CN107740936A - Led - Google Patents
Led Download PDFInfo
- Publication number
- CN107740936A CN107740936A CN201710926490.1A CN201710926490A CN107740936A CN 107740936 A CN107740936 A CN 107740936A CN 201710926490 A CN201710926490 A CN 201710926490A CN 107740936 A CN107740936 A CN 107740936A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- led
- led chip
- ceramics seat
- insulation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 238000009413 insulation Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a kind of LED, including LED chip, ceramics seat, outer cover, heat sink, insulation plate, substrate, LED chip is fixed in described ceramics seat one end, the socket heat sink on the outside of the ceramics seat of installation LED chip one end, heat sink edge cover buckles outer cover, in LED chip cover is buckled in by outer cover, insulation plate is provided with the downside of the heat sink, the insulation plate downside is provided with substrate.Its structure design is simple, good heat dissipation effect, advantageously ensures that product use reliability, extends product service life, meets market use demand, be advantageous to product promotion.
Description
Technical field
The invention belongs to lighting technical field, and in particular to a kind of LED.
Background technology
Constantly lifted with LED luminous efficiency, white LED light source is widely used to general illumination, LCD TV
(LED LCD TV) substitutes conventional light source.Middle power-type LED is generally 0.2w~0.8w, and high power type LED is generally 1w~3w.
Common LED, common problem are that, in LED long-term works, it produces big calorimetric, makes currently on the market
Obtaining LED reliability reduces, and has a strong impact on its quality, it is difficult to meets customer requirement or standard requirement.
The content of the invention
The purpose of the present invention is to propose to a kind of LED, overcomes the above-mentioned deficiency of prior art, and its structure design is simple,
Good heat dissipation effect, product use reliability is advantageously ensured that, extend product service life, meet market use demand, be advantageous to
Product promotion.
In order to reach above-mentioned purpose of design, the technical solution adopted by the present invention is as follows:
A kind of LED, including LED chip, ceramics seat, outer cover, heat sink, insulation plate, substrate, the ceramics seat one
The fixed LED chip in end, outside install the ceramics seat outside socket heat sink of LED chip one end, heat sink edge cover is buckled
Cover, in LED chip cover is buckled in by outer cover, insulation plate is provided with the downside of the heat sink, the insulation plate downside is provided with
Substrate.
Raised fin is provided with the downside of the heat sink.
The fin is the structure extended laterally by middle part so that is formed between fin and insulation plate outside
The heat dissipation channel of extension.
Mesopore, mesopore inwall parcel ceramics seat are provided with the middle part of the heat sink.
Through hole is provided with the middle part of the ceramics seat, the electrode wires of LED chip are stretched out by through hole.
The beneficial effect of LED of the present invention is:Its structure design is simple, good heat dissipation effect, advantageously ensures that production
Product use reliability, extend product service life, meet market use demand, be advantageous to product promotion.
Brief description of the drawings
Fig. 1 is the sectional view of LED of the present invention;
Fig. 2 is the rearview of the heat sink of LED of the present invention.
Embodiment
Preferred embodiment of the invention is described in further detail below.
As shown in Figure 1-2, in embodiment of the present invention, the LED, including LED chip 1, ceramics seat 2, outer cover 3, dissipate
LED core is fixed in hot plate 4, fin 5, insulation plate 6, substrate 7, through hole 8, electrode wires 9, mesopore 10, described one end of ceramics seat 2
Piece 1, the outside of the ceramics seat 2 socket heat sink 4 close to installation LED chip 1 one end, the heat distributed for absorbing LED chip 1,
Heat dispersion is improved, the edge cover of heat sink 4 buckles outer cover 3, in the cover of LED chip 1 is buckled in by outer cover 3, improves the peace of product
Full property and life-span, the downside of heat sink 4 are provided with insulation plate 6, improve the security of product, the insulation plate 6
Downside is provided with substrate 7, for fixing whole LED.
In the application, heat dispersion, the downside of heat sink 2 are provided with raised fin 5 in order to better improve.
The fin 5 is the structure extended laterally by middle part so that is formed between fin 5 and insulation plate 6
The heat dissipation channel to stretch out, further improve the thermal diffusivity of product.
The middle part of heat sink 4 is provided with mesopore 10, the inwall of mesopore 10 parcel ceramics seat 2.
In the application, product uses in order to better improve convenience, the middle part of ceramics seat 2 is provided with through hole 8, LED
The electrode wires 9 of chip 1 are stretched out by through hole 8.
Above content is to combine the further description that specific preferred embodiment is done to the present invention, is easy to the skill
The technical staff in art field is understood that and using the present invention, it is impossible to assert that the specific implementation of the present invention is confined to these explanations.
For general technical staff of the technical field of the invention, it can also make without departing from the inventive concept of the premise
Some simple deduction or replace, without by performing creative labour.Therefore, those skilled in the art's taking off according to the present invention
Show, the simple modifications made to the present invention all should be within protection scope of the present invention.
Claims (5)
- A kind of 1. LED, it is characterised in that:Including LED chip, ceramics seat, outer cover, heat sink, insulation plate, substrate, institute State ceramics seat one end and fix LED chip, socket heat sink, the heat sink on the outside of the ceramics seat of installation LED chip one end Edge cover buckles outer cover, and outer cover is provided with insulation plate, the insulated heat in LED chip cover is buckled on the downside of the heat sink Substrate is provided with the downside of plate.
- 2. LED according to claim 1, it is characterised in that:Raised fin is provided with the downside of the heat sink.
- 3. LED according to claim 2, it is characterised in that:The fin is the structure extended laterally by middle part, So that the heat dissipation channel to stretch out is formed between fin and insulation plate.
- 4. LED according to claim 3, it is characterised in that:Mesopore, mesopore inwall parcel are provided with the middle part of the heat sink Ceramics seat.
- 5. LED according to claim 4, it is characterised in that:Through hole, the electricity of LED chip are provided with the middle part of the ceramics seat Polar curve is stretched out by through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710926490.1A CN107740936A (en) | 2017-10-07 | 2017-10-07 | Led |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710926490.1A CN107740936A (en) | 2017-10-07 | 2017-10-07 | Led |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107740936A true CN107740936A (en) | 2018-02-27 |
Family
ID=61236667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710926490.1A Pending CN107740936A (en) | 2017-10-07 | 2017-10-07 | Led |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107740936A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101009992A (en) * | 2007-02-05 | 2007-08-01 | 深圳高力特通用电气有限公司 | Heat radiation device and lighting device |
CN201032117Y (en) * | 2007-05-21 | 2008-03-05 | 诸建平 | High-power LED lighting lamp |
CN201753859U (en) * | 2010-08-24 | 2011-03-02 | 东莞市光宇新能源科技有限公司 | High-power LED energy-saving lighting fixtures |
KR20160131447A (en) * | 2015-05-07 | 2016-11-16 | 조정기 | LED Light Source, Backlight and Liquid Crystal Display Apparatus |
-
2017
- 2017-10-07 CN CN201710926490.1A patent/CN107740936A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101009992A (en) * | 2007-02-05 | 2007-08-01 | 深圳高力特通用电气有限公司 | Heat radiation device and lighting device |
CN201032117Y (en) * | 2007-05-21 | 2008-03-05 | 诸建平 | High-power LED lighting lamp |
CN201753859U (en) * | 2010-08-24 | 2011-03-02 | 东莞市光宇新能源科技有限公司 | High-power LED energy-saving lighting fixtures |
KR20160131447A (en) * | 2015-05-07 | 2016-11-16 | 조정기 | LED Light Source, Backlight and Liquid Crystal Display Apparatus |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180227 |
|
RJ01 | Rejection of invention patent application after publication |