CN107740146A - A kind of intaglio plate copper plating additive - Google Patents
A kind of intaglio plate copper plating additive Download PDFInfo
- Publication number
- CN107740146A CN107740146A CN201711022904.4A CN201711022904A CN107740146A CN 107740146 A CN107740146 A CN 107740146A CN 201711022904 A CN201711022904 A CN 201711022904A CN 107740146 A CN107740146 A CN 107740146A
- Authority
- CN
- China
- Prior art keywords
- parts
- intaglio plate
- acid sodium
- copper plating
- plate copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000654 additive Substances 0.000 title claims abstract description 24
- 230000000996 additive Effects 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 21
- 239000010949 copper Substances 0.000 title claims abstract description 21
- 238000007747 plating Methods 0.000 title claims abstract description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- KEAYESYHFKHZAL-UHFFFAOYSA-N sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 16
- 239000011734 sodium Substances 0.000 claims abstract description 16
- 229920002873 Polyethylenimine Polymers 0.000 claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 12
- 239000012153 distilled water Substances 0.000 claims abstract description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 239000000080 wetting agent Substances 0.000 claims abstract description 12
- 239000008096 xylene Substances 0.000 claims abstract description 12
- ZCJHFOLNXNSZJG-UHFFFAOYSA-N [Na].NS(O)(=O)=O Chemical compound [Na].NS(O)(=O)=O ZCJHFOLNXNSZJG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-L Sulphite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
The invention discloses a kind of intaglio plate copper plating additive, is made up of by weight the following raw material：20 22 parts of xylene disulfonic acid sodium, 8 10 parts of sulfamic acid sodium, 8 10 parts of polyethyleneimine, 24 parts of ethanol, 57 parts of wetting agent, 45 55 parts of 46 parts of sulfuric acid, the distilled water of mass concentration 98%.Instant component and dosage are scientific and reasonable, and method is simple, easily production, and easy to use, effect is good, are the improvement innovative to present additive, and both hardness was big, finish is good, and performance is flexible good, and effectively storage period length, are the innovations that intaglio plate is crossed on copper additives.
Description
Technical field
The present invention relates to additive, specifically a kind of intaglio plate copper plating additive.
Background technology
Additive when being gravure electroplating copper must material because requirement of the electronic engraving printing gravure in engraving to copper
High, hardness control is in 190-210HV, and copper ion arrangement will uniformly, and the additive used at present has two kinds, and such as Japan is greatly and hard
Additive is spent, the defects of one kind is Hard, and its plating performance is good, and hardness, finish are all highly desirable, but its is maximum is hardness storage
Phase is short, only 3-4 days；Another kind is COMSG, although its plating performance is not so good as Hard, hardness, finish are also all fine, its
Performance is partially flexible, and biggest advantage was storage period length, up to 1-2 months, then how to develop that a kind of both hardness is big, finish
Good, performance is flexible, and the Gravure hard copper additive of effectively storage period length is the technical problem for needing conscientiously to solve.
The content of the invention
The invention provides a kind of intaglio plate copper plating additive, to solve above-mentioned technical problem.
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：Xylene disulfonic acid sodium 20-22 parts, amino sulphur
Sour sodium 8-10 parts, polyethyleneimine 8-10 parts, ethanol 2-4 parts, wetting agent 5-7 parts, sulfuric acid 4-6 parts of mass concentration 98%, steaming
Distilled water 45-55 parts.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：20 parts of xylene disulfonic acid sodium, ammonia
8 parts of base sodium sulfonate, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, 45 parts of 4 parts of sulfuric acid, the distilled water of mass concentration 98%.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：21 parts of xylene disulfonic acid sodium, ammonia
9 parts of base sodium sulfonate, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, 50 parts of 5 parts of sulfuric acid, the distilled water of mass concentration 98%.
Preferably, a kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：22 parts of xylene disulfonic acid sodium, ammonia
10 parts of base sodium sulfonate, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, 6 parts of sulfuric acid, the distilled water 55 of mass concentration 98%
Part.
Beneficial effects of the present invention：
Instant component and dosage are scientific and reasonable, and method is simple, easily production, and easy to use, effect is good, is to present
The innovative improvement of additive, both hardness was big, finish is good, and performance is flexible good, and effectively storage period length, was that intaglio plate crosses copper addition
Innovation in agent.
Embodiment
Embodiments of the invention are described in detail below, but what the present invention can be defined by the claims and cover
Multitude of different ways is implemented.
Below by way of specific embodiment, the present invention will be described in detail.
The technical scheme that the present invention is embodied is：
Embodiment 1
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：20 parts of xylene disulfonic acid sodium, sulfamic acid sodium
8 parts, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, 45 parts of 4 parts of sulfuric acid, the distilled water of mass concentration 98%.
(4) finishing reason and packaging and storage.
Embodiment 2
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：21 parts of xylene disulfonic acid sodium, sulfamic acid sodium
9 parts, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, 50 parts of 5 parts of sulfuric acid, the distilled water of mass concentration 98%.
Embodiment 3
A kind of intaglio plate copper plating additive, it is made up of by weight the following raw material：22 parts of xylene disulfonic acid sodium, sulfamic acid sodium
10 parts, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, 55 parts of 6 parts of sulfuric acid, the distilled water of mass concentration 98%.
The embodiments of the present invention described above are not intended to limit the scope of the present invention, any in the present invention
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (4)
1. a kind of intaglio plate copper plating additive, it is characterised in that be made up of by weight the following raw material：Xylene disulfonic acid sodium 20-22
Part, sulfamic acid sodium 8-10 parts, polyethyleneimine 8-10 parts, ethanol 2-4 parts, wetting agent 5-7 parts, the sulfuric acid of mass concentration 98%
4-6 parts, distilled water 45-55 parts.
2. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight
Into：20 parts of xylene disulfonic acid sodium, 8 parts of sulfamic acid sodium, 8 parts of polyethyleneimine, 2 parts of ethanol, 5 parts of wetting agent, mass concentration
98% 4 parts of sulfuric acid, 45 parts of distilled water.
3. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight
Into：21 parts of xylene disulfonic acid sodium, 9 parts of sulfamic acid sodium, 9 parts of polyethyleneimine, 3 parts of ethanol, 6 parts of wetting agent, mass concentration
98% 5 parts of sulfuric acid, 50 parts of distilled water.
4. a kind of intaglio plate copper plating additive according to claim 1, it is characterised in that by the following raw material group by weight
Into：22 parts of xylene disulfonic acid sodium, 10 parts of sulfamic acid sodium, 10 parts of polyethyleneimine, 4 parts of ethanol, 7 parts of wetting agent, mass concentration
98% 6 parts of sulfuric acid, 55 parts of distilled water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711022904.4A CN107740146A (en) | 2017-10-27 | 2017-10-27 | A kind of intaglio plate copper plating additive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711022904.4A CN107740146A (en) | 2017-10-27 | 2017-10-27 | A kind of intaglio plate copper plating additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107740146A true CN107740146A (en) | 2018-02-27 |
Family
ID=61238472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711022904.4A Pending CN107740146A (en) | 2017-10-27 | 2017-10-27 | A kind of intaglio plate copper plating additive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107740146A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109371437A (en) * | 2018-12-04 | 2019-02-22 | 东莞市同欣表面处理科技有限公司 | A kind of intaglio plate acid electroplating hard copper additive and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912388A (en) * | 2012-10-11 | 2013-02-06 | 郑州市大有制版有限公司 | Gravure hard copper additive |
| CN103014787A (en) * | 2012-12-28 | 2013-04-03 | 广东达志环保科技股份有限公司 | Copper-electroplating solution and electroplating process thereof |
| CN103757667A (en) * | 2014-01-01 | 2014-04-30 | 安庆市亿豪工贸发展有限公司 | Chrome plating additive and electroplating liquid thereof |
| CN104087985A (en) * | 2014-06-25 | 2014-10-08 | 安徽长青电子机械（集团）有限公司 | Copper coating method of metal part |
| CN104499021A (en) * | 2014-12-29 | 2015-04-08 | 广东光华科技股份有限公司 | Printed circuit board and electrocoppering process thereof |
| CN105200467A (en) * | 2015-11-02 | 2015-12-30 | 江苏梦得电镀化学品有限公司 | Intaglio hard copper additive and plating solution |
| CN107268042A (en) * | 2017-06-02 | 2017-10-20 | 吕艺璇 | A kind of electronic engraving printing gravure hard copper additive |
-
2017
- 2017-10-27 CN CN201711022904.4A patent/CN107740146A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912388A (en) * | 2012-10-11 | 2013-02-06 | 郑州市大有制版有限公司 | Gravure hard copper additive |
| CN103014787A (en) * | 2012-12-28 | 2013-04-03 | 广东达志环保科技股份有限公司 | Copper-electroplating solution and electroplating process thereof |
| CN103757667A (en) * | 2014-01-01 | 2014-04-30 | 安庆市亿豪工贸发展有限公司 | Chrome plating additive and electroplating liquid thereof |
| CN104087985A (en) * | 2014-06-25 | 2014-10-08 | 安徽长青电子机械（集团）有限公司 | Copper coating method of metal part |
| CN104499021A (en) * | 2014-12-29 | 2015-04-08 | 广东光华科技股份有限公司 | Printed circuit board and electrocoppering process thereof |
| CN105200467A (en) * | 2015-11-02 | 2015-12-30 | 江苏梦得电镀化学品有限公司 | Intaglio hard copper additive and plating solution |
| CN107268042A (en) * | 2017-06-02 | 2017-10-20 | 吕艺璇 | A kind of electronic engraving printing gravure hard copper additive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109371437A (en) * | 2018-12-04 | 2019-02-22 | 东莞市同欣表面处理科技有限公司 | A kind of intaglio plate acid electroplating hard copper additive and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180227 |