CN107510509A - A kind of microsensor encapsulating structure and its manufacture method - Google Patents
A kind of microsensor encapsulating structure and its manufacture method Download PDFInfo
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- CN107510509A CN107510509A CN201710555423.3A CN201710555423A CN107510509A CN 107510509 A CN107510509 A CN 107510509A CN 201710555423 A CN201710555423 A CN 201710555423A CN 107510509 A CN107510509 A CN 107510509A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B90/00—Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
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Abstract
The invention discloses a kind of microsensor encapsulating structure, including housing unit, piece core assembly is installed in the housing unit, described housing unit includes cylinder type hollow pipe, one end of the cylinder type hollow pipe is connected with round end, the window at least spilling the described core assembly in part is offered on the cylinder type hollow pipe, described core assembly includes sensor chip, the sensor chip is provided with coating, the coating is connected with the cylinder type hollow pipe of the thereabout, one end away from round end connects the front end of flexible PCB by anisotropic conducting film on the sensor chip, the rear end of the flexible PCB is connected with circuit enamel-covered wire.The microsensor method for packing of the present invention not only simplify sonde configuration form, simplifies technological process, simultaneously effective reduces the size of probe, have universality to the encapsulation of diversified forms sensor.
Description
Technical field
The present invention relates to hard conduit type sensor technical field, it particularly relates to a kind of microsensor encapsulation knot
Structure and its manufacture method.
Background technology
Hard conduit type probe is widely used in medical diagnosis as microsensor carrier, the structure one of this probe
As be metal that outermost is cylinder type or ceramic material hollow pipe, surface applied and is covered with biocompatible materials, and inside is placed
Suitable sensor, the signal of sensor detection pass through in the wire transmission in hollow pipe to patient monitor below.
The packaging technology of such probe generally comprises support plate bonding and connected with lead.Support plate functions as biography
The support of sensor chip, some support plates are also furnished with pad and wire is used for sensor and is connected with the circuit of outside.With support plate
Sonde configuration packaging technology is that first sensing chip is adhered on support plate, then very small with diameter using Wire Bonding Technology
Metal wire both ends connect chip and support plate circuit land respectively, and so as to form electrical connection, support plate finally is loaded into hollow shell
Body, using by the way of support plate can sensor load housing when play a part of positioning.Typical application example has the U.S.
A kind of the catheter tip equipment and its production technology that General Electric patent US20090299178 is introduced.
But due to having used support plate to still result in many problems, support plate manufacture first belongs to retrofit, in certain cost
It is difficult to obtain preferable size under limitation；Electrically connect in addition, support plate not only needs also to do with back-end circuit with sensor chip
Connect, whole probe size thus will be made to become big；Finally, Wire Bonding Technology not only work is used between support plate and sensor pads
Skill is complicated, and being bonded the reduction of size reduces bonding point intensity, easily cause lead open circuit, it is short-circuit a series of problems, such as.
The content of the invention
For the above-mentioned technical problem in correlation technique, the present invention proposes a kind of microsensor encapsulating structure and its manufacture
Method, the above-mentioned deficiency of prior art can be overcome.
To realize above-mentioned technical purpose, the technical proposal of the invention is realized in this way：
A kind of microsensor encapsulating structure, including housing unit, piece core assembly, described shell are installed in the housing unit
Body component includes cylinder type hollow pipe, and one end of the cylinder type hollow pipe is connected with round end, opened on the cylinder type hollow pipe
Provided with the window at least spilling the described core assembly in part, described core assembly includes sensor chip, the sensor
Chip is provided with coating, and the coating is connected with the cylinder type hollow pipe of the thereabout, remote on the sensor chip
One end of round end connects the front end of flexible PCB by anisotropic conducting film, and the rear end of the flexible PCB is connected with electricity
Road enamel-covered wire.
Further, the coating is connected by medical grade glue with the cylinder type hollow pipe.
Further, the rear end of the sensor chip is connected by glue with the flexible PCB.
Further, the upside of described sensor chip is provided with some pin pads two being separated from each other, the flexibility
The front end of circuit board is provided with some pin pads one corresponding with the pin pad two, the flexible PCB and sensor core
Connected between piece and between the pin pad one and pin pad two by anisotropic conducting film, the anisotropic
It is dispersed in conducting film to have some electrically conductive particles.
Further, the rear end of the flexible PCB is provided with pad, and the flexible PCB passes through the pad and electricity
Road enamel-covered wire connection.
The application also provides a kind of manufacture method of described microsensor encapsulating structure, comprises the following steps：
S401：The cylinder type hollow pipe and round end splicing are assembled into housing unit；
S402：By sensor chip, anisotropic conducting film, flexible PCB and circuit enamel-covered wire by being fixed together, group
Dress up piece core assembly；
S403：Piece core assembly is inserted in housing unit and is packaged into complete structure, that is, completes microsensor encapsulating structure
Manufacture.
Further, step S402 is specifically included：
S4021：The anisotropic conducting film of banding is first bonded on flexible PCB, placed it on workbench, adjusts position
Putting makes bonding face alignment thermal head tip and is fixed, and then sets hot-press equipment running parameter to carry out pre- patch technique；
S4022：This pressure technique is carried out, is specially：Component after pre- patch technique is fixed to workbench and is directed at thermal head and is set
Good hot-press equipment parameter completes the curing reaction and physical reactions of anisotropic conducting film；
S4023：By coating uniform coated on sensor chip；
S4024：The support flexible PCB is fixed in the rear end that glue is coated in sensor chip；
S4025：Circuit enamel-covered wire is welded on the pad of flexible PCB rear end.
Further, step S403 is specially：The piece core assembly assembled in step S402 is coated into medical grade glue, waits doctor
Piece core assembly is sent into step S401 in the housing unit assembled after slightly dry with level glue, sensor sensing is faced quasi- shell
The window of body component, wait glue fixed after being dried.
Beneficial effects of the present invention：The microsensor method for packing of the present invention not only simplify sonde configuration form, letter
Technological process is changed, has simultaneously effective reduced the size of probe, there is universality to the encapsulation of diversified forms sensor.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the overall structure figure of microsensor encapsulating structure described according to embodiments of the present invention；
Fig. 2 is the structural representation of flexible circuit plate part in microsensor encapsulating structure described according to embodiments of the present invention
Figure；
Fig. 3 is the partial enlarged drawing at A in Fig. 2；
Fig. 4 is the hot pressing schematic diagram in the microsensor method for packing of the present invention；
Fig. 5 is the flow chart of the microsensor method for packing of the present invention；
In figure：1000th, pop one's head in；101st, round end；102nd, cylinder type hollow pipe；103rd, window；104th, medical grade glue；105th, apply
Layer；106th, circuit enamel-covered wire；107th, glue；108th, pad；201st, flexible PCB；202nd, sensor chip；205th, Ge Xiangyi
Property conducting film；206th, electrically conductive particles；301st, thermal head；302nd, workbench.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained, belong to what the present invention protected
Scope.
As Figure 1-3, described a kind of microsensor encapsulating structure according to embodiments of the present invention, including housing group
Part, piece core assembly is installed in the housing unit, described housing unit includes cylinder type hollow pipe 102, the cylinder type
One end of hollow pipe 102 is connected with round end 101, is offered on the cylinder type hollow pipe 102 at least spilling described in part
The window 103 of piece core assembly, described core assembly include sensor chip 202, and the sensor chip 202 is provided with coating
105, the coating 105 is connected with the cylinder type hollow pipe 102 around the window 103, remote on the sensor chip 202
One end of round end 101 connects the front end of flexible PCB 201 by anisotropic conducting film 205, the flexible PCB 201
Rear end is connected with circuit enamel-covered wire 106.
In one embodiment, the coating 105 is connected by medical grade glue 104 and the cylinder type hollow pipe 102
Connect.
In one embodiment, the rear end of the sensor chip 202 passes through glue 107 and the flexible PCB
201 connections.
In one embodiment, the upside of described sensor chip 202 is provided with some pin pads being separated from each other
2 204, the front end of the flexible PCB 201 is provided with some pin pads 1 corresponding with the pin pad 2 204,
Between the flexible PCB 201 and sensor chip 202 and between the pin pad 1 and pin pad 2 204
Connected by anisotropic conducting film 205, it is dispersed in the anisotropic conducting film 205 to have some electrically conductive particles
206。
In one embodiment, the rear end of the flexible PCB 201 is provided with pad 108, the flexible PCB 201
It is connected by the pad 108 with circuit enamel-covered wire 106.
The present invention also provides a kind of manufacture method of microsensor encapsulating structure, as shown in figure 5, comprising the following steps：
S401：The cylinder type hollow pipe 102 and the splicing of the round end 101 are assembled into housing unit；
S402：Sensor chip 202, anisotropic conducting film 205, flexible PCB 201 and circuit enamel-covered wire 106 are passed through solid
It is scheduled on together, is assembled into piece core assembly；
S403：Piece core assembly is inserted in housing unit and is packaged into complete structure, that is, completes microsensor encapsulating structure
Manufacture.
In one embodiment, as shown in figure 4, step S402 is specifically included：
S4021：The anisotropic conducting film 205 of banding is first bonded on flexible PCB 201, places it in workbench 302
On, adjustment position makes the tip of bonding face alignment thermal head 301 and is fixed, and then sets hot-press equipment running parameter to carry out pre-
Patch technique；
S4022：This pressure technique is carried out, is specially：Component after pre- patch technique is fixed to workbench（302）And it is directed at thermal head
Set hot-press equipment parameter and complete anisotropic conducting film（205）Curing reaction and physical reactions；
S4023：By coating 105 uniformly coated on sensor chip 202；
S4024：The support flexible PCB 201 is fixed in the rear end that glue 107 is coated in sensor chip 202；
S4025：Circuit enamel-covered wire 106 is welded on the pad 108 of the rear end of flexible PCB 201.
In one embodiment, step S403 is specially：The piece core assembly assembled in step S402 is coated into medical grade
Glue 104, piece core assembly is sent into step S401 in the housing unit assembled after slightly dry etc. medical grade glue 104, makes biography
Sensor sensitive area is directed at the window of housing unit, waits glue fixed after being dried.
In order to facilitate understand the present invention above-mentioned technical proposal, below by way of in specifically used mode to the present invention it is above-mentioned
Technical scheme is described in detail.
It is described according to a kind of microsensor encapsulating structure of the present invention, including probe 1000 when specifically used
Probe includes housing unit and piece core assembly, and described piece core assembly includes sensor chip, and sensor chip can be various
Outer boundary environment can be experienced（Such as pressure, temperature, pH value）Change and produce the sensor of electric signal output, probe 1000 can
It is implanted into a manner of by operation in human body and is used to measure various physiological signals, such as measurement intracranial pressure etc..
Round end 101 and cylinder type hollow pipe 102 are the shells of probe, it is desirable to which there is certain rigidity can give internal biography
Sensor chip 202 is protected well, prevents from being scrapped by what impact and collision of extraneous stress etc. caused entirely to pop one's head in, round end
101 and cylinder type hollow pipe 102 should be made up of the material with bio-compatibility, such as high molecule plastic, titanium alloy, ceramics.
Tissue of the probe inside some cavity arrival that implantation needs by body surface, to prevent from damaging tissue increasing
Add patient painful, smooth curved surface should be made in probing shell, reduce the presence of corner angle, in the example that Fig. 1 is provided, round end as far as possible
End is connected with cylinder type hollow pipe one end.A window is provided with the centre of cylinder type hollow pipe 102, the effect of this window is
The sensitive area of sensor chip 202 is allowed directly to be contacted with external environment to ensure the precision of measurement, according to sensor bulk not
Can be at 50 ° to 120 ° relative to the central angle angle of the hollow tube hub of cylinder type with window；Medical grade glue 104 is used for will
Sensor chip 202 is fixed in cylinder type hollow pipe 102, various medical grade glue can be selected, such as two-component UV glue, RTV
Deng, different glue has different curing characteristics and water absorption character, can according to sensor chip measure physiological signal tool
Bulk properties selects suitable glue；Coating 105 is that sensor surface coating material is used to protect sensor, prevents tissue liquid
Composition produces corrosiveness on sensor chip and then influences measurement accuracy.Coating 105 should have high dielectric strength, good
Anti-steam permeance property etc. is specific, and it is in heat that can select material, the coatings 105 such as Parylene, epoxy resin, organic siliconresin
Technique is pressed to be coated up after completing.
Sensor chip 202 is connected with flexible PCB 201 by anisotropic conductive film, as shown in Fig. 2 flexible
One end of circuit board 201 has pin pad one to be used for the electrical connection with sensor chip 202, and its shapes and sizes mainly depends on
In the position of pin pad two on sensor chip, the pin pad one on flexible PCB should weld with pin on sensor chip
The size and location of disk two is consistent, all pad bonded energy one-shot formings during welding, to ensure flexible PCB and sensor
The stable adhesion of chip, glue 107 can be coated in sensor rear end as support；Also there is pad in the other end of flexible PCB
108 are used to be connected with back-end circuit enamel-covered wire 106, and the layout of pad 108 can be along flexible PCB Longitudinal extending, when pad number
Mesh is less and flexible PCB lateral dimension is sufficiently large pad tile horizontally can be so advantageous to circuit enamel-covered wire and be pullled
When each line uniform force；Circuit enamel-covered wire can select 50 μm to 150 μm of diameter, and material can be with gold thread, silver wire, copper cash
Deng enamel-covered wire is fixed by way of welding with pad.
Wherein, the bonding and electrically conducting between pin pad one and pin pad two is to rely on anisotropic conducting film
205 come what is realized, and wherein electrically conductive particles 206 are the reason for anisotropic conducting film can be conductive, and the material of electrically conductive particles has tradition
Gold, silver, the metal material such as copper, also have the Novel environment-friendlymaterial materials such as carbon black, graphite, low-melting alloy, in anisotropic conducting film
The conducting particles quantity of middle unit volume is added by the calculating of science, and after heat pressing process, Z-direction is due to leading
Electric particulate flattening deformation directly with contact pads and turn on, due to the limitation of number on XY directions, avoid leading after dispersed
Electric particulate contacts with each other, and realizes that one direction turns on, as shown in partial enlarged drawing in Fig. 3；The anisotropic conducting film of different size
Material can have an impact to sensor chip and flexible PCB bonding effect, and the size of electrically conductive particles 206 can directly affect most
Bonding resistance eventually, the conductive particle subnumber on a pin is caused to reduce or even occur laterally to lead if electrically conductive particles diameter crosses conference
Logical phenomenon, reality should consider the size of pin pad two and spacing on sensor chip when choosing electrically conductive particles diameter
Influence, using anisotropic conducting film carry out bonding be to be realized by heat pressing process, caused high temperature meeting in hot pressing
Sensor chip 202 is had an impact, because according to anisotropic of the characteristic of the sensor chip selection with suitable hot pressing temperature
Conducting membrane material.
Core process in the manufacturing process of microsensor encapsulating structure is hot pressing, temperature and pressure of the hot pressing to work
Higher Deng requirement, heat pressing process is carried out on specific hot press working platform in the present invention, and hot pressing schematic diagram is as shown in Figure 4.
301 be thermal head in figure, it is desirable to which thermal head can be rapidly heated and keeping temperature is stable, and output temperature can connect between 0-600 DEG C
Continuous adjustable, temperature can reach the 90% of target temperature in 10s；The certain pressure of thermal head output simultaneously, pressure are scope in 0-
Continuously adjustabe between 10N, and the variable quantity within 80s is no more than ± 0.3N；Thermal head tip is used for pressure sensor chip
Area be not less than sensor chip surface welding zone area, 302 place the workbench of sensor chip when being hot pressing, it is desirable to work
The surface of platform 302 is smooth, dustless, and there is positioner to coordinate thermal head to carry out hot pressing, while has for clamping sensor core
The fixture of piece；For some platforms, workbench 302 has the function of pressure caused by measurement thermal head, is surveyed according to real-time pressure
Value can carry out necessary adjustment to the pressure on thermal head.
Fig. 5 is the assembly flow charts of the microsensor packaging technology of the present invention, and step S401 assembles for housing unit, is
Round end 101 and cylinder type hollow pipe 102 are connected, round end 101 and cylinder type hollow pipe 102 different according to used material
It can connect in different ways, such as moulding welding, arc welding or use glue bonding etc..
Step S402 assembles for piece core assembly, mainly by heat pressing process that sensor chip 202, anisotropic is conductive
Film 205 and sensor chip 201 are fixed together, and heat pressing process includes pre- patch and two processes of this pressure；Pre- patch is to make banding each
Item anisotropic conductive film is first bonded above sensor chip, is placed the assembly on workbench 302, adjustment position is directed at bonding face
The tip of thermal head 301 is simultaneously fixed, and then sets 80 DEG C of hot-press equipment running parameter temperature, pressure 0.5N, time 2s, passes through
Pre- patch can be such that the electrically conductive particles of anisotropic conducting film are contacted with sensor chip surface, and this pressure is most important in heat pressing process
Link, should during anisotropic conducting membrane material complete whole curing reaction and physical reactions, the group that will be generated in pre- patch
Part is fixed to workbench and is directed at thermal head, sets hot-press equipment parameter and is originally pressed through journey, device parameter can imitate to hot pressing
Fruit produces considerable influence, and resistance reduces between pin can be caused when being improved such as pressure, and temperature is higher, bonding time is long to produce
More bubbles, the parameter area for being adapted to sensor chip and anisotropic conducting film is pressure：2.5-3.2N, temperature：150-210
DEG C, the time：60s or so, processing is coated after the completion of hot pressing, coating 105 is uniformly coated on sensor sensing face, will
Glue 107 is coated in sensor rear end and fixes support flexible PCB, and finally circuit enamel-covered wire 106 is welded on flexible PCB
Pad 108 on.
Step S403 carries out overall assembling, and the piece core assembly assembled in S402 coats medical grade glue 104, waits glue slightly
Piece core assembly is sent into S401 after dry in the housing unit assembled, sensor sensing is faced quasi- shell window, wait glue
Water, which is dried, to be fixed.
In summary, microsensor method for packing of the invention not only simplify sonde configuration form, simplify technique
Flow, the size of probe is simultaneously effective reduced, there is universality to the encapsulation of diversified forms sensor.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (8)
1. a kind of microsensor encapsulating structure, it is characterised in that including housing unit, label is provided with the housing unit
Component, described housing unit include cylinder type hollow pipe（102）, the cylinder type hollow pipe（102）One end be connected with circle
Head（101）, the cylinder type hollow pipe（102）On offer window at least spilling the described core assembly in part（103）,
Described core assembly includes sensor chip（202）, the sensor chip（202）It is provided with coating（105）, the coating
（105）With the window（103）The cylinder type hollow pipe of surrounding（102）Connection, the sensor chip（202）Upper remote round end
（101）One end pass through anisotropic conducting film（205）Connect flexible PCB（201）Front end, the flexible PCB
（201）Rear end be connected with circuit enamel-covered wire（106）.
A kind of 2. microsensor encapsulating structure according to claim 1, it is characterised in that the coating（105）Pass through
Medical grade glue（104）With the cylinder type hollow pipe（102）Connection.
A kind of 3. microsensor encapsulating structure according to claim 1, it is characterised in that the sensor chip
（202）Rear end pass through glue（107）With the flexible PCB（201）Connection.
A kind of 4. microsensor encapsulating structure according to claim 3, it is characterised in that described sensor chip
（202）Upside be provided with some pin pads two being separated from each other（204）, the flexible PCB（201）If front end be provided with
The dry and pin pad two（204）Corresponding pin pad one（203）, the flexible PCB（201）And sensor chip
（202）Between and the pin pad one（203）With pin pad two（204）Between pass through anisotropic conducting film
（205）Connection, the anisotropic conducting film（205）In dispersed have some electrically conductive particles（206）.
A kind of 5. microsensor encapsulating structure according to claim 1, it is characterised in that the flexible PCB
（201）Rear end be provided with pad（108）, the flexible PCB（201）Pass through the pad（108）With circuit enamel-covered wire
（106）Connection.
A kind of 6. manufacture method of microsensor encapsulating structure as described in claim 1-5 is any, it is characterised in that including
Following steps：
S401：By the cylinder type hollow pipe（102）With the round end（101）Splicing is assembled into housing unit；
S402：By sensor chip（202）, anisotropic conducting film（205）, flexible PCB（201）With circuit enamel-covered wire
（106）By being fixed together, piece core assembly is assembled into；
S403：Piece core assembly is inserted in housing unit and is packaged into complete structure, that is, completes microsensor encapsulating structure
Manufacture.
A kind of 7. manufacture method of microsensor encapsulating structure according to claim 6, it is characterised in that step S402
Specifically include：
S4021：By the anisotropic conducting film of banding（205）First it is bonded at flexible PCB（201）On, place it in workbench
（302）On, adjustment position makes bonding face be directed at thermal head（301）Tip is simultaneously fixed, and then sets hot-press equipment to work and joins
Number carries out pre- patch technique；
S4022：This pressure technique is carried out, is specially：Component after pre- patch technique is fixed to workbench（302）And it is directed at thermal head
Set hot-press equipment parameter and complete anisotropic conducting film（205）Curing reaction and physical reactions；
S4023：By coating（105）Uniformly it is coated in sensor chip（202）On；
S4024：By glue（107）It is coated in sensor chip（202）Rear end fix and support the flexible PCB（201）；
S4025：By circuit enamel-covered wire（106）It is welded to flexible PCB（201）The pad of rear end（108）On.
A kind of 8. manufacture method of microsensor encapsulating structure according to claim 6, it is characterised in that step S403
Specially：The piece core assembly assembled in step S402 is coated into medical grade glue（104）, etc. medical grade glue（104）After slightly dry
Piece core assembly is sent into step S401 in the housing unit assembled, sensor sensing is faced the window of quasi- housing unit,
Wait glue fixed after being dried.
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| CN201710555423.3A CN107510509A (en) | 2017-07-10 | 2017-07-10 | A kind of microsensor encapsulating structure and its manufacture method |
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| CN109674460A (en) * | 2019-02-18 | 2019-04-26 | 中国电子科技集团公司第二十六研究所 | A kind of the bougie structure and its packaging method of implanted micro sensor |
| CN112107306A (en) * | 2020-09-25 | 2020-12-22 | 北京万特福医疗器械有限公司 | Intracranial pressure probe |
| CN114088026A (en) * | 2022-01-20 | 2022-02-25 | 江苏奥琳斯邦装备科技股份有限公司 | Hot-pressing curing device and curing method for strain measurement |
| CN114088026B (en) * | 2022-01-20 | 2022-04-05 | 江苏奥琳斯邦装备科技股份有限公司 | Hot-pressing curing device and curing method for strain measurement |
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