CN107742753B - Battery packaging structure, battery packaging method and battery detection method - Google Patents
Battery packaging structure, battery packaging method and battery detection method Download PDFInfo
- Publication number
- CN107742753B CN107742753B CN201710805484.0A CN201710805484A CN107742753B CN 107742753 B CN107742753 B CN 107742753B CN 201710805484 A CN201710805484 A CN 201710805484A CN 107742753 B CN107742753 B CN 107742753B
- Authority
- CN
- China
- Prior art keywords
- transmitting
- receiving
- signal
- wafer
- battery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 98
- 238000001514 detection method Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 32
- 238000005070 sampling Methods 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims description 112
- 239000002184 metal Substances 0.000 claims description 112
- 238000004891 communication Methods 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000001808 coupling effect Effects 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004146 energy storage Methods 0.000 description 4
- 230000036541 health Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- BNOODXBBXFZASF-UHFFFAOYSA-N [Na].[S] Chemical compound [Na].[S] BNOODXBBXFZASF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003862 health status Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007773 negative electrode material Substances 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/4285—Testing apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a battery packaging structure, a battery packaging method and a battery detection method, which comprise a transmitting packaging module and a receiving packaging module; the transmitting and packaging module transmits detection ultrasonic waves, the detection ultrasonic waves pass through the battery to form information ultrasonic waves, the receiving and packaging module receives the information ultrasonic waves and converts the information ultrasonic waves into detection signals; the transmitting packaging module comprises a transmitting piezoelectric wafer, a patch singlechip, a patch transmitting element, a transmitting power supply signal interface and a temperature-sensitive resistor; the receiving packaging module comprises a receiving piezoelectric wafer, a signal amplifying element, a signal processing element, a signal sampling element and a receiving power supply signal interface; the transmitting packaging module and the receiving packaging module are symmetrically fixed on two opposite sides of the battery and correspond to each other. The invention has the advantages and beneficial effects that: the method has the characteristics of high sensitivity, high accuracy, safety, reliability, distributed property, low cost and the like; the coupling property is improved, and the manufacturing cost is reduced; the real-time monitoring of the state of charge of the battery is realized.
Description
Technical Field
The present invention relates to the field of detection, and in particular, to a battery packaging structure, a battery packaging method, and a battery detection method.
Background
The development of energy storage technology plays a significant role in applications ranging from small to watches, mobile phones to electric automobiles, unmanned planes, communication base stations, distributed power grids and renewable energy power generation systems. The minimum energy storage unit of the energy storage technology is a battery, and currently common energy storage batteries include lead-acid storage batteries, nickel-hydrogen storage batteries, nickel-chromium batteries, sodium-sulfur batteries, lithium ion batteries and the like. In most applications, the recycling health status of the battery not only relates to the normal maintenance and reliable use of an application system, but also relates to the use safety of the battery, which is a general concern, and is difficult to monitor and effectively guarantee at present;
At present, the state of charge of the battery pack is estimated mainly by means of a temperature sensor, a current sensor and a voltage sensor to monitor the state of health of the battery pack. However, for the state of charge of the battery, the voltage, the current and the temperature are not directly related to the state of charge and the state of health of the battery due to the characteristics of indirect measurement, and it is difficult to directly monitor and predict the state of charge and the state of health of the battery only by three physical information of the voltage, the current and the temperature.
Disclosure of Invention
In order to solve the problems, the invention provides a battery packaging structure, a battery packaging method and a battery detection method. According to the technical scheme, the transmitting packaging module is used for transmitting detection ultrasonic waves, the detection ultrasonic waves pass through the battery to form information ultrasonic waves, the receiving packaging module is used for receiving the information ultrasonic waves and converting the information ultrasonic waves into detection signals, and a worker can judge the charge state of the battery through the detection signals;
Because the battery charge and discharge process is accompanied by the change of the charge state, the components, density, crystal structure domain and other physical parameters of the positive and negative electrode active materials are changed, and the corresponding sound propagation sound, amplitude and other parameters are also changed, the charge state of the battery can be accurately detected by detecting the change of the ultrasonic parameters, and the technical scheme has the characteristics of high sensitivity, high accuracy, safety, reliability, distributability, low cost and the like; the transmitting packaging module and the receiving packaging module are respectively fixed on two opposite sides of the battery and are integrated with the battery, so that the coupling between the transmitting packaging module and the battery and the coupling between the receiving packaging module and the battery are improved, and the manufacturing cost is reduced; the computer is utilized to monitor the charge state of the battery in real time through the transmitting packaging module and the receiving packaging module, so that the detection force of the battery is improved, and the service life of the battery is further guaranteed.
Meanwhile, because the wave amplitude of the detection signal is the maximum value M when the battery is in the full charge state (the charge state=100%), and the wave amplitude of the detection signal is the minimum value N when the battery is in the full discharge state (the charge state=0%), according to the technical scheme, under different charge states of the battery, the steps JS1-JS6 are repeated to obtain the corresponding relation between the charge state and the wave amplitude of the detection signal, and a charge-wave amplitude relation curve is drawn, and a worker can judge the wave amplitude of the current detection signal according to the charge-wave amplitude relation curve, so that the charge state of the current battery can be judged;
The waveform profile output by the signal processing element can be sampled in a time-sharing way within a long time by adopting the signal sampling element, the obtained sampling signal is output to the computer in a time-sharing way, and a worker can judge the change of the charge state of the battery within the time according to the waveform of the detection signal output by the signal adopting element in the time-sharing way, so that the dynamic monitoring of the charge state of the battery is realized.
The invention relates to a battery packaging structure, which comprises a transmitting packaging module and a receiving packaging module;
The transmitting packaging module transmits detection ultrasonic waves, the detection ultrasonic waves pass through the battery to form information ultrasonic waves, and the receiving packaging module receives the information ultrasonic waves and converts the information ultrasonic waves into detection signals;
The transmitting packaging module comprises a transmitting piezoelectric wafer, a patch singlechip, a patch transmitting element, a transmitting power supply signal interface and a temperature-sensitive resistor;
the receiving packaging module comprises a receiving piezoelectric wafer, a signal amplifying element, a signal processing element, a signal sampling element and a receiving power supply signal interface;
The transmitting packaging module and the receiving packaging module are symmetrically fixed on two opposite sides of the battery, and the transmitting piezoelectric wafer and the receiving piezoelectric wafer correspond to each other.
In the above scheme, the patch singlechip is connected with the patch transmitting element and the transmitting power supply signal interface respectively, and the transmitting piezoelectric chip is connected with the patch transmitting element;
The transmitting power supply signal interface is used for connecting a power supply and a signal source; the power supply outputs electric energy to the chip microcomputer through a transmitting power supply signal interface, and the signal source outputs electric signals to the chip microcomputer through the transmitting power supply signal interface;
the chip microcomputer controls the transmitting piezoelectric wafer through the chip transmitting element according to the frequency of the electric signal, so that the transmitting piezoelectric wafer outputs detection ultrasonic waves to the battery; the frequency of the detected ultrasonic wave corresponds to the frequency of the electric signal.
In the above scheme, the transmitting and packaging module further comprises a communication interface, and the communication interface is connected with the chip microcomputer; the communication interface is connected with a computer, and the computer controls the starting or stopping of the chip microcomputer through the communication interface; the chip microcomputer outputs detection ultrasonic waves to the computer through the communication interface; the temperature-sensitive resistor is also connected with the chip microcomputer and is used for sensing the temperature of the battery and forming a temperature signal to be output to the chip microcomputer, and the chip microcomputer outputs the temperature signal to the computer through a communication interface.
In the above scheme, the emission packaging module further comprises an emission circuit board, an emission metal wafer and an emission line;
the transmitting circuit board is provided with transmitting through holes communicated with two sides of the transmitting circuit board, the transmitting metal disc is fixed at one end of the transmitting through holes, the transmitting piezoelectric wafer is positioned in the transmitting through holes and connected with the transmitting metal disc, and the transmitting metal disc is provided with transmitting through holes communicated with two sides of the transmitting metal disc;
one end of the transmitting line is connected with the transmitting piezoelectric chip, and the other end of the transmitting line passes through the transmitting through hole and is connected with the patch transmitting element; the surface of one side of the transmitting piezoelectric wafer, which is opposite to the transmitting metal wafer, and the surface of one side of the transmitting circuit board, which is opposite to the transmitting metal wafer, are positioned on the same horizontal plane; the chip microcomputer, the chip transmitting element, the transmitting power signal interface, the communication interface and the temperature-sensitive resistor are respectively fixed on the surface of one side of the circuit board, which faces the transmitting metal wafer;
the transmitting metal wafer is also connected with a grounding wire of the transmitting circuit board.
In the above scheme, the receiving piezoelectric chip, the signal amplifying element, the signal processing element, the signal sampling element and the receiving power signal interface are sequentially connected in series, and the receiving power signal interface is connected with the computer;
the receiving piezoelectric wafer receives the information ultrasonic wave, the receiving piezoelectric wafer converts the information ultrasonic wave into an information signal and outputs the information signal to the signal amplifying element, the signal amplifying element amplifies the information signal and outputs the information signal to the signal processing element, the signal processing element processes the amplified information signal to obtain a waveform profile of the information signal, and the sampling element samples the waveform profile to obtain a detection signal; the received power signal interface outputs the detection signal to a computer.
In the above scheme, the receiving packaging module further comprises a receiving circuit board, a receiving metal wafer and a receiving wire;
The receiving circuit board is provided with receiving through holes communicated with two sides of the receiving circuit board, the receiving metal wafer is fixed at one end of the receiving through holes, the receiving piezoelectric wafer is positioned in the receiving through holes and connected with the receiving metal wafer, and the receiving metal wafer is provided with receiving through holes communicated with two sides of the receiving metal wafer;
One end of the receiving wire is connected with the receiving piezoelectric chip, and the other end of the receiving wire passes through the receiving through hole and is connected with the patch receiving element; the surface of one side of the receiving piezoelectric wafer, which is away from the receiving metal wafer, and the surface of one side of the receiving circuit board, which is away from the receiving metal wafer, are positioned on the same horizontal plane; the signal amplifying element, the signal processing element, the signal sampling element and the power supply signal receiving interface are respectively fixed on the surface of one side of the circuit board facing the metal receiving wafer;
the receiving metal wafer is also connected with a grounding wire of the receiving circuit board.
A battery packaging method for packaging the battery packaging structure, which comprises the following steps:
FS1, perforating a transmitting circuit board and forming a transmitting through hole, preparing a metal disc with the diameter larger than the inner diameter of the transmitting through hole, and fixing the transmitting metal disc on one end of the transmitting through hole through a screw or an adhesive; an opening is formed on the emitting metal wafer, and an emitting through hole is formed;
FS2, placing the transmitting piezoelectric wafer in the transmitting through hole, connecting the transmitting piezoelectric wafer to the transmitting metal wafer through a screw or an adhesive, enabling the surface of one side of the transmitting piezoelectric wafer, which is opposite to the transmitting metal wafer, to be positioned on the same horizontal plane with the surface of one side of the transmitting circuit board, which is opposite to the transmitting metal wafer, and connecting the transmitting metal wafer with a grounding wire on the transmitting circuit board; connecting one end of a transmitting line with the transmitting piezoelectric wafer, and then passing the other end of the transmitting line through the transmitting through hole;
FS3, connecting the patch singlechip with the patch transmitting element, the transmitting power supply signal interface, the communication interface and the temperature-sensitive resistor respectively, wherein the patch transmitting element is also connected with one end of the transmitting line, which is opposite to the transmitting piezoelectric wafer; then the chip microcomputer, the chip transmitting element, the transmitting power supply signal interface and the communication interface are respectively fixed on the surface of one side of the circuit board, which faces the transmitting metal wafer, so as to manufacture a transmitting packaging module;
FS4, forming a receiving through hole by punching on a receiving circuit board, preparing a metal wafer with the diameter larger than the inner diameter of the receiving through hole, and fixing the receiving metal wafer on one end of the receiving through hole through a screw or an adhesive; opening on the receiving metal wafer and forming a receiving through hole;
FS5, placing the receiving piezoelectric wafer in the receiving through hole, connecting the receiving piezoelectric wafer to the receiving metal wafer through a screw or an adhesive, enabling the surface of one side of the receiving piezoelectric wafer, which is opposite to the receiving metal wafer, to be positioned on the same horizontal plane with the surface of one side of the receiving circuit board, which is opposite to the receiving metal wafer, and connecting the receiving metal wafer to a grounding wire on the receiving circuit board; connecting one end of a receiving wire with a receiving piezoelectric wafer, and then penetrating the other end of the receiving wire through the receiving through hole;
FS6, sequentially connecting a signal amplifying element, a signal processing element, a signal sampling element and a receiving power supply signal interface, wherein the signal amplifying element is also connected with one end of the receiving line, which is opposite to the receiving piezoelectric wafer; then the signal amplifying element, the signal processing element, the signal sampling element and the receiving power signal interface are respectively fixed on the surface of one side of the circuit board facing the receiving metal wafer to manufacture a receiving packaging module;
FS7, fixing one side of the transmitting circuit board, which is opposite to the transmitting metal disc, and one side of the receiving circuit board, which is opposite to the receiving metal disc, on two opposite sides of the battery respectively, and completing the packaging of the battery.
In the above scheme, in FS7, the transmitting circuit board and the receiving circuit board are aligned with each other, the transmitting piezoelectric chip and the receiving piezoelectric chip correspond to each other, and the transmitting circuit board and the receiving circuit board are connected to the battery through an adhesive.
A battery detection method, the above-mentioned a battery packaging structure, including the following steps:
The JS1 is characterized in that a communication interface and a receiving power supply signal interface are respectively connected with a computer, a transmitting power supply signal interface is connected with a power supply and a signal source, and the computer also provides electric energy for a signal amplifying element, a signal processing element and a signal sampling element through the receiving power supply signal interface;
Js2, operating the computer to control the start and stop of the chip microcomputer through the communication interface; operating a signal source to enable the signal source to output an electric signal to the chip microcomputer through a transmitting power supply signal interface; the power supply provides electric energy for the chip microcomputer through the transmitting power supply signal interface;
Js3 the chip microcomputer controls the transmitting piezoelectric chip through the chip transmitting element, and enables the transmitting piezoelectric chip to output detection ultrasonic waves to the battery according to the frequency of the electric signal; the frequency of the detection ultrasonic wave corresponds to the frequency of the electric signal; meanwhile, the chip microcomputer outputs detection ultrasonic waves to a computer through a communication interface and displays the detection ultrasonic waves; the staff can confirm the waveform of the detection ultrasonic wave output by the packaging module through the computer;
Js4 the detected ultrasonic wave passes through the battery to form information ultrasonic wave, the piezoelectric wafer receives the information ultrasonic wave, and the information ultrasonic wave is converted into an information signal and is output to the signal amplifying element;
Js5 the signal amplifying element amplifies the information signal and outputs it to the signal processing element; the signal processing element processes the amplified information signal to obtain a waveform profile of the information signal, and the sampling element samples the waveform profile to obtain a detection signal; the power supply signal receiving interface outputs the detection signal to a computer and displays the detection signal; the staff can observe and receive the waveform of the detection signal outputted by the packaging module through the computer;
Js6 staff can judge the state of charge of the battery by comparing the waveform of the detected ultrasonic wave with the waveform of the detected signal.
In the above solution, the JS6 may further perform the following steps:
Js61 senses the temperature of the battery by using a temperature sensitive resistor, forms a temperature signal, outputs the temperature signal to the chip microcomputer, outputs the temperature signal to the computer through a communication interface, and compares the waveform of the detected ultrasonic wave with the waveform of the detected signal and judges the state of charge of the battery on the premise of referring to the temperature of the battery.
The invention has the advantages and beneficial effects that: the invention provides a battery packaging structure, a battery packaging method and a battery detection method, which have the characteristics of high sensitivity, high accuracy, safety, reliability, distributability, low cost and the like; the coupling between the transmitting packaging module and the battery as well as the coupling between the receiving packaging module and the battery are improved, and the manufacturing cost is reduced; the method realizes the real-time monitoring of the charge state of the battery, improves the detection force of the battery, and is further beneficial to guaranteeing the service life of the battery.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic diagram of a positional relationship between a battery and a package structure of the battery according to the present invention;
Fig. 2 is a schematic structural diagram of a side of a transmitting package module facing away from a battery in a package structure of the battery according to the present invention;
fig. 3 is a schematic structural view of a side of an emission package module facing a battery in a package structure of the battery according to the present invention;
fig. 4 is a schematic structural diagram of a side of a receiving and packaging module facing away from a battery in a packaging structure of the battery according to the present invention;
fig. 5 is a schematic view of a structure of a battery according to the present invention, in which a receiving package module faces a side of the battery;
fig. 6 is a schematic diagram showing the connection between a battery package structure and a computer, a power source and a signal source according to the present invention.
In the figure: 1. transmitting packaging module 2, receiving packaging module 3, battery
4. Computer 5, power supply 6, signal source
7. Transmitting line 8, receiving line
11. Emitting piezoelectric chip 12, chip microcomputer 13, and chip emitting element
14. Transmitting power signal interface 15, temperature sensitive resistor 16 and communication interface
17. Transmitting circuit board 18, transmitting through hole 19 and transmitting metal wafer
10. Transmitting through port
21. Receiving piezoelectric wafer 22, signal amplifying element 23, signal processing element
24. Signal sampling element 25, receiving power signal interface 26, receiving circuit board
27. Receiving through hole 28, receiving metal wafer 29, receiving through hole
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
As shown in fig. 1 to 6, the present invention is a package structure of a battery, including a transmitting package module 1 and a receiving package module 2;
The transmitting and packaging module 1 transmits detection ultrasonic waves, the detection ultrasonic waves pass through the battery 3 to form information ultrasonic waves, the receiving and packaging module 2 receives the information ultrasonic waves and converts the information ultrasonic waves into detection signals;
the transmitting packaging module 1 comprises a transmitting piezoelectric wafer 11, a patch singlechip 12, a patch transmitting element 13, a transmitting power supply signal interface 14 and a temperature-sensitive resistor 15;
the receiving packaging module 2 comprises a receiving piezoelectric chip 21, a signal amplifying element 22, a signal processing element 23, a signal sampling element 24 and a receiving power supply signal interface 25;
the transmitting package module 1 and the receiving package module 2 are symmetrically fixed on two opposite sides of the battery 3, and the transmitting piezoelectric wafer 11 and the receiving piezoelectric wafer 21 correspond to each other.
Specifically, the patch singlechip 12 is respectively connected with the patch transmitting element 13 and the transmitting power signal interface 14, and the transmitting piezoelectric wafer 11 is connected with the patch transmitting element 13;
The transmitting power signal interface 14 is used for connecting the power supply 5 and the signal source 6; the power supply 5 outputs electric energy to the chip microcomputer 12 through the transmitting power supply signal interface 14, and the signal source 6 outputs electric signals to the chip microcomputer 12 through the transmitting power supply signal interface 14;
The chip microcomputer 12 controls the transmitting piezoelectric chip 11 through the chip transmitting element 13 according to the frequency of the electric signal, so that the transmitting piezoelectric chip 11 outputs detection ultrasonic waves to the battery 3; the frequency of the detected ultrasonic wave corresponds to the frequency of the electric signal.
The working principle of the technical scheme is as follows: the transmitting packaging module 1 is used for transmitting detection ultrasonic waves, the detection ultrasonic waves pass through the battery 3 to form information ultrasonic waves, the receiving packaging module 2 is used for receiving the information ultrasonic waves and converting the information ultrasonic waves into detection signals, and a worker can judge the charge state of the battery 3 through the detection signals, so that the device has the characteristics of high sensitivity, high accuracy, safety, reliability, distributability, low cost and the like, and is widely adopted and used; the transmitting packaging module 1 and the receiving packaging module 2 are respectively fixed on two opposite sides of the battery 3 and are integrated with the battery 3, so that the coupling between the transmitting packaging module 1 and the receiving packaging module 2 and the battery 3 is improved, and the manufacturing cost is reduced; the state of charge of the battery 3 is monitored in real time by the computer 4 through the transmitting packaging module 1 and the receiving packaging module 2, so that the detection force of the battery 3 is improved, and the service life of the battery 3 is further guaranteed.
Further, the transmitting and packaging module 1 further comprises a communication interface 16, and the communication interface 16 is connected with the chip microcomputer 12; the communication interface 16 is connected with the computer 4, and the computer 4 controls the starting or stopping of the patch singlechip 12 through the communication interface 16; the chip microcomputer 12 outputs detection ultrasonic waves to the computer 4 through the communication interface 16; the temperature-sensitive resistor 15 is also connected with the chip microcomputer 12, and is used for sensing the temperature of the battery 3 and forming a temperature signal to be output to the chip microcomputer 12, and the chip microcomputer 12 outputs the temperature signal to the computer 4 through the communication interface 16.
Further, the emission packaging module 1 further comprises an emission circuit board 17, an emission metal wafer 19 and an emission line 7;
the transmitting circuit board 17 is provided with transmitting through holes 18 communicated with the two sides of the transmitting circuit board 17, a transmitting metal disc 19 is fixed at one end of the transmitting through holes 18, the transmitting piezoelectric wafer 11 is positioned in the transmitting through holes 18 and connected with the transmitting metal disc 19, and the transmitting metal disc 19 is provided with transmitting through holes 10 communicated with the two sides of the transmitting metal disc 19;
One end of the transmitting line 7 is connected with the transmitting piezoelectric chip 11, and the other end of the transmitting line 7 passes through the transmitting through hole 10 and is connected with the patch transmitting element 13; the surface of one side of the emitting piezoelectric wafer 11, which is back to the emitting metal wafer 19, and the surface of one side of the emitting circuit board 17, which is back to the emitting metal wafer, are positioned on the same horizontal plane; the chip microcomputer 12, the chip transmitting element 13, the transmitting power signal interface 14, the communication interface 16 and the temperature-sensitive resistor 15 are respectively fixed on the surface of one side of the circuit board facing the transmitting metal wafer 19;
The radiating metal disc 19 is also connected to the ground line of the radiating wiring board 17.
Preferably, the emitting circuit board 17 is 66mm long, 33mm wide and 2mm thick; the diameter of the emission through hole 18 is 28.5mm; the chip microcomputer 12 is an MC9S08DZ60 chip microcomputer; the diameter of the emitting metal disc 19 is 30mm and the thickness is 0.4mm; the diameter of the emission through hole 10 is 1.5mm;
The communication interface 16 is a wired network implemented by 485 or CAN, and the communication interface 16 may also be a wireless network implemented by bluetooth or very high frequency.
Preferably, the chip microcomputer 12, the chip transmitting element 13, the transmitting power signal interface 14, the communication interface 16 and the temperature sensitive resistor 15 can be connected with the transmitting circuit board 17 through welding or adhesives.
Specifically, the receiving piezoelectric chip 21, the signal amplifying element 22, the signal processing element 23, the signal sampling element 24 and the receiving power signal interface 25 are sequentially connected in series, and the receiving power signal interface 25 is connected with the computer 4;
The receiving piezoelectric chip 21 receives the information ultrasonic wave, the receiving piezoelectric chip 21 converts the information ultrasonic wave into an information signal and outputs the information signal to the signal amplifying element 22, the signal amplifying element 22 amplifies the information signal and outputs the information signal to the signal processing element 23, the signal processing element 23 processes the amplified information signal to obtain a waveform profile of the information signal, and the sampling element samples the waveform profile to obtain a detection signal; the received power signal interface 25 outputs the detection signal to the computer 4.
Further, the receiving package module 2 further includes a receiving circuit board 26, a receiving metal wafer 28 and a receiving wire 8;
The receiving circuit board 26 is provided with a receiving through hole 27 communicated with two sides of the receiving circuit board 26, a receiving metal disc 28 is fixed at one end of the receiving through hole 27, the receiving piezoelectric wafer 21 is positioned in the receiving through hole 27 and connected with the receiving metal disc 28, and the receiving metal disc 28 is provided with a receiving through hole 29 communicated with two sides of the receiving metal disc 28;
One end of the receiving wire 8 is connected with the receiving piezoelectric chip 21, and the other end of the receiving wire 8 passes through the receiving through hole 29 to be connected with the patch receiving element; the surface of the side of the receiving piezoelectric wafer 21 facing away from the receiving metal wafer 28 is positioned on the same horizontal plane with the surface of the receiving circuit board 26 facing away from the receiving metal wafer; the signal amplifying element 22, the signal processing element 23, the signal sampling element 24 and the receiving power signal interface 25 are respectively fixed on the surface of one side of the circuit board facing the receiving metal wafer 28;
The receiving metal wafer 28 is also connected to the ground line of the receiving wiring board 26.
Preferably, the receiving circuit board 26 is 66mm long, 33mm wide and 2mm thick; the diameter of the receiving through hole 27 is 28.5mm; the diameter of the receiving metal disc 28 is 30mm and the thickness is 0.4mm; the diameter of the receiving opening 29 is 1.5mm.
Preferably, the signal amplifying element 22, the signal processing element 23, the signal sampling element 24, and the receiving power signal interface 25 may be connected to the receiving circuit board 26 by soldering or an adhesive.
Preferably, the signal source 6 is also connected to the computer 4, and the computer 4 controls the frequency or amplitude of the electric signal received by the chip microcomputer 12 by controlling the signal source 6.
A battery packaging method for packaging a packaging structure of the battery 3 on the battery 3, comprising the steps of:
FS1, perforating a transmitting circuit board 17 and forming a transmitting through hole 18, preparing a metal disc with the diameter larger than the inner diameter of the transmitting through hole 18, and fixing the transmitting metal disc 19 on one end of the transmitting through hole 18 through a screw or an adhesive; an emission port 10 is formed by opening on the emission metal wafer 19;
FS2, placing the transmitting piezoelectric wafer 11 in the transmitting through hole 18, connecting the transmitting piezoelectric wafer 11 to the transmitting metal wafer 19 through screws or adhesives, enabling the surface of one side of the transmitting piezoelectric wafer 11, which is back to the transmitting metal wafer 19, to be positioned on the same horizontal plane with the surface of one side of the transmitting circuit board 17, which is back to the transmitting metal wafer 19, and connecting the transmitting metal wafer 19 with a grounding wire on the transmitting circuit board 17; one end of the transmitting line 7 is connected with the transmitting piezoelectric chip 11, and the other end of the transmitting line 7 passes through the transmitting through hole 10;
FS3, the chip microcomputer 12 is respectively connected with the chip transmitting element 13, the transmitting power supply signal interface 14, the communication interface 16 and the temperature-sensitive resistor 15, and the chip transmitting element 13 is also connected with one end of the transmitting line 7, which is opposite to the transmitting piezoelectric wafer 11; then the chip microcomputer 12, the chip transmitting element 13, the transmitting power signal interface 14 and the communication interface 16 are respectively fixed on the surface of one side of the circuit board facing the transmitting metal wafer 19 to manufacture the transmitting packaging module 1;
FS4, forming a receiving through hole 27 by punching a receiving circuit board 26, preparing a metal disc with a diameter larger than the inner diameter of the receiving through hole 27, and fixing the receiving metal disc 28 on one end of the receiving through hole 27 by a screw or an adhesive; opening on the receiving metal wafer 28 and forming a receiving through opening 29;
FS5 placing the receiving piezoelectric wafer 21 in the receiving through hole 27, connecting the receiving piezoelectric wafer 21 to the receiving metal wafer 28 by screws or adhesives, and making the surface of the receiving piezoelectric wafer 21 facing away from the receiving metal wafer 28 and the surface of the receiving circuit board 26 facing away from the receiving metal wafer 28 be on the same horizontal plane, and connecting the receiving metal wafer 28 to the grounding wire on the receiving circuit board 26; one end of the receiving wire 8 is connected with the receiving piezoelectric chip 21, and the other end of the receiving wire 8 passes through the receiving through hole 29;
FS6 connecting a signal amplifying element 22, a signal processing element 23, a signal sampling element 24 and a receiving power signal interface 25 in sequence, wherein the signal amplifying element 22 is also connected with one end of the receiving wire 8, which is opposite to the receiving piezoelectric chip 21; then the signal amplifying element 22, the signal processing element 23, the signal sampling element 24 and the receiving power signal interface 25 are respectively fixed on the surface of one side of the circuit board facing the receiving metal wafer 28 to manufacture the receiving packaging module 2;
FS7 the side of the transmitting circuit board 17 facing away from the transmitting metal disc 19 and the side of the receiving circuit board 26 facing away from the receiving metal disc 28 are respectively fixed on two opposite sides of the battery 3, so as to complete the packaging of the battery 3.
Preferably, in FS7, the transmitting wiring board 17 and the receiving wiring board 26 are aligned with each other, the transmitting piezoelectric chip 11 and the receiving piezoelectric chip 21 correspond to each other, and the transmitting wiring board 17 and the receiving wiring board 26 are connected to the battery 3 by an adhesive.
A battery detection method, which uses the above battery 3 packaging structure, includes the following steps:
js1, the communication interface 16 and the receiving power signal interface 25 are respectively connected with the computer 4, the transmitting power signal interface 14 is connected with the power supply 5 and the signal source 6, and the computer 4 also provides electric energy for the signal amplifying element 22, the signal processing element 23 and the signal sampling element 24 through the receiving power signal interface 25;
Js2, operating the computer 4 to control the start and stop of the chip microcomputer 12 by the computer 4 through the communication interface 16; operating the signal source 6 to enable the signal source 6 to output an electric signal to the chip microcomputer 12 through the transmitting power signal interface 14; the power supply 5 supplies electric energy to the chip microcomputer 12 through the transmitting power supply signal interface 14;
Js3 the chip microcomputer 12 controls the transmitting piezoelectric chip 11 through the chip transmitting element 13, and makes the transmitting piezoelectric chip 11 output the detecting ultrasonic wave to the battery 3 according to the frequency of the electric signal; detecting that the frequency of the ultrasonic wave corresponds to the frequency of the electric signal; meanwhile, the chip microcomputer 12 outputs detection ultrasonic waves to the computer 4 through the communication interface 16 and displays the detection ultrasonic waves; the staff can confirm the waveform of the detection ultrasonic wave output by the packaging module through the computer 4;
js4 detects the ultrasonic wave passing through the battery 3 to form information ultrasonic wave, receives the information ultrasonic wave by the piezoelectric wafer 21, converts the information ultrasonic wave into an information signal, and outputs the information signal to the signal amplifying element 22;
Js5 the signal amplifying element 22 amplifies the information signal and outputs to the signal processing element 23; the signal processing element 23 processes the amplified information signal to obtain a waveform profile of the information signal, and the sampling element samples the waveform profile to obtain a detection signal; the received power signal interface 25 outputs the detection signal to the computer 4 and displays the detection signal; the staff can observe the waveform of the detection signal output by the receiving packaging module 2 through the computer 4;
Js6 the staff can judge the state of charge of the battery 3 by comparing the waveform of the detected ultrasonic wave with the waveform of the detected signal; when the battery 3 is in a full charge state (state of charge=100%), the amplitude of the waveform of the detection signal is the maximum value M, and when the battery 3 is in a full discharge state (state of charge=0%), the amplitude of the waveform of the detection signal is the minimum value N, so that according to this principle, the steps JS1-JS6 can be repeated under different states of charge of the battery 3 to obtain the correspondence between the states of charge and the amplitudes of the waveforms of the detection signals, and a charge-amplitude relationship curve is drawn, so that a worker can judge the amplitude of the waveforms of the current detection signal by referring to the charge-amplitude relationship curve, and further judge the state of charge of the current battery 3;
By adopting the signal sampling element 24, the waveform profile output by the signal processing element 23 can be sampled in a time-sharing manner for a long time, and the obtained sampling signal is output to the computer 4 in a time-sharing manner, so that a worker can judge the change of the charge state of the battery 3 in the time according to the waveform of the detection signal output by the signal sampling element in a time-sharing manner, and further realize the dynamic monitoring of the charge state of the battery 3.
Preferably, the following steps may also be performed in JS 6:
Js61 uses the temperature-sensitive resistor 15 to sense the temperature of the battery 3 and form a temperature signal, and outputs the temperature signal to the chip microcomputer 12, the chip microcomputer 12 outputs the temperature signal to the computer 4 via the communication interface 16, and the staff compares the waveform of the detected ultrasonic wave with the waveform of the detected signal and judges the state of charge of the battery 3 on the premise of referring to the temperature of the battery 3, so as to improve the detection accuracy of the state of charge of the battery 3.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (7)
1. The packaging structure of the battery is characterized by comprising a transmitting packaging module and a receiving packaging module;
The transmitting packaging module transmits detection ultrasonic waves, the detection ultrasonic waves pass through the battery to form information ultrasonic waves, and the receiving packaging module receives the information ultrasonic waves and converts the information ultrasonic waves into detection signals;
The transmitting packaging module comprises a transmitting piezoelectric wafer, a patch singlechip, a patch transmitting element, a transmitting power supply signal interface and a temperature-sensitive resistor;
the receiving packaging module comprises a receiving piezoelectric wafer, a signal amplifying element, a signal processing element, a signal sampling element and a receiving power supply signal interface;
The transmitting packaging module and the receiving packaging module are symmetrically fixed on two opposite sides of the battery, and the transmitting piezoelectric wafer and the receiving piezoelectric wafer correspond to each other;
the patch singlechip is respectively connected with the patch transmitting element and the transmitting power supply signal interface, and the transmitting piezoelectric wafer is connected with the patch transmitting element;
The transmitting power supply signal interface is used for connecting a power supply and a signal source; the power supply outputs electric energy to the chip microcomputer through a transmitting power supply signal interface, and the signal source outputs electric signals to the chip microcomputer through the transmitting power supply signal interface;
the chip microcomputer controls the transmitting piezoelectric wafer through the chip transmitting element according to the frequency of the electric signal, so that the transmitting piezoelectric wafer outputs detection ultrasonic waves to the battery; the frequency of the detected ultrasonic wave corresponds to the frequency of the electric signal.
2. The battery packaging structure according to claim 1, wherein the transmitting packaging module further comprises a communication interface, and the communication interface is connected with the chip microcomputer; the communication interface is connected with a computer, and the computer controls the starting or stopping of the chip microcomputer through the communication interface; the chip microcomputer outputs detection ultrasonic waves to the computer through the communication interface; the temperature-sensitive resistor is also connected with the chip microcomputer and is used for sensing the temperature of the battery and forming a temperature signal to be output to the chip microcomputer, and the chip microcomputer outputs the temperature signal to the computer through a communication interface.
3. The packaging structure of a battery according to claim 2, wherein the emission packaging module further comprises an emission circuit board, an emission metal wafer and an emission line;
the transmitting circuit board is provided with transmitting through holes communicated with two sides of the transmitting circuit board, the transmitting metal disc is fixed at one end of the transmitting through holes, the transmitting piezoelectric wafer is positioned in the transmitting through holes and connected with the transmitting metal disc, and the transmitting metal disc is provided with transmitting through holes communicated with two sides of the transmitting metal disc;
one end of the transmitting line is connected with the transmitting piezoelectric chip, and the other end of the transmitting line passes through the transmitting through hole and is connected with the patch transmitting element; the surface of one side of the transmitting piezoelectric wafer, which is opposite to the transmitting metal wafer, and the surface of one side of the transmitting circuit board, which is opposite to the transmitting metal wafer, are positioned on the same horizontal plane; the chip microcomputer, the chip transmitting element, the transmitting power signal interface, the communication interface and the temperature-sensitive resistor are respectively fixed on the surface of one side of the circuit board, which faces the transmitting metal wafer;
the transmitting metal wafer is also connected with a grounding wire of the transmitting circuit board.
4. The battery packaging structure according to claim 1, wherein the receiving piezoelectric chip, the signal amplifying element, the signal processing element, the signal sampling element and the receiving power signal interface are sequentially connected in series, and the receiving power signal interface is connected with a computer;
the receiving piezoelectric wafer receives the information ultrasonic wave, the receiving piezoelectric wafer converts the information ultrasonic wave into an information signal and outputs the information signal to the signal amplifying element, the signal amplifying element amplifies the information signal and outputs the information signal to the signal processing element, the signal processing element processes the amplified information signal to obtain a waveform profile of the information signal, and the sampling element samples the waveform profile to obtain a detection signal; the received power signal interface outputs the detection signal to a computer.
5. The battery package structure according to claim 4, wherein the receiving package module further comprises a receiving circuit board, a receiving metal wafer, and a receiving wire;
The receiving circuit board is provided with receiving through holes communicated with two sides of the receiving circuit board, the receiving metal wafer is fixed at one end of the receiving through holes, the receiving piezoelectric wafer is positioned in the receiving through holes and connected with the receiving metal wafer, and the receiving metal wafer is provided with receiving through holes communicated with two sides of the receiving metal wafer;
One end of the receiving wire is connected with the receiving piezoelectric chip, and the other end of the receiving wire passes through the receiving through hole and is connected with the signal amplifying element; the surface of one side of the receiving piezoelectric wafer, which is away from the receiving metal wafer, and the surface of one side of the receiving circuit board, which is away from the receiving metal wafer, are positioned on the same horizontal plane; the signal amplifying element, the signal processing element, the signal sampling element and the power supply signal receiving interface are respectively fixed on the surface of one side of the circuit board facing the metal receiving wafer;
the receiving metal wafer is also connected with a grounding wire of the receiving circuit board.
6. A packaging method of a battery, for packaging the packaging structure of a battery according to any one of claims 1 to 5 on a battery, characterized by comprising the steps of:
FS1, perforating a transmitting circuit board and forming a transmitting through hole, preparing a metal disc with the diameter larger than the inner diameter of the transmitting through hole, and fixing the transmitting metal disc on one end of the transmitting through hole through a screw or an adhesive; an opening is formed on the emitting metal wafer, and an emitting through hole is formed;
FS2, placing the transmitting piezoelectric wafer in the transmitting through hole, connecting the transmitting piezoelectric wafer to the transmitting metal wafer through a screw or an adhesive, enabling the surface of one side of the transmitting piezoelectric wafer, which is opposite to the transmitting metal wafer, to be positioned on the same horizontal plane with the surface of one side of the transmitting circuit board, which is opposite to the transmitting metal wafer, and connecting the transmitting metal wafer with a grounding wire on the transmitting circuit board; connecting one end of a transmitting line with the transmitting piezoelectric wafer, and then passing the other end of the transmitting line through the transmitting through hole;
FS3, connecting the patch singlechip with the patch transmitting element, the transmitting power supply signal interface, the communication interface and the temperature-sensitive resistor respectively, wherein the patch transmitting element is also connected with one end of the transmitting line, which is opposite to the transmitting piezoelectric wafer; then the chip microcomputer, the chip transmitting element, the transmitting power supply signal interface and the communication interface are respectively fixed on the surface of one side of the circuit board, which faces the transmitting metal wafer, so as to manufacture a transmitting packaging module;
FS4, forming a receiving through hole on the receiving circuit board, preparing a metal wafer with the diameter larger than the inner diameter of the receiving through hole, and fixing the receiving metal wafer on one end of the receiving through hole through a screw or an adhesive; opening on the receiving metal wafer and forming a receiving through hole;
FS5, placing a receiving piezoelectric wafer in the receiving through hole, connecting the receiving piezoelectric wafer to the receiving metal wafer through a screw or an adhesive, enabling the surface of one side of the receiving piezoelectric wafer, which is opposite to the receiving metal wafer, to be positioned on the same horizontal plane with the surface of one side of the receiving circuit board, which is opposite to the receiving metal wafer, and connecting the receiving metal wafer to a grounding wire on the receiving circuit board; connecting one end of a receiving wire with a receiving piezoelectric wafer, and then penetrating the other end of the receiving wire through the receiving through hole;
FS6, sequentially connecting a signal amplifying element, a signal processing element, a signal sampling element and a receiving power supply signal interface, wherein the signal amplifying element is also connected with one end of the receiving line, which is opposite to the receiving piezoelectric wafer; then the signal amplifying element, the signal processing element, the signal sampling element and the receiving power signal interface are respectively fixed on the surface of one side of the circuit board facing the receiving metal wafer to manufacture a receiving packaging module;
FS7, fixing one side of the transmitting circuit board, which is opposite to the transmitting metal disc, and one side of the receiving circuit board, which is opposite to the receiving metal disc, on two opposite sides of the battery respectively, and completing the packaging of the battery.
7. The method of claim 6, wherein in FS7, the transmitting circuit board and the receiving circuit board are aligned with each other, the transmitting piezoelectric chip and the receiving piezoelectric chip correspond to each other, and the transmitting circuit board and the receiving circuit board are connected to the battery by an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805484.0A CN107742753B (en) | 2017-09-08 | 2017-09-08 | Battery packaging structure, battery packaging method and battery detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805484.0A CN107742753B (en) | 2017-09-08 | 2017-09-08 | Battery packaging structure, battery packaging method and battery detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107742753A CN107742753A (en) | 2018-02-27 |
| CN107742753B true CN107742753B (en) | 2024-06-07 |
Family
ID=61235236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710805484.0A Active CN107742753B (en) | 2017-09-08 | 2017-09-08 | Battery packaging structure, battery packaging method and battery detection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107742753B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11374415B2 (en) | 2019-05-20 | 2022-06-28 | Amazon Technologies, Inc. | Aerial vehicle fleet maintenance systems and methods |
| US11175346B2 (en) | 2019-05-20 | 2021-11-16 | Amazon Technologies, Inc. | Power supply monitoring systems and methods using ultrasonic sensors |
| EP3973589A1 (en) * | 2019-05-20 | 2022-03-30 | Amazon Technologies Inc. | Monitoring of a battery state using ultrasonic sensors |
| CN111323720B (en) * | 2020-01-07 | 2022-08-16 | 苏州热工研究院有限公司 | Apparatus for diagnosing aging state of storage battery and apparatus for repairing aging state of storage battery |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012351A (en) * | 2010-09-30 | 2011-04-13 | 大连理工大学 | Portable storage battery electrolyte ultrasonic areometer |
| CN102183797A (en) * | 2011-03-04 | 2011-09-14 | 西安交通大学 | Ultrasonic air bubble detection device applicable to biological microtubules |
| CN203101641U (en) * | 2012-12-14 | 2013-07-31 | 长安大学 | Ultrasonic range finding device based on one-chip microcomputer |
| KR20140049331A (en) * | 2012-10-17 | 2014-04-25 | 현대모비스 주식회사 | Battery stste of charge estimation method using ultrasonic sensor |
| CN105372328A (en) * | 2015-11-02 | 2016-03-02 | 侬泰轲（上海）检测科技有限责任公司 | Detection device and method |
| JP2016217716A (en) * | 2015-05-14 | 2016-12-22 | 日産自動車株式会社 | Ultrasonic wave measuring device and ultrasonic wave measuring method |
| CN205844274U (en) * | 2016-06-08 | 2016-12-28 | 北京华泰科恩科技有限公司 | A kind of ultrasonic examination double crystal probe device |
| CN106680730A (en) * | 2017-03-01 | 2017-05-17 | 侬泰轲（上海）检测科技有限责任公司 | Power charging and discharging device capable of detecting the state of charge and the detection method for the state of charge |
| CN106772063A (en) * | 2016-11-21 | 2017-05-31 | 华中科技大学 | A kind of method and its device for monitoring charge states of lithium ion battery and health status |
| CN107128186A (en) * | 2016-02-26 | 2017-09-05 | 福特全球技术公司 | The system and method monitored for cell health state |
| CN207409617U (en) * | 2017-09-08 | 2018-05-25 | 侬泰轲（昆山）检测科技有限公司 | A kind of encapsulating structure of battery |
-
2017
- 2017-09-08 CN CN201710805484.0A patent/CN107742753B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012351A (en) * | 2010-09-30 | 2011-04-13 | 大连理工大学 | Portable storage battery electrolyte ultrasonic areometer |
| CN102183797A (en) * | 2011-03-04 | 2011-09-14 | 西安交通大学 | Ultrasonic air bubble detection device applicable to biological microtubules |
| KR20140049331A (en) * | 2012-10-17 | 2014-04-25 | 현대모비스 주식회사 | Battery stste of charge estimation method using ultrasonic sensor |
| CN203101641U (en) * | 2012-12-14 | 2013-07-31 | 长安大学 | Ultrasonic range finding device based on one-chip microcomputer |
| JP2016217716A (en) * | 2015-05-14 | 2016-12-22 | 日産自動車株式会社 | Ultrasonic wave measuring device and ultrasonic wave measuring method |
| CN105372328A (en) * | 2015-11-02 | 2016-03-02 | 侬泰轲（上海）检测科技有限责任公司 | Detection device and method |
| CN107128186A (en) * | 2016-02-26 | 2017-09-05 | 福特全球技术公司 | The system and method monitored for cell health state |
| CN205844274U (en) * | 2016-06-08 | 2016-12-28 | 北京华泰科恩科技有限公司 | A kind of ultrasonic examination double crystal probe device |
| CN106772063A (en) * | 2016-11-21 | 2017-05-31 | 华中科技大学 | A kind of method and its device for monitoring charge states of lithium ion battery and health status |
| CN106680730A (en) * | 2017-03-01 | 2017-05-17 | 侬泰轲（上海）检测科技有限责任公司 | Power charging and discharging device capable of detecting the state of charge and the detection method for the state of charge |
| CN207409617U (en) * | 2017-09-08 | 2018-05-25 | 侬泰轲（昆山）检测科技有限公司 | A kind of encapsulating structure of battery |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107742753A (en) | 2018-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107742753B (en) | Battery packaging structure, battery packaging method and battery detection method | |
| CN202735105U (en) | Fault detecting device | |
| CN103197248B (en) | Method and device for detecting electric quantity of robot storage battery | |
| CN1963879A (en) | System and method for detecting online of built on stilts power transmission sequence | |
| CN201475653U (en) | A remote monitoring device combining anti-theft prewarning and cathodic protection for pipeline | |
| CN202339393U (en) | Insulation detector of power battery system of electric vehicle | |
| CN107313052A (en) | A kind of synchronous detecting system of pipe cathode current potential and detection method | |
| CN102025170A (en) | Display calculation type storage battery instant electric quantity charge-discharge protection management system | |
| CN207409617U (en) | A kind of encapsulating structure of battery | |
| CN105698962A (en) | Teletransmission resonance-type SAW (surface acoustic wave) temperature sensing device used for high-voltage equipment | |
| CN202710176U (en) | Aeolian vibration detecting device for transmission lines | |
| CN205590801U (en) | Pipeline cathode potential synchronous detection system | |
| CN215986133U (en) | Measurement and calibration system for improving precision of ultrasonic wind sensor | |
| TW202332890A (en) | Method, apparatus, and system for a fastener having a wireless monitoring system | |
| CN109004297A (en) | A kind of battery management system | |
| CN103353566A (en) | Cell in-place detection circuit for simulation circuit apparatus | |
| CN203216604U (en) | A wind generator blade vibration state detection system | |
| CN103630846A (en) | Method and system for monitoring residual capacity of storage battery on line based on internal resistance method | |
| CN209015395U (en) | The acoustic-optic alarm torn open is leaked in anti-test shorting stub | |
| CN208922132U (en) | A kind of ultrasonic solution LPG cylinder level monitoring scheme and system | |
| CN206848370U (en) | Field strength monitoring alarm and system | |
| CN206193205U (en) | Electric motor car group battery data remote monitoring ware | |
| CN213482365U (en) | Intelligent cable fault positioning device | |
| CN220982340U (en) | Composite multi-parameter detector | |
| CN214585046U (en) | Integrated embedded soil temperature and humidity meter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |