CN107562147A - A kind of computer circuit board substrate with mute heat dissipation function - Google Patents
A kind of computer circuit board substrate with mute heat dissipation function Download PDFInfo
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- CN107562147A CN107562147A CN201710632192.1A CN201710632192A CN107562147A CN 107562147 A CN107562147 A CN 107562147A CN 201710632192 A CN201710632192 A CN 201710632192A CN 107562147 A CN107562147 A CN 107562147A
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- fin
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- circuit board
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- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 29
- 239000004568 cement Substances 0.000 claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 241000883990 Flabellum Species 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 4
- 238000009423 ventilation Methods 0.000 description 5
- 239000003570 air Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001680 brushing Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 methods Methods 0.000 description 2
- 281000137952 General Computer companies 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- -1 cabinet Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering processes Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000002360 preparation methods Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Abstract
The invention discloses a kind of computer circuit board substrate with mute heat dissipation function,Including cabinet,Ceramic substrate and heating element,The ceramic substrate corner is arranged in cabinet by plastic cement damping screw,The heating element is in ceramic substrate,Some frames are installed in the cabinet,The ceramic substrate upper surface is installed with some fin,Fin is provided with the heating element space,The heating element is provided with heat pipe,The fin both ends are equipped with fan,Make heating element be dispersed into the heat on circuit board by the substrate of ceramic material easily to dissipate,Heat pipe is radiated by fin,Fin is brushed plus fan,The caused heat of heating element is set to distribute soon,Operating efficiency is high,Using electric fan top convex structure,And fan and substrate are fixed by plastic cement vibration-absorptive material,Greatly reduce noise caused by substrate work and the resonance of each device,Preferably experienced to user.
Description
Technical field
The present invention relates to computer circuit board matrix technique field, specially a kind of computer with mute heat dissipation function
Circuit board substrate.
Background technology
For computer during operation, various heating elements on circuit board substrate can be because electric current is by producing
Heat, and heating element fever time is long, resistance can change, and block slack-off become of computer, the member on circuit board substrate
Device keeps high temperature for a long time, can also burn out circuit element, so that computer damages.Therefore, the internal circuit of general computer
Heat abstractor is fitted with plate substrate.
The heat-radiating substrate of currently the majority includes two kinds:One kind is that fin is vertically installed with substrate, at the top of fin
Component is dispelled by the heat of fin conductive by fan, but this radiating mode, which is fan, directly blows substrate, and
The circulation of wind direction can not be kept, when the heating of computer load large inner is more, the heat of fin cannot discharge in time, make
It is incomplete into radiating, and fan can also radiate, and noise can be sent；Another computer substrate radiating is heat pipe heat radiation, profit
Liquid evaporation is increased along heat pipe with radiating, condensate liquid is flowed through heating element using gravity, have the function that cooling, but heat
The heat abstractor of pipe radiates generally in cabinet by natural wind, can so make computer cabinet temperature very high, it is impossible to reaches and allows member
The purpose of device perfect operation under normal temperature or cryogenic conditions.
The content of the invention
In order to overcome the shortcomings of prior art, the present invention provides a kind of computer circuits with mute heat dissipation function
Plate substrate, heating element is dispersed into the heat on circuit board by the substrate of ceramic material and easily dissipate, heat pipe passes through
Fin is radiated, and fin is brushed plus fan, the caused heat of heating element is distributed soon, and operating efficiency is high,
Using electric fan top convex structure, and fan and substrate are fixed by plastic cement vibration-absorptive material, greatly reduce substrate
Noise caused by work and the resonance of each device, is preferably experienced to user.
The technical solution adopted for the present invention to solve the technical problems is：A kind of calculating with mute heat dissipation function is electromechanical
Road plate substrate, including cabinet, ceramic substrate and heating element, the ceramic substrate corner are arranged on by plastic cement damping screw
In cabinet, the heating element is arranged on ceramic substrate upper surface, and the both sides of the cabinet are equipped with heat emission hole, the cabinet
Some frames are inside installed, the ceramic substrate upper surface is installed with some fin, and the heating element is provided with
Heat pipe, side and the heat pipe side of the fin are affixed, and the fin both ends are equipped with fan, and the fan corner passes through
Plastic cement damping screw is arranged in frame, and motor, the motor connection heat pipe are provided with the fan.
As a kind of preferable technical scheme of the present invention, the heating element is scattered to be arranged on ceramic substrate upper surface,
And each described heating element erects arrangement.
As a kind of preferable technical scheme of the present invention, the fin described in several is all vertically installed at ceramic substrate
On, and several fin are parallel to each other, in the space of the heater element installation between fins.
As a kind of preferable technical scheme of the present invention, each heating element upper surface is connected with by copper sheet
Being circulated if dry heat pipe, in the heat pipe has condensate liquid.
As a kind of preferable technical scheme of the present invention, the ceramic substrate is connected with cabinet contact surface and fan with frame
Place is lined with rubber sheet gasket.
As a kind of preferable technical scheme of the present invention, the flabellum top of the fan uses smooth convex structure,
Fan wind direction described in two is identical, and the passage between the wind direction of fan and fin is parallel.
As a kind of preferable technical scheme of the present invention, the frame has a hollow structure inside, in the hollow structure
Filled with acoustical cotton.
As a kind of preferable technical scheme of the present invention, the heat pipe is attached to heating element and the position ratio on motor surface
Heat pipe is attached to the low 1~2cm of fin lateral location.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) present invention makes heating element be dispersed into the heat on circuit board easily to distribute by the substrate of ceramic material
Fall, using entering fan and go out brushing fin for fan, and the wind direction design parallel with fin space makes cross-ventilation
It is more smooth, the heat of heating element is ideally spread out of outside cabinet；
(2) present invention by heat pipe by the heat transfer on heating element surface to fin, receive the fin of heat
After distributing heat, heat is blown out into cabinet by the cross-ventilation of two fans, heating element rapid heat dissipation, operating efficiency is high, makes
Substrate is operated under stable a normal temperature or cryogenic conditions, and each component operating efficiency is high, and the computer speed of service is faster；
(3) present invention use electric fan top convex structure, reduces fan tip and rubs air and caused make an uproar
Sound, and fan and substrate are fixed by plastic cement vibration-absorptive material, are greatly reduced and are made an uproar caused by substrate work and the resonance of each device
Sound, preferably experienced to user.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is profile of the present invention；
Fig. 3 is heat pipe and heater element, fin annexation figure.
In figure：1- cabinets；2- ceramic substrates；3- heating elements；4- plastic cement damping screws；5- heat emission holes；6- frames；7-
Fin；8- heat pipes；9- fans；10- motors；11- copper sheets；12- condensate liquids；13- rubber sheet gaskets.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
The explanation of following embodiment is refer to the attached drawing, can be to the specific embodiment implemented to the example present invention.
The direction and position term that the present invention is previously mentioned, for example, " on ", " in ", " under ", "front", "rear", "left", "right", " interior ", "
Outside ", " side " etc., only it is direction and position with reference to annexed drawings.Therefore, the direction and position term used is to illustrate
And understand the present invention, and it is not used to the limitation present invention.
Embodiment：
As shown in Figure 1 to Figure 3, a kind of computer circuit board substrate with mute heat dissipation function provided by the invention, bag
Cabinet 1, ceramic substrate 2 and heating element 3 are included, the good thermal diffusivity of ceramic substrate 2 makes heating element be dispersed into circuit board
On heat preferably distribute and cool down, protection circuit plate, 2 four jiaos of the ceramic substrate is arranged on by plastic cement damping screw 4
In cabinet 1, the heating element 3 is arranged on the upper surface of ceramic substrate 2, and the both sides of the cabinet 1 are equipped with heat emission hole 5, profit
Heat is blown out in fan 9, ventilation and heat, some frames 6 are installed in the cabinet 1, the upper surface of ceramic substrate 2 is consolidated
Dingan County is equipped with some fin 7, and the heating element 3 is provided with heat pipe 8, and heat pipe 8 is by heat caused by heating element 3
It is sent on fin 7, then brushing through fan 9, heat is blown out outside cabinet 1, allows heating element to keep safe temperature, institute
The side and the side of heat pipe 8 for stating fin 7 are affixed, and the both ends of fin 7 are equipped with fan 9, and 9 four jiaos of the fan passes through modeling
Glue damping screw 4 is arranged in frame 6, and two plastic cement damping screws 4 make component and fan work make generation vibration less, subtract
Noise is lacked, motor 10 has been installed, the motor 10 connects heat pipe 8, for the heat of fan 9 to be given out in the fan 9
Go, the heating of itself of reduction fan 9.
Preferably, as shown in figure 1, the heating element 3 is scattered to be arranged on the upper surface of ceramic substrate 2, installation is disperseed
Heating element 3 more preferably radiate, avoid heat from flocking together and burn out the circuit board of computer, each described heating element 3 is equal
Arrangement is erect, heater element is received more easy heat radiation when fan brushes, radiating is faster；As depicted in figs. 1 and 2, described in several
Fin 7 be all vertically installed on ceramic substrate 2, and several fin 7 are parallel to each other, and the heater element 3 is arranged on
In space between several fin 7, for parallel fin 7 after passing through fan 9 brushes, the glen effect of air makes radiating fast
Degree and efficiency all greatly improve；As shown in figure 3, each upper surface of heating element 3 be connected with by copper sheet 11 it is some
Heat pipe 8, the design of copper sheet 11 makes heat pipe 8 and the contact area of heating element 3 bigger, by the heat transfer on heating element 3
The speed walked faster, in the heat pipe 8 circulation have a condensate liquid 12, the heat pipe 8 is attached to heating element 3 and the surface of motor 10
It is low 1~2cm that position than heat pipe 8 is attached to the lateral location of fin 7, and heat pipe 8 condenses radiating using the thermal evaporation of internal condensation liquid 12
Principle, one end temperature of the contact heating component 3 of heat pipe 8 is high, and condensate liquid 12 flashes to steam, and steam is because of heat pipe two about 8
The temperature difference at end and rise to colling end, be exactly that one end that heat pipe 8 is connected with fin 7, by that one end radiate, steam condensation
As condensate liquid 12, condensate liquid 12 because gravity influence flow to heat production end (i.e. the end of heating element 8 and motor 10 heating end),
Form backflow, heat transfer, rapid heat dissipation, efficiency high；The ceramic substrate 2 and the contact surface of cabinet 1 and fan 9 and the junction of frame 6 are equal
Rubber sheet gasket 13 is lined with, rubber sheet gasket 13 plays the effect of anti-vibration noise reducing sound；The flabellum top of the fan 9 uses smooth circle
Arc structure, noise caused by electric fan tip friction air being reduced, the wind direction of fan 9 described in two is identical, and fan 9
Passage between wind direction and fin 7 is parallel, wind is formed backflow in cabinet 1, the temperature of heating element 3 is maintained at safety
In temperature；The frame 6 has hollow structure inside, and is filled with acoustical cotton in hollow structure, and the filling of acoustical cotton makes fan
The noise sent is further reduced, and reduces noise.
A kind of computer circuit board substrate with mute heat dissipation function provided by the present invention is as follows using process：Open
After main frame, computer circuit board is started working and operation, heating element 3 can be more and more warmmer over time, heating member
The part that the heat of device 3 is passed on ceramic substrate 2 is distributed by ceramic substrate 2 with its material property, avoids first device that generates heat
The heat of part 3 distributes to damage to other elements, and at this moment, heat pipe 8 starts to transmit heat, and the condensate liquid in heat pipe 8 starts the cycle over
Heat caused by heating element 3 is sent to fin 7 by reflux movement, i.e. heat pipe 8 by condensate liquid 12, and fin 7 is by warm
Amount comes out, and because its area is big, piece number is more, so good heat dissipation effect, the heat that fin 7 distributes brushes through passing through fan 9,
The heat distributed is blown out into heat emission hole 5, and motor 10 also passes through the radiating of heat pipe 8 and temperature is unlikely to very high, electric fan 9 and pottery
Porcelain substrate 2 is fixed by plastic cement Shockproof screw 4, reduces the resonance noise of circuit components and fan 9, and the He of rubber blanket 13
The design of acoustical cotton, noise in computer running is greatly reduced, improves the performance of computer.
The main characteristic of the invention lies in that the present invention makes heating element be dispersed into circuit board by the substrate of ceramic material
On heat easily dissipate, using entering fan and to go out the brushing fin of fan, and wind direction is parallel with fin space
Design make cross-ventilation more smooth, the heat of heating element is ideally spread out of outside cabinet；It will be generated heat first device by heat pipe
The heat transfer on part surface to fin, receive heat fin distribute heat after, by the cross-ventilation of two fans by heat
Amount blowout cabinet, heating element rapid heat dissipation, operating efficiency is high, substrate is operated in a stable normal temperature or cryogenic conditions
Under, each component operating efficiency is high, and the computer speed of service is faster；Using electric fan top convex structure, wind is reduced
Fan tip friction air and caused noise, and fan and substrate are fixed by plastic cement vibration-absorptive material, greatly reduce substrate
Noise caused by work and the resonance of each device, is preferably experienced to user.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Claims (8)
1. a kind of computer circuit board substrate with mute heat dissipation function, including cabinet (1), ceramic substrate (2) and heating member
Device (3), ceramic substrate (2) corner are arranged in cabinet (1) by plastic cement damping screw (4), the heating element
(3) it is arranged on ceramic substrate (2) upper surface, it is characterised in that：The both sides of the cabinet (1) are equipped with heat emission hole (5), the machine
Some frames (6) are installed in case (1), ceramic substrate (2) upper surface is installed with some fin (7), the hair
Hot component (3) is provided with heat pipe (8), and side and heat pipe (8) side of the fin (7) are affixed, the fin (7) two
End is equipped with fan (9), and fan (9) corner is arranged in frame (6) by plastic cement damping screw (4), the fan (9)
Motor (10), motor (10) the connection heat pipe (8) are inside installed.
A kind of 2. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：Institute
Heating element (3) is stated to disperse to be arranged on ceramic substrate (2) upper surface, and each described heating element (3) row of setting
Row.
A kind of 3. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：If
Dry described fin (7) is all vertically installed on ceramic substrate (2), and several fin (7) are parallel to each other, the hair
Thermal element (3) is arranged in the space between several fin (7).
A kind of 4. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：Institute
Each heating element (3) upper surface is stated by copper sheet (11) if being connected with dry heat pipe (8), being circulated in the heat pipe (8) has
Condensate liquid (12).
A kind of 5. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that:Institute
State ceramic substrate (2) and be lined with rubber sheet gasket (13) with frame (6) junction with cabinet (1) contact surface and fan (9).
A kind of 6. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：Institute
The flabellum top for stating fan (9) uses smooth convex structure, and fan (9) wind direction described in two is identical, and fan (9)
Passage between wind direction and fin (7) is parallel.
A kind of 7. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：Institute
Stating frame (6) has hollow structure inside, and is filled with acoustical cotton in hollow structure.
A kind of 8. computer circuit board substrate with mute heat dissipation function according to claim 1, it is characterised in that：Institute
State that heat pipe (8) is attached to heating element (3) and the position on motor (10) surface is attached to fin (7) lateral location than heat pipe (8)
Low 1~2cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632192.1A CN107562147A (en) | 2017-07-28 | 2017-07-28 | A kind of computer circuit board substrate with mute heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710632192.1A CN107562147A (en) | 2017-07-28 | 2017-07-28 | A kind of computer circuit board substrate with mute heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107562147A true CN107562147A (en) | 2018-01-09 |
Family
ID=60974753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710632192.1A Pending CN107562147A (en) | 2017-07-28 | 2017-07-28 | A kind of computer circuit board substrate with mute heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107562147A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109445537A (en) * | 2018-11-05 | 2019-03-08 | 英业达科技有限公司 | Server and its shockproof structure |
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| CN2857415Y (en) * | 2005-12-23 | 2007-01-10 | 禾富热导股份有限公司 | Improved structure of radiator air hood |
| CN201377498Y (en) * | 2009-03-20 | 2010-01-06 | 高小玲 | Plastic spring screw |
| CN202005099U (en) * | 2010-11-01 | 2011-10-05 | 国营第三八八厂 | Portable full-sealing radiating machine case of high frequency ground wave radar |
| CN105320237A (en) * | 2014-06-23 | 2016-02-10 | 迟键 | Active air cooling structure |
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2017
- 2017-07-28 CN CN201710632192.1A patent/CN107562147A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2488108Y (en) * | 2001-07-11 | 2002-04-24 | 谢英俊 | Radiator suitable for host computer of high-power low-noise computer |
| CN2583720Y (en) * | 2002-12-06 | 2003-10-29 | 方矩科技股份有限公司 | Computer power source supplying apparatus having forced convection heat dissipation function |
| CN2857415Y (en) * | 2005-12-23 | 2007-01-10 | 禾富热导股份有限公司 | Improved structure of radiator air hood |
| CN201377498Y (en) * | 2009-03-20 | 2010-01-06 | 高小玲 | Plastic spring screw |
| CN202005099U (en) * | 2010-11-01 | 2011-10-05 | 国营第三八八厂 | Portable full-sealing radiating machine case of high frequency ground wave radar |
| CN105320237A (en) * | 2014-06-23 | 2016-02-10 | 迟键 | Active air cooling structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109445537A (en) * | 2018-11-05 | 2019-03-08 | 英业达科技有限公司 | Server and its shockproof structure |
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Application publication date: 20180109 |