CN107590421A - Optical fingerprint sensor module - Google Patents
Optical fingerprint sensor module Download PDFInfo
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- CN107590421A CN107590421A CN201610536745.9A CN201610536745A CN107590421A CN 107590421 A CN107590421 A CN 107590421A CN 201610536745 A CN201610536745 A CN 201610536745A CN 107590421 A CN107590421 A CN 107590421A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
Abstract
A kind of optical fingerprint sensor module, including：Optical fingerprint sensor；Planar backlight；The optical fingerprint sensor has and an only transparent substrates；The first surface of the transparent substrates is directly used in finger print contact；The second surface of the transparent substrates has device layer；The device layer has pixel region；The pixel region has multiple pixels；Each pixel has transmission region and non-transparent region；The non-transparent region has photo-sensitive cell；The transmission region enables the pixel region of the light through the device layer；The planar backlight is located at below the device layer, and the emergent light of the planar backlight passes through the device layer from the transmission region, enters back into the transparent substrates.The optical fingerprint sensor modular structure optimization, performance improve.
Description
Technical field
The present invention relates to optical finger print to identify field, more particularly to a kind of optical fingerprint sensor module.
Background technology
Fingerprint imaging identification technology, be the fingerprint image that human body is collected by optical fingerprint sensor, then with system
In existing fingerprint imaging information be compared, whether carry out correct judgment, and then realize the technology of identification.Due to its use
Convenience, and the uniqueness of somatic fingerprint, fingerprint imaging identification technology be widely used in every field.Such as public security
Consumer product area such as the office and field of safety check such as customs, the gate control system of building and PC and mobile phone etc..Fingerprint imaging
The implementation of identification technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Comparatively, optical finger print into
Picture identification technology imaging effect is relatively preferable, and equipment cost is relatively low.
More contents about optical fingerprint sensor refer to Publication No. CN204759454U Chinese utility model
Patent.
The structure of existing optical fingerprint sensor module has much room for improvement, and performance has much room for improvement.
The content of the invention
The present invention solves the problems, such as to be to provide a kind of optical fingerprint sensor module, to optimize optical fingerprint sensor module
Structure, improve optical fingerprint sensor module performance.
To solve the above problems, the present invention provides a kind of optical fingerprint sensor module, including：Optical fingerprint sensor；
Planar backlight；The optical fingerprint sensor has and an only transparent substrates；The first surface of the transparent substrates is direct
Contacted for finger print；The second surface of the transparent substrates has device layer；The device layer has pixel region；The picture
Plain area has multiple pixels；Each pixel has transmission region and non-transparent region；The non-transparent region has photosensitive
Element；The transmission region enables the pixel region of the light through the device layer；The planar backlight is positioned at described
Below device layer, the emergent light of the planar backlight passes through the device layer from the transmission region, enters back into the printing opacity
Substrate.
Optionally, a pixel also includes light shield layer, and the photo-sensitive cell is located at the light shield layer and the printing opacity
Between substrate, the light shield layer is between the photo-sensitive cell and the planar backlight.
Optionally, also include between the optical fingerprint sensor and the planar backlight in light collecting layer and light collimation layer
At least one layer, the light collecting layer and light collimation layer makes the angular range of the light of transmission diminish.
Optionally, the light collecting layer, the optically focused are included between the optical fingerprint sensor and the planar backlight
Layer includes basalis and multiple dimpling lens units, and the dimpling lens unit is located at the basalis upper and lower surface
At least one.
Optionally, the dimpling lens unit is located at the basalis upper surface, and the basalis lower surface is flat, described
The lower surface of basalis is bonded with the upper surface of the planar backlight；Or the dimpling lens unit is located at the substrate
Layer lower surface, the basalis upper surface is flat, and the upper surface of the basalis and the bottom surface of the optical fingerprint sensor are pasted
Close.
Optionally, the light collecting layer also includes filling and leading up layer；The dimpling lens unit is located at the basalis upper surface, institute
State that basalis lower surface is flat, the layer of filling and leading up fills and leads up the basalis upper surface with the dimpling lens unit；Or
Person, the dimpling lens unit are located at the basalis lower surface, and the basalis upper surface is flat, and the layer of filling and leading up will have
The basalis lower surface of the dimpling lens unit is filled and led up；Or the dimpling lens unit is located on the basalis
Surface and lower surface, the layer of filling and leading up fill and lead up the basalis upper and lower surface with the dimpling lens unit.
Optionally, crown, spherical, the conical or pyramid that is shaped as ellipsoid of the dimpling lens unit；It is described
The size of dimpling lens unit is less than the size of the pixel；The refractive index for filling and leading up layer is less than the dimpling lens unit
Refractive index.
Optionally, the light collecting layer, the optically focused are included between the optical fingerprint sensor and the planar backlight
Layer includes flatness layer and the multiple dimpling lens units being distributed in the flatness layer.
Optionally, crown, spherical, the conical or pyramid that is shaped as ellipsoid of the dimpling lens unit；It is described
The size of dimpling lens unit is less than the size of the pixel；The refractive index of the flatness layer is less than the dimpling lens unit
Refractive index.
Optionally, light collimation layer, the light are included between the optical fingerprint sensor and the planar backlight
Collimation layer has shading framework and is evenly distributed on multiple loopholes of the shading framework.
Optionally, the light collimation layer is single layer structure or sandwich construction；When light collimation layer is single layer structure,
Including shading framework and multiple loopholes；When light collimation layer is sandwich construction, all include shading framework in every Rotating fields
With multiple loopholes, and the loophole between different layers is overlapped.
Optionally, the area of the loophole is less than the area of the pixel, the ratio of the Kong Gaoyu diameters of the loophole
Example is more than 1.
Optionally, the first surface of the transparent substrates and at least one of which surface of the second surface have
Filter layer.
Compared with prior art, technical scheme has advantages below：
In the optical fingerprint sensor module that technical scheme is provided, optical fingerprint sensor only includes one
Transparent substrates, now, the light that planar backlight is sent is when through optical fingerprint sensor, it is only necessary to through device layer and one
Individual transparent substrates, therefore, the substrate that light passes through are less, help to be formed clearly fingerprint image.Simultaneously as optical finger print
Sensor construction is simple, and thickness reduces, and simplifies the structure of optical fingerprint sensor module, reduces cost.In addition, planar is carried on the back
The light that light source is sent reaches the light increase of transparent substrates first surface, whole optics after device layer and transparent substrates
Fingerprint sensor module can more accurately realize the identification of fingerprint image, further increase the definition of fingerprint image, and
Further simplify the structure of optical fingerprint sensor module, reduce cost.
Further, also include between the optical fingerprint sensor and the planar backlight in light collecting layer and light collimation layer
At least one layer.By setting light collecting layer and (or) light to collimate layer between optical fingerprint sensor and planar backlight, so as to
Enable from planar backlight project radiation direction by light collecting layer and (or) light collimation layer adjustment, make a large amount of light all with compared with
Small angular range injects protective layer, and corresponding angle between angular range and protective layer upper surface is all close to straight
Angle, cause the reflected light of different angle to interfere with each other because ranges of incidence angles is larger so as to both reduce, ensure reflection light again
The pixel nearer from its pip is irradiated to, so as to improve the definition for the fingerprint image that optical fingerprint sensor module is formed
And the degree of accuracy.
Further, the light collecting layer includes basalis and multiple dimpling lens units, being shaped as dimpling lens unit are ellipse
It is spherical.Dimpling lens unit is located at substrate surface.Dimpling lens unit spotlight effect is good, and converged light is uniform.
Further, the light collecting layer includes flatness layer and the multiple dimpling lens units being distributed in flatness layer.Wherein, it is micro-
Convex lens mirror unit is that ellipsoid is crown.Dimpling lens unit is wrapped in inside it by flatness layer, and flatness layer upper and lower surface
Flat, the whole light collecting layer upper and lower surface is flat, is more beneficial for assembling with other structures.
Further, light is set to collimate layer, light collimation layer between the optical fingerprint sensor and the planar backlight
With shading framework and the multiple loopholes for being evenly distributed on shading framework., can be by shading when skew ray is irradiated into loophole
Framework absorbs.So as to only allow the light of angle more vertically upward to pass through, so that light collimation layer can realize light collimation
Effect.Make a large amount of light and protective layer, and corresponding angular range and protective layer upper surface are all injected with less angular range
Between angle all close to right angle, so as to both reduce because ranges of incidence angles is larger cause different angle reflected light it is mutual
Interference, ensures that reflection light is irradiated to the pixel nearer from its pip, so as to improve optical fingerprint sensor module institute shape again
Into fingerprint image definition and the degree of accuracy.
Brief description of the drawings
Fig. 1 is the optical fingerprint sensor module cross-sectional view that first embodiment of the invention is provided；
Fig. 2 is the optical fingerprint sensor module cross-sectional view that second embodiment of the invention is provided；
Fig. 3 is the optical fingerprint sensor module cross-sectional view that third embodiment of the invention is provided；
Fig. 4 is light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3；
Fig. 5 is light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Fig. 6 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Fig. 7 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Fig. 8 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Fig. 9 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Figure 10 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Figure 11 is another light collecting layer structure schematic diagram in optical fingerprint sensor module shown in Fig. 3 in other embodiments；
Figure 12 is the optical fingerprint sensor module cross-sectional view that fourth embodiment of the invention is provided；
Figure 13 is the light collimation layer schematic diagram of optical fingerprint sensor module shown in Figure 12.
Embodiment
In a kind of existing optical fingerprint sensor, it usually needs including transparent substrates and protective layer.This structure can not be kept away
Cause the thickness of whole optical fingerprint sensor larger with exempting from.And the light that larger thickness also causes light source to send need by
Longer light path just reaches photo-sensitive cell, causes the fingerprint image quality of collection can not further to improve.
Therefore, the present invention provides a kind of new optical fingerprint sensor module, by the knot for simplifying optical fingerprint sensor
Structure, protective layer is omitted, so as to reduce not only optical fingerprint sensor module thickness, and improve formed fingerprint image matter
Amount.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
First embodiment of the invention provides a kind of optical fingerprint sensor module, refer to Fig. 1.
The optical fingerprint sensor module includes optical fingerprint sensor 110 and planar backlight 120.Optical finger print passes
Sensor 110 has and an only transparent substrates 111.The first surface (not marking) of transparent substrates 111 is directly used in finger print
Contact.The second surface (not marking) of transparent substrates 111 has device layer 112.
In Fig. 1, the first surface is the upper surface of transparent substrates 111, and the second surface is under transparent substrates 111
Surface.
Though not distinctly displayed in figure, device layer 112 has pixel region.The pixel region has multiple pixels.Each
The pixel has transmission region and non-transparent region.The non-transparent region has photo-sensitive cell.The transmission region makes light
Line can pass through the pixel region of the device layer 112.
It refer to Fig. 1, planar backlight 120 is located at the lower section of device layer 112, and the emergent light of planar backlight 120 is from described
Transmission region passes through device layer 112, enters back into transparent substrates 111.
In the present embodiment, planar backlight 120 include point source of light 121 and light guide plate 122 (i.e. planar backlight 120 by
Point source of light 121 and light guide plate 122 are formed).Point source of light is LED.
In other embodiments, the planar backlight can also directly be area light source structure (the face battle array from main light emission
Structure), for example be Organic Light Emitting Diode area source or electroluminescence area source etc..
In other embodiments, point source of light can also be other suitable lamp sources, for example, fluorescent lamp.
In the present embodiment, point source of light 121 is arranged on outside one of side of light guide plate 122.Point source of light 121 is sent
Light in certain dispersion angle, be irradiated into light guide plate 122.
In other embodiments, point source of light can also be embedded within light guide plate.
In the present embodiment, the thickness T1 of transparent substrates 111 can be in below 0.4cm, and transparent substrates 111 are too thin mechanical strong
Degree is poor, can not ensure the reliability of optical fingerprint sensor 110.Transparent substrates 111 are too thick, whole optical fingerprint sensor mould
Group thickness increase, produces various adverse effects.
In the present embodiment, the thickness (not marking) of device layer 112 can be at 0.5 μm to 5 μm.Device layer 112 is too thin, device
Device performance in part layer 112 does not reach requirement.Device layer 112 is too thick, and existing technique can not produce respective performances
Device, if process modification, the corresponding thickness of device layer 112 can further reduce.
Though not shown in figure, in the present embodiment, a pixel also includes light shield layer, and the photo-sensitive cell is located at the screening
Between photosphere and transparent substrates 111, the light shield layer is between the photo-sensitive cell and planar backlight 120.Due to described
Light shield layer is arranged on relevant position, and therefore, the photo-sensitive cell can only receive the light for entering device layer 112 from transparent substrates 111
Signal, and the emergent light of planar backlight 120 can not be irradiated to the photo-sensitive cell directly below from device layer 112.
In other embodiments, the first surface of the transparent substrates and at least one of which table of the second surface
Face can have filter layer.The filter layer can include at least one of interference reflecting layer and light absorbing layer.Wherein, do
Relating to emission layer and can increasing has finger with without the reflected light difference at finger, so as to increase picture contrast, reducing ambient light pair
The interference of fingerprint image, to reduce influence of the ambient light to fingerprint imaging.
In the optical fingerprint sensor module that the present embodiment is provided, optical fingerprint sensor 110 only includes a printing opacity
Substrate 111, now, the light that planar backlight 120 is sent is when through optical fingerprint sensor 110, it is only necessary to through device
Layer 112 and a transparent substrates 111, therefore, the substrate that light passes through are less, help to be formed clearly fingerprint image.Meanwhile
Because optical fingerprint sensor 110 is simple in construction, thickness reduces, and simplifies the structure of optical fingerprint sensor module, reduces
Cost.In addition, the light that planar backlight 120 is sent after device layer 112 and transparent substrates 111, reaches transparent substrates 111
The light increase of first surface, whole optical fingerprint sensor module can more accurately realize the identification of fingerprint image, enter one
Step improves the definition of fingerprint image, and further simplifies the structure of optical fingerprint sensor module, reduces cost.
Second embodiment of the invention provides another optical fingerprint sensor module, refer to Fig. 2.
The optical fingerprint sensor module includes optical fingerprint sensor 210 and planar backlight 220.Optical finger print passes
Sensor 210 has and an only transparent substrates 211.The first surface (not marking) of transparent substrates 211 is directly used in finger print
Contact.The second surface (not marking) of transparent substrates 211 has device layer 212.In Fig. 2, the first surface is transparent substrates
211 upper surface, the second surface are the lower surface of transparent substrates 211.
Though not distinctly displayed in figure, device layer 212 has pixel region.The pixel region has multiple pixels.Each
The pixel has transmission region and non-transparent region.The non-transparent region has photo-sensitive cell.The transmission region makes light
Line can pass through the pixel region of the device layer 212.
The planar backlight 220 is located at the lower section of device layer 212, and the emergent light of planar backlight 220 is worn from transmission region
Device layer 212 is crossed, enters back into transparent substrates 211.
In the present embodiment, the planar backlight 220 includes point source of light 221 and light guide plate 222, and point source of light is LED
Lamp.Point source of light 221 is arranged on outside one of side of light guide plate 222.The light that point source of light 221 is sent is in certain diverging
In angle, light guide plate 222 is irradiated into.
In the present embodiment, light collecting layer 230 is also included between optical fingerprint sensor 210 and planar backlight 220.Light collecting layer
230 are enabled to change from the radiation direction that light guide plate 222 projects, and the light for making to be distributed in larger angle scope originally is adjusted
Being made into the light being distributed in the range of smaller angle, i.e. light collecting layer 230 upwardly propagates as far as possible light concentration, so that
Most of light as far as possible with first surface is perpendicular or subvertical relation.Therefore, after light collecting layer 230 is set, this reality
Applying example and both having reduced causes the reflected light of different angle to interfere with each other because ranges of incidence angles is larger, ensures that reflection light is irradiated to again
The pixel nearer from its incident ray, so as to improve the definition for the fingerprint image that optical fingerprint sensor module is formed and standard
Exactness.
It should be noted that in other embodiments, light collecting layer 230 can use up collimation layer and replace.The light collimates layer energy
The light choosing for enough projecting light guide plate collimates layer optionally through light, and only more (direction is more vertical vertically upward in direction
Mean that the direction of light can form larger angle with follow-up protective layer upper surface upwards) light can be collimated by light
Layer.Therefore, likewise, set light collimate layer both reduced because ranges of incidence angles is larger cause between incident light caused by reflected light
Interfere with each other, ensure that reflection light is irradiated to the pixel nearer from its incident ray again, so as to improve optical fingerprint sensor mould
The definition of the formed fingerprint image of group and the degree of accuracy.
It should be noted that in other embodiments, can also both include between the optical fingerprint sensor and light guide plate
Light collecting layer, include light collimation layer again.
In the present embodiment, as a result of light collecting layer 230, the thickness T2 maximums of transparent substrates 211 can be 5cm, printing opacity
Substrate 211 is thicker, it is possible to increase mechanical strength.
The structure and property of more optical fingerprint sensor modules provided about the present embodiment, refer to foregoing implementation
The optical fingerprint sensor module corresponding contents that example is provided.
Third embodiment of the invention provides another optical fingerprint sensor module, refer to Fig. 3.
The optical fingerprint sensor module includes optical fingerprint sensor 310 and planar backlight 320.Optical finger print passes
Sensor 310 has and an only transparent substrates 311.The first surface (not marking) of transparent substrates 311 is directly used in finger print
Contact.The second surface (not marking) of transparent substrates 311 has device layer 312.In Fig. 3, the first surface is transparent substrates
311 upper surface, the second surface are the lower surface of transparent substrates 311.
Though not distinctly displayed in figure, device layer 312 has pixel region.The pixel region has multiple pixels.Each
The pixel has transmission region and non-transparent region.The non-transparent region has photo-sensitive cell.The transmission region makes light
Line can pass through the pixel region of the device layer 312.
The planar backlight 320 is located at the lower section of device layer 312, and the emergent light of planar backlight 320 is worn from transmission region
Device layer 312 is crossed, enters back into transparent substrates 311.
In the present embodiment, the planar backlight 320 includes point source of light 321 and light guide plate 322, and point source of light is LED
Lamp.Point source of light 321 is arranged on outside one of side of light guide plate 322.The light that point source of light 321 is sent is in certain diverging
In angle, light guide plate 322 is irradiated into.The light that point-like backlight 321 is sent is as shown in thick black unidirectional arrow in Fig. 3.
In the present embodiment, there is the small salient point 3221 of hemisphere one by one or semielliptical type at the back of light guide plate 322.Light guide plate 322
Internal light, which is irradiated to small salient point 3221, will produce scattering, so as to change the direction of light, realize irradiation upwards.Light guide plate
322 bottoms (lower surface) and other sides (outer surface) also have reflectance coating (not shown in Fig. 3), when light reaches light guide plate
When 322 back sides or other sides, the overwhelming majority can be reflected back light guide plate 322 again by the reflectance coating, so as to square directly up
To injection, or continue to scatter to upward direction by small salient point 3221.In light such as Fig. 3 after the guide-lighting scattering of light guide plate 322
Shown in thin black unidirectional arrow.
In other embodiments, light guide plate 322 can also be that other structures (for example increase diffusion barrier on light guide plate 322
Deng), it is only necessary to ensure that the light that corresponding point source of light is sent is uniformly dispersed by light guide plate 322, and project upwards.
In the present embodiment, Fig. 3 specifically show two pixels in the pixel region, respectively pixel X1 and pixel X2,
Pixel X1 and pixel X2 has non-transparent region (not marking) and transmission region (not marking).Pixel X1 and pixel the X2 length of side
Size (flat shape of pixel is rectangle) can be at 30 μm to 100 μm.Pixel X1 and pixel X2 size dimension are too small, nothing
Method produces corresponding circuit devcie in region shared by pixel, and can also increase the data volume of image.Pixel X1 and pixel
X2 size dimension is too big, and corresponding fingerprint image resolution can reduce.Because the size of somatic fingerprint is typically on 200 μm of left sides
The right side, so considering, 50 μm or so can be selected.
In the present embodiment, light collecting layer 330 is also included between optical fingerprint sensor 310 and planar backlight 320.Optics refers to
Can also may be used between line sensor 310 and light collecting layer 330 by optics glue between planar backlight 320 and light collecting layer 330
To pass through optics glue.The optical cement can reduce the possibility that light passes through air in communication process as far as possible, so as to drop
The multiple reflections and scattering risk of low light, it is clear further to improve the fingerprint image that the optical fingerprint sensor module is formed
Clear degree.
It refer to Fig. 4, Fig. 4 individually shows a kind of light collecting layer 330a, i.e. light collecting layer 330a is light collecting layer in Fig. 3 in Fig. 4
A kind of 330 concrete structure.
In the present embodiment, light collecting layer 330a has basalis a1 and multiple dimpling lens unit a2.Dimpling lens unit a2
To be shaped as ellipsoid crown.Dimpling lens unit a2 is located at basalis a1 lower surfaces.And basalis a1 upper surfaces and the light
Learn the fitting of fingerprint sensor bottom surface.For physically, dimpling lens unit a2 will have spotlight effect, then from solid
See, from centre to edge, gradually thinning can plays spotlight effect to thickness.But in all structures, the dimpling of ellipsoid structure
Lens unit a2 is that spotlight effect is best, and the converged light formed is also most uniform.
In other embodiments, dimpling lens unit can be other shapes, such as spherical, conical or pyramid
Deng.In other embodiments, the dimpling lens unit can also be located at the upper surface of the basalis.
In the present embodiment, dimpling lens unit a2 diameter dimension is at 1 μm to 100 μm.Dimpling lens unit a2 diameter
It is too small that spotlight effect can be caused poor, and make also relatively difficult.Dimpling lens unit a2 diameter is too big, optically focused
Uniformity is poor.
The present embodiment controls the area for causing dimpling lens unit a2 to be less than the area of pixel, and causes average each pixel
At least to have below a dimpling lens unit a2 (it is required that dimpling lens unit a2 base diameter be less than pixel width, and
And dimpling lens unit a2 height is again smaller than pixel wide).So macroscopically, the backlight of each pixel can be just uniform
's., whereas if dimpling lens unit a2 area is more than the area of pixel, it is possible to a dimpling lens unit a2 occurs and covers
The situation of multiple pixels is covered.What each pixel so directly over a dimpling lens unit a2 was received just differs
's.So as to accomplish that the backlight of each pixel is the same, last imaging is caused also to produce uneven.
In actual conditions, the backlight that light guide plate 3221 is sent not is preferable point source of light one by one.Each dimpling is saturating
Mirror unit a2 focal length may also have difference.It is saturating by dimpling but as long as light a part of in backlight is the equal of point source of light
Mirror unit a2 is focused on, and this part light is exactly directional light or nearly directional light (nearly directional light), can be achieved with preferable image.Other are not
Parallel or near parallel part light is focused into, just when a background noise for being image.Both ratio regular meetings influence image noise
Than as long as signal to noise ratio is higher than certain value, image just meets require that.It can be seen that the distance between dimpling lens unit a2 is smaller more
It is good, can be one by one.Meanwhile if meeting that a pixel corresponds to multiple dimpling lens unit a2, then dimpling lens
Spacing can between unit a2 is appropriate big.
It should be noted that the nearly directional light refers to maximum angle difference between whole light within 10 degree.
It should be noted that in other embodiments, Fig. 5 is refer to, another concrete structure of light collecting layer 330 is light collecting layer
330b, light collecting layer 330b have basalis b1 and multiple dimpling lens unit b2, and dimpling lens unit b2 shape is same
It is crown for ellipsoid, unlike, dimpling lens unit b2 is located at basalis b1 upper and lower surfaces simultaneously.
It should be noted that in other embodiments, Fig. 6 is refer to, another concrete structure of light collecting layer 330 is light collecting layer
330c, light collecting layer 330c have basalis c1 and multiple dimpling lens unit c2, unlike, dimpling lens unit c2 is in pyramid
Shape (can be triangular pyramid or pyramid shape etc., but triangle is shown as in section shown in Fig. 6, in other embodiments also
Can be cone), and dimpling lens unit c2 is only located at basalis c1 upper surfaces.Basalis c1 lower surfaces are flat, can be with
Basalis c1 lower surfaces are bonded with optical fingerprint sensor bottom surface, it is of course also possible to by basalis c1 lower surfaces and light guide plate
3221 top surfaces are bonded.
It should be noted that in other embodiments, Fig. 7 is refer to, another concrete structure of light collecting layer 330 is light collecting layer
330d, light collecting layer 330d have basalis d1 and multiple dimpling lens unit d2.Light collecting layer 330d also includes filling and leading up a layer d3.Its
In, fill and lead up layer d3 and fill and lead up the basalis 471d lower surfaces with dimpling lens unit d2, that is, fill and lead up layer d3 and be located at dimpling lens
Unit d2 both sides, and whole dimpling lens unit d2 can be covered, so that whole light collecting layer 330 has flat surfaces.
It should be noted that in other embodiments, Fig. 8 is refer to, another concrete structure of light collecting layer 330 is light collecting layer
330e, light collecting layer 330e have basalis e1 and multiple dimpling lens unit e2.Light collecting layer 330e also includes filling and leading up a layer e3.Dimpling
Lens unit e2 is located at basalis e1 upper and lower surfaces.Layer e3 is filled and led up by the upper of the basalis e1 with dimpling lens unit
Surface and lower surface are all filled and led up.Layer e3 is filled and led up to fill and lead up the upper and lower surface of the basalis e1 with dimpling lens unit e2
Afterwards, whole light collecting layer 330e upper and lower surfaces are flat, are more beneficial for assembling with other structures.
It should be noted that in other embodiments, Fig. 9 is refer to, another concrete structure of light collecting layer 330 is light collecting layer
330f, light collecting layer 330f have basalis f1 and multiple dimpling lens unit f2.Light collecting layer 330f also includes filling and leading up a layer f3.Dimpling
Lens unit f2 is pyramid, and dimpling lens unit f2 is located at basalis f1 upper surfaces.Dimpling lens list will be had by filling and leading up layer f3
First f2 basalis f1 upper surfaces are filled and led up.Fill and lead up after layer f3 fill and lead up the basalis f1 upper surfaces with dimpling lens unit f2,
The whole light collecting layer upper and lower surface is flat, is more beneficial for assembling with other structures.
In above-mentioned each embodiment with basalis, each dimpling lens unit can play a part of optically focused, so as to
The light that the polarizers of big angle scope sent from light guide plate 3221 is distributed, the light of small angle range is accumulated, so as to be advantageous to light
Learn fingerprint sensor module and form clearly fingerprint image.
It should be noted that in the various embodiments described above, respectively fill and lead up layer choosing and (fill and lead up layer with the relatively low material making of refractive index
Material refractive index be less than dimpling lens unit material refractive index), so as to ensure in each light collecting layer, each dimpling lens list
Member gives full play to condenser effect.
It should be noted that in other embodiments, Figure 10 is refer to, another concrete structure of light collecting layer 330 is optically focused
Layer 330g, light collecting layer 330g include flatness layer g2 and the multiple dimpling lens unit g1 being distributed in flatness layer g2.Wherein, Figure 10
Middle dimpling lens unit g1 is pyramid (being specifically as follows triangular pyramid or pyramid shape etc.).Flatness layer g2 is by dimpling lens
Unit g1 is wrapped in inside it, and flatness layer g2 upper and lower surfaces are flat, and the whole light collecting layer upper and lower surface is flat,
It is more beneficial for assembling with other structures.
It should be noted that in other embodiments, Figure 11 is refer to, another concrete structure of light collecting layer 330 is optically focused
Layer 330h, light collecting layer 330h include flatness layer h2 and the multiple dimpling lens unit h1 being distributed in flatness layer h2.Wherein, Figure 11
Middle dimpling lens unit h1 is that ellipsoid is crown (can be spherical or other shapes in other embodiments).Flatness layer h2 will be micro-
Convex lens mirror unit h1 is wrapped in inside it, and flatness layer h2 upper and lower surfaces are flat, the whole light collecting layer upper and lower surface
It is flat, it is more beneficial for assembling with other structures.
In above-mentioned each embodiment with flatness layer, likewise, each dimpling lens unit can play the work of optically focused
With so as to the light for being distributed the polarizers of big angle scope sent from light guide plate 3221, the light of small angle range being accumulated, so as to have
Clearly fingerprint image is formed beneficial to optical fingerprint sensor module.
It should be noted that in the various embodiments described above, flatness layer also makes (i.e. flatness layer from the relatively low material of refractive index
Material refractive index be less than dimpling lens unit material refractive index), so as to ensure in each light collecting layer, each dimpling lens list
Member gives full play to condenser effect.
From the foregoing, in the optical fingerprint sensor module that the present embodiment is provided, by optical fingerprint sensor
The light collecting layer is set between planar backlight, so that the radiation direction projected from planar backlight can be by light collecting layer
Adjustment, make a large amount of light and all reached with less angular range the first surfaces of transparent substrates 311, and corresponding angle
The angle spent between scope and the first surface all close to right angle, so as to both reduce because ranges of incidence angles is larger cause into
Caused reflected light interferes with each other between penetrating light, ensures that reflection light is irradiated to the pixel nearer from its incident ray again, so as to
Improve the definition for the fingerprint image that optical fingerprint sensor module is formed.
The structure and property of more optical fingerprint sensor modules provided about the present embodiment, refer to foregoing implementation
The optical fingerprint sensor module corresponding contents that example is provided.
Fourth embodiment of the invention provides another optical fingerprint sensor module, refer to Figure 12.
The optical fingerprint sensor module includes optical fingerprint sensor 410 and planar backlight 420.Optical finger print passes
Sensor 410 has and an only transparent substrates 411.The first surface (not marking) of transparent substrates 411 is directly used in finger print
Contact.The second surface (not marking) of transparent substrates 411 has device layer 412.In Figure 12, the first surface is transparent substrates
411 upper surface, the second surface are the lower surface of transparent substrates 411.
Though not distinctly displayed in figure, device layer 412 has pixel region.The pixel region has multiple pixels.Each
The pixel has transmission region and non-transparent region.The non-transparent region has photo-sensitive cell.The transmission region makes light
Line can pass through the pixel region of the device layer 412.
The planar backlight 420 is located at the lower section of device layer 412, and the emergent light of planar backlight 420 is worn from transmission region
Device layer 412 is crossed, enters back into transparent substrates 411.
In the present embodiment, the planar backlight 420 includes point source of light 421 and light guide plate 422, and point source of light is LED
Lamp.Point source of light 421 is arranged on outside one of side of light guide plate 422.The light that point source of light 421 is sent is in certain diverging
In angle, light guide plate 422 is irradiated into.The light that point-like backlight 421 is sent is as shown in thick black unidirectional arrow in Figure 12.
In the present embodiment, there is the small salient point 4221 of hemisphere one by one or semielliptical type at the back of light guide plate 422.Light guide plate 422
Internal light, which is irradiated to small salient point 4221, will produce scattering, so as to change the direction of light, realize irradiation upwards.Light guide plate
422 bottoms (lower surface) and other sides (outer surface) also have reflectance coating (not shown in Figure 12), when light reaches light guide plate
When 422 back sides or other sides, the overwhelming majority can be reflected back light guide plate 422 again by the reflectance coating, so as to square directly up
To injection, or continue to scatter to upward direction by small salient point 4221.In light such as Fig. 4 after the guide-lighting scattering of light guide plate 422
Shown in thin black unidirectional arrow.
In the present embodiment, Figure 12 specifically show two of which pixel, respectively pixel Y1 and pixel Y2, pixel Y1 and picture
Plain Y2 has non-transparent region (not marking) and transmission region (not marking).Pixel Y1 and pixel Y2 size dimension (pixel
Flat shape be rectangle) can specifically select 50 μm or so at 40 μm to 100 μm.
Also include light collimation layer 430 in the present embodiment, between optical fingerprint sensor 410 and planar backlight 420.
Though do not shown in figure, in the optical fingerprint sensor module, optical fingerprint sensor 410 and light collimation layer 430
Between can have optical cement layer, so as to prevent the presence of air layer.For optimum efficiency, the optical cement layer is as thin as possible, and one
As can be arranged on 2 μm to 200 μm.In other embodiments, there can also be optics between light collimation layer 430 and light guide plate 422
Glue-line.
Figure 13 is refer to, light collimation layer 430 has shading framework 432 and is evenly distributed on the multiple of shading framework 432
Unthreaded hole 431.When skew ray is irradiated into loophole, can be absorbed by shading framework 432.So as to only allow angle more vertically upward
Light pass through so that light collimation layer 430 can realize light collimation effect.
In the present embodiment, light collimation layer 430 is single layer structure.The area of loophole 431 is less than the area of pixel.For reality
Now good optical uniformity and collimation, the size of loophole 431 are necessarily less than the size of pixel.
In the present embodiment, in the timing of 431 diameter of loophole one, in the case of meeting at least one aperture of each pixel, phase
The distance between adjacent loophole 431 is bigger, and the number of loophole 431 is fewer, then light utilization efficiency is lower, and actual signal is just
It is smaller, therefore, in any case, the distance between loophole 431 can be reduced as far as possible.
Refer to Figure 13, in the present embodiment, the hole high H and diameter D of loophole 431 ratio is more than 1, i.e. in Figure 13, H:D
>1.H:D value is bigger, better through the light ray parallel effect of light collimation layer, but the light that can be passed through is also fewer.
In the present embodiment, the integral thickness of light collimation layer 430 can be 10 μm to 10000 μm.Light collimates the entirety of layer 430
Thickness control within the above range, that is, ensures that it can play corresponding light collimating effect, while prevent whole optical finger print again
Sensor module thickness is too big.
Can be air, vacuum or light transmission medium in the present embodiment, in loophole 431, it is only necessary to ensure loophole 431
Being capable of printing opacity respective ray of light.Certainly, when it is vacuum or light transmission medium that loophole 431 is interior, advantageously in light
Through.
In other embodiments, light collimation layer can also be sandwich construction.When light collimation layer is sandwich construction, per Rotating fields
In all include shading framework 432 and multiple loopholes 431, and the loophole 431 between different layers is overlapped.When light collimates
When layer is sandwich construction, light collimates 10 μm to 10000 μm of the integral thickness of layer.
In various embodiments of the present invention, in order to reduce the refraction of light scattering, the optical cement layer and the optics can be made
The refractive index of fingerprint sensor is as far as possible close.Such as the refractive index of this three-decker can be made all 1.5 or so.
It should be noted that in the present invention, it is above-mentioned that each embodiment is all to realize that vertical or near vertical incide of light reaches
The first surface (i.e. radiation direction and protective layer upper surface direction is at a right angle or close at a right angle) of transparent substrates 411.But
In some cases, by the structures of the various embodiments described above, (at least one of which that light collecting layer and light collimate layer is arranged on leaded light
Between plate and optical fingerprint sensor), it can also suitably reduce above-mentioned angle, such as 70 degree or 50 degree etc., but to ensure owning
The angle of incident light is all more or less the same.When angle is vertical, underface of the imaging pixel at fingerprint corresponding to fingerprint, if
Incident light all keeps an inclination angle, then all imaging pixels all offset corresponding fingerprint certain distance, but image definition and
The degree of accuracy will not be significantly affected.
The structure and property of more optical fingerprint sensor modules provided about the present embodiment, refer to foregoing implementation
The optical fingerprint sensor module corresponding contents that example is provided.
Although present disclosure is as above, the present invention is not limited to this.Any those skilled in the art, this is not being departed from
In the spirit and scope of invention, it can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
The scope of restriction is defined.
Claims (13)
1. a kind of optical fingerprint sensor module, including：
Optical fingerprint sensor；
Planar backlight；
It is characterized in that：
The optical fingerprint sensor has and an only transparent substrates；
The first surface of the transparent substrates is directly used in finger print contact；
The second surface of the transparent substrates has device layer；
The device layer has pixel region；The pixel region has multiple pixels；Each pixel has transmission region and non-
Transmission region；The non-transparent region has photo-sensitive cell；The transmission region enables institute of the light through the device layer
State pixel region；
The planar backlight is located at below the device layer, and the emergent light of the planar backlight passes through from the transmission region
The device layer, enter back into the transparent substrates.
2. optical fingerprint sensor module as claimed in claim 1 a, it is characterised in that pixel also includes shading
Layer, the photo-sensitive cell positioned at the light shield layer and the transparent substrates between, the light shield layer be located at the photo-sensitive cell and
Between the planar backlight.
3. optical fingerprint sensor module as claimed in claim 1 or 2, it is characterised in that the optical fingerprint sensor and
Also include at least one layer in light collecting layer and light collimation layer between the planar backlight, light collecting layer and light the collimation layer makes
The angular range for the light crossed diminishes.
4. optical fingerprint sensor module as claimed in claim 3, it is characterised in that the optical fingerprint sensor and described
Include the light collecting layer between planar backlight, the light collecting layer includes basalis and multiple dimpling lens units, the dimpling
Lens unit is located at least one of the basalis upper and lower surface.
5. optical fingerprint sensor module as claimed in claim 4, it is characterised in that the dimpling lens unit is positioned at described
Basalis upper surface, the basalis lower surface is flat, the lower surface of the basalis and the upper surface of the planar backlight
Fitting；Or the dimpling lens unit is located at the basalis lower surface, the basalis upper surface is flat, the substrate
The upper surface of layer is bonded with the bottom surface of the optical fingerprint sensor.
6. optical fingerprint sensor module as claimed in claim 4, it is characterised in that the light collecting layer also includes filling and leading up layer；
The dimpling lens unit is located at the basalis upper surface, and the basalis lower surface is flat, and the layer of filling and leading up will have institute
The basalis upper surface for stating dimpling lens unit is filled and led up；Or the dimpling lens unit is located at the basalis following table
Face, the basalis upper surface is flat, and the layer of filling and leading up fills out the basalis lower surface with the dimpling lens unit
It is flat；Or the dimpling lens unit is located at the basalis upper and lower surface, the layer of filling and leading up will have the dimpling
The basalis upper and lower surface of lens unit is filled and led up.
7. optical fingerprint sensor module as claimed in claim 6, it is characterised in that the dimpling lens unit is shaped as
Ellipsoid is crown, spherical, conical or pyramid；The size of the dimpling lens unit is less than the size of the pixel；Institute
State and fill and lead up refractive index of the refractive index of layer less than the dimpling lens unit.
8. optical fingerprint sensor module as claimed in claim 3, it is characterised in that the optical fingerprint sensor and described
Include the light collecting layer between planar backlight, the light collecting layer includes flatness layer and is distributed in multiple micro- in the flatness layer
Convex lens mirror unit.
9. optical fingerprint sensor module as claimed in claim 8, it is characterised in that the dimpling lens unit is shaped as
Ellipsoid is crown, spherical, conical or pyramid；The size of the dimpling lens unit is less than the size of the pixel；Institute
The refractive index for stating flatness layer is less than the refractive index of the dimpling lens unit.
10. optical fingerprint sensor module as claimed in claim 3, it is characterised in that the optical fingerprint sensor and institute
Stating includes light collimation layer between planar backlight, and the light collimation layer has shading framework and is evenly distributed on the shading
Multiple loopholes of framework.
11. optical fingerprint sensor module as claimed in claim 10, it is characterised in that the light collimation layer is single layer structure
Or sandwich construction；When light collimation layer is single layer structure, including shading framework and multiple loopholes；When the light collimates
When layer is sandwich construction, all include shading framework and multiple loopholes, and the printing opacity between different layers in every Rotating fields
Hole is overlapped.
12. optical fingerprint sensor module as claimed in claim 11, it is characterised in that the area of the loophole is less than institute
The area of pixel is stated, the ratio of the Kong Gaoyu diameters of the loophole is more than 1.
13. optical fingerprint sensor module as claimed in claim 1, it is characterised in that described the first of the transparent substrates
Surface and at least one of which surface of the second surface have filter layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610536745.9A CN107590421A (en) | 2016-07-08 | 2016-07-08 | Optical fingerprint sensor module |
| PCT/CN2016/095827 WO2018006475A1 (en) | 2016-07-08 | 2016-08-18 | Optical fingerprint sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610536745.9A CN107590421A (en) | 2016-07-08 | 2016-07-08 | Optical fingerprint sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107590421A true CN107590421A (en) | 2018-01-16 |
Family
ID=60901598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610536745.9A Pending CN107590421A (en) | 2016-07-08 | 2016-07-08 | Optical fingerprint sensor module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107590421A (en) |
| WO (1) | WO2018006475A1 (en) |
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| CN110245631A (en) * | 2019-06-20 | 2019-09-17 | 厦门天马微电子有限公司 | Display panel and fingerprint recognition display device |
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