CN107477381A - LED circuit board and LED support - Google Patents

Abstract

The invention provides an LED circuit board and an LED bracket, belonging to the technical field of LED lamps. The LED bracket includes a base plate, and the base plate is provided with a power line, a first wire and a second wire along the vertical direction of the base plate, and the first wire and the second wire are arranged in a Z shape with the base plate , the first conductive wire is provided with a plurality of first conductive regions arranged in sequence, the second conductive wire is provided with a plurality of second conductive regions arranged in sequence, each first conductive region and each second conductive region are formed for The installation area where the LED chip is placed, the first wire and the second wire are connected in series and parallel through the LED chips arranged in the installation area, so that the installation of the LED chip is simpler and the bonding of the LED chip is easier. Effectively save space on the LED circuit board, and the structure is more stable.

Description

LED circuit board and LED bracket

technical field

The invention relates to the technical field of LED lamps, in particular to an LED circuit board and an LED bracket.

Background technique

LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

Existing LED circuit boards all use two parallel wires, usually the distance between the two is relatively large, and the LED chip needs to be installed between the two wires, and the LED chip is usually relatively small. On the one hand, this method This makes soldering of the LED chips very difficult, and it is also inconvenient to attach the LED chips. On the other hand, the area of the circuit board will be relatively large.

Contents of the invention

The object of the present invention is to provide an LED circuit board and an LED bracket, which can improve the above problems.

Embodiments of the present invention are achieved like this:

An LED circuit board, comprising a bottom plate, on which a power line, a first lead and a second lead are arranged on the bottom plate along the vertical direction of the bottom plate, one end of the power line is connected to a driving power supply, and the first lead is One end is connected to the driving power supply, one end of the second wire is connected to the other end of the power line, and a loop is formed between the first wire, the second wire and the power line; the first Both the wire and the second wire are arranged in a Z shape, the first wire is provided with a plurality of first conductive regions arranged in sequence, and the second wire is provided with a plurality of second conductive regions arranged in sequence, and each first The conductive area and each second conductive area form an installation area for placing LED chips, and the first wire and the second wire are connected in parallel through the LED chip strings arranged in the installation area.

In a preferred embodiment of the present invention, an independent power line is further provided on the base plate, and the independent power line is connected to the second wire.

In a preferred embodiment of the present invention, the installation areas are sequentially arranged on the bottom plate according to a preset distance.

In a preferred embodiment of the present invention, one end of the power line is connected to the negative pole of the driving power supply, and one end of the first wire is connected to the positive pole of the driving power supply.

In a preferred embodiment of the present invention, one end of the power line is connected to the positive pole of the driving power supply, and one end of the first wire is connected to the negative pole of the driving power supply.

In a preferred embodiment of the present invention, one end of the bottom plate is further provided with a first metal terminal and a second metal terminal, one end of the first metal terminal is connected to the positive pole of the drive power supply, and the first metal terminal The other end of the terminal is connected to the power line, one end of the second metal terminal is connected to the negative pole of the driving power supply, and the other end of the second metal terminal is connected to one end of the first wire.

In a preferred embodiment of the present invention, the LED chip is coated with fluorescent colloid.

In a preferred embodiment of the present invention, a heat sink is further provided on the bottom plate, and a heat dissipation area is provided on the first wire and the second wire, and the heat sink is connected to the heat radiation area.

In a preferred embodiment of the present invention, the first wire and the second wire in the heat dissipation area are provided with a protruding arc.

An LED bracket, the LED bracket includes a plurality of LED circuit boards, and the plurality of LED circuit boards are arranged in sequence along the vertical direction of the LED bracket.

The beneficial effects of the embodiments of the present invention are:

An embodiment of the present invention provides an LED circuit board and an LED bracket. The first wire and the second wire are arranged on the base plate in a Z shape, and the first wire is provided with a plurality of first conductive regions arranged in sequence. , the second wire is provided with a plurality of second conductive regions arranged in sequence, each first conductive region and each second conductive region form a mounting area for placing LED chips, the first wire and the second The wires are connected in series and parallel through the LED chips arranged in the installation area, so that the installation of the LED chips is simpler and the bonding of the LED chips is easier, which can effectively save the space of the LED circuit board and have a more stable structure.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

Fig. 1 is a schematic structural diagram of an LED circuit board provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of another LED circuit board provided by an embodiment of the present invention;

3 is a schematic structural diagram of another LED circuit board provided by an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of an LED bracket provided by an embodiment of the present invention.

Icon: 200-LED bracket; 100-LED circuit board; 110-base plate; 120-power line; 130-first wire; 132-first conductive area; 140-second wire; LED chip; 160-independent power line; 170-first metal terminal; 180-second metal terminal; 190-radiation area; 192-arc.

detailed description

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or is the The usual orientation or positional relationship of the invention product in use is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore It should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or can be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of an LED circuit board 100 provided by an embodiment of the present invention. The LED circuit board 100 includes a bottom plate 110 on which a power supply wire 120, a first wire 130 and a second wire 140, one end of the power wire 120 is connected to a driving power supply (not shown in the figure), and the other end of the power wire 120 is connected to the first wire 130 or the second wire. Two wires 140 form a loop between the driving power supply, the first wire 130 , the second wire 140 and the power wire 120 .

Specifically, the first conductive wire 130 and the second conductive wire 140 are arranged in a Z shape, the first conductive wire 130 is provided with a plurality of first conductive regions 132 arranged in sequence, and the second conductive wire 140 is provided with a plurality of first conductive regions 132 arranged in sequence. A plurality of second conductive regions 142 are arranged, and each first conductive region 132 and each second conductive region 142 form an installation area for placing the LED chip 150, and the first wire 130 and the second wire 140 are arranged by The LED chips 150 in the mounting area are connected in series and parallel.

Wherein, the first wire 130 and the second wire 140 adopt a Z shape, which can form a series-parallel connection between the LED chips 150 , can effectively save the space of the LED circuit board 100 , and have a more stable structure.

Both the first conductive area 132 and the second conductive area 142 are coated with a conductive layer, and the LED chip 150 is installed in the installation area, so that the first wire 130 and the second wire 140 can be connected in series and parallel, thereby reducing the supply current of the driving power supply, The energy consumption of the LED circuit board 100 is effectively reduced.

The first conductive area 132 and the second conductive area 142 are rectangular areas protruding toward each other, which can facilitate the installation of the LED chip 150. In addition, in order to save the space of the LED circuit board 100, all the LED chips in the installation area can be placed The first conductive regions 132 and the second conductive regions 142 are alternately arranged.

The drive power supply adopts LED constant current drive power supply, which is a voltage converter that converts the power supply into a specific voltage and current to drive the LED to emit light. It is a constant current source that can change the voltage as the forward voltage drop value of the LED changes.

As a method, one end of the power line 120 is connected to the negative pole of the driving power supply, one end of the first wire 130 is connected to the positive pole of the driving power supply, and one end of the second wire 140 is connected to the power supply The other end of the line 120 is connected, or, one end of the power line 120 is connected to the positive pole of the driving power supply, one end of the first wire 130 is connected to the negative pole of the driving power supply, and one end of the second wire 140 Connect with the other end of the power line 120, so that the driving power, the power line 120, the first wire 130 and the second wire 140 can form a series-parallel circuit, so that the driving power can drive the LED chip 150 installed in the installation area to emit light .

Please refer to Fig. 2, Fig. 2 is a schematic structural diagram of another LED circuit board 100 provided by the embodiment of the present invention, the base plate 110 is also provided with an independent power line 160, and the independent power line 160 is connected to the second wire 140 connection, when a power controller is used to supply power to the LED circuit board 100, if the power supply is single-ended, it is only necessary to connect the positive and negative poles of the driving power to the power line 120 and the first wire 130, if the double-ended To supply power, an independent power cord 160 is required to lead the current from the other end to the end with the power controller.

The bottom plate 110 is a metal plate, the structure of the power line 120, the first lead 130, the second lead 140 and the independent power line 160 is a metal plate integrally formed at one time, and the processing method can be stamping or It is hub rolling, and the material of the metal plate is any conductive metal or its alloy.

In order to save the space of the LED circuit board 100 more conveniently, each first conductive region 132 and each second conductive region 142 can be closely interlaced and arranged, which can make the distance between the two wires smaller without affecting the LED chip 150. The installation also greatly saves the space of the LED circuit board 100.

Wherein, the LED chip 150 is installed between the first wire 130 and the second wire 140, and the LED chip 150 is usually relatively small. In order to better weld or bond the LED chip 150, the first conductive area 132 is the conductive area where the first wire 130 protrudes toward the direction of the second wire 140, and the second conductive area 142 is the conductive area where the second wire 140 protrudes toward the direction of the first wire 130, so that the LED chip 150 can be installed in the gap between the first wire 130 and the second wire 140 , which increases the structural stability of the LED circuit board 100 . Wherein, the first conductive region 132 and the second conductive region 142 can be protruding triangles, saving the coating of the conductive layer of the conductive region, and compared with the rectangular conductive region, it is more convenient for the bonding of the LED chip 150 .

In order not to affect the light emitting conditions of the LED chips 150, if the distance between the LED chips 150 is too dense, the entire light may be too strong, or there may be certain obstacles to the installation of the LED chips 150, and too dense may cause a short circuit. Therefore, the installation areas on the bottom plate 110 can be set in sequence according to preset distances, for example, the installation areas can be set at intervals of 2 cm.

Please refer to FIG. 3 . FIG. 3 is a schematic structural diagram of another LED circuit board 100 provided by an embodiment of the present invention. One end of the bottom board 110 is also provided with a first metal terminal 170 and a second metal terminal 180 . One end of the metal terminal 170 is connected to the positive pole of the driving power supply, the other end of the first metal terminal 170 is connected to the power line 120, one end of the second metal terminal 180 is connected to the negative pole of the driving power supply, The other end of the second metal terminal 180 is connected to one end of the first wire 130 or the second wire 140 .

The first metal terminal 170 can be connected to the driving power supply and the power line 120 by welding or other methods, and the second metal terminal 180 can also be connected to the driving power supply and the first metal terminal 180 by welding or other methods. One end of the wire 130 is connected.

The LED chip 150 is coated with a fluorescent colloid (not shown in the figure), which can be epoxy resin, silica gel, or silica gel containing different concentrations of phosphor powder, which is used to convert the light emitted by the LED chip 150 Shown in different colors.

A plurality of LED chips 150 on the LED circuit board 100 can be chips of the same luminous color or chips of different luminous colors, for example, the first LED chip 150 is a chip of red or other monochromatic luminous colors, and the second LED chip 150 chips with blue luminous color, and other LED chips 150 can also be arranged as chips with different luminous colors at intervals as required.

The LED chip 150 will generate a lot of heat in the process of emitting light. In order to dissipate the heat in time and faster, the first wire 130 and the second wire 140 are provided with a heat dissipation area 190, and only by heat dissipation It is often not enough for the area 190 to dissipate heat into the air or other media in contact with it. Sometimes it is necessary to connect the heat dissipation area 190 to other heat dissipation components to dissipate heat faster. Therefore, the base plate 110 can also be provided with There are heat dissipation elements (not shown in the figure), and the heat dissipation elements are all connected to the heat dissipation area 190 .

The first wire 130 and the second wire 140 in the heat dissipation area 190 are provided with a protruding arc 192 to fit onto the heat sink. At the same time, due to the first wire 130 and the second wire The wire 140 is made of metal, which has good thermal conductivity, and can be directly welded to the heat sink instead of being bonded to the heat sink through an insulating layer.

As a method, the bottom shape of the protruding arc 192 is set to be straight, and the protruding arc 192 of the first wire 130 and the second wire 140 in the straight heat dissipation area 190 are welded. Or when it is attached to the heat sink, its contact area is larger and the heat conduction effect is better. At the same time, it can not only dissipate heat through the heat sink, but also directly dissipate heat into the air or other media in contact with it.

Please refer to FIG. 4. FIG. 4 is a schematic structural diagram of an LED bracket 200 provided by an embodiment of the present invention. The LED bracket 200 includes a plurality of the above-mentioned LED circuit boards 100. The brackets 200 are arranged in sequence in the vertical direction.

The LED bracket 200 is formed from a metal plate at one time, and can form multiple LED circuit boards 100 at one time, which effectively improves the production capacity of the LED circuit boards 100 .

To sum up, the embodiment of the present invention provides an LED circuit board 100 and an LED bracket 200. The first wire 130 and the second wire 140 are arranged on the bottom plate 110 in a Z-shape. The first wire 130 There are a plurality of first conductive regions 132 arranged in sequence, and the second wire 140 is provided with a plurality of second conductive regions 142 arranged in sequence, and each first conductive region 132 and each second conductive region 142 are formed for placing The installation area of the LED chip 150, the first wire 130 and the second wire 140 are connected in series and parallel through the LED chip 150 arranged in the installation area, so that the installation of the LED chip 150 is simpler and easier. The bonding can effectively save the space of the LED circuit board 100, and the structure is more stable.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. a kind of LED circuit board, it is characterised in that including bottom plate, be provided with the bottom plate along the vertical direction of the bottom plate Power line, the first wire and the second wire, one end of the power line are connected with driving power, the other end of the power line Connect first wire or second wire, the driving power, first wire, second wire and the electricity Loop is formed between the line of source；

First wire is spaced setting with second wire into Z-type, and first wire is provided with what is be arranged in order Multiple first conductive regions, second wire are provided with and are arranged in order multiple second conductive regions, each first conductive region with Each second conductive region forms the installation region for placing LED chip, and first wire passes through with second wire It is arranged on the LED chip connection in series-parallel of the installation region.

2. LED circuit board according to claim 1, it is characterised in that independent current source line is additionally provided with the bottom plate, it is described Independent current source line is connected with second wire.

3. LED circuit board according to claim 2, it is characterised in that the installation region is set gradually by pre-determined distance On the bottom plate.

4. LED circuit board according to claim 3, it is characterised in that one end of the power line and the driving power Negative pole connection, one end of first wire is connected with the positive pole of the driving power.

5. according to the LED circuit board described in any claim in claim 1-4, it is characterised in that one end of the power line with The positive pole connection of the driving power, one end of first wire is connected with the negative pole of the driving power.

6. LED circuit board according to claim 5, it is characterised in that one end of the bottom plate is additionally provided with the first metal end Son and the second metal terminal, one end of the first metal end are connected with the positive pole of the driving power, first metal The other end of terminal is connected with the power line, and one end of second metal terminal is connected with the negative pole of the driving power, The other end of second metal terminal is connected with one end of first wire or second wire.

7. LED circuit board according to claim 6, it is characterised in that the LED chip is coated with fluorescent colloid.

8. LED circuit board according to claim 7, it is characterised in that it is additionally provided with radiating piece on the bottom plate, described first Wire and second wire are equipped with radiating area, and the radiating piece is connected with the radiating area.

9. LED circuit board according to claim 8, it is characterised in that first wire and institute in the radiating area State the arc that the second wire is provided with protrusion.

10. a kind of LED support, it is characterised in that the LED support includes any described LED line roads of a plurality of claim 1-9 Plate, a plurality of LED circuit board are set gradually along the LED support vertical direction.