceramic component by step S2 processing is cleaned up, and to institute Electronic ceramic component is stated to be dried;
S4:Configure spray liniment:Be mixed from propionic aldehyde, propane, propylene and ethene as raw material, its composition and respectively into The concentration divided is propionic aldehyde 10%~20%, propane 10%~30%, propylene 20%~30%, ethene 15%~25%;
S5:Spraying:Sprayed by thermal spraying, cooled after spraying.
2. the surface treatment method according to claim 1 for suppressing electronic ceramic component and climbing plating, it is characterised in that described to match somebody with somebody Between it is 5 to 10 minutes to put the time soaked described in step S2, and the temperature of soaking water is 20 ° to 30 °.
3. the surface treatment method according to claim 1 for suppressing electronic ceramic component and climbing plating, it is characterised in that step S4 Described in mix when temperature between 600 ° to 800 °.
4. the surface treatment method according to claim 1 for suppressing electronic ceramic component and climbing plating, it is characterised in that step S5 Described in thermal jet include:The propionic aldehyde, propane, propylene and the mixed solution of ethene are sprayed at once upon mixing, then It is placed on ventilation drying, allows it freely to air-dry.
5. a kind of electronic ceramic component, it is characterised in that manufacture by the following method:
The first step:Prepare raw material, by the use of ZnO be used as main material, then add Al, Fe, Pr, La, Ce, Nd, B, Si and Mn optionally Oxidate powder forms mixed material;
Second step:Drying and processing, the raw material chosen is dried;
3rd step:Weigh, certain material quality is weighed according to the data calculated;
5th step:Vibration, load weighted each raw material is mixed, is ground after mixing;
6th step:Drying screening, the good raw material stoving of mixed grinding, then it is compacted blocking, is then regrind, ground After be dried, dried particle is screened;
7th step:Granulating and forming, powder pressing into sequin and is progressively heated at 600~720 DEG C of insulation dumpings;
8th step:Sintering, heat-agglomerating is carried out to the raw material after dumping, and be cooled to room temperature;
9th step:Test, is tested the element after sintering by instrument, is packaged after test passes.
6. a kind of electronic ceramic component, it is characterised in that including ceramic component body(1), the ceramic component body(1)One Groove is provided with the outer wall of side, and groove embeds and is connected to termination electrode(4), the ceramic component body(1)Away from termination electrode(4)One Side is provided with internal electrode(2), the ceramic component body(1)Both sides inwall on be welded with element substrate(3).
CN201711115205.4A 2017-11-13 2017-11-13 Suppress surface treatment method and electronic ceramic component that electronic ceramic component climbs plating CN107759252A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1929046A (en) * 2005-09-07 2007-03-14 国巨股份有限公司 Semi-conductive ceramic component and its manufacturing method
CN101286393A (en) * 2008-05-16 2008-10-15 昆明理工大学 Stratified structure low-voltage ZnO piezoresistor preparation method
CN102683016A (en) * 2011-03-09 2012-09-19 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1929046A (en) * 2005-09-07 2007-03-14 国巨股份有限公司 Semi-conductive ceramic component and its manufacturing method
CN101286393A (en) * 2008-05-16 2008-10-15 昆明理工大学 Stratified structure low-voltage ZnO piezoresistor preparation method
CN102683016A (en) * 2011-03-09 2012-09-19 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same

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Effective date of registration: 20180823

Address after: 415000 group 2, Pan Shan village, Zhang Gong temple, Lixian, Changde, Hunan

Applicant after: Hunan Jiayeda Electronic Co., Ltd.

Address before: 415502 No. 170, Li Bei North District, Xiao Xi men neighborhood committee, Liyang Town, Lixian, Changde, Hunan, China. Ten

Applicant before: Dai Chengping

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