CN107676755A - The good LED of thermal diffusivity - Google Patents

The good LED of thermal diffusivity Download PDF

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Publication number
CN107676755A
CN107676755A CN201710926483.1A CN201710926483A CN107676755A CN 107676755 A CN107676755 A CN 107676755A CN 201710926483 A CN201710926483 A CN 201710926483A CN 107676755 A CN107676755 A CN 107676755A
Authority
CN
China
Prior art keywords
led
thermal diffusivity
ceramics seat
heat sink
good
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710926483.1A
Other languages
Chinese (zh)
Inventor
谭瑞银
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201710926483.1A priority Critical patent/CN107676755A/en
Publication of CN107676755A publication Critical patent/CN107676755A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention discloses a kind of good LED of thermal diffusivity, including LED wafer, heat sink, ceramics seat, substrate, the LED wafer is fixed on ceramics seat one end, the ceramics seat is fixed on substrate, socket heat sink on the outside of one end of the ceramics seat installation LED wafer, heat sink stretches out, and absorbs the heat distributed around LED wafer.Its structure design is simple, good heat dissipation effect, advantageously ensures that product use reliability, extends product service life, meets market use demand, be advantageous to product promotion.

Description

The good LED of thermal diffusivity
Technical field
The invention belongs to lighting technical field, and in particular to a kind of good LED of thermal diffusivity.
Background technology
Constantly lifted with LED luminous efficiency, white LED light source is widely used to general illumination, LCD TV (LED LCD TV) substitutes conventional light source.Middle power-type LED is generally 0.2w~0.8w, and high power type LED is generally 1w~3w.
Common LED, common problem are that, in LED long-term works, it produces big calorimetric, makes currently on the market Obtaining LED reliability reduces, and has a strong impact on its quality, it is difficult to meets customer requirement or standard requirement.
The content of the invention
The purpose of the present invention is to propose to a kind of good LED of thermal diffusivity, the above-mentioned deficiency of prior art is overcome, its structure is set Meter is simple, good heat dissipation effect, advantageously ensures that product use reliability, extends product service life, meets market use demand, Be advantageous to product promotion.
In order to reach above-mentioned purpose of design, the technical solution adopted by the present invention is as follows：
A kind of good LED of thermal diffusivity, including LED wafer, heat sink, ceramics seat, substrate, the LED wafer are fixed on pottery Porcelain seat one end, the ceramics seat are fixed on substrate, socket heat sink on the outside of one end of the ceramics seat installation LED wafer, are dissipated Hot plate stretches out, and absorbs the heat distributed around LED wafer.
The heat sink edge extends downwardly, and forms extension, multiple raised fin are provided with the outside of extension.
The extension exceeds substrate outer.
In the middle part of the heat sink parcel is provided with socket ceramics seat.
Insulation plate is provided between the heat sink and substrate.
The LED wafer outside mask button outer cover.
Through hole is provided with the middle part of the ceramics seat, the electrode wires of LED wafer are stretched out by through hole.
The good LED of thermal diffusivity of the present invention beneficial effect is：Its structure design is simple, good heat dissipation effect, favorably In ensureing product use reliability, extend product service life, meet market use demand, be advantageous to product promotion.
Brief description of the drawings
Fig. 1 is the good LED of thermal diffusivity of the present invention schematic diagram；
Fig. 2 is the good LED of thermal diffusivity of the present invention sectional view.
Embodiment
Preferred embodiment of the invention is described in further detail below.
As shown in Figure 1-2, in embodiment of the present invention, the good LED of the thermal diffusivity, including LED wafer 1, heat sink 2, Ceramics seat 3, outer cover 4, insulation plate 5, substrate 6, the LED wafer 1 are fixed on the one end of ceramics seat 3, and the ceramics seat 3 is fixed On substrate 6, in order to improve the thermal diffusivity of LED wafer 1, the ceramics seat 3 installs socket radiating on the outside of one end of LED wafer 1 Plate 2, heat sink 2 stretch out, and absorb the heat distributed around LED wafer 1, good heat dissipation effect, advantageously ensure that product makes With reliability, extend product service life.
In the application, heat dispersion, the edge of heat sink 2 extend downwardly in order to better improve, form extension 22, The outside of extension 22 is provided with multiple raised fin 23, is radiated.
The extension 22 exceeds the outer of substrate 6, and heat dispersion is more preferable.
Parcel 21 is provided with the middle part of the heat sink 2 socket ceramics seat 3, parcel 21, can closer to LED wafer 1 Preferably absorb the heat that LED wafer 1 distributes.
In the application, the security of product in order to better improve, be provided between the heat sink 2 and substrate 6 insulation every Hot plate 5.
In the application, the security and service life of product in order to better improve, outside the outside mask button of LED wafer 1 Cover 4.
In the application, product uses in order to better improve convenience, the middle part of ceramics seat 2 is provided with through hole 21, LED The electrode wires 11 of chip 1 are stretched out by through hole 21.
Above content is to combine the further description that specific preferred embodiment is done to the present invention, is easy to the skill The technical staff in art field is understood that and using the present invention, it is impossible to assert that the specific implementation of the present invention is confined to these explanations. For general technical staff of the technical field of the invention, it can also make without departing from the inventive concept of the premise Some simple deduction or replace, without by performing creative labour.Therefore, those skilled in the art's taking off according to the present invention Show, the simple modifications made to the present invention all should be within protection scope of the present invention.

Claims (7)

  1. A kind of 1. good LED of thermal diffusivity, it is characterised in that：Including LED wafer, heat sink, ceramics seat, substrate, the LED wafer Ceramics seat one end is fixed on, the ceramics seat is fixed on substrate, and socket is scattered on the outside of one end of the ceramics seat installation LED wafer Hot plate, heat sink stretch out, and absorb the heat distributed around LED wafer.
  2. 2. the good LED of thermal diffusivity according to claim 1, it is characterised in that：The heat sink edge extends downwardly, and is formed Extension, extension outside are provided with multiple raised fin.
  3. 3. the good LED of thermal diffusivity according to claim 2, it is characterised in that：The extension exceeds substrate outer.
  4. 4. the good LED of thermal diffusivity according to claim 3, it is characterised in that：In the middle part of the heat sink at socket ceramics seat Provided with parcel.
  5. 5. the good LED of thermal diffusivity according to claim 4, it is characterised in that：It is provided between the heat sink and substrate exhausted Edge thermal insulation board.
  6. 6. the good LED of thermal diffusivity according to claim 5, it is characterised in that：The LED wafer outside mask button outer cover.
  7. 7. the good LED of thermal diffusivity according to claim 6, it is characterised in that：Through hole, LED are provided with the middle part of the ceramics seat The electrode wires of chip are stretched out by through hole.
CN201710926483.1A 2017-10-07 2017-10-07 The good LED of thermal diffusivity Pending CN107676755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710926483.1A CN107676755A (en) 2017-10-07 2017-10-07 The good LED of thermal diffusivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710926483.1A CN107676755A (en) 2017-10-07 2017-10-07 The good LED of thermal diffusivity

Publications (1)

Publication Number Publication Date
CN107676755A true CN107676755A (en) 2018-02-09

Family

ID=61139766

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710926483.1A Pending CN107676755A (en) 2017-10-07 2017-10-07 The good LED of thermal diffusivity

Country Status (1)

Country Link
CN (1) CN107676755A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101009992A (en) * 2007-02-05 2007-08-01 深圳高力特通用电气有限公司 Heat radiation device and lighting device
CN201032117Y (en) * 2007-05-21 2008-03-05 诸建平 High-power LED lighting lamp
CN204285064U (en) * 2014-12-31 2015-04-22 浙江盛开光电有限公司 The removable LED of a kind of radiator
KR20160131447A (en) * 2015-05-07 2016-11-16 조정기 LED Light Source, Backlight and Liquid Crystal Display Apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101009992A (en) * 2007-02-05 2007-08-01 深圳高力特通用电气有限公司 Heat radiation device and lighting device
CN201032117Y (en) * 2007-05-21 2008-03-05 诸建平 High-power LED lighting lamp
CN204285064U (en) * 2014-12-31 2015-04-22 浙江盛开光电有限公司 The removable LED of a kind of radiator
KR20160131447A (en) * 2015-05-07 2016-11-16 조정기 LED Light Source, Backlight and Liquid Crystal Display Apparatus

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Application publication date: 20180209

RJ01 Rejection of invention patent application after publication