CN107740146A - A kind of intaglio plate copper plating additive - Google Patents

A kind of intaglio plate copper plating additive Download PDF

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Publication number
CN107740146A
CN107740146A CN201711022904.4A CN201711022904A CN107740146A CN 107740146 A CN107740146 A CN 107740146A CN 201711022904 A CN201711022904 A CN 201711022904A CN 107740146 A CN107740146 A CN 107740146A
Authority
CN
China
Prior art keywords
parts
intaglio plate
acid sodium
copper plating
plate copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711022904.4A
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Chinese (zh)
Inventor
张利明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TONGCHENG YUNCHENG PLATEMAKING CO Ltd
Original Assignee
TONGCHENG YUNCHENG PLATEMAKING CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TONGCHENG YUNCHENG PLATEMAKING CO Ltd filed Critical TONGCHENG YUNCHENG PLATEMAKING CO Ltd
Priority to CN201711022904.4A priority Critical patent/CN107740146A/en
Publication of CN107740146A publication Critical patent/CN107740146A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Abstract

The invention discloses a kind of intaglio plate copper plating additive, is made up of by weight the following raw material:20 22 parts of xylene disulfonic acid sodium, 8 10 parts of sulfamic acid sodium, 8 10 parts of polyethyleneimine, 24 parts of ethanol, 57 parts of wetting agent, 45 55 parts of 46 parts of sulfuric acid, the distilled water of mass concentration 98%.Instant component and dosage are scientific and reasonable, and method is simple, easily production, and easy to use, effect is good, are the improvement innovative to present additive, and both hardness was big, finish is good, and performance is flexible good, and effectively storage period length, are the innovations that intaglio plate is crossed on copper additives.

Description

A kind of intaglio plate copper plating additive
Technical field
The present invention relates to additive, specifically a kind of intaglio plate copper plating additive.
Background technology
Additive when being gravure electroplating copper must material because requirement of the electronic engraving printing gravure in engraving to copper High, hardness control is in 190-210HV, and copper ion arrangement will uniformly, and the additive used at present has two kinds, and such as Japan is greatly and hard Additive is spent, the defects of one kind is Hard, and its plating performance is good, and hardness, finish are all highly desirable, but its is maximum is hardness storage Phase is short, only 3-4 days;Another kind is COMSG, although its plating performance is not so good as Hard, hardness, finish are also all fine, its Performance is partially flexible, and biggest advantage was storage period length, up to 1-2 months, then how to develop that a kind of both hardness is big, finish Good, performance is flexible, and the Gravure hard copper additive of effectively storage period length is the technical problem for needing conscientiously to solve.
The content of the invention
The invention provides a kind of intaglio plate copper plating additive, to solve above-mentioned technical problem.
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:Xylene disulfonic acid sodium 20-22 parts, amino sulphur Sour sodium 8-10 parts, polyethyleneimine 8-10 parts, ethanol 2-4 parts, wetting agent 5-7 parts, sulfuric acid 4-6 parts of mass concentration 98%, steaming Distilled water 45-55 parts.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:20 parts of xylene disulfonic acid sodium, ammonia 8 parts of base sodium sulfonate, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, 45 parts of 4 parts of sulfuric acid, the distilled water of mass concentration 98%.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:21 parts of xylene disulfonic acid sodium, ammonia 9 parts of base sodium sulfonate, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, 50 parts of 5 parts of sulfuric acid, the distilled water of mass concentration 98%.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:22 parts of xylene disulfonic acid sodium, ammonia 10 parts of base sodium sulfonate, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, 6 parts of sulfuric acid, the distilled water 55 of mass concentration 98% Part.
Beneficial effects of the present invention:
Instant component and dosage are scientific and reasonable, and method is simple, easily production, and easy to use, effect is good, is to present The innovative improvement of additive, both hardness was big, finish is good, and performance is flexible good, and effectively storage period length, was that intaglio plate crosses copper addition Innovation in agent.
Embodiment
Embodiments of the invention are described in detail below, but what the present invention can be defined by the claims and cover Multitude of different ways is implemented.
Below by way of specific embodiment, the present invention will be described in detail.
The technical scheme that the present invention is embodied is:
Embodiment 1
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:20 parts of xylene disulfonic acid sodium, sulfamic acid sodium 8 parts, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, 45 parts of 4 parts of sulfuric acid, the distilled water of mass concentration 98%.
(4) finishing reason and packaging and storage.
Embodiment 2
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:21 parts of xylene disulfonic acid sodium, sulfamic acid sodium 9 parts, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, 50 parts of 5 parts of sulfuric acid, the distilled water of mass concentration 98%.
Embodiment 3
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material:22 parts of xylene disulfonic acid sodium, sulfamic acid sodium 10 parts, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, 55 parts of 6 parts of sulfuric acid, the distilled water of mass concentration 98%.
The embodiments of the present invention described above are not intended to limit the scope of the present invention, any in the present invention Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the claim protection model of the present invention Within enclosing.

Claims (4)

1. a kind of intaglio plate copper plating additive, it is characterised in that be made up of by weight the following raw material:Xylene disulfonic acid sodium 20-22 Part, sulfamic acid sodium 8-10 parts, polyethyleneimine 8-10 parts, ethanol 2-4 parts, wetting agent 5-7 parts, the sulfuric acid of mass concentration 98% 4-6 parts, distilled water 45-55 parts.
2. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight Into:20 parts of xylene disulfonic acid sodium, 8 parts of sulfamic acid sodium, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, mass concentration 98% 4 parts of sulfuric acid, 45 parts of distilled water.
3. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight Into:21 parts of xylene disulfonic acid sodium, 9 parts of sulfamic acid sodium, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, mass concentration 98% 5 parts of sulfuric acid, 50 parts of distilled water.
4. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight Into:22 parts of xylene disulfonic acid sodium, 10 parts of sulfamic acid sodium, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, mass concentration 98% 6 parts of sulfuric acid, 55 parts of distilled water.
CN201711022904.4A 2017-10-27 2017-10-27 A kind of intaglio plate copper plating additive Pending CN107740146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711022904.4A CN107740146A (en) 2017-10-27 2017-10-27 A kind of intaglio plate copper plating additive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711022904.4A CN107740146A (en) 2017-10-27 2017-10-27 A kind of intaglio plate copper plating additive

Publications (1)

Publication Number Publication Date
CN107740146A true CN107740146A (en) 2018-02-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711022904.4A Pending CN107740146A (en) 2017-10-27 2017-10-27 A kind of intaglio plate copper plating additive

Country Status (1)

Country Link
CN (1) CN107740146A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109371437A (en) * 2018-12-04 2019-02-22 东莞市同欣表面处理科技有限公司 A kind of intaglio plate acid electroplating hard copper additive and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102912388A (en) * 2012-10-11 2013-02-06 郑州市大有制版有限公司 Gravure hard copper additive
CN103014787A (en) * 2012-12-28 2013-04-03 广东达志环保科技股份有限公司 Copper-electroplating solution and electroplating process thereof
CN103757667A (en) * 2014-01-01 2014-04-30 安庆市亿豪工贸发展有限公司 Chrome plating additive and electroplating liquid thereof
CN104087985A (en) * 2014-06-25 2014-10-08 安徽长青电子机械(集团)有限公司 Copper coating method of metal part
CN104499021A (en) * 2014-12-29 2015-04-08 广东光华科技股份有限公司 Printed circuit board and electrocoppering process thereof
CN105200467A (en) * 2015-11-02 2015-12-30 江苏梦得电镀化学品有限公司 Intaglio hard copper additive and plating solution
CN107268042A (en) * 2017-06-02 2017-10-20 吕艺璇 A kind of electronic engraving printing gravure hard copper additive

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102912388A (en) * 2012-10-11 2013-02-06 郑州市大有制版有限公司 Gravure hard copper additive
CN103014787A (en) * 2012-12-28 2013-04-03 广东达志环保科技股份有限公司 Copper-electroplating solution and electroplating process thereof
CN103757667A (en) * 2014-01-01 2014-04-30 安庆市亿豪工贸发展有限公司 Chrome plating additive and electroplating liquid thereof
CN104087985A (en) * 2014-06-25 2014-10-08 安徽长青电子机械(集团)有限公司 Copper coating method of metal part
CN104499021A (en) * 2014-12-29 2015-04-08 广东光华科技股份有限公司 Printed circuit board and electrocoppering process thereof
CN105200467A (en) * 2015-11-02 2015-12-30 江苏梦得电镀化学品有限公司 Intaglio hard copper additive and plating solution
CN107268042A (en) * 2017-06-02 2017-10-20 吕艺璇 A kind of electronic engraving printing gravure hard copper additive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109371437A (en) * 2018-12-04 2019-02-22 东莞市同欣表面处理科技有限公司 A kind of intaglio plate acid electroplating hard copper additive and preparation method thereof

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Application publication date: 20180227