CN107562147A - A kind of computer circuit board substrate with mute heat dissipation function - Google Patents
A kind of computer circuit board substrate with mute heat dissipation function Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 57
- 239000000919 ceramic Substances 0.000 claims abstract description 28
- 239000004033 plastic Substances 0.000 claims abstract description 13
- 238000013016 damping Methods 0.000 claims abstract description 6
- 239000004568 cement Substances 0.000 claims abstract 4
- 229920000742 Cotton Polymers 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 241000883990 Flabellum Species 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011359 shock absorbing material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本发明涉及计算机电路板基板技术领域，具体为一种具有静音散热功能的计算机电路板基板。The invention relates to the technical field of computer circuit board substrates, in particular to a computer circuit board substrate with a silent heat dissipation function.
背景技术Background technique
计算机在运行的过程中，电路板基板上的各种发热元器件会因电流的通过而产生热量，而发热元器件发热时间过长，电阻会发生变化，使电脑变慢变卡，电路板基板上的元器件长时间保持高温，还会烧坏电路元件，从而使电脑损坏。因此，一般计算机的内部电路板基板上都安装有散热装置。During the operation of the computer, various heating components on the circuit board substrate will generate heat due to the passage of current, and the heating time of the heating components is too long, the resistance will change, making the computer slow down and become stuck, the circuit board substrate The components on the computer keep high temperature for a long time, and the circuit components will be burned out, which will damage the computer. Therefore, heat dissipation devices are installed on the internal circuit board substrate of general computers.
现在大部分的散热基板包括两种:一种为基板上垂直安装有散热片，散热片顶部通过风扇将元器件通过散热片传导的热量吹散，但是这种散热方式是风扇直接吹基板，而无法保持风向的流通，当计算机负荷大内部发热多时，散热片的热量就不能及时排出去，造成散热不完全，且风扇也会散热，而且会发出噪声；另一种计算机基板散热为热管散热，利用散热使液体蒸发沿热管上升，利用重力使冷凝液流经发热元器件，达到冷却的作用，但热管的散热装置通常在机箱内靠自然风散热，这样会使计算机机箱温度很高，不能达到让元器件在常温或低温条件下完美运行的目的。Most of the heat dissipation substrates now include two types: one is that a heat sink is vertically installed on the substrate, and the top of the heat sink blows away the heat conducted by the components through the heat sink through a fan, but this heat dissipation method is that the fan directly blows the substrate, while Unable to maintain the flow of the wind direction, when the computer load is heavy and the internal heat is too high, the heat of the heat sink cannot be discharged in time, resulting in incomplete heat dissipation, and the fan will also dissipate heat, and will make noise; another kind of computer substrate heat dissipation is heat pipe heat dissipation, Use heat dissipation to evaporate the liquid and rise along the heat pipe, and use gravity to make the condensate flow through the heating components to achieve cooling effect. However, the cooling device of the heat pipe is usually dissipated by natural wind in the chassis, which will make the temperature of the computer chassis very high and cannot be achieved. The purpose of making components work perfectly under normal or low temperature conditions.
发明内容Contents of the invention
为了克服现有技术方案的不足,本发明提供一种具有静音散热功能的计算机电路板基板,通过陶瓷材料的基板使发热元器件散发到电路板上的热量轻松散发掉，热管通过散热片散热，加上风扇对散热片的吹拂，使发热元器件的产生的热量散发快，工作效率高，采用风扇扇叶顶端圆弧状结构，且风扇和基板均通过塑胶减震材料固定，大大降低了基板工作和各器件共振产生的噪音，给用户更好的体验。In order to overcome the deficiencies of the existing technical solutions, the present invention provides a computer circuit board substrate with a silent heat dissipation function. The heat emitted by the heating components to the circuit board is easily dissipated through the substrate of ceramic materials, and the heat pipe dissipates heat through the heat sink. Coupled with the blowing of the fan on the heat sink, the heat generated by the heating components can be dissipated quickly, and the work efficiency is high. The arc-shaped structure at the top of the fan blade is adopted, and the fan and the substrate are fixed by plastic shock-absorbing materials, which greatly reduces the cost of the substrate. The noise generated by work and resonance of various devices gives users a better experience.
本发明解决其技术问题所采用的技术方案是：一种具有静音散热功能的计算机电路板基板，包括机箱、陶瓷基板和发热元器件，所述陶瓷基板四角通过塑胶减震螺丝安装在机箱内，所述发热元器件安装在陶瓷基板上表面，所述机箱的两侧均设有散热孔，所述机箱内安装有若干机架，所述陶瓷基板上表面固定安装有若干散热片，所述发热元器件上设有热管，所述散热片的侧面与热管侧面相贴，所述散热片两端均设有风扇，所述风扇四角通过塑胶减震螺丝安装在机架上，所述风扇内安装有电机，所述电机连接热管。The technical solution adopted by the present invention to solve the technical problem is: a computer circuit board substrate with silent heat dissipation function, including a chassis, a ceramic substrate and heating components, the four corners of the ceramic substrate are installed in the chassis through plastic shock-absorbing screws, The heating components are installed on the upper surface of the ceramic substrate, heat dissipation holes are provided on both sides of the case, a number of racks are installed in the case, and a number of heat sinks are fixedly installed on the upper surface of the ceramic substrate. A heat pipe is arranged on the component, and the side of the heat sink is attached to the side of the heat pipe. Fans are installed at both ends of the heat sink. The four corners of the fan are installed on the frame through plastic shock-absorbing screws. There is a motor, which is connected to the heat pipe.
作为本发明一种优选的技术方案，所述发热元器件分散安装在陶瓷基板上表面，且每个所述的发热元器件均竖立排列。As a preferred technical solution of the present invention, the heating components are dispersedly installed on the upper surface of the ceramic substrate, and each of the heating components is vertically arranged.
作为本发明一种优选的技术方案，若干个所述的散热片皆竖直安装在陶瓷基板上，且若干个散热片互相平行，所述发热元件安装在散热片之间的空隙内。As a preferred technical solution of the present invention, several of the heat sinks are installed vertically on the ceramic substrate, and the several heat sinks are parallel to each other, and the heating elements are installed in the gaps between the heat sinks.
作为本发明一种优选的技术方案，所述每个发热元器件上表面均通过铜片连接有若干热管，所述热管内流通有冷凝液。As a preferred technical solution of the present invention, the upper surface of each heating element is connected with several heat pipes through copper sheets, and condensate flows in the heat pipes.
作为本发明一种优选的技术方案，所述陶瓷基板与机箱接触面和风扇与机架连接处均垫有橡胶垫片。As a preferred technical solution of the present invention, the contact surface between the ceramic substrate and the chassis and the connection between the fan and the frame are all covered with rubber gaskets.
作为本发明一种优选的技术方案，所述风扇的扇叶顶端采用光滑的圆弧状结构，两个所述的风扇风向相同，且风扇的风向与散热片之间的通道平行。As a preferred technical solution of the present invention, the top of the fan blades adopts a smooth arc-shaped structure, the two fans have the same wind direction, and the wind direction of the fans is parallel to the passage between the cooling fins.
作为本发明一种优选的技术方案，所述机架具有内部中空结构，所述中空结构内填充有吸音棉。As a preferred technical solution of the present invention, the frame has an internal hollow structure, and the hollow structure is filled with sound-absorbing cotton.
作为本发明一种优选的技术方案，所述热管贴在发热元器件和电机表面的位置比热管贴在散热片侧面位置低1～2cm。As a preferred technical solution of the present invention, the position where the heat pipe is pasted on the surface of the heating element and the motor is 1-2 cm lower than the position where the heat pipe is pasted on the side of the heat sink.
与现有技术相比，本发明的有益效果是：Compared with prior art, the beneficial effect of the present invention is:
(1)本发明通过陶瓷材料的基板使发热元器件散发到电路板上的热量轻松散发掉，利用进风扇和出风扇的对散热片的吹拂，且风向与散热片空隙平行的设计使空气对流更顺畅，使发热元器件的热量完美地传出机箱外；(1) The present invention makes the heat dissipated from the heating components to the circuit board easily dissipated through the substrate of ceramic material, utilizes the blowing of the heat sink by the inlet fan and the outlet fan, and the design of the wind direction parallel to the gap of the heat sink makes the air convection Smoother, so that the heat of the heating components can be transmitted out of the chassis perfectly;
(2)本发明通过热管将发热元器件表面的热量传递给散热片，接收热量的散热片散发热量后，经过两风扇的空气对流将热量吹出机箱，发热元器件散热快，工作效率高，使基板工作在一个稳定的常温或低温条件下，各元器件工作效率高，计算机运行速度更快；(2) The present invention transfers the heat on the surface of the heating element to the heat sink through the heat pipe. After the heat sink that receives the heat dissipates heat, the air convection of the two fans blows the heat out of the chassis. The heat dissipation of the heat generating element is fast and the work efficiency is high. The substrate works at a stable normal temperature or low temperature, the components work with high efficiency, and the computer runs faster;
(3)本发明采用风扇扇叶顶端圆弧状结构，降低了风扇尖端摩擦空气而产生的噪声，且风扇和基板均通过塑胶减震材料固定，大大降低了基板工作和各器件共振产生的噪音，给用户更好的体验。(3) The present invention adopts the arc-shaped structure at the top of the fan blade, which reduces the noise generated by the friction of the fan tip against the air, and the fan and the substrate are fixed by plastic shock-absorbing materials, which greatly reduces the noise generated by the operation of the substrate and the resonance of various devices , to give users a better experience.
附图说明Description of drawings
图1为本发明结构示意图；Fig. 1 is a structural representation of the present invention;
图2为本发明剖面图；Fig. 2 is a sectional view of the present invention;
图3为热管和发热元件、散热片连接关系图。Fig. 3 is a connection diagram of the heat pipe, the heating element, and the heat sink.
图中：1-机箱；2-陶瓷基板；3-发热元器件；4-塑胶减震螺丝；5-散热孔；6-机架；7-散热片；8-热管；9-风扇；10-电机；11-铜片；12-冷凝液；13-橡胶垫片。In the figure: 1-chassis; 2-ceramic substrate; 3-heating components; 4-plastic shock-absorbing screws; 5-cooling holes; 6-rack; Motor; 11-copper sheet; 12-condensate; 13-rubber gasket.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
以下各实施例的说明是参考附图，用以示例本发明可以用以实施的特定实施例。本发明所提到的方向和位置用语，例如「上」、「中」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向和位置。因此，使用的方向和位置用语是用以说明及理解本发明，而非用以限制本发明。The following descriptions of various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented. The terms of direction and position mentioned in the present invention, such as "upper", "middle", "lower", "front", "rear", "left", "right", "inner", "outer", "side ", etc., are only for reference to the orientation and position of the attached drawings. Therefore, the terms of direction and position are used to illustrate and understand the present invention, but not to limit the present invention.
实施例：Example:
如图1至图3所示，本发明提供的一种具有静音散热功能的计算机电路板基板，包括机箱1、陶瓷基板2和发热元器件3，陶瓷基板2良好的散热性使发热元器件散发到电路板上的热量更好地散发和冷却，保护电路板，所述陶瓷基板2四角通过塑胶减震螺丝4安装在机箱1内，所述发热元器件3安装在陶瓷基板2上表面，所述机箱1的两侧均设有散热孔5，利于风扇9将热量吹出去，通风散热，所述机箱1内安装有若干机架6，所述陶瓷基板2上表面固定安装有若干散热片7，所述发热元器件3上设有热管8，热管8将发热元器件3所产生的热量传送到散热片7上，再经风扇9的吹拂，将热量吹出机箱1外，让发热元器件保持安全温度，所述散热片7的侧面与热管8侧面相贴，所述散热片7两端均设有风扇9，所述风扇9四角通过塑胶减震螺丝4安装在机架6上，两个塑胶减震螺丝4使元器件和风扇工作使产生振动更少，减少了噪音，所述风扇9内安装有电机10，所述电机10连接热管8，用于将风扇9的热量散发出去，减少风扇9自身的发热。As shown in Fig. 1 to Fig. 3, a kind of computer circuit board substrate with mute heat dissipation function provided by the present invention comprises chassis 1, ceramic substrate 2 and heating components 3, and the good heat dissipation of ceramic substrate 2 makes heating components dissipate heat. The heat on the circuit board is better dissipated and cooled to protect the circuit board. The four corners of the ceramic substrate 2 are installed in the chassis 1 through plastic damping screws 4, and the heating components 3 are installed on the upper surface of the ceramic substrate 2. Both sides of the chassis 1 are provided with heat dissipation holes 5, which are beneficial to the fan 9 to blow out the heat, ventilate and dissipate heat. Several racks 6 are installed in the chassis 1, and several heat sinks 7 are fixedly installed on the upper surface of the ceramic substrate 2. , the heating element 3 is provided with a heat pipe 8, and the heat pipe 8 transmits the heat generated by the heating element 3 to the heat sink 7, and then blows by the fan 9 to blow the heat out of the chassis 1, so that the heating element remains Safe temperature, the side of described heat sink 7 and heat pipe 8 sides stick together, and described heat sink 7 two ends are all provided with fan 9, and described fan 9 four corners are installed on frame 6 by plastic damping screw 4, two The plastic damping screw 4 makes the components and the fan work so that there is less vibration and reduces the noise. The motor 10 is installed in the fan 9, and the motor 10 is connected to the heat pipe 8 for dissipating the heat of the fan 9 to reduce the noise. The heat generated by the fan 9 itself.
优选的是，如图1所示，所述发热元器件3分散安装在陶瓷基板2上表面，分散安装的发热元器件3更好散热，避免热量扎堆烧坏计算机的电路板，每个所述的发热元器件3均竖立排列，使发热元件接受风扇吹拂时更易散热，散热更快；如图1和图2所示，若干个所述的散热片7皆竖直安装在陶瓷基板2上，且若干个散热片7互相平行，所述发热元件3安装在若干个散热片7之间的空隙内，平行的散热片7经过风扇9吹拂后，空气的狭谷效应使散热速度和效率都大大提高；如图3所示，所述每个发热元器件3上表面均通过铜片11连接有若干热管8，铜片11的设计使热管8与发热元器件3接触面积更大，将发热元器件3上的热量运输走的速率更快，所述热管8内流通有冷凝液12，所述热管8贴在发热元器件3和电机10表面的位置比热管8贴在散热片7侧面位置低1～2cm，热管8利用内部冷凝液12热蒸发，冷凝散热的原理，热管8接触发热元器件3的一端温度高，冷凝液12蒸发成蒸汽，蒸汽因为热管8上下两端的温差而上升到冷却端，就是热管8与散热片7连接的那一端，经过那一端散热，蒸汽冷凝成为冷凝液12，冷凝液12因为重力的影响流向产热端(即发热元器件8端和电机10发热端)，形成回流，传热、散热快，效率高；所述陶瓷基板2与机箱1接触面和风扇9与机架6连接处均垫有橡胶垫片13，橡胶垫片13起到防震减噪音的效果；所述风扇9的扇叶顶端采用光滑的圆弧状结构，降低风扇扇叶尖端摩擦空气产生的噪声，两个所述的风扇9风向相同，且风扇9的风向与散热片7之间的通道平行，使风在机箱1内形成回流，使发热元器件3温度保持在安全温度内；所述机架6具有内部中空结构，且中空结构内填充有吸音棉，吸音棉的填充使风扇发出的噪声进一步减少，降低了噪音。Preferably, as shown in FIG. 1 , the heating components 3 are dispersedly installed on the upper surface of the ceramic substrate 2, and the dispersedly installed heating components 3 can dissipate heat better, so as to prevent the heat from getting together and burning out the circuit board of the computer. The heating elements 3 are all vertically arranged, so that the heating elements are easier to dissipate heat when they are blown by a fan, and the heat dissipation is faster; And several cooling fins 7 are parallel to each other, and the heating element 3 is installed in the gap between several cooling fins 7, after the parallel cooling fins 7 are blown by the fan 9, the narrow valley effect of the air makes the heat dissipation speed and efficiency greatly improved. Improve; as shown in Figure 3, described each heating element parts 3 upper surface all is connected with some heat pipes 8 by copper sheet 11, and the design of copper sheet 11 makes heat pipe 8 and heating element parts 3 contact area bigger, and heating element The rate of heat transport on the device 3 is faster, and the heat pipe 8 has a condensate 12 circulating in it, and the position where the heat pipe 8 is attached to the surface of the heating element 3 and the motor 10 is lower than the position where the heat pipe 8 is attached to the side of the heat sink 7 1 to 2 cm, the heat pipe 8 utilizes the heat evaporation of the internal condensate 12, the principle of condensation and heat dissipation, the temperature of the end of the heat pipe 8 contacting the heating element 3 is high, the condensate 12 evaporates into steam, and the steam rises to the cooling due to the temperature difference between the upper and lower ends of the heat pipe 8. The end is the end where the heat pipe 8 is connected to the heat sink 7. Through that end, the steam condenses and becomes a condensate 12, and the condensate 12 flows to the heat generating end due to the influence of gravity (that is, the 8 end of the heating element and the heating end of the motor 10) , form reflux, heat transfer and heat dissipation are fast, and the efficiency is high; the contact surface between the ceramic substrate 2 and the chassis 1 and the connection between the fan 9 and the frame 6 are all cushioned with rubber gaskets 13, and the rubber gaskets 13 play a role of shockproof and noise reduction Effect: the top of the fan blade of the fan 9 adopts a smooth arc-shaped structure, which reduces the noise generated by the friction of the fan blade tip against the air. The channels are parallel, so that the wind forms a backflow in the chassis 1, so that the temperature of the heating element 3 is kept at a safe temperature; the frame 6 has an internal hollow structure, and the hollow structure is filled with sound-absorbing cotton, and the filling of the sound-absorbing cotton makes the fan The emitted noise is further reduced, reducing the noise.
本发明所提供的一种具有静音散热功能的计算机电路板基板使用过程如下：打开计算机主机后，计算机电路板开始工作和运行，发热元器件3会随着时间越来越热，发热元器件3的热量传到陶瓷基板2上的部分被陶瓷基板2以其材料特性散发出去，避免发热元器件3热量散发对其他元件造成危害，这时，热管8开始传递热量，热管8内的冷凝液开始循环回流运动，即热管8将发热元器件3产生的热量通过冷凝液12传送到散热片7，散热片7将热量散发出来，因其面积大，片数多，所以散热效果好，散热片7散发的热量经过风扇9的吹拂，将散发的热量吹出散热孔5，且电机10也经过热管8的散热而温度不至于很高，电风扇9和陶瓷基板2均通过塑胶防震螺丝4固定，降低了电路元器件和风扇9的共振噪音，且橡胶垫13和吸音棉的设计，使计算机运行过程中噪音大大地减小，提高了计算机的性能。The use process of a computer circuit board substrate with silent heat dissipation function provided by the present invention is as follows: after the computer mainframe is turned on, the computer circuit board starts to work and run, and the heating element 3 will become hotter and hotter with time, and the heating element 3 The part of the heat transferred to the ceramic substrate 2 is dissipated by the ceramic substrate 2 with its material characteristics, so as to avoid the heat dissipation of the heating element 3 and cause harm to other components. At this time, the heat pipe 8 begins to transfer heat, and the condensate in the heat pipe 8 begins to Circular backflow movement, that is, the heat pipe 8 transmits the heat generated by the heating element 3 to the heat sink 7 through the condensate 12, and the heat sink 7 dissipates the heat. Because of its large area and large number of pieces, the heat dissipation effect is good, and the heat sink 7 The heat dissipated is blown by the fan 9, and the dissipated heat is blown out of the heat dissipation hole 5, and the motor 10 is also dissipated by the heat pipe 8 so that the temperature is not too high. The resonance noise of the circuit components and the fan 9 is eliminated, and the design of the rubber pad 13 and the sound-absorbing cotton greatly reduces the noise during the operation of the computer and improves the performance of the computer.
本发明的主要特点在于，本发明通过陶瓷材料的基板使发热元器件散发到电路板上的热量轻松散发掉，利用进风扇和出风扇的对散热片的吹拂，且风向与散热片空隙平行的设计使空气对流更顺畅，使发热元器件的热量完美地传出机箱外；通过热管将发热元器件表面的热量传递给散热片，接收热量的散热片散发热量后，经过两风扇的空气对流将热量吹出机箱，发热元器件散热快，工作效率高，使基板工作在一个稳定的常温或低温条件下，各元器件工作效率高，计算机运行速度更快；采用风扇扇叶顶端圆弧状结构，降低了风扇尖端摩擦空气而产生的噪声，且风扇和基板均通过塑胶减震材料固定，大大降低了基板工作和各器件共振产生的噪音，给用户更好的体验。The main feature of the present invention is that the heat dissipated by the heating components on the circuit board is easily dissipated through the substrate of ceramic material, and the heat dissipation fins are blown by the inlet fan and the outlet fan, and the wind direction is parallel to the gap of the heat dissipation fins. The design makes the air convection smoother, so that the heat of the heating components is perfectly transmitted out of the chassis; the heat on the surface of the heating components is transferred to the heat sink through the heat pipe, and after the heat sink receives the heat, the air convection of the two fans will dissipate the heat. The heat is blown out of the chassis, the heat dissipation of the heating components is fast, and the work efficiency is high, so that the substrate works under a stable normal temperature or low temperature condition, the work efficiency of each component is high, and the computer runs faster; the arc-shaped structure at the top of the fan blade is adopted, The noise generated by the fan tip rubbing the air is reduced, and the fan and the substrate are fixed by plastic shock-absorbing materials, which greatly reduces the noise generated by the operation of the substrate and the resonance of various devices, giving users a better experience.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.
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