CN107545246A - A kind of encapsulating structure and its method for packing of fingerprint recognition chip - Google Patents
A kind of encapsulating structure and its method for packing of fingerprint recognition chip Download PDFInfo
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- CN107545246A CN107545246A CN201710708749.5A CN201710708749A CN107545246A CN 107545246 A CN107545246 A CN 107545246A CN 201710708749 A CN201710708749 A CN 201710708749A CN 107545246 A CN107545246 A CN 107545246A
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- recognition chip
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000012856 packing Methods 0.000 title claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 24
- 239000010703 silicon Substances 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 19
- 239000012528 membrane Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 28
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of encapsulating structure and its method for packing of fingerprint recognition chip, including fingerprint recognition chip, fingerprint recognition chip includes first surface and second surface；Fingerprint sensing area is provided with first surface, the pad being electrically connected with fingerprint sensing area；Some conducting terminals and groove are provided with second surface；Silicon hole is provided with groove, silicon hole exposes the pad on first surface；Pad is electrically connected with by the metallic circuit in silicon hole and recess sidewall and conducting terminal；Wherein fingerprint recognition chip all around with second surface on the outside of be enclosed with the second plastic-sealed body, the second plastic-sealed body makes conducting terminal exposed；The first plastic-sealed body is enclosed with the outside of second plastic-sealed body and first surface.The encapsulating structure has plastic packaging protection, and fingerprint recognition chip is provided with silicon hole, so that encapsulating structure is thinner, the encapsulating structure is compared with existing structure, and thickness reduces, and cost is smaller.
Description
Technical field
The invention belongs to identity identification technical field, and in particular to a kind of packaging mechanism of fingerprint recognition chip and its encapsulation
Method.
Background technology
Fingerprint sensor can be built in electronic installation, such as notebook computer, tablet personal computer, smart mobile phone, pass through reading
Take the fingerprint pattern at family so that the certification for the fingerprint pattern that device can pass through the authorized user by the authorized user of device is entered
Row unblock, substantially increase the security of electronic installation.
Fingerprint sensor, it is characterised in that fingerprint sensor surface has induction region, and the region to be identified with it
Environmental stimuli have an effect, produce the chip electric signal that can identify and handle.The distance of the region and environmental stimuli will be use up
May be short, to allow caused signal to be detected.Current many chip technologies, chip bonding pad also typically are located at same table
Face, chip bonding pad is drawn according to bonding wire mode, inevitably lifting induction region and packaging body are extraneous for bonding wire height
Distance.To solve the problems, such as that bonding wire influences sensor performance higher than censorchip surface.
Patent No. CN201420009042, the practicality of entitled wafer level packaging structure and fingerprint identification device are new
One kind is proposed in type and makes step at sensing chip edge, chip surface pad is led at the step by conductive layer, so
Carry out routing again afterwards.In Patent No. US20140285263A1 document, sensed using being formed on a silicon substrate with deposition technique
Region, above-mentioned silicon substrate marginal existence slope, in order to which electric signal caused by induction region is drawn by conductive layer.
The technical scheme of above-mentioned two patent is to make step in sensing chip front, then carries out routing, chip with
Substrate is electrically connected by metal wire, and last plastic packaging cuts into fingerprint sensor.Because substrate has certain thickness so that
Fingerprint sensor can not be accomplished thinner.
The content of the invention
The invention provides a kind of encapsulating structure of fingerprint recognition chip, the encapsulating structure has two layers of plastic packaging, and fingerprint
Identification chip is provided with silicon hole, so that encapsulating structure is thinner, the encapsulating structure is compared with existing structure, thickness drop
It is low, and cost is smaller.
Present invention also offers a kind of method for packing of fingerprint recognition chip, this method is obtained by carrying out plastic packaging twice
The encapsulating structure of above-mentioned fingerprint recognition chip, the thickness of the encapsulating structure is smaller, more merrily and lightheartedly.
The technical scheme is that：A kind of encapsulating structure of fingerprint recognition chip, including fingerprint recognition chip, fingerprint are known
Other chip includes first surface and second surface；Fingerprint sensing area is provided with first surface, is electrically connected with fingerprint sensing area
Pad；Some conducting terminals and groove are provided with second surface；Silicon hole is provided with groove, silicon hole exposes the first table
Pad on face；Pad is electrically connected with by the metallic circuit in silicon hole and recess sidewall and conducting terminal；Wherein fingerprint is known
Other chip is all around enclosed with the second plastic-sealed body with second surface outside, and the second plastic-sealed body makes conducting terminal exposed；Second plastic packaging
The first plastic-sealed body is enclosed with the outside of body and first surface.
Further, the features of the present invention also resides in：
Wherein the side wrap of the second plastic-sealed body is inside the first plastic-sealed body.
The side of wherein the second plastic-sealed body is exposed, and is flushed with the side of the first plastic-sealed body.
The thickness of wherein the first plastic-sealed body on the first surface is 50-100 μm.
Its further groove includes the first inclined-plane along second surface obliquely, and the bottom on the first inclined-plane is arranged to horizontal groove
Bottom surface；And silicon hole is arranged in groove floor.
The present invention another technical scheme be：A kind of method for packing of fingerprint recognition chip, comprises the following steps：
Step 1, glued membrane is pasted on support plate, the first surface that fingerprint recognition chip has fingerprint sensing area is mounted on glue
On film, while make second surface upward；
Step 2, plastic packaging is carried out to the fingerprint recognition chip for completing attachment；It is specific to be filled in fingerprint knowledge using capsulation material
Above the surrounding and second surface of other chip, the second plastic-sealed body is obtained；
Step 3, the second plastic-sealed body is ground, makes conducting terminal exposed；
Step 4, glued membrane is separated with fingerprint recognition chip under 200 DEG C of environment, glued membrane is reset on support plate, then
The second surface for having conducting terminal in step 3 is mounted on glued membrane, first surface is set upward；
Step 5, plastic packaging is carried out in the first surface of fingerprint recognition chip and the outside of the second plastic-sealed body using capsulation material,
Obtain the first plastic-sealed body；
Step 6, glued membrane is separated in the environment of 200 DEG C, obtains the encapsulating structure of fingerprint recognition chip；
Step 7, encapsulation finished product is cut, obtains single encapsulating structure of circular, ellipse, rectangle or waist-hole type.
Further, the features of the present invention also resides in：
The partial mill that first plastic-sealed body is located on first surface is encapsulated to after 50-100 μm wherein in step 5
Structure.
Wherein first plastic-sealed body is cut in step 5, it is cube shape structure to make the first plastic-sealed body.
Wherein first plastic-sealed body is cut in step 5, makes the side of the second plastic-sealed body exposed, and the second plastic-sealed body
Alignd with the side of the first plastic-sealed body side.
The dielectric constant of the capsulation material wherein used in step 2 and step 3 is 3-5 or 7-25.
Compared with prior art, the beneficial effects of the invention are as follows：The encapsulating structure is the secondary modeling to fingerprint recognition chip
Seal structure, relative to the encapsulating structure of an existing plastic packaging, the encapsulating structure eliminates the use of substrate, so as to reduce envelope
The thickness of assembling structure, and use fingerprint recognition chip；Wherein the second plastic-sealed body is used to encapsulate fingerprint recognition chip all around and led
Gap between electric terminal, the first plastic-sealed body are used for the first surface for encapsulating the second plastic-sealed body and fingerprint recognition chip.
Further, the side of the second plastic-sealed body is exposed, can reduce the volume of encapsulating structure.
Further, the thickness of the first plastic-sealed body is smaller, so as to realize that the thickness of the encapsulating structure can reach smaller.
Further, the groove of the first inclined-plane and groove floor composition is used to etch silicon hole, and defines groove
Optimal etch angle and size；By first etching first inclined-plane and horizontal groove floor on groove, can prevent from losing
The part at quarter is broken, so as to convenient further etching silicon hole.
Beneficial effects of the present invention also reside in：This method to fingerprint recognition chip by carrying out plastic packaging, and first twice
Using plate and glued membrane fixation fingerprint recognition chip is cut out, avoid using substrate, the encapsulation of fingerprint recognition chip is realized, by core
Piece all around encapsulates to obtain the second plastic-sealed body and the first plastic-sealed body with chip face, so as to reduce the use of capsulation material, and drops
The low thickness of encapsulating structure.
Further, after the encapsulation of the first plastic-sealed body, the first plastic-sealed body is ground, reduces encapsulating structure
Volume.
Further, the first plastic-sealed body is cut, makes the volume of plastic-sealed body smaller.
Further, the scope of the capsulation material used is larger, and more different types of capsulation materials can be used to enter
Row encapsulation, applicability are wider.
Fingerprint recognition chip-packaging structure its thickness that this method obtains can reach 0.3mm or less than 0.3mm, compared to
Existing fingerprint recognition chip-packaging structure, its thickness is smaller, more frivolous.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the present invention；
Fig. 2 is another structural representation of the present invention；
Fig. 3 is the structural representation mounted in the present invention；
Fig. 4 is the structural representation of the second plastic-sealed body in the present invention；
Fig. 5 is the structural representation of the first plastic-sealed body in the present invention.
In figure, 1 is the first plastic-sealed body；2 be the second plastic-sealed body；3 be conducting terminal；4 be fingerprint recognition chip；5 be groove；
6 be glued membrane；7 be support plate；8 be the first inclined-plane；9 be groove floor；10 be silicon hole；11 be fingerprint sensing area；12 be pad；13
For first surface；14 be second surface.
Embodiment
Technical scheme is further illustrated with specific embodiment below in conjunction with the accompanying drawings.
The invention provides a kind of encapsulating structure of fingerprint recognition chip, as shown in figure 1, including fingerprint recognition chip 4；Refer to
Line identification chip 4 includes first surface 13 and second surface 14, and fingerprint sensing area 11 and pad 12 are provided with first surface 13,
It is electrically connected between fingerprint sensing area 11 and pad 12, some conducting terminals 3, and second surface 14 is provided with second surface 14
End set fluted 5 by etching, groove 5 includes the first inclined-plane 8 for being etched obliquely along second surface 14, wherein the
The angle of inclination on one inclined-plane 8 is 60-70 °, is preferably provided with 65 °, and the vertical depth of groove 5 is 60-100 μm, preferably 80 μm, the
The bottom on one inclined-plane 8 is provided with the horizontal groove floor 9 etched, and the length of groove floor 9 is 240-250 μm, is preferably
245μm；The silicon hole 10 of truncated cone-shaped is wherein etched with groove floor 9, the depth of silicon hole 10 is 55-65 μm, preferably 60 μ
m；The big one end of the diameter of silicon hole 10 is arranged in groove floor 9, a diameter of 100-105 μm, preferably 104 μm；Silicon hole 10
The small one end of diameter is arranged on first surface 13, a diameter of 55-65 μm, preferably 60 μm.And silicon hole 10 is in first surface
13 position face pad 12, and pad 12 is electrically connected with through silicon hole 10 and groove 5 with conducting terminal 3.
As shown in figure 1, the outside of fingerprint recognition chip 4 is enclosed with the encapsulating structure of cube shape, encapsulating structure includes first
The plastic-sealed body 2 of plastic-sealed body 1 and second；Wherein the second plastic-sealed body 2 is wrapped on the side and second surface 14 of fingerprint recognition chip 4,
And second plastic-sealed body 2 make first surface 13 and conducting terminal 3 exposed；First plastic-sealed body 1 is wrapped in the outside of the second plastic-sealed body 2,
First plastic-sealed body 1 wraps up the side of the plastic-sealed body 2 of first surface 13 and second；Encapsulating structure makes power-off terminal 3 exposed.
As shown in Fig. 2 the outside of fingerprint recognition chip 4 is enclosed with the encapsulating structure of cube shape, encapsulating structure includes first
The plastic-sealed body 2 of plastic-sealed body 1 and second；Wherein the second plastic-sealed body 2 is wrapped on the side and second surface 14 of fingerprint recognition chip 4,
And second plastic-sealed body 2 make first surface 13 and conducting terminal 3 exposed；First plastic-sealed body 1 is wrapped on first surface 13, and first
The side of plastic-sealed body 1 flushes setting with the side of the second plastic-sealed body 2.
Wherein the side of the second plastic-sealed body 2 and the first plastic-sealed body 1 can be multiple planes, or curved surface；I.e. first
The section of the plastic-sealed body 2 of plastic-sealed body 1 and second is polygon, or ellipse, or the structure such as circle.
Capsulation material used in the first plastic-sealed body 1 and the second plastic-sealed body 2 of the encapsulating structure is that dielectric constant is 3-5
Or 7-25 capsulation material, its fingerprint recognition performance of the higher capsulation material of its medium dielectric constant microwave medium is better, preferably dielectric constant
For 7 capsulation material.And first plastic-sealed body 1 thickness be 50-100 μm, the gross thickness of the encapsulating structure is less than 0.3mm.
When fingerprint recognition chip 4 is using FPC or the fingerprint chip algorithm of remittance top science and technology, the first plastic-sealed body 1 and the second modeling
Envelope body 2 uses capsulation material of the dielectric constant for 3-5；When fingerprint recognition chip uses other fingerprint chip algorithms, first
Plastic-sealed body and the second plastic-sealed body use capsulation material of the dielectric constant for 7-25.
Present invention also offers a kind of method for packing of fingerprint recognition chip, comprise the following steps：
Step 1, as shown in figure 3, glued membrane 6 is pasted onto on support plate 7, wherein glued membrane 6 divides for the heat of epoxy resin material
From film, support plate 7 is steel material or other metal materials or safety glass material；Then by the first surface of fingerprint recognition chip 4
13 are mounted on glued membrane 6, and the wherein fingerprint sensing area 11 of fingerprint recognition chip 4 and the adhesion of glued membrane 6, second surface 14 is set upward
Put, complete the attachment of fingerprint recognition chip.
Step 2, as shown in figure 4, carrying out exposed die encapsulation to the fingerprint recognition chip 4 for completing attachment；Detailed process is
The capsulation material that dielectric constant is 3-5 or 7-25 is filled outside the side of fingerprint recognition chip 4 and on second surface 14, obtains the
Two plastic-sealed bodies 2.Second plastic-sealed body 2 is all around capsulation material between conducting terminal 3 for being filled in fingerprint recognition chip 4, and
It is connected.
Step 3, the part that the second plastic-sealed body 2 is located to second surface more than 14 is ground, and makes all conducting terminals 3
It is exposed.
Step 4, as shown in figure 5, on the basis of step 3, at a temperature of 200 degrees Celsius, the thermal release of glued membrane 6 is made, and
And mount glued membrane 6 again on support plate 7, then the second surface 14 after polishing is mounted on glued membrane 6, makes conducting terminal 3 viscous
It is attached on glued membrane 6, and first surface 13 is set upward；
Step 5, using dielectric constant be 3-5 or 7-25 capsulation material to the second plastic-sealed body 2 all around and first surface
13 top carries out plastic packaging, obtains the first plastic-sealed body 1, and the first plastic-sealed body 1 wraps up the second plastic-sealed body 2 and first surface 13.
Step 6, the position that the first plastic-sealed body 1 is located above first surface 13 is ground, to the thickness of the first plastic-sealed body 1
Spend for 50-100 μm；Then to be cut, obtain the encapsulating structure of cube shape, after cutting, the side of the second plastic-sealed body 2 is exposed,
And the side of the second plastic-sealed body 2 flushes with the side of the first plastic-sealed body 1.
Step 7, encapsulating structure is placed in 200 DEG C of environment, glued membrane 6 is departed from second surface 14, that is, sealed
Product are dressed up, the thickness of the encapsulating structure is less than 0.3mm；
Step 8, encapsulation finished product is cut, obtains single encapsulating structure of circular, ellipse, rectangle or waist-hole type.
The embodiment of the method for packing of fingerprint recognition chip of the present invention is：
Embodiment 1
The embodiment uses fingerprint recognition chip, and the chip uses FPC fingerprint chip algorithms.
Thermal release film is pasted first on the support plate of steel material, then mounts the first surface 13 of fingerprint recognition chip 4
On thermal release film, and the second surface 14 with conducting terminal 3 is upward；Then existed using the capsulation material that dielectric constant is 4
Fingerprint recognition chip 4 all around with carry out plastic packaging on second surface 14, obtain the second plastic-sealed body 2, then the second plastic-sealed body 2 entered
Row grinding, makes all conducting terminals 3 exposed；Then the thermal release of glued membrane 6, and the weight on support plate 7 are made in the environment of 200 DEG C
It is new to paste glued membrane, and second surface 14 is pasted onto on glued membrane, first surface 13 is set upward；Then in first surface 13
It is upper and the second plastic-sealed body 2 all around to carry out plastic packaging using the capsulation material that dielectric constant is 4, obtain the first plastic-sealed body 1；Finally make
The first plastic-sealed body is ground with grinding body, is ground to 50 μm, and it is cut, as shown in Fig. 2 making the second modeling
The side of envelope body 2, which exposes, to be come, and the side of the second plastic-sealed body 2 flushes with the side of the first plastic-sealed body 1；Then at 200 DEG C
In the environment of, second surface 14 is departed from thermal release film, the encapsulation finished product that thickness is 0.30mm is finally obtained, then to encapsulation
Finished product is cut, and obtains circular or ellipse single encapsulating structure.
Embodiment 2
The embodiment uses fingerprint recognition chip, and the chip pushes up scientific and technological fingerprint chip algorithm using remittance.
Thermal release film is pasted first on the support plate of stainless steel, fingerprint recognition chip 4 is then mounted on thermal release film
On, make second surface 14 upward；Then it is brought into close contact using mould and first surface 13；And use the modeling that dielectric constant is 3
Closure material all around carries out plastic packaging fingerprint recognition chip 4 between conducting terminal, obtains the second plastic-sealed body 2, is then moulded to second
Envelope body 2 is ground, and makes all conducting terminals 3 exposed；Then make the thermal release of glued membrane 6 in the environment of 200 DEG C, and carrying
Glued membrane is re-pasted on plate 7, and second surface 14 is pasted onto on glued membrane, first surface 13 is set upward；Then
Plastic packaging is carried out using the capsulation material that dielectric constant is 5 on one surface 13 and the side of the second plastic-sealed body 2, obtains the first plastic packaging
Body；Finally the first plastic-sealed body 1 is ground using grinding body, 60 μm is ground to, then it is cut, such as Fig. 1 institutes
Show, the first plastic-sealed body 1 is wrapped up the second plastic-sealed body 2；Then in the environment of 200 DEG C, second surface 14 is made to be taken off with thermal release film
From finally obtaining the encapsulation finished product that thickness is less than 0.30mm, then encapsulation finished product cut, obtain single of rectangle encapsulation
Structure.
Embodiment 3
The embodiment uses fingerprint recognition chip, and the chip uses common fingerprint chip algorithm.
Thermal release film is pasted first on the support plate of stainless steel, fingerprint recognition chip 4 is then mounted on thermal release film
On, make second surface 14 upward；Then it is brought into close contact using the mould with protection soft formation with first surface 13；And use Jie
The capsulation material that electric constant is 7 all around carries out plastic packaging in fingerprint recognition chip between conducting terminal, obtains the second plastic-sealed body, so
The second plastic-sealed body 2 is ground afterwards, makes all conducting terminals 3 exposed；Then the heat point of glued membrane 6 is made in the environment of 200 DEG C
From, and glued membrane is re-pasted on support plate 7, and second surface 14 is pasted onto on glued membrane, first surface 13 is set upward
Put；Then plastic packaging is carried out using the capsulation material that dielectric constant is 7 on the plastic-sealed body 2 of first surface 13 and second, obtains first
Plastic-sealed body 1；Finally the first plastic-sealed body 1 is ground using grinding body, is ground to 100 μm, then encapsulating structure is carried out
Cutting；Then in the environment of 200 DEG C, second surface 14 is departed from thermal release film, finally obtain the envelope that thickness is 0.30mm
Product are dressed up, then encapsulation finished product is cut, obtains single encapsulating structure of waist-hole type.
Claims (10)
1. a kind of encapsulating structure of fingerprint recognition chip, it is characterised in that including fingerprint recognition chip (4), fingerprint recognition chip
(4) first surface (13) and second surface (14) are included；Fingerprint sensing area (11) is provided with first surface (13), with fingerprint sense
Survey the pad (12) that area (11) are electrically connected with；Some conducting terminals (3) and groove (5) are provided with second surface (14)；Groove
(5) silicon hole (10) is provided with, silicon hole (10) exposes the pad (12) on first surface (13)；Pad (12) is led to by silicon
Metallic circuit on hole (10) and groove (5) side wall is electrically connected with conducting terminal (3)；
The second plastic-sealed body (2), the second plastic-sealed body are enclosed with the outside of the surrounding and second surface (14) of the fingerprint recognition chip (4)
(2) make conducting terminal (3) exposed；The first plastic-sealed body (1) is enclosed with the outside of second plastic-sealed body (2) and first surface (13).
2. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that second plastic-sealed body (2)
Side wrap it is internal in the first plastic-sealed body (1).
3. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that second plastic-sealed body (2)
Side it is exposed, and flushed with the side of the first plastic-sealed body (1).
4. the encapsulating structure of the fingerprint recognition chip according to claim 1-3 any one, it is characterised in that described first
Thickness of the plastic-sealed body (1) on first surface (13) is 50-100 μm.
5. the encapsulating structure of the fingerprint recognition chip according to claim 1-3 any one, it is characterised in that the groove
(5) the first inclined-plane (8) along second surface (14) obliquely is included, the bottom of the first inclined-plane (8) is arranged to horizontal groove-bottom
Face (9)；And silicon hole (10) is arranged in groove floor (9).
6. a kind of method for packing of fingerprint recognition chip, it is characterised in that comprise the following steps：
Step 1, glued membrane (6) is pasted on support plate (7), the first table that fingerprint recognition chip (4) is had to fingerprint sensing area (11)
Face (13) is mounted on glued membrane (6), while makes second surface (14) upward；
Step 2, plastic packaging is carried out to the fingerprint recognition chip (4) for completing attachment；It is specific to be filled in fingerprint knowledge using capsulation material
Above the surrounding and second surface (14) of other chip (4), the second plastic-sealed body (2) is obtained；
Step 3, the second plastic-sealed body (2) is ground, makes conducting terminal (3) exposed；
Step 4, glued membrane (6) is separated with fingerprint recognition chip (4) under 200 DEG C of environment, glued membrane is reset on support plate (7)
(6), then the second surface (14) for having conducting terminal (3) in step 3 is mounted on glued membrane (6), makes first surface (13)
Set upward；
Step 5, entered using capsulation material on the outside of the first surface (13) and the second plastic-sealed body (2) of fingerprint recognition chip (4)
Row plastic packaging, obtain the first plastic-sealed body (1)；
Step 6, glued membrane is separated in the environment of 200 DEG C, obtains the encapsulation finished product of fingerprint recognition chip；
Step 7, encapsulation finished product is cut, obtains single encapsulating structure of circular, ellipse, rectangle or waist-hole type.
7. the method for packing of fingerprint recognition chip according to claim 6, it is characterised in that by first in the step 5
Plastic-sealed body (1) is located at the partial mill on first surface (13) to after 50-100 μm, obtains encapsulating structure.
8. the method for packing of fingerprint recognition chip according to claim 6, it is characterised in that to first in the step 5
Plastic-sealed body (1) is cut, and it is cube shape structure to make the first plastic-sealed body (1).
9. the method for packing of the fingerprint recognition chip according to right wants 7 or 8 any one, it is characterised in that the step 5
In the first plastic-sealed body (1) is cut, make the side of the second plastic-sealed body (2) exposed, and the side of the second plastic-sealed body (2) and the
The side alignment of one plastic-sealed body (1).
10. the method for packing of fingerprint recognition chip according to claim 6, it is characterised in that the step 2 and step 3
The dielectric constant of the middle capsulation material used is 3-5 or 7-25.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710708749.5A CN107545246A (en) | 2017-08-17 | 2017-08-17 | A kind of encapsulating structure and its method for packing of fingerprint recognition chip |
| PCT/CN2017/104589 WO2019033522A1 (en) | 2017-08-17 | 2017-09-29 | Packaging structure of fingerprint recognition chip and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710708749.5A CN107545246A (en) | 2017-08-17 | 2017-08-17 | A kind of encapsulating structure and its method for packing of fingerprint recognition chip |
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| Publication Number | Publication Date |
|---|---|
| CN107545246A true CN107545246A (en) | 2018-01-05 |
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|---|---|---|---|
| CN201710708749.5A Pending CN107545246A (en) | 2017-08-17 | 2017-08-17 | A kind of encapsulating structure and its method for packing of fingerprint recognition chip |
Country Status (2)
| Country | Link |
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| CN (1) | CN107545246A (en) |
| WO (1) | WO2019033522A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112885743A (en) * | 2021-01-14 | 2021-06-01 | 江苏和睿半导体科技有限公司 | Plastic packaging device for chip packaging and testing |
| CN113078070A (en) * | 2021-03-30 | 2021-07-06 | 无锡闻泰信息技术有限公司 | Device plastic packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102483435A (en) * | 2009-04-21 | 2012-05-30 | 约翰国际有限公司 | Electrically conductive kelvin contacts for microcircuit tester |
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| CN105895572A (en) * | 2015-02-16 | 2016-08-24 | 精材科技股份有限公司 | Chip package and method for forming the same |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN106611714A (en) * | 2015-10-22 | 2017-05-03 | 艾马克科技公司 | Semiconductor device and manufacturing method thereof |
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2017
- 2017-08-17 CN CN201710708749.5A patent/CN107545246A/en active Pending
- 2017-09-29 WO PCT/CN2017/104589 patent/WO2019033522A1/en active Application Filing
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| CN102483435A (en) * | 2009-04-21 | 2012-05-30 | 约翰国际有限公司 | Electrically conductive kelvin contacts for microcircuit tester |
| CN104051367A (en) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
| CN104495741A (en) * | 2014-12-30 | 2015-04-08 | 华天科技（昆山）电子有限公司 | Packaging structure for surface-sensing chip and fabrication method |
| CN104600055A (en) * | 2014-12-30 | 2015-05-06 | 华天科技（西安）有限公司 | Fingerprint recognition sensor |
| CN105895572A (en) * | 2015-02-16 | 2016-08-24 | 精材科技股份有限公司 | Chip package and method for forming the same |
| CN106611714A (en) * | 2015-10-22 | 2017-05-03 | 艾马克科技公司 | Semiconductor device and manufacturing method thereof |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
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| WO2019033522A1 (en) | 2019-02-21 |
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